Water channel integrated die-casting type liquid heater

The liquid heater design, which integrates the water channel and the shell through die casting, solves the problems of sealing and installation complexity, and achieves a liquid heater with high production efficiency and high thermal efficiency.

CN223783032UActive Publication Date: 2026-01-09CHANGZHOU XINNENG THERMAL POWER TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202520350658.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-28
Publication Date
2026-01-09
Estimated Expiration
2035-02-28

AI Technical Summary

Technical Problem

Existing liquid heaters have poor water channel sealing, making them prone to leakage, and the installation of the heating pack is complex, with risks of incomplete or missing welds.

Method used

The design incorporates a water channel and housing integrally die-cast, with the heating element embedded in the mounting groove and the controller installed in the mounting cavity. The controller is connected via high-voltage and low-voltage connectors, simplifying the production process and ensuring electrical safety.

Benefits of technology

It avoids the risk of flow channel leakage, simplifies the production process, improves production efficiency and thermal efficiency, reduces costs, and the heating pack is in a single unit form, making it easy to install and reducing welding steps.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the field of liquid heaters, and particularly relates to a water channel integrated die-casting type liquid heater which comprises a water pipe, a shell and a heating bag, the water pipe comprises a water inlet pipe, a water outlet pipe, a first pipe section connected with the water inlet pipe and a second pipe section connected with the water outlet pipe, and the first pipe section and the second pipe section are communicated through a transition bent pipe. The first pipe section is parallel to the second pipe section, the water pipe and the shell are integrally formed in a die-casting mode, an installation groove is formed in the position, between the first pipe section and the second pipe section, of the shell, the heating bag is installed in the installation groove in an embedded mode, the shell is further provided with an installation cavity communicated with the installation groove, and the controller is installed in the installation cavity. According to the liquid heater, the water channel and the shell are integrally formed in a die-casting mode, the risk of leakage does not exist, and machining is convenient.
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Description

Technical Field

[0001] This utility model belongs to the field of liquid heaters, and specifically relates to an integrated die-cast liquid heater for water channels. Background Technology

[0002] Existing PTC (Polymer Chromium Torque Control) flow channels are formed by assembling two or more housings, which are sealed together using adhesive or sealing rings. This requires high precision in manufacturing and precise sealing design. Because rubber is prone to aging, adhesive and sealing ring methods can lead to leakage risks over prolonged use.

[0003] In existing liquid heaters, the heating element consists of multiple small heating elements inserted and connected in parallel via an adapter plate. Each small heating element requires individual welding, which is time-consuming and carries the risk of poor heat dissipation or incomplete welding. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention presents a liquid heater with an integrally die-cast water channel and shell, eliminating the risk of leakage and facilitating processing.

[0005] The technical solution of this utility model is as follows:

[0006] An integrated die-cast liquid heater includes a water pipe, a housing, and a heating element. The water pipe includes an inlet pipe, an outlet pipe, a first pipe section connected to the inlet pipe, and a second pipe section connected to the outlet pipe. The first and second pipe sections are connected by a transition bend and are parallel to each other. The water pipe and the housing are integrally die-cast, and an installation groove is formed in the housing between the first and second pipe sections. The heating element is embedded in the installation groove. The housing also has an installation cavity communicating with the installation groove. A controller is installed in the installation cavity and connected to the heating element. The housing also includes a cover plate for sealing the installation cavity. The housing also has a high-voltage connector and a low-voltage connector connected to the controller.

[0007] Furthermore, the first pipe section includes several straight pipes. One end of the straight pipe at the front end is connected to the water inlet pipe, and one end of the straight pipe at the rear end is connected to the transition bend. The straight pipes are in the same plane and parallel to each other. One end of adjacent straight pipes is connected by a connecting bend to form a continuous water flow channel.

[0008] Furthermore, the structure of the second pipe section is the same as that of the first pipe section.

[0009] Furthermore, the distance between the opposing surfaces of the first and second pipe sections is between 20 and 24 mm.

[0010] Furthermore, the heating pack includes a chip fixing frame, and the chip fixing frame is also provided with a spacer strip, which divides the chip fixing frame into a first receiving area and a second receiving area. Both the first receiving area and the second receiving area are provided with PTC cores. It also includes a positive electrode plate, which is located below the PTC core and is connected to the PTC cores in the first receiving area and the second receiving area. It also includes a first negative electrode plate and a second negative electrode plate. The first negative electrode plate is located in the first receiving area and is located above and connected to the PTC cores in the first receiving area. The second negative electrode plate is located in the second receiving area and is located above and connected to the PTC cores in the second receiving area.

