Upward-pressing adsorption laser machining table
By designing an upper-pressure adsorption laser processing stage, the chip is fixed using a vacuum chuck and an upper pressure plate, which solves the problem of chip movement during laser processing, improves processing quality and yield, and simplifies pressure adjustment and testing.
Patent Information
- Application Number
- CN202520293514.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-24
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2035-02-24
AI Technical Summary
During the laser processing of chips, the chips are prone to movement, which leads to a decrease in the processing quality of adjacent chips and a reduction in the overall yield.
A pressure adsorption laser processing stage is used, and the chip is fixed by a vacuum suction cup. An upper pressure plate and quartz are set above it. The position of the pressure block is adjusted by adjusting the lead screw and threaded sleeve to ensure that the chip is fixed in place during the processing.
This technology enables stable chip fixation during the manufacturing process, improving processing quality and overall yield, and facilitating the comparison and adjustment of effects under different pressure conditions.
Smart Images

Figure CN223776309U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of laser processing technology, and in particular to an upper pressure adsorption laser processing stage. Background Technology
[0002] During laser processing, the chip needs to be placed on a processing platform such as a vacuum chuck.
[0003] A search revealed a Chinese patent publication number, CN218123362U, which discloses a laser device for chip processing, belonging to the field of chip technology. The device includes a base plate with a controller and a flipping structure on its top. The bottom of a telescopic push rod is fixedly connected to an adjusting frame, and the bottom end of a movable frame is fixedly connected to the top end of the telescopic push rod. A motor is located at the top of the movable frame, and the inner wall of a connecting rod is fixedly connected to the outer wall of a bevel gear set. This laser device for chip processing, through its flipping structure, allows users to process chips from both sides to ensure optimal processing results. This saves time and improves processing efficiency while maintaining quality by preventing chips from falling and affecting subsequent processing. Ultimately, it increases both the efficiency and quality of chip production.
[0004] In summary, the problem with the existing technology is that the conventional method is usually direct laser processing. During the processing, the chip that is peeled off first will move, which will affect the processing of adjacent chips and lead to a decrease in the overall yield.
[0005] In view of the above-mentioned shortcomings, the designer actively researched and innovated in order to create a pressure adsorption laser processing stage, which would have greater industrial application value. Utility Model Content
[0006] To solve any of the above-mentioned technical problems, the purpose of this utility model is to provide an upper pressure adsorption laser processing stage.
[0007] To achieve the above objectives, the present invention adopts the following technical solution:
[0008] The pressure adsorption laser processing stage includes a DD motor, a suction cup base, and a vacuum suction cup. The suction cup base is mounted on the DD motor, and the vacuum suction cup is mounted on the suction cup base.
[0009] An upper pressure plate is set directly above the vacuum suction cup, and a quartz is installed in the central groove of the upper pressure plate. The product is placed on the vacuum suction cup directly below the quartz.
[0010] Several pressure blocks are evenly distributed along the circumference on the suction cup base outside the upper pressure plate. An adjusting screw is installed vertically inside the pressure block. The adjusting screw can move up and down inside the pressure block and contact the upper pressure plate below.
[0011] The pressure block includes a vertical end and a horizontal end. The vertical end of the pressure block is mounted on the suction cup base in a vertical direction, and the horizontal end of the pressure block is mounted on the top inner side of the vertical end of the pressure block in a horizontal direction. A threaded sleeve is installed in the horizontal end of the pressure block in a vertical direction, and an adjusting screw is screwed into the internal thread of the threaded sleeve in a vertical direction.
[0012] As a further improvement of this utility model, the threaded sleeve is screwed into the internal thread of the horizontal end of the pressure block.
[0013] As a further improvement of this utility model, at least one sealing ring is installed between the vacuum suction cup and the suction cup base.
[0014] As a further improvement of this utility model, a dial indicator is installed at the bottom of the suction cup base directly below at least one pressure block via a dial indicator fixing block, and the pin at the top of the dial indicator is in contact with the bottom of the upper pressure plate above.
