Laser processing device

Abstract

The utility model relates to a laser processing device. Comprising a mounting frame; the cutting head is arranged on the mounting frame and is used for machining a workpiece to be machined; the suction mechanism is connected with the mounting frame, the end, close to the to-be-machined part, of the cutting head is sleeved with the suction mechanism, the suction mechanism comprises a plurality of cavity walls forming a vacuum cavity in a surrounding mode, an adsorption opening is formed in the cavity wall facing the to-be-machined part, and the adsorption opening is communicated with the vacuum cavity. In the working process, vacuum can be generated in the vacuum cavity for impurities such as dust or disintegrating slag formed after the to-be-machined part is subjected to laser machining, then the impurities such as dust or disintegrating slag are sucked into the vacuum cavity from the adsorption opening under the action of vacuum adsorption force, and therefore the machining precision and stability of the to-be-machined part are improved.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a laser processing apparatus. Background Technology

[0002] Laser processing equipment uses a high-power-density laser beam to cut workpieces fixed on a platform. This is achieved by focusing the laser beam onto the workpiece surface, causing the material to melt, vaporize, or burn rapidly, thus achieving the cutting purpose. However, with traditional laser processing equipment, dust or debris generated after processing will remain on the platform, the processed surface of the workpiece, or fall into the precision internal components of the laser processing equipment. This can range from affecting the positioning accuracy of other workpieces or damaging the workpiece itself, to causing the laser processing equipment to jam or reduce its operational accuracy, ultimately affecting the processing precision and stability of the workpieces. Utility Model Content

[0003] One of the technical problems addressed by this application is how to improve the machining accuracy and stability of the workpiece.

[0004] A laser processing apparatus, comprising:

[0005] Mounting rack;

[0006] A cutting head, mounted on the mounting bracket, is used to process the workpiece.

[0007] A suction mechanism is connected to the mounting bracket. The suction mechanism is fitted over the end of the cutting head near the workpiece. The suction mechanism includes multiple cavity walls surrounding a vacuum cavity. An adsorption port is provided on the cavity wall facing the workpiece, and the adsorption port communicates with the vacuum cavity.

[0008] In one embodiment, the adsorption port is an annular adsorption port, which is arranged around the cutting head; or, there are multiple adsorption ports, which are arranged at intervals around the cutting head.

[0009] In one embodiment, the cavity wall facing the workpiece is flush with the end face of the cutting head near the workpiece.

[0010] In one embodiment, the suction mechanism is at a predetermined distance from the cutting head.

[0011] In one embodiment, one of the suction mechanism and the mounting bracket has an elongated hole and the other has a circular hole. The elongated hole extends along an axial direction perpendicular to the cutting head, and fasteners are inserted into the elongated hole and the circular hole.

[0012] In one embodiment, the suction mechanism includes a suction box and a cover that together form the vacuum chamber, the cover being detachably connected to the suction box to remove dust from the suction box.

[0013] In one embodiment, the suction mechanism further includes a seal that abuts between the suction box and the cap to seal the vacuum chamber.

[0014] In one embodiment, the cutting head includes a main body that forms a receiving cavity. The receiving cavity forms an outlet on the end face of the main body facing the workpiece. The main body also has an air blowing hole that connects the receiving cavity to the outside.

[0015] In one embodiment, the cutting head further includes a lens assembly connected to the main body and located within the accommodating cavity, with the air inlet closer to the outlet relative to the lens assembly.

[0016] In one embodiment, the system further includes a positive pressure generator, a vacuum generator, and a purifier. The positive pressure generator is connected to the vacuum generator and the purifier. The positive pressure generator supplies gas to the air inlet through the purifier, and the vacuum generator creates a vacuum in the vacuum chamber.

[0017] One technical effect of one embodiment of this application is that, during operation, for dust or debris generated after laser processing of the workpiece, a vacuum can be created within the vacuum chamber. This allows the dust or debris to be drawn from the suction port into the vacuum chamber under the influence of vacuum suction force, thus facilitating their removal. This more thoroughly removes dust and debris, effectively preventing them from remaining on the stage, the processed surface of the workpiece, or penetrating the interior of the laser processing device and corroding precision components. This improves the positioning and processing accuracy of the workpiece. It also prevents dust or debris from damaging the workpiece and affecting the movement accuracy of the laser processing device, thereby improving the stability of the workpiece processing. Attached Figure Description

[0018] Figure 1 This is a three-dimensional schematic diagram of a laser processing apparatus provided in one embodiment.