[0011] Furthermore, the lower end face of the spacer is flush with the surface of the PTC core, the lower surface of the positive electrode sheet is higher than the surface of the chip fixing frame, one end of the positive electrode sheet extends to provide a positive lead, and the chip fixing frame is provided with a first clearance groove, in which the positive lead is fitted.

[0012] Furthermore, the upper surfaces of the first negative electrode sheet and the second negative electrode sheet are higher than the upper surface of the chip fixing frame. The first negative electrode sheet is provided with a first negative pin, and the second negative electrode sheet is provided with a second negative pin. The chip fixing frame is provided with a second clearance groove and a third clearance groove. The first negative pin is fitted into the second clearance groove, and the second negative pin is fitted into the third clearance groove.

[0013] Furthermore, it also includes an insulating thermally conductive film, which covers the surfaces of the first negative electrode sheet, the second negative electrode sheet, and the positive electrode sheet.

[0014] Furthermore, it also includes a protective plate, which includes an upper protective plate, a lower protective plate, and a transition portion connecting the upper and lower protective plates. The upper protective plate is pressed onto the surface of the insulating thermally conductive film above the first negative electrode sheet and the second negative electrode sheet. The lower protective plate is pressed onto the surface of the insulating thermally conductive film below the positive electrode sheet. The lower protective plate has downwardly extending side baffles at both ends in the width direction of the chip fixing frame.

[0015] In summary, this utility model has the following beneficial effects:

[0016] This utility model integrates the water pipe and shell into a single die-cast unit, avoiding the risk of leakage from the flow channel from the design stage. It also eliminates the need for flow channel installation, simplifies production steps, reduces production costs, and improves production efficiency. The heating pack is a single unit that can be inserted as a whole for easy installation. It also has only three pins that connect directly to the controller, reducing the need for adapter boards and simplifying the process. Furthermore, the water pipe forms an S-shaped flow channel, resulting in lower internal resistance. The first and second pipe sections are located above and below the heating pack, respectively, which can fully conduct the heat generated by the heating pack into the fluid, resulting in higher thermal efficiency. Attached Figure Description

[0017] Figure 1 This is a three-dimensional schematic diagram of the present invention;

[0018] Figure 2 This is a three-dimensional schematic diagram of the present invention (excluding the cover plate);

[0019] Figure 3 This is a perspective view of the present invention (excluding the cover plate and controller);

[0020] Figure 4 This is a three-dimensional schematic diagram of the present invention (with part of the housing, controller, and cover removed);

[0021] Figure 5 This is an explosion diagram of the heating pack of this utility model;

[0022] Figure 6 This is a three-dimensional schematic diagram of part of the structure of the heating pack of this utility model;

[0023] Figure 7 This is a three-dimensional schematic diagram of the chip fixing frame and PTC core of the heating pack of this utility model;

[0024] Figure 8 This is a partial cross-sectional view of the heating pack of this utility model;

[0025] Figure 9 A 3D schematic diagram of the water pipes and heating element;

[0026] In the diagram, 1 is the water pipe, 10 is the inlet pipe, 11 is the outlet pipe, 12 is the first pipe section, 13 is the second pipe section, 14 is the transition bend, 15 is the high-pressure connector, and 16 is the low-pressure connector.

[0027] 120 is a straight pipe, and 121 is a connecting bend.

[0028] 2 is the housing, 20 is the mounting slot, and 21 is the mounting cavity.

[0029] 3 is the heating element; 30 is the chip fixing frame; 301 is the spacer strip; 302 is the first receiving area; 303 is the second receiving area; 31 is the PTC core; 32 is the positive electrode sheet; 33 is the first negative electrode sheet; 34 is the second negative electrode sheet; 320 is the positive pin; 304 is the first clearance slot; 330 is the first negative pin; 340 is the second negative pin; 305 is the second clearance slot; 306 is the third clearance slot; 35 is the insulating thermally conductive film; 36 is the protective plate; 360 is the upper protective plate; 361 is the lower protective plate; 362 is the transition section; 3610 is the side baffle; and 4 is the controller.

