Wafer grinding rotating mechanism

Abstract

The utility model relates to the technical field of wafer processing equipment, in particular to a wafer grinding rotating mechanism which comprises a W-axis rotating mechanism and a DDR driving mechanism, the W-axis rotating mechanism comprises a rotating shaft bearing seat, the inner side of the upper end of the rotating shaft bearing seat is connected with a rotating shaft through an angular contact ball bearing, and the top of the rotating shaft is provided with a wafer table. The upper end of the rotating shaft, close to the wafer table, is sleeved with a waterproof cover, the DDR driving mechanism comprises a DD motor, and an output shaft of the DD motor is connected with the rotating shaft through a coupler. According to the wafer grinding rotating mechanism, the DD motor is adopted as a driving source and is directly connected with the rotating shaft through the coupler, so that gaps and elastic deformation caused by transmission parts such as a synchronous belt and a belt wheel in a traditional mechanism are eliminated, and high-precision rotating control is achieved. Therefore, the processed wafer has higher precision and surface quality, and the requirements of customers on high-precision wafer processing are met. Complex transmission parts are removed, the mechanism structure is simplified, and the overall stability and reliability are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing equipment technical field, concretely relates to a wafer grinding rotation mechanism. BACKGROUND

[0002] In wafer processing equipment technical field, wafer grinding rotation mechanism is the key assembly in wafer edge grinding chamfering process, and its performance directly influences the quality and precision after wafer grinding. Traditional wafer grinding rotation mechanism usually adopts servo motor to drive synchronous pulley, and then rotates through synchronous belt drive wafer table rotating shaft. However, this structure has many deficiencies:

[0003] The structure of traditional mechanism is relatively complex, contains multiple transmission components, such as synchronous belt, pulley etc., and these components are easy to produce gap and elastic deformation in transmission process, thereby causing the accumulation of rotation error. This error is not only difficult to eliminate, but also gradually increases with the increase of using time, seriously influences the precision and surface quality of processed wafer, so that the product is difficult to meet the high-precision requirement of customer. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a wafer grinding rotation mechanism to solve the problem of the structure of traditional mechanism being relatively complex, containing multiple transmission components, such as synchronous belt, pulley etc., and these components being easy to produce gap and elastic deformation in transmission process, thereby causing the accumulation of rotation error in the above background technical field.

[0005] To achieve the above object, the utility model provides a wafer grinding rotation mechanism, including W axis rotation mechanism and DDR drive mechanism, the W axis rotation mechanism includes rotating shaft bearing seat, the inner side of the upper end of rotating shaft bearing seat is connected with rotating shaft through angular contact ball bearing, the top of rotating shaft is installed with wafer table, the upper end of rotating shaft is equipped with waterproof cover near wafer table, the DDR drive mechanism includes DD motor, and the output shaft of DD motor is connected with rotating shaft through shaft coupling.

[0006] As preferred, the upper end of rotating shaft bearing seat is installed with bearing end cover.

[0007] As preferred, the inner wall of rotating shaft bearing seat and the outer wall of rotating shaft are provided with shaft sleeve.

[0008] As preferred, the bottom end of rotating shaft is provided with threaded end, and is connected with locking nut.

[0009] As preferred, the inner wall of waterproof cover and the outer wall of rotating shaft are provided with vacuum sealing ring.

[0010] As preferred, the inner side of bearing end cover is provided with waterproof skeleton oil seal.

[0011] As preferred, the DD motor is fixed on the external device by the DDR mounting base.

[0012] As preferred, the inside of the rotating shaft is provided with an adsorption channel, the output shaft of the DD motor is internally provided with a hollow stainless steel pipe, the upper end of the hollow stainless steel pipe is connected with the adsorption channel, the lower end of the hollow stainless steel pipe is provided with a rotary joint, and the outer end of the rotary joint is connected with the output end of the vacuum generator.

[0013] Compared with the prior art, the utility model has the beneficial effects of:

[0014] In the wafer grinding rotating mechanism, the DD motor is used as the driving source and is directly connected with the rotating shaft through the shaft coupling, so that the gap and elastic deformation caused by the transmission components such as the synchronous belt and the pulley in the traditional mechanism are eliminated, and high-precision rotation control is realized. This makes the processed wafer have higher precision and surface quality, and meets the needs of customers for high-precision wafer processing.

