Gradient temperature control heating plate for die-cutting machine
By using a gradient temperature-controlled heating plate design, the problem that the heating plate of the die-cutting machine cannot meet the diverse material requirements is solved, achieving precise heating and efficient energy utilization, and improving die-cutting quality and efficiency.
Patent Information
- Application Number
- CN202520325990.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-27
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2035-02-27
AI Technical Summary
The heating plates of existing die-cutting machines use a uniform heating method, which cannot meet the diverse processing needs of different materials, resulting in poor die-cutting quality and energy waste.
The heating plate adopts a gradient temperature control design, which achieves a gradient temperature control effect by gradually decreasing the temperature from left to right through an integrated gradient substrate and temperature control adjustment mechanism. It also combines PTC ceramic heating element and micro semiconductor cooling element to adjust the temperature difference and precisely regulate the temperature of the heating plate.
It achieves precise heating requirements for different materials, improves die-cutting quality and energy utilization efficiency, and reduces material deformation and energy waste.
Smart Images
Figure CN223777332U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heating plates for die-cutting machines, and in particular to a gradient temperature control heating plate for die-cutting machines. Background Technology
[0002] Heating plates play a crucial role in die-cutting machines, especially when processing materials that require heating to enhance the die-cutting effect. Heating plates can bring the material to the appropriate temperature, improve the material's flexibility and plasticity, and thus make it easier to perform die-cutting operations, improving die-cutting accuracy and efficiency.
[0003] Currently, most common die-cutting machine heating plates on the market use uniform heating, meaning the entire surface of the heating plate maintains a constant temperature. This heating method has many limitations in practical applications. First, uniform heating cannot meet the diverse processing needs of materials with different properties. For example, different layers of composite materials may have different coefficients of thermal expansion and softening temperatures. Uniform heating may cause some parts of the material to be overheated while others are underheated, thus affecting the die-cutting quality. When die-cutting multi-layer composite packaging materials, the outer plastic film may melt and deform due to excessive temperature, while the inner paper may not soften sufficiently due to insufficient temperature, resulting in uneven die-cutting edges, delamination, and other problems.
[0004] Secondly, uniform heating can easily lead to severe thermal deformation of materials. If the temperature changes too drastically during the heating process, significant thermal stress will be generated internally, causing deformation phenomena such as curling, wrinkling, and warping. Uniform heating also has low energy efficiency. To meet the heating needs of certain parts of the material, the entire heating plate needs to be maintained at a high temperature, resulting in a large amount of energy waste. Utility Model Content
[0005] To solve the above-mentioned technical problems, this utility model provides a gradient temperature control heating plate for a die-cutting machine.
[0006] The gradient temperature control heating plate for a die-cutting machine provided by this utility model adopts the following technical solution:
[0007] A gradient temperature control heating plate for a die-cutting machine includes a heating plate, a heating cavity, a hot air blower, an air inlet pipe, and an air outlet pipe. The heating cavity is fixed to the bottom of the heating plate. An integrated gradient substrate is disposed inside the heating cavity and is fixed to the bottom of the heating plate. The air inlet pipe and the air outlet pipe are disposed on two symmetrical sides of the heating cavity. The air inlet pipe is disposed on the side closer to the integrated gradient substrate at a higher horizontal position. The hot air blower is connected to the air inlet pipe. The integrated gradient substrate and the heating cavity form a wedge-shaped channel. At least three sets of temperature sensors are disposed on the integrated gradient substrate.
[0008] Optionally, it also includes a temperature control adjustment mechanism, which includes a cylinder, a connecting rod, and a baffle. The baffle is hinged to the inner wall of the heating chamber near the air inlet pipe. The cylinder is disposed on the outer wall of the heating chamber near the air inlet pipe. The piston rod of the cylinder passes through the heating chamber and is connected to the connecting rod. The connecting rod is hinged to one side of the baffle.
[0009] Optionally, it also includes a second temperature control mechanism, which includes an integrated PTC ceramic heating element and a micro semiconductor cooling element. The integrated PTC ceramic heating element is arranged in several groups, and the several groups of integrated PTC ceramic heating elements are arranged at the bottom of the higher side of the integrated gradient substrate. The micro semiconductor cooling element is arranged in several groups, and the several groups of micro semiconductor cooling elements are arranged at the bottom of the lower side of the integrated gradient substrate.
[0010] Optionally, the temperature sensor is specifically a thin-film thermocouple.
[0011] Optionally, each group of thin-film thermocouples may have three.
