Pin cutting device for semiconductor packaging
By introducing clamping and collecting components into the lead-cutting device, the instability and residue accumulation problems when fixing semiconductors of different sizes are solved, resulting in a more efficient lead-cutting operation and a cleaner working environment.
Patent Information
- Application Number
- CN202520254318.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-18
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2035-02-18
AI Technical Summary
Existing lead-cutting devices for semiconductor packaging are unstable when fixing semiconductors of different sizes, resulting in low cutting efficiency. Furthermore, the residue generated during the lead-cutting process tends to accumulate and affect subsequent operations.
The device employs a clamping assembly and a collecting assembly. The clamping assembly, through the cooperation of an electric telescopic rod and a sliding plate, achieves stable fixation of semiconductors of different sizes. The collecting assembly, through the design of a cavity and a collecting tray, cleans up the residue and debris generated during the cutting process.
This improves the stability and efficiency of the semiconductor lead cutting process, ensures the cleanliness of the workbench, and does not affect subsequent operations.
Smart Images
Figure CN223776100U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor chip packaging technology, and in particular to a lead-cutting device for semiconductor packaging. Background Technology
[0002] Defective semiconductor products are marked during the assembly and production process. After packaging, defective products need to be identified by cutting off their leads. The usual practice is to cut off the leads of the defective products with small scissors.
[0003] Existing lead-cutting devices for semiconductor packaging are not convenient for clamping and fixing semiconductors of different sizes during use, causing them to wobble during the cutting process and reducing lead-cutting efficiency. In addition, the residue generated during the lead-cutting process tends to accumulate on the operating table, affecting subsequent operations, which makes the device somewhat inadequate. Utility Model Content
[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a lead-cutting device for semiconductor packaging.
[0005] To achieve the above objectives, the present invention adopts the following technical solution: a lead-cutting device for semiconductor packaging, including an operating table, a pressing component connected to the top of the operating table, a cavity opened inside the operating table, and a collecting component connected inside the cavity;
[0006] The clamping assembly includes a support plate, which is fixedly connected to the top of the operating table. An electric telescopic rod is fixedly connected to one side of the support plate, and a connecting frame is fixedly connected to the other side of the support plate. A connecting plate is fixedly connected to the output end of the electric telescopic rod. A sliding plate is fixedly connected to the top of the connecting plate. A sliding groove is formed in the support plate, and the sliding plate slides in the sliding groove. A drive plate is rotatably connected to the side of the connecting frame. A first limiting groove is formed in the drive plate. A fixing rod is fixedly connected to the side of the sliding plate, and the fixing rod slides in the first limiting groove. A driven plate is fixedly connected to the top of the drive plate, and an auxiliary component is connected to the side of the driven plate.
[0007] As a further description of the above technical solution:
[0008] The auxiliary component includes a support frame, which is fixedly connected to the top of the operating table. The support frame has second limiting grooves on both sides, and a slider is slidably connected in the second limiting groove. A first pressure plate is fixedly connected to the side of the slider. A spring is fixedly connected between the first pressure plate and the top of the support frame. A connecting rod is fixedly connected to the bottom of the first pressure plate, and a second pressure plate is fixedly connected to the bottom of the connecting rod.
[0009] As a further description of the above technical solution:
[0010] The collection component includes a collection drawer that is slidably connected within a cavity, and the top of the operating table has a slot, which is provided in multiple sets.
[0011] As a further description of the above technical solution:
[0012] The collection drawer is fixedly connected to a handle on its side.
[0013] As a further description of the above technical solution:
[0014] A fixed frame is fixedly connected to the top of the operating table, and a cylinder is fixedly connected to the top of the fixed frame. A blade is fixedly connected to the output end of the cylinder.
[0015] As a further description of the above technical solution:
[0016] The sliding plate is parallel to the control panel.
[0017] As a further description of the above technical solution:
[0018] Both the first and second pressure plates are parallel to the operating table.