[0019] Figure 2 for Figure 1 The diagram shows a three-dimensional structure of the laser processing device from another perspective.

[0020] Figure 3 for Figure 1 A three-dimensional cross-sectional view of the laser processing device shown.

[0021] Figure 4 for Figure 1 A schematic diagram of the planar cross-sectional structure of the laser processing device shown.

[0022] Figure 5 for Figure 1 The diagram shows a planar cross-sectional view of the laser processing device during the processing of the workpiece.

[0023] Figure 6 for Figure 1 The diagram shows the gas path structure of the laser processing device.

[0024] Reference numerals: Laser processing device 10, workpiece to be processed 20, stage 30, mounting bracket 100, elongated hole 110, cutting head 200, main body 210, accommodating cavity 211, air blowing hole 212, end face 213, outlet 214, lens group 220, annular gap 230, suction mechanism 300, vacuum chamber 310, adsorption port 311, adsorption surface 312, suction box 320, bottom plate 321, top plate 322, side cylinder 323, cover 330, first cover 331, second cover 332, sealing element 340, positive pressure generator 410, vacuum generator 420, purifier 430. Detailed Implementation

[0025] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0026] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0027] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0028] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0029] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0030] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0031] See figure Figure 1 , Figure 2 and Figure 5This application provides an embodiment for cutting a workpiece 20 supported on a stage 30. The workpiece 20 can be a glass substrate or similar material. The laser processing apparatus 10 also includes a mounting frame 100, a cutting head 200, and a suction mechanism 300. Both the cutting head 200 and the suction mechanism 300 are mounted on the mounting frame 100. The suction mechanism 300 is fitted over the end of the cutting head 200 near the workpiece 20. The suction mechanism 300 includes multiple cavity walls surrounding a vacuum chamber 310. The suction mechanism 300 has an adsorption port 311 facing the cavity wall of the workpiece 20, and the adsorption port 311 communicates with the vacuum chamber 310. When the vacuum chamber 310 is evacuated, dust or debris generated by the cutting head 200 during operation can be drawn into the vacuum chamber 310 and finally discharged through the vacuum chamber 310. Since dust or debris can be adsorbed by vacuum force, it is possible to remove dust or debris more thoroughly.

[0032] See Figure 2 , Figure 3 and Figure 4 In some embodiments, the cutting head 200 can be movably connected to the mounting bracket 100, allowing the cutting head 200 to slide relative to the mounting bracket 100 along its axial direction or along an axial direction perpendicular to its direction. The cutting head 200 may include a main body 210 forming a receiving cavity 211. The main body 210 has an end face 213 facing the workpiece 20, through which the receiving cavity 211 extends, forming an exit port 214 on the end face 213. During processing, the laser beam passes through the receiving cavity 211 and exits from the exit port 214, reaching the workpiece 20 and thus processing the workpiece 20.

[0033] See Figure 2 , Figure 3 and Figure 4In some embodiments, the suction mechanism 300 is fixedly connected to the mounting bracket 100 and is sleeved outside the main body 210 of the cutting head 200. The vacuum chamber 310 can be arranged around the main body 210 of the cutting head 200. The suction mechanism 300 has an adsorption surface 312, which can be understood as the cavity wall of the suction mechanism 300 facing the workpiece 20. Therefore, the adsorption surface 312 faces the workpiece 20 to be processed. An adsorption port 311 is provided on the adsorption surface 312, and the adsorption port 311 communicates with the vacuum chamber 310. Alternatively, it can be understood that the vacuum chamber 310 has an adsorption port 311 on the adsorption surface 312, that is, the adsorption port 311 is the opening formed by the vacuum chamber 310 on the adsorption surface 312. For ease of description, the direction perpendicular to the axis of the cutting head 200 can be understood as the radial direction of the cutting head 200. Along the radial direction of the cutting head 200, the adsorption port 311 and the outlet 214 are spaced apart by a set distance.

