Processing apparatus and processing system

Abstract

The utility model provides a processing device and a processing system, the processing device processes a part bearing part structure so as to enable the part bearing part structure to be traced, and the processing device comprises a reading device. The reading device comprises an X-ray emission unit and an X-ray detection unit to read a main marker arranged in the interior of the component carrier structure; and a writing device arranged at an exterior of the component carrier structure to face at least one of the first and second exterior major surfaces of the component carrier structure to write a secondary marker associated with the processed component carrier structure and correspondingly associated with the primary marker, at least one of the reading device and the writing device is movable relative to the resting read and write position while the component carrier structure is held at the resting read and write position such that the reading device reads the primary marker and the writing device writes the secondary marker.

Description

TECHNICAL FIELD

[0001] The present utility model relates to a processing device for processing a component carrier structure to make the component carrier structure traceable, and to a processing system comprising the processing device and the component carrier structure. BACKGROUND

[0002] In the context of increasing product functionality of component carriers equipped with one or more electronic components, increasing miniaturization of such electronic components, and increasing numbers of electronic components such as printed circuit boards mounted on the component carriers, increasingly powerful array-like components or packages with several electronic components are being employed, which have a plurality of contacts or connections, and the spacing between these contacts is increasingly small. Removing the heat generated by such electronic components and the component carriers themselves during operation becomes an increasingly serious problem. At the same time, the component carriers should be mechanically robust and electrically reliable in order to be able to operate even under adverse conditions.

[0003] Traceability of the component carrier or of a preform thereof is desired, i.e. the ability to track and identify the component carrier structure, for example during manufacture and / or use. SUMMARY

[0004] It is an object of the present utility model to efficiently trace a component carrier and / or a preform thereof.

[0005] To achieve the above object, a processing device for processing a component carrier structure to make the component carrier structure traceable, and a component carrier structure are provided.

[0006] According to an exemplary embodiment of the present utility model, a processing device is provided for processing a component carrier structure to make the component carrier structure traceable, the processing device comprising: a reading device comprising an X-ray emitting unit and an X-ray detecting unit, the X-ray emitting unit and the X-ray detecting unit being arranged to respectively face opposite first and second outer major surfaces of the component carrier structure, the reading device reading a primary identifier arranged in an interior of the component carrier structure and identifying the processed component carrier structure; and a writing device arranged at an exterior of the component carrier structure to face at least one of the first and second outer major surfaces of the component carrier structure to write a secondary identifier associated with the processed component carrier structure and corresponding to the primary identifier; wherein at least one of the reading device and the writing device is movable relative to a stationary reading and writing position at which the component carrier structure is held, such that the reading device reads the primary identifier and the writing device writes the secondary identifier.

[0007] According to another exemplary embodiment of the present utility model, a processing system is provided comprising the aforementioned processing device and a traceable component carrier structure, the component carrier structure being traceable by the processing device, the component carrier structure comprising: a stack comprising a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures; a primary identifier readable by X-rays, the primary identifier being arranged in an interior of the stack and identifying the component carrier structure; and a secondary identifier optically readable, the secondary identifier being located at an exterior of the stack or closer to the exterior of the stack than the primary identifier, the secondary identifier being associated with the component carrier structure and related to the primary identifier.

[0008] In the context of the present application, the term "device for processing a component carrier structure" can in particular denote a machine configured to act on a component carrier structure so as to change structural and / or functional properties of the component carrier structure. In particular, such a device can be configured to define, physically create and / or act on physical identifiers of the component carrier structure.

[0009] In the context of the present application, the term "reading device for reading a primary identifier arranged in the interior of a component carrier" can in particular denote a device comprising a sensing element configured to sense data indicative of a characteristic and / or information content of a primary identifier positioned to be embedded or masked in the interior of a component carrier structure instead of being located on an outer surface of the component carrier structure. For example, such a reading device can be an X-ray reader. Alternatively, such a reading device can be, for example, an MRT (magnetic resonance tomography), CT (computed tomography) or PET (positron emission tomography) device.

[0010] In the context of the present application, the term "writing device for writing an identifier on the exterior of a component carrier structure" can in particular denote a device configured to create a physical identifier on an outer surface of a component carrier structure. For example, such a writing device can create a readable pattern that can be used as an identifier. For example, such a writing device can write an identifier by means of a laser, by means of an electron beam, by means of lithography and etching, or by means of printing.