[0019] This utility model has the following beneficial effects:
[0020] 1. In this utility model, in the lead-cutting device used for semiconductor packaging, the clamping component is used to fix semiconductors of different sizes, making them more stable during the lead-cutting process and improving efficiency.
[0021] 2. In this utility model, in the lead-cutting device used for semiconductor packaging, the use of a collection component facilitates the cleaning and collection of residues and debris generated during the lead-cutting process, without affecting subsequent operations. Attached Figure Description
[0022] Figure 1 This invention provides a schematic diagram of the overall structure of a lead-cutting device for semiconductor packaging. Figure 1 ;
[0023] Figure 2 This invention provides a schematic diagram of the overall structure of a lead-cutting device for semiconductor packaging. Figure 2 ;
[0024] Figure 3 This is a partial structural schematic diagram of a lead-cutting device for semiconductor packaging proposed in this utility model;
[0025] Figure 4 This invention provides a lead-cutting device for semiconductor packaging. Figure 1 Enlarged view of point A in the middle.
[0026] Legend:
[0027] 1. Operating table; 2. Fixing frame; 3. Support plate; 4. Electric telescopic rod; 5. Connecting plate; 6. Slide plate; 7. Slide groove; 8. Fixing rod; 9. Connecting frame; 10. Drive plate; 11. First limiting groove; 12. Support frame; 13. Second limiting groove; 14. Slider; 15. First pressure plate; 16. Spring; 17. Connecting rod; 18. Second pressure plate; 19. Hollow groove; 20. Cavity; 21. Collection drawer; 22. Handle; 23. Driven plate; 24. Cylinder; 25. Blade. Detailed Implementation
[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0029] Reference Figures 1-4 The present invention provides an embodiment of a lead-cutting device for semiconductor packaging, comprising an operating table 1, a pressing component connected to the top of the operating table 1, a cavity 20 formed inside the operating table 1, and a collecting component connected inside the cavity 20.
[0030] The clamping assembly includes a support plate 3, which is fixedly connected to the top of the operating table 1. An electric telescopic rod 4 is fixedly connected to one side of the support plate 3, and a connecting frame 9 is fixedly connected to the other side of the support plate 3. A connecting plate 5 is fixedly connected to the output end of the electric telescopic rod 4. A sliding plate 6 is fixedly connected to the top of the connecting plate 5. A sliding groove 7 is provided in the support plate 3, and the sliding plate 6 slides in the sliding groove 7. A drive plate 10 is rotatably connected to the side of the connecting frame 9. A first limiting groove 11 is provided in the drive plate 10. A fixing rod 8 is fixedly connected to the side of the sliding plate 6, and the fixing rod 8 slides in the first limiting groove 11. A driven plate 23 is fixedly connected to the top of the drive plate 10. An auxiliary component is connected to the side of the driven plate 23 to facilitate the driven plate 23 driving the second pressure plate 18 to move downward.
[0031] The auxiliary components include a support frame 12, which is fixedly connected to the top of the operating table 1. Second limiting grooves 13 are formed on both sides of the support frame 12, and sliders 14 are slidably connected within the second limiting grooves 13. A first pressure plate 15 is fixedly connected to the side of the slider 14. A spring 16 is fixedly connected between the first pressure plate 15 and the top of the support frame 12. A connecting rod 17 is fixedly connected to the bottom of the first pressure plate 15, and a second pressure plate 18 is fixedly connected to the bottom of the connecting rod 17. The collection components include a collection drawer 21, which is slidably connected within a cavity 20. A slot 19 is formed on the top of the operating table 1, and multiple slots are provided in the slot 19. A handle 22 is fixedly connected to the side of the collection drawer 21. A fixing frame 2 is fixedly connected to the top of the operating table 1, and a cylinder 24 is fixedly connected to the top of the fixing frame 2. A blade 25 is fixedly connected to the output end of the cylinder 24. A slide plate 6 is parallel to the operating table 1. Both the first pressure plate 15 and the second pressure plate 18 are parallel to the operating table 1, making the fixation of the semiconductor more stable.