[0034] During operation, dust or debris generated after laser processing of the workpiece 20 can be removed by creating a vacuum in the vacuum chamber 310. This vacuum suction force draws the dust or debris into the vacuum chamber 310, ensuring complete removal. This effectively prevents dust or debris from remaining on the stage 30, the processed surface of the workpiece 20, or penetrating the interior of the laser processing device 10 and corroding precision components, thus improving the positioning and processing accuracy of the workpiece 20. It also prevents damage to the workpiece 20 and avoids affecting the movement accuracy of the laser processing device 10, thereby improving the stability of the workpiece 20 processing.

[0035] See Figure 2 , Figure 3 and Figure 4 In some embodiments, for example, there may be one adsorption port 311, which is arranged around the cutting head 200. For instance, the adsorption port 311 may be approximately annular, meaning it is a ring-shaped adsorption port. By making the adsorption port 311 annular, its area can be increased to a certain extent, ensuring that impurities such as dust or debris can more easily enter the vacuum chamber 310 through the adsorption port 311, ensuring that all impurities generated during processing are completely removed, further improving the processing accuracy and stability of the workpiece 20. Alternatively, there may be multiple adsorption ports 311, which can be circular, elliptical, or polygonal, etc. These multiple adsorption ports 311 are spaced apart circumferentially around the cutting head 200. This also ensures that the multiple adsorption ports 311 have a reasonable area, thereby achieving effective suction of impurities from the vacuum chamber 310.

[0036] See Figure 2 , Figure 3 and Figure 4 In some embodiments, the adsorption surface 312 and the end face 213 are flush with each other, that is, the cavity wall of the suction mechanism 300 facing the workpiece 20 is flush with the end face 213. This can be understood as the adsorption port 311 and the outlet port 214 being at the same height relative to the stage 30. This ensures that the adsorption port 311 maintains a small distance from dust or debris and other impurities, so that the adsorption port 311 can generate sufficient suction force to draw the impurities into the vacuum chamber 310. In other embodiments, for example, the adsorption surface 312 and the end face 213 are spaced apart from each other along the axial direction of the cutting head 200, such that the adsorption port 311 and the emission port 214 are spaced apart from each other along the axial direction of the cutting head 200. This allows the height of the adsorption port 311 relative to the stage 30 to be less than the height of the emission port 214 relative to the stage 30, that is, the adsorption port 311 is located below the emission port 214. Of course, the height of the adsorption port 311 relative to the stage 30 can also be greater than the height of the emission port 214 relative to the stage 30, that is, the adsorption port 311 is located above the emission port 214.

[0037] See Figure 2 , Figure 3 and Figure 4 In some embodiments, the suction mechanism 300 includes a suction box 320 and a cover 330. The suction box 320 is fixedly connected to the mounting bracket 100, and the suction box 320 and the cover 330 are detachably connected, for example, by bolts or snap-fit ​​connections. The suction box 320 and the cover 330 together form a vacuum chamber 310. The surface of the suction box 320 facing the workpiece 20 is configured as an adsorption surface 312, that is, the adsorption surface 312 includes the surface of the suction box 320 facing the workpiece 20. Obviously, the adsorption port 311 is formed on the suction box 320. By detachably connecting the suction box 320 and the cover 330, it is easy to disassemble the suction box and the cover 330 to clean the vacuum chamber 310, thereby improving the suction efficiency of the vacuum chamber 310 for impurities and improving the ease of maintenance of the suction mechanism 300.

[0038] See Figure 2 , Figure 3 and Figure 4 In some embodiments, the suction mechanism 300 may further include a sealing element 340. The sealing element 340 is annular and abuts between the suction box 320 and the cover 330, effectively sealing the vacuum chamber 310. Therefore, by providing the sealing element 340, sufficient vacuum can be ensured in the vacuum chamber 310, preventing leakage and ensuring sufficient suction force for impurities, ultimately improving the suction efficiency of the vacuum chamber 310 for impurities.