[0011] In the context of the present application, the term "the reading device and the writing device are configured for reading and writing when the component carrier structure is held in a stationary reading and writing position" can in particular denote that the component carrier structure can be held or retained at a fixed position while the reading device reads an identifier from the component carrier structure and the writing device writes another identifier on the component carrier structure. The stationary reading and writing position can be configured such that it supports or allows reading and writing of identifiers of the component carrier structure when the component carrier structure is located at said stationary reading and writing position.

[0012] In the context of the present application, the term "component carrier" can in particular denote any support structure capable of accommodating one or more components on and / or in the component carrier to provide mechanical support and / or electrical connections. In other words, the component carrier can be configured as a mechanical and / or electronic carrier for components. In particular, the component carrier can be one of a printed circuit board (PCB), an organic interposer and an IC (integrated circuit) substrate. The component carrier can also be a hybrid board made of a combination of different ones of the above-mentioned types of component carriers.

[0013] In the context of the present application, the term "stack" can in particular denote a flat or planar sheet-like body. For example, the stack can be a layer stack, in particular a laminated layer stack or laminate. Such a laminate can be formed by connecting a plurality of layer structures by applying mechanical pressure and / or heat. Preferably, the stacked layer structures can be arranged parallel to each other.

[0014] In the context of the present application, the term "layer structure" can particularly denote a continuous layer, a patterned layer or a plurality of non-continuous islands in a common plane.

[0015] In the context of the present application, the term "component carrier structure" can particularly denote a component carrier (such as a printed circuit board or an IC substrate) itself or a larger body of a plurality of component carriers or preforms thereof (e.g. semi-finished products obtained individually or during the manufacturing of component carriers in a batch process), such as a panel or an array.

[0016] In the context of the present application, the term "traceable component carrier structure" can particularly denote a component carrier structure that is configured such that it can be traced or tracked during the manufacturing process and / or during use. In particular, the traceable component carrier structure can be configured such that it can be identified (particularly uniquely), more particularly by reading a secondary and / or primary identifier of the traceable component carrier. It is also possible that the traceable component carrier structure is configured to be traceable such that at least one identifier of the component carrier structure also allows retrieving information about the manufacturing process of the component carrier structure, particularly about the manufacturing batch of the component carrier structure, its manufacturing time, its manufacturing location and / or the operating parameters (e.g. temperature, humidity, etc.) of the manufacturing plant during the manufacturing of the component carrier structure. Tracing the component carrier structure can allow verifying the history, location or application of the individual component carrier structure.

[0017] In the context of the present application, the term "tracking or tracing a component carrier or a component carrier structure" can particularly denote the opportunity of a system capable of analyzing a component carrier or a component carrier structure with respect to an assigned identifier or identification code, thereby allowing identifying the component carrier or the component carrier structure and / or allowing relating the component carrier or the component carrier structure to a specific manufacturing batch or lot (e.g. for determining a lot number) and / or manufacturing location, manufacturing process (e.g. a specific customer order), time (e.g. date) or issue (e.g. a quality issue determined during product testing).

[0018] In the context of the present application, the term "identifier" can in particular denote a physical structure assigned to or associated with a component carrier or a component carrier structure or a layer structure thereof and which identifies said component carrier, said component carrier structure or said layer structure. In particular, the identifier can be a code structure. Preferably, but not necessarily, the identifier or a combination of identifiers can be unique for a particular component carrier or component carrier structure. However, it is also possible that the identifier or a combination of identifiers is identical for a certain number of component carriers or component carrier structures, e.g. for those component carriers or component carrier structures manufactured within the same batch or lot. Such an identifier can be a QR code, for example. In such a QR code or other identifier, information such as a link to a specific data set in a database can be included. Additionally or alternatively, such a QR code or other identifier can include a batch number, a panel serial number, a date and time of production of the panel, e.g. at the time of photo imaging or laser direct imaging (LDI) process. In particular, the manufacturing history of a component carrier structure or a portion thereof, e.g. a layer structure, can be directly encoded in the respective identifier(s) and / or can be retrieved from a data set in a database to which the identifier(s) link. In particular, the identifier can be an identification structure. For example, the identifier can be produced by one or more of the following processes: patterning by a lithography process or LDI; applying the identifier by pasting, cutting, scribing, casting, embossing, printing, in particular 3D printing, inkjet printing, etc.; providing the identifier made of an electrically conductive material or a dielectric material, wherein the material of the identifier should differ in its properties with respect to the surrounding material in order to enable the identifier to be read by a reader device (e.g. by providing a darker identifier made of a corresponding resin, which is surrounded by a lighter (e.g. at least partially transparent) resin, such that the identifier can be read by a reader device. By at least one lighter resin (which can also be two or more more transparent resins), the code or identifier can be made of multiple materials and / or heights. This can be used, for example, to establish a multi-dimensional code (e.g. a 4D code).