[0015] As a further improvement of this utility model, the vacuum suction cup is a ceramic suction cup.
[0016] As a further improvement of this utility model, quartz adhesive is bonded to the central groove of the upper pressure plate.
[0017] By means of the above solution, this utility model has at least the following advantages:
[0018] This invention involves adsorbing the chip onto a carrier stage, then placing it on a quartz plate and pressing it down. The laser passes through the quartz plate for processing, ensuring that the chip remains stationary during the processing.
[0019] This utility model has a simple structure, visualizes the pressure applied to the product, facilitates adjustment and testing, and allows for comparison of processing effects under different pressure conditions.
[0020] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description
[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the structure of a pressure adsorption laser processing stage according to the present invention;
[0023] Figure 2 yes Figure 1 Internal structure diagram;
[0024] Figure 3 yes Figure 2 A partially enlarged structural diagram of the intermediate pressure block, adjusting screw, and threaded sleeve.
[0025] The meanings of the labels in the figures are as follows.
[0026] 1. DD motor; 2. Suction cup base; 3. Vacuum suction cup; 4. Product; 5. Sealing ring; 6. Quartz; 7. Upper pressure plate; 8. Dial indicator; 9. Dial indicator fixing block; 10. Pressure block; 11. Adjusting screw; 12. Threaded sleeve. Detailed Implementation
[0027] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.
[0028] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0029] like Figures 1-3 As shown, a pressure adsorption laser processing stage includes a DD motor 1, a suction cup base 2, and a vacuum suction cup 3, wherein the vacuum suction cup 3 is a ceramic suction cup. The suction cup base 2 is mounted on the DD motor 1, and the vacuum suction cup 3 is mounted on the suction cup base 2. At least one sealing ring 5 is installed between the vacuum suction cup 3 and the suction cup base 2.
[0030] An upper pressure plate 7 is set directly above the vacuum suction cup 3. A quartz 6 is installed in the central groove of the upper pressure plate 7. The quartz 6 is glued to the central groove of the upper pressure plate 7. The product 4 is placed on the vacuum suction cup 3 directly below the quartz 6.
[0031] Several pressure blocks 10 are evenly distributed along the circumference on the suction cup base 2 outside the upper pressure plate 7. An adjusting screw 11 is installed in the vertical direction inside the pressure block 10. The adjusting screw 11 can move up and down inside the pressure block 10 and contact the upper pressure plate 7 below.
[0032] The pressure block 10 includes a vertical end and a horizontal end. The vertical end is mounted on the suction cup base 2 in a vertical direction, and the horizontal end is mounted on the inner top of the vertical end in a horizontal direction. A threaded sleeve 12 is installed vertically inside the horizontal end of the pressure block, and an adjusting screw 11 is screwed vertically into the internal thread of the threaded sleeve 12. The threaded sleeve 12 is screwed into the internal thread of the horizontal end of the pressure block.
[0033] A dial indicator 8 is mounted on the bottom of the suction cup base 2 directly below at least one pressure block 10 via a dial indicator fixing block 9, and the pin on the top of the dial indicator 8 is in contact with the bottom of the upper pressure plate 7 above.
[0034] The positional and connection relationships between the components of this utility model are as follows:
[0035] The suction cup base 2 is mounted on the DD motor 1 with screws. A sealing ring 5 is placed in the central groove above the suction cup base 2. The vacuum suction cup 3 is positioned on the suction cup base 2 by the sealing ring 5. The product 4 is placed on the vacuum suction cup 3. The quartz 6 is glued to the central groove of the upper pressure plate 7 and placed on top of the product 4, with the quartz surface pressing against the product 4. The dial indicator fixing block 9 is mounted on the back of the flange of the suction cup base 2 with screws. The pin of the dial indicator 8 passes through the flange hole of the suction cup base 2 and is clamped and fixed by the dial indicator fixing block 9. The threaded sleeve 12 is screwed into the threaded hole of the pressure block 10, and the adjusting screw 11 is screwed into the internal thread of the threaded sleeve 12. The entire assembly is then mounted on the front of the flange of the suction cup base 2 with screws.