[0030] 5 is the cover plate. Detailed Implementation

[0031] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0032] It should be noted that when a component is referred to as being "set on" or "fixed to" another component, it can be directly on the other component or there may be an intermediate component. When a component is referred to as being "fixed to" another component, or "fixedly connected" to another component, the fixing method can be detachable or non-detachable. When a component is considered to be "connected" or "rotatably connected" to another component, it can be directly connected to the other component or there may be an intermediate component. The terms "vertical," "horizontal," "left," "right," "upper," "lower," and similar expressions used are for illustrative purposes only and do not represent the only possible implementation.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of this invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0034] In this invention, terms such as "first," "second," and "third" are used not to represent specific quantities or orders, but merely to distinguish names.

[0035] See Figures 1 to 4As shown, the water-integrated die-cast liquid heater includes a water pipe 1, a shell 2, and a heating element 3. The water pipe 1 includes an inlet pipe 10, an outlet pipe 11, a first pipe section 12 connected to the inlet pipe 10, and a second pipe section 13 connected to the outlet pipe 11. The first pipe section 12 and the second pipe section 13 are connected by a transition bend 14, thus forming a continuous water path from the inlet pipe to the outlet pipe. The first pipe section 12 and the second pipe section 13 are parallel to each other. The water pipe 1 and the shell 2 are die-cast integrally, forming a sealed water channel within the shell, eliminating the need for subsequent processing and overcoming the leakage problem that may exist in assembled water channels in the prior art. Furthermore, an installation groove 20 is formed within the shell 2 between the first pipe section 12 and the second pipe section 13. The heating element 3 is embedded and installed in the installation groove 20, and the heat generated by the heating element is transferred to the shell. The heating element is supplied to the liquid flowing through the water pipe, thereby heating the liquid. Located between the first and second pipe sections, the heating element can heat both sections simultaneously, ensuring its heating efficiency. The housing 2 also has a mounting cavity 21 communicating with the mounting groove 20. The controller 4 is installed in the mounting cavity 21 and connected to the heating element 3. A cover plate 5 is also included to seal the mounting cavity, ensuring its airtightness and protecting the controller, meeting the requirements of harsh environments. The housing 1 also has a high-voltage connector 15 and a low-voltage connector 16 connected to the controller. These connectors connect the high-voltage and low-voltage power supplies to the controller, and their connector structure enhances the electrical safety of the equipment.

[0036] This invention improves upon the existing method of machining water channels on the shell by pre-forming water pipes into water channels for water flow, and then integrally die-casting the pre-formed water channels with the shell. This eliminates the need for machining on the shell and post-sealing, reducing processing steps, improving production efficiency, and overcoming the problem of leakage in the later stages of products in the existing technology.

[0037] Furthermore, the structural form of the first pipe section is specified here; see [link to relevant documentation]. Figure 4 and Figure 9As shown, the first pipe section 12 includes several straight pipes 120. Specifically, in this embodiment, seven straight pipes are provided. One end of the straight pipe 120 at the front end is connected to the water inlet pipe 10, and one end of the straight pipe 120 at the rear end is connected to the transition bend 14. The straight pipes 120 are in the same plane and parallel to each other. One end of adjacent straight pipes 120 is connected by a connecting bend 121 to form a continuous water flow channel. The structure of the first pipe section is limited here. By adopting the above structural design, the length of the water flow channel is effectively guaranteed, and the heating pack can better heat the liquid in the water flow channel, thereby meeting the user's requirements for the outlet water temperature. In addition, the straight pipes and the connecting bend form an S-shaped flow channel, resulting in low internal resistance of the water flow.

[0038] Preferably, the structure of the second pipe section 13 is the same as that of the first pipe section 12. Using the same structural design can reduce the processing difficulty and improve the processing efficiency, thereby reducing the manufacturing cost of the product. For other different considerations, the structure of the second pipe section may be different from that of the first pipe section, which also falls within the protection scope of this utility model.

[0039] The distance between the opposite surfaces of the first pipe section 12 and the second pipe section 13 is between 20-24mm. The distance between the first pipe section and the second pipe section is further limited here. On the one hand, it ensures that there is enough space between them to facilitate the processing and forming of the installation groove. On the other hand, it ensures that the height of the installation groove is sufficient to facilitate the installation of the heating pack.