[0019] In the context of the present application, the term "main surface" of a body can in particular denote one of the two largest opposite surfaces of the body. The main surfaces can be connected by a circumferential side wall. The thickness of a body such as a component carrier structure or a stack can be defined by the distance between the two opposite main surfaces.

[0020] According to the exemplary embodiments of the present utility model, a component carrier structure can be processed to provide it with a structure that allows to reliably track it in a simple manner. For this purpose, a reading device can be provided for reading a primary marker from an embedded position in the interior of the component carrier structure. The primary marker can be configured to provide identification information for identifying the component carrier structure when read out. Advantageously, the primary marker can be read by X-ray reading of an X-ray reader device. In addition, a writing device can be used to write a secondary marker onto an external position of the component carrier structure. Advantageously, the secondary marker can be read from the outer surface of the component carrier structure by an optical reader device, such as a camera operating in the visible wavelength range. Additionally or alternatively, the secondary marker can be read by the reading device. For example, the secondary marker can be read by the X-ray reader device. The second marker can be related to the primary marker and thus also able to identify the component carrier structure, for example in terms of tracking the component carrier structure. However, the written second marker can be read by a very simple reader, such as an optical camera, which only needs the ability to read information from the externally exposed surface of the physical structure. Preferably, the information content carried by the second marker can be at least partially based on the information content carried by the primary marker, so that the information content carried by the second marker is also associated with the processed component carrier structure and thus also able to identify the component carrier structure. Thus, the surface-located second marker can support full traceability of the component carrier structure in a simple manner without the need for more complex reading devices with the ability to read hidden interior markers for tracking the component carrier structure. Advantageously, the reading device and the writing device can be arranged and able to perform the marker reading / writing tasks of the reading device and the writing device while the component carrier structure is resting at a fixed or stationary position during reading and writing. This can allow to perform the reading and writing tasks quickly without the need to transport the component carrier structure from a reading position to another writing position after reading and before writing. This can avoid unwanted damage or contamination of the component carrier structure as it remains at a fixed or stationary position during reading and writing. This can also allow to construct the device in a compact manner. Advantageously, the exemplary embodiments can allow to apply markers to component carrier structures to allow to track and link information of all layers of independent component carrier structures, such as panels for manufacturing printed circuit boards or integrated circuit substrates. Advantageously, the device and method of the exemplary embodiments can allow to achieve full traceability of component carrier structures and components carried by them along the whole processing chain from core processing to transportation and, if necessary, also during actual use.

[0021] In the following, further exemplary embodiments of the component carrier structure, the method and the apparatus will be explained.

[0022] In an embodiment, the method of processing the component carrier structure comprises reading by the X-ray reading device the primary identifier located in the interior of the component carrier structure through the at least one electrically conductive layer structure, such as a continuous or patterned metal layer. Surprisingly, the primary identifier embodied as a patterned metal structure in the interior of the component carrier structure can be read correctly by X-ray detection even through another electrically conductive layer structure of the component carrier structure between the reading device and the primary identifier.

[0023] In an embodiment, the reading device comprises an X-ray emitting unit and an X-ray detection unit. The X-ray emitting unit can be configured to generate X-rays and to direct the X-rays onto the component carrier structure to be processed for reading out the primary identifier. The X-ray detection unit can be arranged relative to the X-ray emitting unit and the component carrier structure to detect X-rays that have been emitted by the X-ray emitting unit and passed through the component carrier structure, and in particular the first identifier embedded therein. The X-ray emitting unit and / or the X-ray detection unit can be moved individually to increase the flexibility of the mutual spatial adjustment of the reading operation. Alternatively, the X-ray emitting unit and / or the X-ray detection unit can be spatially fixed.

