Semiconductor chip trimming structure
The clamping and fixing components solve the problems of semiconductor chip shaking and poor specification adaptability during processing, achieving stable processing and efficient production.
Patent Information
- Application Number
- CN202520255694.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-18
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2035-02-18
AI Technical Summary
Existing semiconductor chips are prone to shaking during processing, leading to positional shifts, and it is difficult to fix chips of different specifications, reducing production efficiency.
The clamping and fixing assembly includes a motor, pulleys, a two-way lead screw, and clamping plates. The motor drives the pulleys to rotate the lead screw, thereby achieving relative movement of the clamping plates and fixing chips of different specifications.
It effectively prevents chip movement, ensures accurate processing trajectory, improves the ease of fixing chips of different specifications, and enhances production efficiency.
Smart Images

Figure CN223775894U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor chip shaving technology, and in particular to a semiconductor chip shaving structure. Background Technology
[0002] Semiconductor chip dicing structure refers to a comprehensive structure or process configuration that includes dicing, shaping, and pin processing, used in the semiconductor chip manufacturing process to separate individual chips from wafers and shape them through precision processing.
[0003] The existing semiconductor chip dicing structure still has the following areas for improvement during use:
[0004] 1. During the processing of semiconductor chips, shaking often occurs, which may directly lead to the deviation of the processing position, causing the originally set processing trajectory to deviate to a certain position, ultimately resulting in a decrease in product performance or scrapping.
[0005] 2. It is inconvenient to fix semiconductor chips of different specifications. If the ribbed structure cannot be easily fixed, it is necessary to change to different specifications of fixtures or adjust the equipment. This process will consume a lot of time and reduce production efficiency. Utility Model Content
[0006] The purpose of this invention is to address the shortcomings of existing technologies by proposing a semiconductor chip bead-cutting structure.
[0007] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor chip cutting structure, including a workbench, a side plate and a fixed plate fixedly connected to the top of the workbench, a top plate fixedly connected to one side of the side plate, an electric telescopic rod fixedly connected to the bottom of the top plate, a support plate connected to the bottom of the electric telescopic rod, a cutter fixedly connected to the bottom of the support plate, and a clamping and fixing assembly provided on the fixed plate.
[0008] As a further description of the above technical solution:
[0009] The clamping and fixing assembly includes a motor, which is connected to one side of the fixing plate. The output shaft of the motor is fixedly connected to a pulley one, and a belt body is connected to the outer wall of the pulley one. A pulley two is connected to one side of the belt body, and a bidirectional lead screw is fixedly connected to the middle of the pulley two. A fixing block is fixedly connected to one side of the fixing plate, and the bidirectional lead screw rotates in the middle of the fixing block.
[0010] As a further description of the above technical solution:
[0011] The clamping and fixing assembly also includes an adjusting plate, and there are two sets of adjusting plates. The two sets of adjusting plates are respectively threaded to the outer wall of the bidirectional lead screw. A connecting block is fixedly connected to one side of the adjusting plate, a connecting plate is fixedly connected to one side of the connecting block, and a clamping plate is fixedly connected to one side of the connecting plate. The clamping plate slides on the top of the worktable.
[0012] As a further description of the above technical solution:
[0013] A base is fixedly connected to one side of the fixing plate, and the top of the base is fixedly connected to the motor.
[0014] As a further description of the above technical solution:
[0015] The bottom of the workbench is fixedly connected to a support leg.
[0016] As a further description of the above technical solution:
[0017] The bottom of the support leg is connected to a universal wheel with brakes.
[0018] This utility model has the following beneficial effects:
[0019] 1. In this utility model, by adding a clamping and fixing component to the semiconductor chip cutting structure, the semiconductor chip will not shake, avoiding the deviation of the processing position, so that the semiconductor chip moves according to the originally set processing trajectory, ensuring the performance of the product.
[0020] 2. In this invention, by adding a clamping and fixing component to the semiconductor chip cutting structure, it is convenient to fix semiconductor chips of different specifications without the need to change to different specifications of clamps or adjust equipment. This improves production efficiency. Attached Figure Description
[0021] Figure 1 This is a first-view view of a semiconductor chip ribbed structure proposed in this utility model;
[0022] Figure 2 This is a second-view view of a semiconductor chip ribbed structure proposed in this utility model;
[0023] Figure 3 This is a third-view diagram of a semiconductor chip ribbed structure proposed in this utility model;
[0024] Figure 4 This is a fourth-view diagram of a semiconductor chip ribbed structure proposed in this utility model.