[0039] See Figure 2 , Figure 3 and Figure 4 In some embodiments, the suction box 320 includes a bottom plate 321, a top plate 322, and a side cylinder 323. At least one of the bottom plate 321, top plate 322, and side cylinder 323 can be fixedly connected to the mounting bracket 100. Both the bottom plate 321 and the top plate 322 are annular and are spaced apart along the axial direction of the cutting head 200, such that the top plate 322 and the bottom plate 321 are connected to the opposite ends of the side cylinder 323. The top plate 322 and the bottom plate 321 are located on the same side in the thickness direction of the side cylinder 323, such that the bottom plate 321, the top plate 322, and the side cylinder 323 generally form a U-shaped cavity. The cover 330 includes a first cover 331 and a second cover 332, which are set at an angle. The first cover 331 is connected to the top plate 322, and the sealing element 340 can abut between the top plate 322 and the first cover 331. The second cover 332 is closer to the cutting head 200 than the side cylinder 323. The second cover 332 plays a certain sealing role for the U-shaped cavity, so that the second cover 332 and the suction box 320 together form a vacuum cavity 310. The surface of the bottom plate 321 facing the workpiece 20 is configured as an adsorption surface 312, that is, the adsorption surface 312 includes the surface of the bottom plate 321 facing the workpiece 20. The adsorption port 311 is located at the end of the adsorption surface 312 near the second cover 332. At this time, the number of adsorption ports 311 can be one and they are in a ring shape. After the adsorption port 311 is formed, the opening of the gap between the second cover 332 and the bottom plate 321 forms the adsorption port 311.

[0040] See Figure 2 , Figure 3 and Figure 4 In some embodiments, the suction mechanism 300 and the cutting head 200 are at a predetermined distance, such that the suction mechanism 300 and the main body 210 of the cutting head 200 are radially spaced apart. For example, the second cover 332 and the main body 210 are radially spaced apart, thus forming an annular gap 230 between the second cover 332 and the main body 210 with a predetermined distance. The annular gap 230 surrounds the main body 210 of the cutting head 200. During processing, the cutting head 200 can slide relative to the mounting bracket 100 along the axial and radial directions of the cutting head 200, thereby allowing for fine-tuning of the position of the cutting head 200 and improving the processing accuracy of the workpiece 20. Given that an annular gap 230 is formed between the second cover 332 and the main body 210, the cutting head 200 can avoid contact with the suction mechanism 300, and the cutting head 200 can avoid generating large frictional resistance due to contact with the suction mechanism 300 during fine adjustment, thus improving the convenience of adjusting the cutting head 200.

[0041] See Figure 2 , Figure 3 and Figure 4 In some embodiments, one of the suction mechanism 300 and the mounting bracket 100 has an elongated hole 110 and the other has a circular hole. The elongated hole 110 extends radially along the cutting head 200 and can be a slotted hole, etc. For example, the elongated hole 110 can be provided on the mounting bracket 100, and the circular hole can be provided on the side cylinder 323 of the suction mechanism 300. Fasteners, such as bolts, are used to pass through the elongated hole 110 and the circular hole. When the mounting position of the fastener relative to the elongated hole 110 is changed, the mounting position of the suction mechanism 300 on the mounting bracket 100 along the radial direction of the cutting head 200 can be fine-tuned, thereby fine-tuning the width of the annular gap 230 between the suction mechanism 300 and the cutting head 200, avoiding the width of the annular gap 230 being zero, that is, effectively preventing contact between the suction mechanism 300 and the cutting head 200.

[0042] See Figure 3 , Figure 4 and Figure 5 In some embodiments, the main body 210 also has an air blowing hole 212, which connects to the outside and the accommodating cavity 211. A certain pressure of airflow can be introduced into the accommodating cavity 211 through the air blowing hole 212, and this airflow will be ejected through the outlet 214. During operation, when the vacuum chamber 310 is suctioning dust or debris and other impurities through the adsorption port 311, a certain pressure of airflow can be simultaneously introduced into the air blowing hole 212. This airflow can be understood as positive pressure air with a pressure greater than atmospheric pressure. Under the action of the positive pressure airflow, the flow velocity of dust or debris and other impurities can be increased, causing them to be suctioned into the vacuum chamber 310 more quickly through the adsorption port 311, thereby further improving the suction efficiency of the vacuum chamber 310 for dust or debris and other impurities. Figure 5 Solid arrows represent the flow trajectory of positive pressure airflow, while dashed arrows represent the flow trajectory of suction airflow.