[0024] In an embodiment, it is possible to detect a negative image at the time of reading. The metal structure can not allow the X-rays to pass through completely, so that a reduced amount of X-rays can pass through the metal portion of the PCB compared to the portion containing the resin.

[0025] In an embodiment, the writing device is configured for writing the secondary identifier in a laser manner. In other words, the writing device can comprise a laser source which can be controlled for emitting a laser beam which acts on the outer surface of the component carrier structure in order to write the secondary identifier on the component carrier structure. For example, the laser source can be scanned over an extension of the component carrier structure or a portion thereof in order to write the secondary identifier.

[0026] In an embodiment, the writing device comprises a first writing unit for writing a first secondary identifier on a first outer main surface of the component carrier structure, and comprises a second writing unit for writing a second secondary identifier on a second, opposite outer main surface of the component carrier structure. In such an advantageous embodiment, two secondary identifiers can be written on two opposite main surfaces of the component carrier structure. This allows to obtain a component carrier structure which can be identified during tracking of the tracking process by reading the second identifier from any exposed main surface of the component carrier structure. For example, each of the two writing units can be configured to write the respective secondary identifier in a laser-like manner, as explained in the preceding paragraph. By forming the respective secondary identifiers on both opposite main surfaces of the component carrier structure also the reliability can be improved, because when one of the two redundant secondary identifiers is damaged during production or use, for example by an external impact, the identification of the component carrier during tracking of the tracking process can also be successfully accomplished. The respective secondary identifiers can be formed on the top side and the bottom side of the component carrier structure by laser treatment. This redundancy can simplify the reading of the secondary identifiers, for example when one side of the component carrier structure (e.g. a panel) is not currently readable during handling (e.g. because the component carrier structure is resting on the ground). Thereby, complex and time-consuming processes such as panel flipping can be avoided. This can also avoid unnecessary damage or contamination of the component carrier structure.

[0027] In an embodiment, the arrangement and configuration of the first and second writing units is such that the first and second secondary identifiers can be written simultaneously. Advantageously, the first writing unit can process the first exposed main surface of the component carrier structure to form the first secondary identifier thereon, while the second writing unit can process the second exposed main surface of the component carrier structure to form the second secondary identifier thereon. Such a fully simultaneous, quasi-simultaneous or temporarily overlapping writing process can shorten the processing time and can increase the throughput of the processed component carrier structures.

[0028] In an embodiment, the apparatus comprises a primary analysis unit for analyzing information read from the primary identifier. The primary analysis unit can be provided with the detected data when the reading device has read the primary identifier arranged in the interior of the component carrier structure and can process and analyze the detected data. In particular, the primary analysis unit can be configured to retrieve identification information from the read primary identifier. This retrieved identification information, which identifies the assigned component carrier structure, can then be used to define the secondary identifier to be written on the exterior of the component carrier structure. In some exemplary embodiments, data corresponding to the primary identifier detected by the X-ray detection unit is provided to the primary analysis unit, which analyzes the data corresponding to the primary identifier.

[0029] In an embodiment, the processing apparatus comprises a generating unit for generating a secondary identifier based on the analyzed primary identifier, the generated secondary identifier being forwarded to the writing device. For example, the identification information retrieved by the primary analysis unit from the read and analyzed primary identifier can be passed to the generating unit, which can determine or define the information content of the secondary identifier to be written on the exterior of the component carrier structure on this basis.

[0030] In an embodiment, the generating unit is configured to generate a secondary identifier having additional information content and / or having reduced information content compared to the analyzed primary identifier. While the information content of the first and second identifiers can not be identical, there can be an overlap of the information content of the first identifier and the information content of the second identifier. In one embodiment, the information content of the second identifier comprises all information content of the first identifier plus additional information content (e.g. additional information content reflecting additional processing steps after the formation of the primary identifier). It is also possible to omit information content of the primary identifier for the second identifier, for example when the second identifier only carries a more concise information content about the identity of the component carrier structure without carrying additional information such as processing parameters. In yet another embodiment, the generating unit can be configured to generate a secondary identifier having the same information content as the analyzed primary identifier, for example as a true copy thereof. In this case, the information content of the secondary identifier can be a fingerprint of the information content of the primary identifier. In particular, the primary identifier and the secondary identifier can have partly or wholly identical information content.