[0015] The utility model removes the complex transmission components, simplifies the mechanism structure, and improves the overall stability and reliability. At the same time, the ingenious design of the bearing end cover, the shaft sleeve, the locking nut and other components further enhances the stability of the mechanism and ensures the stability of the wafer table during rotation.

[0016] By setting the waterproof cover on the upper end of the rotating shaft, the vacuum sealing ring between the inner wall of the waterproof cover and the outer wall of the rotating shaft, and the waterproof skeleton oil seal on the inner side of the bearing end cover, water and dust are effectively prevented from entering the inside of the mechanism, the service life of the mechanism is prolonged, and the cleanliness during wafer processing is ensured.

[0017] The adsorption channel arranged in the rotating shaft is connected with the hollow stainless steel pipe in the output shaft of the DD motor, and the output end of the vacuum generator is connected through the rotary joint, so that the wafer is conveniently adsorbed. This design not only improves the processing efficiency, but also ensures the stable fixation of the wafer during processing, and avoids the processing error caused by loosening or deviation. BRIEF DESCRIPTION OF DRAWINGS

[0018] Fig. 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Fig. 2 It is a schematic diagram of the internal structure of the utility model;

[0020] Fig. 3 It is a schematic diagram of the structure of the W-axis rotating mechanism in the utility model;

[0021] The meanings of the various reference signs in the drawings are as follows:

[0022] 1, W-axis rotating mechanism; 11, rotating shaft bearing seat; 12, angular contact ball bearing; 13, bearing end cover; 14, shaft sleeve; 15, locking nut; 16, waterproof cover; 17, waterproof skeleton oil seal; 18, vacuum sealing ring; 19, wafer table; 110, rotating shaft; 2, DDR drive mechanism; 21, DD motor; 22, shaft coupling; 23, hollow stainless steel pipe; 24, rotary joint; 3, DDR mounting seat. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0024] The utility model provides a kind of wafer grinding rotating mechanism, as shown in figure Figs. 1-3 It includes W-axis rotating mechanism 1 and DDR drive mechanism 2, W-axis rotating mechanism 1 includes rotating shaft bearing seat 11, rotating shaft 110 is connected on the inner side of upper end of rotating shaft bearing seat 11 by angular contact ball bearing 12, the top of rotating shaft 110 is equipped with wafer table 19, waterproof cover 16 is sleeved on the upper end of rotating shaft 110 close to wafer table 19, DDR drive mechanism 2 includes DD motor 21, the output shaft of DD motor 21 is connected with rotating shaft 110 by shaft coupling 22.Rotating shaft 110 in W-axis rotating mechanism 1 is accurately installed in rotating shaft bearing seat 11 by angular contact ball bearing 12, to ensure low friction and high stability in the process of rotation.Meanwhile, DDR drive mechanism 2 uses DD motor 21, and the output shaft thereof is directly connected with rotating shaft 110 by shaft coupling 22, and this direct driving mode eliminates the gap and elastic deformation in traditional transmission mechanism, to realize high-precision rotation control of wafer table 19, and significantly improve the precision and surface quality of wafer grinding.

[0025] Rotating shaft bearing seat 11 provides firm support for rotating shaft 110, cooperates with the use of angular contact ball bearing 12, effectively bears various forces and vibrations in the process of rotation, and enhances the stability of the entire rotating mechanism.In addition, the sleeving of waterproof cover 16 not only plays a waterproof and dustproof role, but also further reinforces the connection between rotating shaft 110 and wafer table 19, and improves the rigidity of the overall structure.

[0026] DD motor 21, as a driving source, has the characteristics of fast response speed and high control precision.Through the direct connection of shaft coupling 22 and rotating shaft 110, efficient power transmission is realized, energy loss and transmission error are reduced, so that the wafer grinding process is more efficient and stable.

[0027] The waterproof cover 16 effectively prevents impurities such as cooling liquid and grinding dust from entering the interior of the rotating mechanism during processing, protecting key components such as bearings and motors, and prolonging the service life of the mechanism. At the same time, the close fit between the waterproof cover 16 and the rotating shaft 110 also ensures the sealing during rotation, improving the cleanliness and safety of processing.