[0032] Working principle: In the lead-cutting device used for semiconductor packaging, the electric telescopic rod 4 is activated to drive the connecting plate 5 to move. The connecting plate 5 drives the sliding plate 6 to slide in the slide groove 7. The sliding plate 6 drives the fixed rod 8 to move. At the same time, the fixed rod 8 slides in the first limiting groove 11, causing the driving plate 10 to rotate around the connecting frame 9, which drives the driven plate 23 to rotate. The driven plate 23 presses down against the first pressure plate 15, thereby causing the second pressure plate 18 to move downward, which facilitates the fixing of semiconductors of different sizes, making them more stable during the lead-cutting process and improving efficiency. The residue and debris generated during the lead-cutting process fall into the collection tray 21 through multiple sets of empty slots 19, which is convenient for cleaning and collection and does not affect subsequent operations.
[0033] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device such as a computer for control. The detailed description of known functions and components is omitted in the specific implementation of this disclosure. To ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.
[0034] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A lead-cutting device for semiconductor packaging, comprising an operating table (1), characterized in that: The top of the operating table (1) is connected to a pressing component, and a cavity (20) is opened inside the operating table (1). A collection component is connected inside the cavity (20). The clamping assembly includes a support plate (3), which is fixedly connected to the top of the operating table (1). An electric telescopic rod (4) is fixedly connected to one side of the support plate (3), and a connecting frame (9) is fixedly connected to the other side of the support plate (3). A connecting plate (5) is fixedly connected to the output end of the electric telescopic rod (4). A sliding plate (6) is fixedly connected to the top of the connecting plate (5). A sliding groove (7) is provided in the support plate (3), and the sliding plate (6) slides in the sliding groove (7). A drive plate (10) is rotatably connected to the side of the connecting frame (9). A first limiting groove (11) is provided in the drive plate (10). A fixing rod (8) is fixedly connected to the side of the sliding plate (6), and the fixing rod (8) slides in the first limiting groove (11). A driven plate (23) is fixedly connected to the top of the drive plate (10), and an auxiliary component is connected to the side of the driven plate (23).
2. The lead-cutting device for semiconductor packaging according to claim 1, characterized in that: The auxiliary component includes a support frame (12), which is fixedly connected to the top of the operating table (1). The support frame (12) has a second limiting groove (13) on both sides. A slider (14) is slidably connected in the second limiting groove (13). A first pressure plate (15) is fixedly connected to the side of the slider (14). A spring (16) is fixedly connected between the first pressure plate (15) and the top of the support frame (12). A connecting rod (17) is fixedly connected to the bottom of the first pressure plate (15). A second pressure plate (18) is fixedly connected to the bottom of the connecting rod (17).
3. The lead-cutting device for semiconductor packaging according to claim 1, characterized in that: The collection component includes a collection drawer (21), which is slidably connected in the cavity (20). The top of the operating table (1) is provided with a slot (19), and the slot (19) is provided with multiple sets.
4. A lead-cutting device for semiconductor packaging according to claim 3, characterized in that: The collection drawer (21) has a handle (22) fixedly connected to its side.
5. A lead-cutting device for semiconductor packaging according to claim 1, characterized in that: The top of the operating table (1) is fixedly connected to a fixed frame (2), and the top of the fixed frame (2) is fixedly connected to a cylinder (24), and the output end of the cylinder (24) is fixedly connected to a blade (25).
6. A lead-cutting device for semiconductor packaging according to claim 1, characterized in that: The slide plate (6) is parallel to the operating table (1).
7. A lead-cutting device for semiconductor packaging according to claim 2, characterized in that: The first pressure plate (15) and the second pressure plate (18) are both parallel to the operating table (1).