[0012] In summary, this utility model has at least one of the following beneficial technical effects:
[0013] 1. The integrated gradient substrate in the heating chamber forms a wedge-shaped channel with the heating chamber, and the air inlet pipe is set on the side with a higher horizontal position close to the integrated gradient substrate. After the hot air generated by the hot air blower enters the wedge-shaped channel from the air inlet pipe, the hot air flow rate slows down as the channel space gradually increases, and the heat gradually disperses and attenuates. In this way, from the side of the air inlet pipe to the side of the air outlet pipe, the heating plate can achieve a gradient temperature control effect with the temperature gradually decreasing from left to right. This temperature gradient can be well adapted to the heating requirements of different materials in the die-cutting process.
[0014] 2. The extension and retraction of the cylinder piston rod drives the connecting rod, which in turn causes the baffle to rotate around the hinge point. This process can flexibly change the cross-sectional area of the hot air passage from the air inlet pipe into the heating chamber. When it is necessary to increase the temperature on the left side of the heating plate (the side of the air inlet pipe), the cylinder piston rod extends, pushing the connecting rod to open the baffle to a larger angle, increasing the amount of hot air entering and thus increasing the temperature in that area. Conversely, if it is necessary to decrease the temperature, the piston rod retracts, the baffle angle decreases, reducing the amount of hot air entering and precisely regulating the temperature.
[0015] 3. Main temperature control components are set at both ends of the substrate. An integrated PTC ceramic heating element is set at the high-temperature end, and a micro semiconductor cooling element is installed at the low-temperature end. A basic temperature field is formed by adjusting the temperature difference between the two ends, and the wedge-shaped channel expands the temperature difference into a continuous gradient. Attached Figure Description
[0016] Figure 1This is a schematic diagram of the overall structure of a gradient temperature control heating plate used in a die-cutting machine.
[0017] Figure 2 This is a bottom view of a gradient temperature-controlled heating plate used in a die-cutting machine (the bottom plate of the heating chamber is omitted).
[0018] Figure 3 yes Figure 2 Enlarged view of part A in the middle.
[0019] Figure 4 This is a right view of a gradient temperature-controlled heating plate used in a die-cutting machine.
[0020] Figure 5 yes Figure 4 Sectional view along line BB.
[0021] Explanation of reference numerals in the attached drawings: 1. Heating plate; 2. Heating chamber; 3. Thin-film thermocouple; 4. Air inlet pipe; 5. Air outlet pipe; 6. Integrated gradient substrate; 7. Temperature control adjustment mechanism one; 71. Cylinder; 72. Connecting rod; 73. Baffle; 8. Temperature control adjustment mechanism two; 81. Integrated PTC ceramic heating element; 82. Miniature semiconductor refrigeration element. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0024] Furthermore, "several" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0025] This utility model discloses a gradient temperature-controlled heating plate for a die-cutting machine. (Refer to...) Figure 1-5A gradient temperature-controlled heating plate for a die-cutting machine includes a heating plate 1, a heating cavity 2, a hot air blower, an air inlet pipe 4, an air outlet pipe 5, a temperature adjustment mechanism one, and a temperature adjustment mechanism two. The heating cavity 2 is fixed to the bottom of the heating plate 1. An integrated gradient substrate 6 is disposed inside the heating cavity 2 and is fixed to the bottom of the heating plate 1. The air inlet pipe 4 and the air outlet pipe 5 are disposed on symmetrical sides of the heating cavity 2. The air inlet pipe 4 is disposed on the side closer to the integrated gradient substrate 6 at a higher horizontal position. The hot air blower is connected to the air inlet pipe 4. The integrated gradient substrate 6 and the heating cavity 2 form a wedge-shaped channel. The integrated gradient substrate 6 is provided with... With at least three sets of temperature sensors, the integrated gradient substrate 6 in the heating chamber 2 forms a wedge-shaped channel with the heating chamber 2, and the air inlet pipe 4 is set on the side with a higher horizontal position near the integrated gradient substrate 6. After the hot air generated by the hot air blower enters the wedge-shaped channel from the air inlet pipe 4, the hot air flow rate slows down as the channel space gradually increases, and the heat gradually disperses and attenuates. In this way, from the side of the air inlet pipe 4 to the side of the air outlet pipe 5, the heating plate 1 can achieve a gradient temperature control effect with the temperature gradually decreasing from left to right. This temperature gradient can be well adapted to the heating requirements of different materials in the die-cutting process.