[0028] In this embodiment, the upper end of the rotating shaft bearing seat 11 is externally mounted with a bearing end cover 13. This design effectively seals the upper end opening of the rotating shaft bearing seat 11, preventing external impurities such as dust and moisture from entering the interior of the bearing, thereby protecting the angular contact ball bearing 12 from contamination and damage, prolonging the service life of the bearing, and enhancing the stability and reliability of the rotating mechanism.

[0029] Specifically, a shaft sleeve 14 is provided between the inner wall of the rotating shaft bearing seat 11 and the outer wall of the rotating shaft 110. The shaft sleeve 14 serves as a transition layer between the rotating shaft and the bearing seat, reducing direct friction between the rotating shaft 110 and the rotating shaft bearing seat 11, reducing wear and heat generation, and improving the smoothness and efficiency of rotation. At the same time, the shaft sleeve 14 also plays a certain positioning role, ensuring the stable rotation of the rotating shaft 110 in the rotating shaft bearing seat 11.

[0030] Further, the bottom end of the rotating shaft 110 is provided with a threaded end, and a locking nut 15 is threadedly connected. This design firmly fixes the rotating shaft in the rotating shaft bearing seat 11 through the locking nut 15, preventing the rotating shaft 110 from loosening or falling off during rotation, and enhancing the stability and safety of the entire rotating mechanism.

[0031] Further, a vacuum sealing ring 18 is provided between the inner wall of the waterproof cover 16 and the outer wall of the rotating shaft 110. This design ensures the tight sealing between the waterproof cover 16 and the rotating shaft, preventing external moisture and impurities from entering the interior of the rotating mechanism, especially protecting key components such as bearings and motors from water erosion, improving the waterproof performance and durability of the mechanism.

[0032] Further, a waterproof skeleton oil seal 17 is provided on the inner side of the bearing end cover 13. This design further enhances the sealing performance of the bearing end, effectively preventing water, grease and other impurities from entering the interior of the bearing, while maintaining the lubrication inside the bearing, reducing friction and wear, and improving the service life of the bearing and the stability of the rotating mechanism.

[0033] Further, the DD motor 21 is fixed to the external equipment through the DDR mounting seat 3. This design enables the DD motor 21 to be stably and firmly installed in the designated position, ensuring the stability and accuracy of the motor during operation. At the same time, the DDR mounting seat 3 also facilitates the disassembly and maintenance of the motor, improving the maintainability of the entire W-axis rotating mechanism 1.

[0034] Further, the inside of the rotating shaft 110 is provided with an adsorption channel, the output shaft of the DD motor 21 is provided with a hollow stainless steel pipe 23, the upper end of the hollow stainless steel pipe 23 is connected with the adsorption channel, the lower end of the hollow stainless steel pipe 23 is provided with a rotary joint 24, and the outer end of the rotary joint 24 is connected with the output end of the vacuum generator. This design realizes the vacuum adsorption function of the wafer table 19, and the wafer is firmly adsorbed on the wafer table 19 through the negative pressure generated by the vacuum generator, so that the wafer is prevented from moving or falling off in the grinding process, and the processing precision and stability are improved. At the same time, the hollow stainless steel pipe 23 and the rotary joint 24 ensure the smoothness and stability of the vacuum adsorption channel, so that the vacuum adsorption function is more reliable.

[0035] The wafer grinding rotating mechanism of the utility model in use, first DD motor 21 as driving source, through its high-precision output shaft provides rotary power. The output shaft of the DD motor 21 is directly connected with the rotating shaft 110 through the shaft coupling 22, realizes the direct and efficient transmission of power, reduces the energy loss and error in the transmission process, and ensures the high precision and stability of rotation.

[0036] The rotating shaft 110 is accurately installed in the rotating shaft bearing seat 11 through the angular contact ball bearing 12, the bearing seat provides firm support for the rotating shaft, and ensures low friction and high stability in the rotating process. The shaft sleeve 14 is a transition layer between the rotating shaft and the bearing seat, which further reduces friction and wear, and improves the smoothness and efficiency of rotation. The locking nut 15 firmly fixes the rotating shaft in the rotating shaft bearing seat 11, prevents the rotating shaft from loosening or falling off during rotation, and enhances the stability and safety of the whole rotating mechanism.

