Wire trimming mechanism and soldering machine

Abstract

The utility model relates to the technical field of tin soldering machines, and discloses a wire cutting mechanism and a tin soldering machine, the wire cutting mechanism is used for removing wires, away from the side of a product, of tin soldering points of the product, the wire cutting mechanism comprises a wire cutting assembly used for cutting off the wires, the wire cutting assembly comprises cutters and a first driving mechanism used for driving the cutters, and the number of the cutters corresponds to the number of the tin soldering points of the product; the recycling mechanism is used for clamping the wire which is separated from the product after being cut off by the wire cutting assembly, the recycling mechanism comprises a clamp and a second driving mechanism used for driving the clamp, and the clamp is used for clamping the wire; product tin soldering is completed through the first tin soldering mechanism and the second tin soldering mechanism, wires subjected to tin soldering are cut off through the wire cutting assembly after CCD detection, meanwhile, clamping is conducted through a clamp arranged on the recycling mechanism, the wires are driven to enter the storage device to be stored after being cut off, cleaning is convenient, then dispensing, detecting and discharging operation is conducted, and the tin soldering process is completed.

Description

Technical Field

[0001] This application belongs to the field of soldering machine technology, and relates to a wire cutting mechanism and a soldering machine. Background Technology

[0002] Soldering is an indispensable process in the manufacturing of electronic products. Traditionally, soldering is done manually. However, with the increase in labor costs and market demand, many manufacturers now use soldering equipment to replace manual soldering. Existing soldering equipment cannot complete soldering, gluing, and wire cutting operations in one machine; multiple processes are required to complete the soldering process.

[0003] Therefore, how to provide a wire-cutting mechanism and soldering machine to integrate the soldering, dispensing, and wire-cutting processes of a product has become an urgent technical problem to be solved. Utility Model Content

[0004] To overcome the problems existing in related technologies, this application aims to provide a wire cutting mechanism that can integrate the soldering, dispensing, and wire cutting processes of a product.

[0005] This application is achieved through the following technical solution.

[0006] According to the first aspect, this technical solution provides a wire cutting mechanism for removing wires from the solder joints of a product away from the product side, comprising:

[0007] A wire-cutting assembly for cutting wires, the wire-cutting assembly including a cutter and a first drive mechanism for driving the cutter, the cutter being provided with at least one, and / or the number of cutters corresponding to the number of solder points on the product;

[0008] A recovery mechanism for holding wires that have been cut off and detached from the product by a wire-cutting assembly, the recovery mechanism including a clamp and a second drive mechanism for driving the clamp, the clamp being used to hold the wire.

[0009] The present invention is further configured such that the wire cutting assembly includes a first cylinder mounted on the bracket, a first track, and a first sliding member slidably connected to the first track, the first driving mechanism being installed inside the first sliding member, and the first cylinder being used to drive the first sliding member to move.

[0010] The present invention is further configured such that the wire cutting assembly also includes a stripping top block mounted on the bracket for pressing against the product to prevent it from being touched.

[0011] The present invention is further configured such that the recycling mechanism includes a second cylinder, a second track, and a second sliding member slidably connected to the outside of the second track, all mounted on the adjustment mechanism. The second driving mechanism is mounted on the tail of the second sliding member, and the second cylinder is used to drive the second sliding member to move.

[0012] The present invention is further provided with a storage device at the bottom of the bracket for storing the removed wires.

[0013] The present invention is further configured such that the adjusting mechanism is used to adjust the position of the clamp.

[0014] The present invention is further configured such that a fine-tuning device is provided inside the first sliding member for adjusting the position of the cutting tool.

[0015] According to the second aspect, the present technical solution provides a soldering machine, including a first soldering mechanism, a second soldering mechanism, a dispensing mechanism, a feeding mechanism, a turntable, and a wire cutting mechanism as described in the first aspect. The turntable is driven to rotate by a motor and is installed on the top of the soldering machine frame. The first soldering mechanism, the second soldering mechanism, the wire cutting mechanism, the dispensing mechanism, and the feeding mechanism are sequentially installed around the turntable on the top of the frame.

[0016] The first soldering mechanism and the second soldering mechanism are used to solder the wires, the glue dispensing mechanism is used to apply glue to the solder joints, and the unloading mechanism is used to unload the glued product.

[0017] The present invention is further provided that a CCD detection device is provided between the second soldering mechanism and the wire cutting mechanism, as well as between the dispensing mechanism and the unloading mechanism.

[0018] The present invention is further configured such that the clamp is a gripper.

[0019] The above technical solution has the following technical effects: the product is soldered by the first soldering mechanism and the second soldering mechanism. After CCD detection, the soldered wire is cut by the wire cutting component. At the same time, the clamps set by the recycling mechanism are used to hold the wire and carry it into the storage device after cutting for easy cleaning. Then, the glue dispensing, detection and unloading operations are performed to complete the soldering process.