[0040] The structure of the heating pack is described below; see [link / reference]. Figures 4 to 8As shown, the heating pack 3 includes a chip fixing frame 30, on which a spacer strip 301 is provided. The spacer strip 301 divides the chip fixing frame into a first receiving area 302 and a second receiving area 303. Both the first receiving area 302 and the second receiving area 303 contain PTC chips 31. Specifically, each receiving area contains three rows and ten columns of PTC chips. It also includes a positive electrode plate 32, which is located below the PTC chips and connected to the PTC chips 31 in both the first and second receiving areas. Furthermore, it includes a first negative electrode plate 33 and a second negative electrode plate 34. The electrode plate 34, the first negative electrode plate 33 is located in the first receiving area 302, and the first negative electrode plate 33 is located on top of and connected to the PTC core in the first receiving area. The second negative electrode plate 34 is located in the second receiving area, and the second negative electrode plate 34 is located on top of and connected to the PTC core in the second receiving area. The positive electrode plate, the first negative electrode plate and the second negative electrode plate are used to realize the electrical connection between the positive and negative electrodes of the PTC core. During use, the first negative electrode plate and / or the second negative electrode plate can be connected simultaneously according to the power requirements of the liquid heater. The power of the heating pack is set according to the usage requirements through the IGBT on the controller end, which meets the diverse usage needs of users. Moreover, the heating pack of this utility model is a whole. The installation scheme only requires external wiring of the positive electrode plate, the first negative electrode plate and the second negative electrode plate, without the need for a lot of welding, which reduces the manufacturing difficulty, improves the production efficiency and ensures the quality of the product.

[0041] The lower end face of the spacer 301 is flush with the surface of the PTC core 31, and the lower surface of the positive electrode 32 is higher than the surface of the chip fixing frame 30. One end of the positive electrode 32 extends to provide a positive lead 320. The chip fixing frame 30 is provided with a first clearance groove 304, and the positive lead 320 is fitted into the first clearance groove 304. Here, the structure of the chip fixing frame is further defined. When the positive electrode 320 is engaged with the chip fixing frame, the lower surface of the positive electrode 320 is higher than the surface of the chip fixing frame. After assembly, the positive electrode 320 is compressed, which ensures that the positive electrode 320 is in close contact with the PTC core.

[0042] The upper surfaces of the first negative electrode 33 and the second negative electrode 34 are higher than the upper surface of the chip fixing frame 30. The first negative electrode 33 is provided with a first negative pin 330, and the second negative electrode 34 is provided with a second negative pin 340. The chip fixing frame is provided with a second clearance groove 305 and a third clearance groove 306. The first negative pin 330 is fitted into the second clearance groove 305, and the second negative pin 340 is fitted into the third clearance groove 306. Here, the structure of the negative electrode and the chip fixing frame is also limited. By setting the second clearance groove and the third clearance groove, the negative pin of the negative electrode is given room, which also avoids the negative electrode being squeezed and deformed during subsequent installation, thus ensuring the reliability of the connection between the negative electrode and the PTC core.

[0043] See Figure 5 As shown, it also includes an insulating thermally conductive film 35, which covers the surfaces of the first negative electrode plate, the second negative electrode plate, and the positive electrode plate. The insulating thermally conductive film plays a role in insulating and conducting heat, on the one hand preventing short circuits between the heating pack and the shell, and on the other hand enabling rapid heat transfer to ensure the heating effect of the heating pack.

[0044] See Figure 5 As shown, it also includes a protective plate 36, which includes an upper protective plate 360, a lower protective plate 361, and a transition portion 362 connecting the upper and lower protective plates. The upper protective plate 360 ​​is pressed onto the surface of the insulating thermally conductive film of the first negative electrode sheet 33 and the second negative electrode sheet 34. The lower protective plate 361 is pressed onto the surface of the insulating thermally conductive film below the positive electrode sheet. The lower protective plate has downwardly extending side baffles 3610 at both ends in the width direction of the chip fixing frame. In order to ensure the reliability of the heating pack in the mounting slot, a plug can also be added. The plug is inserted into the mounting slot, the upper surface of the plug abuts against the lower protective plate, and the left and right positions of the plug are limited by the side baffles.