[0037] The waterproof cover 16 is sleeved on the upper end of the rotating shaft 110 close to the wafer table 19, which effectively prevents the cooling liquid, grinding dust and other impurities in the processing process from entering the inside of the rotating mechanism, and protects the key components such as bearings and motors. The vacuum sealing ring 18 and the waterproof skeleton oil seal 17 are arranged between the waterproof cover 16 and the rotating shaft and the inner side of the bearing end cover 13 respectively, which further enhances the sealing performance of the mechanism, prevents external moisture and impurities from entering, and improves the waterproof performance and durability of the mechanism.

[0038] The inside of the rotating shaft 110 is provided with an adsorption channel, the output shaft of the DD motor 21 is provided with a hollow stainless steel pipe 23, and the two are connected through a rotary joint 24 and connected with the output end of the vacuum generator. When the vacuum generator starts, negative pressure is generated through the hollow stainless steel pipe 23 and the adsorption channel, and the wafer is firmly adsorbed on the wafer table 19, so that the wafer is prevented from moving or falling off in the grinding process, and the processing precision and stability are improved.

[0039] The DD motor 21 is stably and firmly mounted on the external device through the DDR mounting seat 3, ensuring the stability and accuracy of the motor during operation. The design of the DDR mounting seat 3 also facilitates the disassembly and maintenance of the motor, improving the maintainability of the entire rotating mechanism.

[0040] Finally, it should be noted that the DD motor 21 and other electronic components in the above components in this embodiment are all standard components or components known to those skilled in the art, and their structure and principle can be known by those skilled in the art through technical manuals or through conventional experimental methods. In the idle place of the device, all the above electrical components are connected through wires respectively. The specific connection means should be completed according to the working order of each electrical component in the above working principle, and they are all well-known technologies in the art.

[0041] The basic principles, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above embodiments. The above embodiments and descriptions in the specification are only preferred examples of the present application and do not limit the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application. These changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A wafer grinding rotation mechanism comprising a W-axis rotation mechanism (1) and a DDR drive mechanism (2), characterized by: The W-axis rotating mechanism (1) comprises a rotating shaft bearing seat (11), an angle contact ball bearing (12) is connected to the rotating shaft (110) on the inner side of the upper end of the rotating shaft bearing seat (11), a wafer table (19) is installed on the top of the rotating shaft (110), a waterproof cover (16) is sleeved on the upper end of the rotating shaft (110) close to the wafer table (19), the DDR driving mechanism (2) comprises a DD motor (21), and the output shaft of the DD motor (21) is connected with the rotating shaft (110) through a shaft coupling (22).

2. The wafer grinding rotation mechanism according to claim 1, characterized by: The outer side of the upper end of the rotating shaft bearing seat (11) is provided with a bearing end cover (13).

3. The wafer grinding rotation mechanism according to claim 1, characterized by: The inner wall of the rotating shaft bearing seat (11) and the outer wall of the rotating shaft (110) are provided with a shaft sleeve (14).

4. The wafer grinding rotation mechanism according to claim 1, characterized by: The bottom end of the rotating shaft (110) is provided with a threaded end, and a locking nut (15) is threadedly connected.

5. The wafer grinding rotation mechanism according to claim 1, characterized by: The inner wall of the waterproof cover (16) and the outer wall of the rotating shaft (110) are provided with a vacuum sealing ring (18).

6. The wafer grinding rotation mechanism according to claim 2, characterized by: The inner side of the bearing end cover (13) is provided with a waterproof skeleton oil seal (17).

7. The wafer grinding rotation mechanism according to claim 1, characterized by: The outer side of the DD motor (21) is fixed on the external equipment through a DDR mounting seat (3).

8. The wafer grinding rotation mechanism according to claim 1, characterized by: The inside of the rotating shaft (110) is provided with a suction channel, the output shaft of the DD motor (21) is provided with a hollow stainless steel pipe (23), the upper end of the hollow stainless steel pipe (23) is connected with the suction channel, the lower end of the hollow stainless steel pipe (23) is provided with a rotary joint (24), and the outer end of the rotary joint (24) is connected with the output end of a vacuum generator.

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