[0036] The working principle and process of this utility model:
[0037] First, place product 4 above vacuum suction cup 3, and turn on the vacuum to adsorb and fix product 4. Quartz 6 is attached to the center groove of upper pressure plate 7 and placed above product 4, with the quartz surface pressing against product 4. Loosen the clamping screws of dial indicator fixing block 9, adjust the overall height of dial indicator 8 to ensure that the pin of dial indicator 8 is pressed against the back of the flange of suction cup base 2, and set all three dial indicators 8 to zero. Install three adjustable pressure blocks 10 on the front of the flange of suction cup base 2, ensuring that the adjusting screw 11 is directly above the pin of dial indicator 8, and screw the ball head of adjusting screw 11 into the V-groove of the flange of suction cup base 2; circumferentially unscrew the three adjusting screws 11 downwards to press down upper pressure plate 7, ultimately pressing down on product 4. The amount of downward pressure is observed by the readings of the three dial indicators 8.
[0038] This invention involves adsorbing the chip onto a carrier stage, then placing it on a quartz plate for pressing. Laser processing is performed through the quartz, ensuring the chip remains stationary during the process. The structure is simple, the pressure applied to the product is visualized, and adjustments and tests are convenient, allowing for comparison of processing effects under different pressure conditions.
[0039] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0040] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0041] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.
Claims
1. A pressure adsorption laser processing stage, comprising a DD motor (1), a suction cup base (2), and a vacuum suction cup (3), wherein the suction cup base (2) is mounted on the DD motor (1), and the vacuum suction cup (3) is mounted on the suction cup base (2); characterized in that: An upper pressure plate (7) is provided directly above the vacuum suction cup (3), and a quartz (6) is installed in the central groove of the upper pressure plate (7). The product (4) is placed on the vacuum suction cup (3) directly below the quartz (6). Several pressure blocks (10) are evenly distributed along the circumferential direction on the suction cup base (2) outside the upper pressure plate (7). An adjusting screw (11) is installed in the pressure block (10) along the vertical direction. The adjusting screw (11) can move up and down in the pressure block (10) and contact the upper pressure plate (7) below. The pressure block (10) includes a vertical end and a horizontal end. The vertical end of the pressure block is mounted on the suction cup base (2) in a vertical direction. The horizontal end of the pressure block is mounted on the top inner side of the vertical end of the pressure block in a horizontal direction. A threaded sleeve (12) is installed in the horizontal end of the pressure block in a vertical direction. The adjusting screw (11) is screwed into the internal thread of the threaded sleeve (12) in a vertical direction.
2. The pressure adsorption laser processing stage as described in claim 1, characterized in that, The threaded sleeve (12) is screwed into the internal thread of the horizontal end of the pressure block.
3. The pressure adsorption laser processing stage as described in claim 1, characterized in that, At least one sealing ring (5) is installed between the vacuum suction cup (3) and the suction cup base (2).
4. The pressure adsorption laser processing stage as described in claim 1, characterized in that, A dial indicator (8) is mounted on the bottom of a suction cup base (2) directly below at least one of the pressure blocks (10) via a dial indicator fixing block (9), and the pin on the top of the dial indicator (8) is in contact with the bottom of the upper pressure plate (7) above.
5. The pressure adsorption laser processing stage as described in claim 1, characterized in that, The vacuum suction cup (3) is a ceramic suction cup.
6. The pressure adsorption laser processing stage as described in claim 1, characterized in that, The quartz (6) is glued to the center groove of the upper pressure plate (7).
Citation Information
Patent Citations
Laser equipment for chip processing
CN218123362U