[0020] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0021] The above and other objects, features and advantages of this application will become more apparent from the more detailed description of exemplary embodiments thereof in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments thereof.

[0022] Figure 1 This is a schematic diagram of the wire-cutting mechanism structure shown in one embodiment of this application;

[0023] Figure 2This is a schematic diagram of the clamp structure shown in one embodiment of this application;

[0024] Figure 3 This is a partially enlarged schematic diagram of part A shown in one embodiment of this application;

[0025] Figure 4 This is a schematic diagram of a soldering machine structure shown in one embodiment of this application;

[0026] Figure 5 This is a schematic diagram showing the location of the solder joints in a product according to one embodiment of this application.

[0027] Reference numerals: 1. Wire cutting assembly; 11. First drive mechanism; 12. Cutting tool; 13. First cylinder; 14. First track; 15. First sliding member; 16. Stripping top block; 2. Recycling mechanism; 21. Clamp; 22. Second drive mechanism; 23. Second cylinder; 24. Second track; 25. Second sliding member; 26. Adjustment mechanism; 3. First soldering mechanism; 4. Second soldering mechanism; 5. Glue dispensing mechanism; 6. Unloading mechanism; 7. Turntable. Detailed Implementation

[0028] The technical solutions of some embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0029] The technical solutions of the embodiments of this application are described in detail below with reference to the accompanying drawings.

[0030] According to the first aspect, this embodiment discloses a wire-cutting mechanism for removing wires from the solder joints of a product away from the product side, such as... Figures 1-5 As shown, it includes:

[0031] A wire-cutting assembly 1 for cutting wires includes a cutter 12 and a first drive mechanism 11 for driving the cutter 12. The cutter 12 is provided with at least one, and / or the number of cutters 12 corresponds to the number of solder points on the product.

[0032] A recycling mechanism 2 is used to hold the wires that have been cut off and detached from the product by the wire cutting assembly 1. The recycling mechanism 2 includes a clamp 21 and a second drive mechanism 22 for driving the clamp 21. The clamp 21 is used to hold the wires.

[0033] It should be noted that after the CCD detection equipment set in front of the wire cutting mechanism detects the wire, the recycling mechanism 2 set in the wire cutting mechanism clamps the wire away from the product side through the clamp 21. Then, the cutter 12 set in the wire cutting assembly 1 moves to the area close to the solder point under the drive of the first drive mechanism 11 to complete the cutting of the wire. The cutter 12 can complete the cutting of the wire in one go, and the clamp 21 has a certain length to clamp all the cut wires at one time.

[0034] like Figures 1-3 As shown, the wire cutting assembly 1 also includes a first cylinder 13 mounted on the bracket, a first track 14 and a first sliding member 15 slidably connected to the first track 14. A first drive mechanism 11 is installed inside the first sliding member 15, and the first cylinder 13 is used to drive the first sliding member 15 to move.

[0035] like Figure 2 As shown, the wire cutting assembly 1 also includes a stripping top block 16 mounted on the bracket for pressing down on the product to prevent it from being touched.

[0036] It should be noted that when the wire cutting assembly 1 is in operation, after the position is adjusted by the first cylinder 13 and other structures, the push rod set by the first drive mechanism 11 drives the push block to squeeze the cutter 12, thereby driving the cutter 12 to cut the wire. At the same time, the stripping top block 16 presses against the product to prevent the wire cutting assembly 1 from moving the product after it has completed the operation.

[0037] like Figures 1-3 As shown, the recycling mechanism 2 also includes a second cylinder 23, a second track 24, and a second sliding member 25 slidably connected to the outside of the second track 24, all mounted on the adjustment mechanism 26. The second drive mechanism 22 is mounted on the tail of the second sliding member 25, and the second cylinder 23 is used to drive the second sliding member 25 to move.

[0038] like Figure 1 As shown, the bottom of the bracket is equipped with a storage device for storing the removed wires. It should be noted that the recycling mechanism 2 clamps the wires with the clamp 21 and moves them with the second cylinder 23. It moves to the storage device and stops, then releases the wires so that they are stored inside the storage device.

[0039] like Figures 1-3 As shown, the adjustment mechanism 26 is used to adjust the position of the clamp 21.

[0040] It should be noted that the adjustment mechanism 26 is a cylinder and a sliding component on the slide rail that is driven by the cylinder.

[0041] like Figures 1-3 As shown, the first sliding member 15 is equipped with a fine-tuning device inside, which is used to adjust and fix the position of the cutter 12.

[0042] It should be noted that the fine-tuning device is a rotatable lead screw assembly.

[0043] According to the second aspect, this utility model discloses a soldering machine, such as... Figures 1-5 As shown, it includes a first soldering mechanism 3, a second soldering mechanism 4, a dispensing mechanism 5, a feeding mechanism 6, a turntable 7, and a wire cutting mechanism as described in the first aspect. The turntable 7 is driven to rotate by a motor and is installed on the top of the soldering machine frame. The first soldering mechanism 3, the second soldering mechanism 4, the wire cutting mechanism, the dispensing mechanism 5, and the feeding mechanism 6 are sequentially installed around the turntable 7 on the top of the frame.