[0026] In actual production, the maximum amount of hot air supply is not always required. When the die-cutting process has lower heating requirements, the opening of the baffle 73 can be reduced by the temperature regulating mechanism to limit the amount of hot air entering. Therefore, the temperature regulating mechanism includes a cylinder 71, a connecting rod 72, and a baffle 73. The baffle 73 is hinged to the inner wall of the heating chamber 2 near the air inlet pipe 4. The cylinder 71 is located on the outer wall of the heating chamber 2 near the air inlet pipe 4. The piston rod of the cylinder 71 passes through the heating chamber 2 and is connected to the connecting rod 72. The connecting rod 72 is hinged to one side of the baffle 73. The extension of the piston rod of the cylinder 71... The retraction action drives the connecting rod 72 to move, which in turn causes the baffle 73 to rotate around the hinge point. This process can flexibly change the cross-sectional area of the hot air passage from the air inlet pipe 4 into the heating chamber 2. When it is necessary to increase the temperature on the left side of the heating plate 1 (the side of the air inlet pipe 4), the piston rod of the cylinder 71 extends, pushing the connecting rod 72 to open the baffle 73 at a larger angle, increasing the amount of hot air entering, thereby increasing the temperature in that area. Conversely, if it is necessary to reduce the temperature, the piston rod retracts, the angle of the baffle 73 becomes smaller, reducing the amount of hot air entering, and precisely regulating the temperature.
[0027] A temperature control mechanism 2 8 is provided at the bottom of the integrated gradient substrate 6. The temperature control mechanism 2 8 includes an integrated PTC ceramic heating element 81 and a micro semiconductor cooling element 82. Several groups of integrated PTC ceramic heating elements 81 are provided and are located at the bottom of the higher side of the integrated gradient substrate 6 at a horizontal position. Several groups of micro semiconductor cooling elements 82 are provided and are located at the bottom of the lower side of the integrated gradient substrate 6 at a horizontal position. With this design, the main temperature control components are provided at both ends of the substrate. The integrated PTC ceramic heating element is provided at the high-temperature end, and the micro semiconductor cooling element 82 is installed at the low-temperature end. By adjusting the temperature difference between the two ends, a basic temperature field is formed, and the wedge-shaped channel expands the temperature difference into a continuous gradient.
[0028] Thin-film thermocouples 3 are respectively set at the front, middle and rear positions of the substrate, which can obtain temperature information of different areas of the heating plate 1 in real time and accurately. This helps the operator to fully understand the temperature distribution of the entire heating plate 1 and judge whether the temperature gradient meets the preset requirements.
[0029] The above are all preferred embodiments of this utility model, and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape and principle of this utility model should be covered within the scope of protection of this utility model.
Claims
1. A gradient temperature-controlled heating plate for a die-cutting machine, characterized in that: The device includes a heating plate (1), a heating chamber (2), a hot air blower, an air inlet pipe (4), and an air outlet pipe (5). The heating chamber (2) is fixed to the bottom of the heating plate (1). An integrated gradient substrate (6) is provided inside the heating chamber (2). The integrated gradient substrate (6) is fixed to the bottom of the heating plate (1). The air inlet pipe (4) and the air outlet pipe (5) are arranged on the symmetrical sides of the heating chamber (2). The air inlet pipe (4) is arranged on the side with a higher horizontal position near the integrated gradient substrate (6). The air inlet pipe (4) is connected to the hot air blower. The integrated gradient substrate (6) and the heating chamber (2) form a wedge-shaped channel. At least three sets of temperature sensors are provided on the integrated gradient substrate (6).
2. The gradient temperature control heating plate for a die-cutting machine according to claim 1, characterized in that: It also includes a temperature control adjustment mechanism (7), which includes a cylinder (71), a connecting rod (72) and a baffle (73). The baffle (73) is hinged to the inner wall of the heating chamber (2) near the air inlet pipe (4). The cylinder (71) is disposed on the outer wall of the heating chamber (2) on the side of the air inlet pipe (4). The piston rod of the cylinder (71) passes through the heating chamber (2) and is connected to the connecting rod (72). The connecting rod (72) is hinged to one side of the baffle (73).
3. A gradient temperature control heating plate for a die-cutting machine according to claim 1, characterized in that: It also includes a second temperature control mechanism (8), which includes an integrated PTC ceramic heating element (81) and a micro semiconductor cooling element (82). The integrated PTC ceramic heating element (81) is provided in several groups, and the several groups of integrated PTC ceramic heating elements (81) are provided at the bottom of the higher side of the integrated gradient substrate (6) at a horizontal position. The micro semiconductor cooling element (82) is provided in several groups, and the several groups of micro semiconductor cooling elements (82) are provided at the bottom of the lower side of the integrated gradient substrate (6) at a horizontal position.
4. A gradient temperature control heating plate for a die-cutting machine according to claim 1, characterized in that: The temperature sensor is specifically a thin-film thermocouple (3).
5. A gradient temperature control heating plate for a die-cutting machine according to claim 4, characterized in that: Each group of thin-film thermocouples (3) is provided with three.