[0025] Legend:
[0026] 1. Workbench; 2. Side panel; 3. Top panel; 4. Electric telescopic rod; 5. Support plate; 6. Cutter; 7. Fixing plate; 8. Base; 9. Motor; 10. Belt pulley one; 11. Belt body; 12. Belt pulley two; 13. Fixing block; 14. Two-way lead screw; 15. Adjusting plate; 16. Connecting block; 17. Connecting plate; 18. Support leg; 19. Universal wheel with brake; 20. Clamping plate. Detailed Implementation
[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0028] Reference Figures 1-4 An embodiment of this utility model provides a semiconductor chip cutting structure, including a workbench 1, a side plate 2 and a fixed plate 7 fixedly connected to the top of the workbench 1, a top plate 3 fixedly connected to one side of the side plate 2, an electric telescopic rod 4 fixedly connected to the bottom of the top plate 3, a support plate 5 connected to the bottom of the electric telescopic rod 4, a cutter 6 fixedly connected to the bottom of the support plate 5, and a clamping and fixing assembly provided on the fixed plate 7.
[0029] The clamping and fixing assembly includes a motor 9, which is connected to one side of the fixing plate 7. The output shaft of the motor 9 is fixedly connected to a pulley 10. A belt body 11 is connected to the outer wall of the pulley 10. A pulley 12 is connected to one side of the belt body 11. A double-acting screw 14 is fixedly connected to the middle of the pulley 12. A fixing block 13 is fixedly connected to one side of the fixing plate 7. The double-acting screw 14 rotates in the middle of the fixing block 13. The clamping and fixing assembly also includes an adjusting plate 15. Two sets of adjusting plates 15 are provided, each set being threadedly connected to the outer wall of the double-acting screw 14. A connecting block 16 is fixedly connected to one side, a connecting plate 17 is fixedly connected to one side of the connecting block 16, and a clamping plate 20 is fixedly connected to one side of the connecting plate 17. The clamping plate 20 slides on the top of the workbench 1. The two sets of clamping plates 20 fix the semiconductor chip. A base 8 is fixedly connected to one side of the fixing plate 7. The top of the base 8 is fixedly connected to the motor 9. The base 8 is used to support the motor 9. A support leg 18 is fixedly connected to the bottom of the workbench 1. The support leg 18 improves the stability of the overall device. A universal wheel 19 with brake is connected to the bottom of the support leg 18. The universal wheel 19 with brake improves the flexibility of the overall device.
[0030] Working principle: The operator places the semiconductor chip between the two sets of clamping plates 20 and the top of the workbench 1, starts the motor 9, and the output shaft of the motor 9 drives the pulley 10 to rotate. Through the connection of the belt body 11, the pulley 12 rotates. The pulley 12 drives the bidirectional lead screw 14 to rotate. The bidirectional lead screw 14 rotates between the two sets of fixed blocks 13. The two sets of adjusting plates 15 move relative to each other on the outer wall of the bidirectional lead screw 14. Through the connection of the connecting block 16 and the connecting plate 17, the two sets of clamping plates 20 move relative to each other, fixing and clamping the semiconductor chip. The electric telescopic rod 4 is started, and the electric telescopic rod 4 drives the cutter 6 to process the semiconductor chip.
[0031] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device such as a computer for control. The detailed description of known functions and components is omitted in the specific implementation of this disclosure. To ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.
[0032] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A semiconductor chip dicing structure, comprising a worktable (1), characterized in that: The top of the workbench (1) is fixedly connected to a side plate (2) and a fixed plate (7). A top plate (3) is fixedly connected to one side of the side plate (2). An electric telescopic rod (4) is fixedly connected to the bottom of the top plate (3). A support plate (5) is connected to the bottom of the electric telescopic rod (4). A cutter (6) is fixedly connected to the bottom of the support plate (5). A clamping and fixing assembly is provided on the fixed plate (7).
2. The semiconductor chip shaving structure according to claim 1, characterized in that: The clamping and fixing assembly includes a motor (9), which is connected to one side of the fixing plate (7). The output shaft of the motor (9) is fixedly connected to a pulley (10). A belt body (11) is connected to the outer wall of the pulley (10). A pulley (12) is connected to one side of the belt body (11). A bidirectional lead screw (14) is fixedly connected to the middle of the pulley (12). A fixing block (13) is fixedly connected to one side of the fixing plate (7). The bidirectional lead screw (14) rotates in the middle of the fixing block (13).
3. The semiconductor chip shaving structure according to claim 1, characterized in that: The clamping and fixing assembly also includes an adjusting plate (15), and two sets of adjusting plates (15) are provided. The two sets of adjusting plates (15) are respectively threaded to the outer wall of the bidirectional lead screw (14). A connecting block (16) is fixedly connected to one side of the adjusting plate (15), a connecting plate (17) is fixedly connected to one side of the connecting block (16), and a clamping plate (20) is fixedly connected to one side of the connecting plate (17). The clamping plate (20) slides on the top of the workbench (1).
4. The semiconductor chip shaving structure according to claim 1, characterized in that: A base (8) is fixedly connected to one side of the fixing plate (7), and the top of the base (8) is fixedly connected to the motor (9).
5. The semiconductor chip shaving structure according to claim 1, characterized in that: The bottom of the workbench (1) is fixedly connected to a support leg (18).
6. A semiconductor chip shaving structure according to claim 5, characterized in that: The bottom of the support leg (18) is connected to a universal wheel (19) with brake.