[0044] The first soldering mechanism 3 and the second soldering mechanism 4 are used to solder the wires, the glue dispensing mechanism 5 is used to apply glue to the solder joints, and the unloading mechanism 6 is used to unload the glued products.

[0045] It should be noted that when using the soldering machine, the product is first placed manually on the designated position above the turntable 7. Then, the first soldering mechanism 3 and the second soldering mechanism 4 perform soldering operations on two adjacent products simultaneously as the turntable 7 rotates. After the soldered product is inspected by CCD, it moves to the wire cutting mechanism to remove the wires, and then to the dispensing mechanism 5 to complete the dispensing operation. After being inspected by CCD again, it reaches the unloading mechanism 6 to complete the unloading operation.

[0046] like Figure 4 As shown, CCD detection equipment is installed between the second soldering mechanism 4, the wire cutting mechanism, the glue dispensing mechanism 5, and the unloading mechanism.

[0047] like Figures 1-4 As shown, clamp 21 is a gripper.

[0048] It should be noted that the first drive mechanism 11 and the second drive mechanism 22 are devices used for driving in the art known to those skilled in the art, such as cylinders, oil cylinders, and motors. The first soldering mechanism 3, the second soldering mechanism 4, the dispensing mechanism 5, the CCD detection equipment, and the unloading mechanism 6 are all prior art.

[0049] Working principle: The product is soldered by the first soldering mechanism 3 and the second soldering mechanism 4. After use, the soldered wire is cut by the wire cutting component 1. At the same time, the wire is clamped by the clamp 21 set by the recycling mechanism 2 so that it can be driven into the storage device after cutting for easy cleaning. Then, the glue dispensing, inspection and unloading operations are performed to complete the soldering process.

[0050] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A wire-cutting mechanism for removing wires from solder joints on the side of a product away from the product, characterized in that, include: A wire-cutting assembly (1) for cutting wires, the wire-cutting assembly (1) including a cutter (12) and a first drive mechanism (11) for driving the cutter (12), the cutter (12) being provided with at least one; A recovery mechanism (2) for holding the wires cut off and detached from the product by the wire-cutting assembly (1), the recovery mechanism (2) including a clamp (21) and a second drive mechanism (22) for driving the clamp (21), the clamp (21) being used to hold the wires.

2. The wire-cutting mechanism according to claim 1, characterized in that, The wire-cutting assembly (1) further includes a first cylinder (13) mounted on a bracket, a first track (14) and a first sliding member (15) slidably connected to the first track (14). The first driving mechanism (11) is installed inside the first sliding member (15), and the first cylinder (13) is used to drive the first sliding member (15) to move.

3. The wire-cutting mechanism according to claim 1, characterized in that, The wire-cutting assembly (1) also includes a stripping top block (16) mounted on a bracket for pressing against the product to prevent it from being touched.

4. The wire-cutting mechanism according to claim 1, characterized in that, The recycling mechanism (2) further includes a second cylinder (23), a second track (24) mounted on the adjustment mechanism (26), and a second sliding member (25) slidably connected to the outside of the second track (24). The second driving mechanism (22) is mounted on the tail of the second sliding member (25), and the second cylinder (23) is used to drive the second sliding member (25) to move.

5. The wire-cutting mechanism according to claim 2, characterized in that, The bottom of the bracket is equipped with a storage device for storing removed wires.

6. The wire-cutting mechanism according to claim 4, characterized in that, The adjustment mechanism (26) is used to adjust the position of the clamp (21).

7. The wire-cutting mechanism according to claim 2, characterized in that, The first sliding member (15) is provided with a fine-tuning device for adjusting the position of the cutting tool (12).

8. The wire-cutting mechanism according to claim 1, characterized in that, The clamp (21) is a gripper.

9. A soldering machine, characterized in that, The device includes a first soldering mechanism (3), a second soldering mechanism (4), a dispensing mechanism (5), a feeding mechanism (6), a turntable (7), and a wire cutting mechanism as described in any one of claims 1-8. The turntable (7) is driven to rotate by a motor and is mounted on the top of the frame. The first soldering mechanism (3), the second soldering mechanism (4), the wire cutting mechanism, the dispensing mechanism (5), and the feeding mechanism (6) are sequentially mounted on the top of the frame around the turntable (7). The first soldering mechanism (3) and the second soldering mechanism (4) are used to solder the wires, the glue dispensing mechanism (5) is used to dispense glue onto the solder joints, and the unloading mechanism (6) is used to unload the glued product.

10. The soldering machine according to claim 9, characterized in that, CCD detection equipment is provided between the second soldering mechanism (4), the wire cutting mechanism, the glue dispensing mechanism (5), and the unloading mechanism.

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