[0045] In summary, this utility model has the following beneficial effects:

[0046] This utility model integrates the water pipe and shell into a single die-cast unit, avoiding the risk of leakage from the flow channel from the design stage. It also eliminates the need for flow channel installation, simplifies production steps, reduces production costs, and improves production efficiency. The heating pack is a single unit that can be inserted as a whole for easy installation. It also has only three pins that connect directly to the controller, reducing the need for adapter boards and simplifying the process. Furthermore, the water pipe forms an S-shaped flow channel, resulting in lower internal resistance. The first and second pipe sections are located above and below the heating pack, respectively, which can fully conduct the heat generated by the heating pack into the fluid, resulting in higher thermal efficiency.

[0047] Based on the described embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

Claims

1. A water-integrated die-cast liquid heater, comprising water pipes, a shell, and a heating element, characterized in that: The water pipe includes an inlet pipe, an outlet pipe, a first pipe section connected to the inlet pipe, and a second pipe section connected to the outlet pipe. The first and second pipe sections are connected by a transition bend. The first and second pipe sections are parallel to each other. The water pipe and the housing are integrally die-cast, and an installation groove is formed in the housing between the first and second pipe sections. The heating element is embedded in the installation groove. The housing also has an installation cavity communicating with the installation groove. The controller is installed in the installation cavity and connected to the heating element. The housing also includes a cover plate for sealing the installation cavity. The housing also has a high-voltage connector and a low-voltage connector connected to the controller.

2. The water channel integrated die-cast liquid heater according to claim 1, characterized in that: The first pipe section includes several straight pipes. One end of the straight pipe at the front end is connected to the water inlet pipe, and one end of the straight pipe at the rear end is connected to the transition bend. The straight pipes are in the same plane and parallel to each other. One end of adjacent straight pipes is connected by a connecting bend to form a continuous water flow channel.

3. The water-integrated die-cast liquid heater according to claim 2, characterized in that: The structure of the second pipe section is the same as that of the first pipe section.

4. The water channel integrated die-cast liquid heater according to claim 2, characterized in that: The distance between the opposite surfaces of the first and second pipe sections is between 20 and 24 mm.

5. The water channel integrated die-cast liquid heater according to claim 1, characterized in that: The heating pack includes a chip fixing frame, and a spacer strip on the chip fixing frame divides the chip fixing frame into a first receiving area and a second receiving area. Both the first and second receiving areas contain PTC cores. The pack also includes a positive electrode plate located below the PTC cores and connected to the PTC cores in both the first and second receiving areas. Additionally, it includes a first negative electrode plate and a second negative electrode plate. The first negative electrode plate is located in the first receiving area, above and connected to the PTC cores within the first receiving area. The second negative electrode plate is located in the second receiving area, above and connected to the PTC cores within the second receiving area.

6. The water-integrated die-cast liquid heater according to claim 5, characterized in that: The lower end face of the spacer is flush with the surface of the PTC core, the lower surface of the positive electrode sheet is higher than the surface of the chip fixing frame, one end of the positive electrode sheet extends to provide a positive lead, and the chip fixing frame is provided with a first clearance groove, in which the positive lead is fitted.

7. The water-integrated die-cast liquid heater according to claim 6, characterized in that: The upper surfaces of the first negative electrode and the second negative electrode are higher than the upper surface of the chip fixing frame. The first negative electrode has a first negative pin and the second negative electrode has a second negative pin. The chip fixing frame has a second clearance groove and a third clearance groove. The first negative pin is fitted into the second clearance groove and the second negative pin is fitted into the third clearance groove.

8. The water-integrated die-cast liquid heater according to claim 7, characterized in that: It also includes an insulating thermally conductive film, which covers the surfaces of the first negative electrode sheet, the second negative electrode sheet, and the positive electrode sheet.

9. The water-integrated die-cast liquid heater according to claim 8, characterized in that: It also includes a protective plate, which includes an upper protective plate, a lower protective plate, and a transition portion connecting the upper and lower protective plates. The upper protective plate is pressed onto the surface of the insulating thermally conductive film above the first negative electrode sheet and the second negative electrode sheet. The lower protective plate is pressed onto the surface of the insulating thermally conductive film below the positive electrode sheet. The lower protective plate has downwardly extending side baffles at both ends in the width direction of the chip fixing frame.