[0043] See Figure 2 , Figure 3 and Figure 4In some embodiments, the cutting head 200 further includes a lens group 220 located within the accommodating cavity 211 and fixedly connected to the main body 210. When the laser beam passes through the accommodating cavity 211, the lens group 220 can focus the laser beam, thereby increasing the working energy of the laser beam. The air blowing hole 212 is closer to the outlet 214 than the lens group 220, which can be understood as the air blowing hole 212 being located below the lens group 220. This effectively avoids the obstruction of the positive pressure airflow by the lens group 220, ensuring that the positive pressure airflow entering the accommodating cavity 211 from the air blowing hole 212 is effectively ejected from the outlet 214. It also ensures that the positive pressure airflow reaching dust or debris has sufficient pressure, thereby increasing the speed at which dust or debris enters the vacuum chamber 310 from the adsorption port 311, thereby improving the suction efficiency of the vacuum chamber 310 for dust or debris.

[0044] See Figure 4 , Figure 5 and Figure 6 In some embodiments, the laser processing apparatus 10 further includes a positive pressure generator 410, a vacuum generator 420, and a purifier 430. The purifier 430 is connected to the positive pressure generator 410, and the positive pressure generator 410 inputs positive pressure airflow to the air outlet 212 through the purifier 430. Specifically, the positive pressure airflow generated by the positive pressure generator 410 first enters the purifier 430 through a pipe. The purifier 430 dries and filters the positive pressure airflow, thereby purifying it. The purified positive pressure airflow is then transported through a pipe to the air outlet 212, where it enters the receiving cavity 211 and is ejected from the outlet 214. Since the positive pressure airflow can be purified by the purifier 430, it effectively prevents the positive pressure airflow from corroding the components inside the receiving cavity 211. Vacuum generator 420 is also connected to positive pressure generator 410. The positive pressure airflow generated by vacuum generator 420 is transported to vacuum generator 420 through a pipe. According to Bernoulli's principle, vacuum generator 420 generates a vacuum under the action of positive pressure airflow. This vacuum will be conducted to vacuum chamber 310 and adsorption port 311 through a pipe, thereby ensuring the adsorption function of vacuum chamber 310 and adsorption port 311 for impurities. Figure 6 The thick solid line represents the flow path of the positive pressure airflow, and the dashed line represents the flow path of the suction airflow.

[0045] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0046] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A laser processing apparatus, characterized in that, include: Mounting rack; A cutting head, mounted on the mounting bracket, is used to process the workpiece. A suction mechanism is connected to the mounting bracket. The suction mechanism is fitted over the end of the cutting head near the workpiece. The suction mechanism includes multiple cavity walls surrounding a vacuum cavity. An adsorption port is provided on the cavity wall facing the workpiece, and the adsorption port communicates with the vacuum cavity.

2. The laser processing apparatus according to claim 1, characterized in that, The adsorption port is an annular adsorption port, which is arranged around the cutting head; or, there are multiple adsorption ports, which are arranged at intervals around the cutting head.

3. The laser processing apparatus according to claim 1, characterized in that, The cavity wall facing the workpiece is flush with the end face of the cutting head near the workpiece.

4. The laser processing apparatus according to claim 1, characterized in that, The suction mechanism is at a predetermined distance from the cutting head.

5. The laser processing apparatus according to claim 1, characterized in that, One of the suction mechanism and the mounting bracket has an elongated hole and the other has a circular hole. The elongated hole extends along an axis perpendicular to the cutting head, and fasteners are inserted into the elongated hole and the circular hole.

6. The laser processing apparatus according to claim 1, characterized in that, The suction mechanism includes a suction box and a cover that together form the vacuum chamber. The cover is detachably connected to the suction box to remove dust from the suction box.

7. The laser processing apparatus according to claim 6, characterized in that, The suction mechanism also includes a sealing element that abuts between the suction box and the cover to seal the vacuum chamber.

8. The laser processing apparatus according to claim 1, characterized in that, The cutting head includes a main body that forms a receiving cavity. The receiving cavity forms an outlet on the end face of the main body facing the workpiece. The main body also has an air blowing hole that connects the receiving cavity to the outside.

9. The laser processing apparatus according to claim 8, characterized in that, The cutting head also includes a lens assembly connected to the main body and located within the accommodating cavity, with the air blowing hole being closer to the outlet than the lens assembly.

10. The laser processing apparatus according to claim 8, characterized in that, It also includes a positive pressure generator, a vacuum generator, and a purifier. The positive pressure generator is connected to the vacuum generator and the purifier. The positive pressure generator inputs gas into the air outlet through the purifier, and the vacuum generator generates a vacuum in the vacuum chamber.

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