[0031] In an embodiment, the component carrier structure comprises a further primary marker arranged in the interior of the component carrier structure, the further primary marker being in a different position than the primary marker. If the primary analysis unit determines that the primary marker is not readable, the reading device is instructed to read the further primary marker arranged in the interior of the component carrier structure and to identify the processed component carrier structure. In undesired cases, it can happen that the primary marker located in the interior of the component carrier structure cannot be read correctly from the outside, for example because the material between the primary marker and the reading device, for example a region of the component carrier structure having a significant copper content, reduces the accuracy of the information read out from the primary marker. It can also happen that the primary marker is subject to a manufacturing error and does not actually carry all the desired information. In such cases, it can happen that the reading device cannot correctly read the information content of the primary marker. However, in order to allow the secondary marker to be meaningfully created on the basis of at least a part of the information content of the first marker that could not be read correctly, a further, for example fully redundant, primary marker can be arranged in the interior of the component carrier structure at a further position. Then, when the ordinary primary marker is not readable, the other primary marker can be used to read out the identification information of the component carrier structure. This backup feature improves the failure robustness of the system. The information content of the ordinary primary marker and the other primary marker can be identical or overlapping. In order to correctly read out the further primary marker, the reading device can be moved from the reading position for reading the ordinary primary marker to a further reading position for reading the further primary marker.

[0032] In an embodiment, the processing device can comprise a suggestion unit coupled with the primary analysis unit. If the primary analysis unit determines that the primary marker and optionally the further primary marker are readable or not readable, the suggestion unit is triggered by the primary analysis unit and outputs a warning inviting, for example a user, to provide information for identifying the component carrier structure. Thus, the failure robustness of the system can be further improved when adding a further option for providing identification information about the component carrier structure, even when the primary marker and the further primary marker, both embedded in the interior of the component carrier structure, are not readable. In this case, the suggestion unit can automatically output a notification or an alarm, thereby enabling a human operator to manually provide the identification information required for creating the secondary marker. For example, the operator can provide the identification information by means of a hand-held scanner or by entering an alphanumeric code in an input device.

[0033] In embodiments, the processing device comprises a secondary analysis unit for analyzing the written secondary identifiers. When at least one secondary identifier has been written or formed on the outer surface of the component carrier structure (e.g. by moving a laser beam), the secondary analysis unit can read out the secondary identifier to verify whether the secondary identifier has been correctly formed. Thus, the written secondary identifier can be read out and its information content can be retrieved and analyzed. The determined information content of the secondary identifier can be compared with the target information content of the secondary identifier derived from the primary identifier read out previously as a basis for writing the secondary identifier. If the actual information content of the read out secondary identifier corresponds with the target information content of the secondary identifier, the secondary analysis unit can conclude that the formation of the secondary identifier has been successful and the processing of the associated component carrier structure can be continued. If not, a predetermined action can be taken. Such predetermined action can be, for example, repeating the process of writing the second identifier, performing a repair procedure, or classifying the associated component carrier structure as defective or waste.

[0034] In embodiments, the secondary analysis unit comprises an optical camera. Such optical camera can be, for example, a CMOS camera or a CCD camera. An optical camera operating in the visible light range or in the infrared range can be used. With such optical camera, the secondary identifier can be read out from the outside of the component carrier structure in a simple manner.

[0035] In embodiments, the reading device is movable relative to the stationary reading and writing position. Such movement can be, for example, a longitudinal movement and / or a tilting movement. Different elements of the reading device (e.g. the X-ray emission unit and the X-ray detection unit) can also be moved relative to each other. With such movable reading device, the reading device can be correctly aligned relative to the stationary component carrier structure to correctly read out the embedded primary identifier.

[0036] In embodiments, the writing device is movable relative to the stationary reading and writing position. Such movement can be, for example, a longitudinal movement and / or a tilting movement. Different elements of the writing device (e.g. the first writing unit and the second writing unit) can also be moved individually or relative to each other. With such movable writing device, the writing device can be correctly aligned relative to the stationary component carrier structure to correctly write the external secondary identifier, or even to write multiple secondary identifiers simultaneously.

[0037] In an embodiment, the apparatus comprises at least one electrostatic discharge protection feature for protecting the component carrier structure. In the context of the present application, the term "electrostatic discharge protection feature" can in particular denote any structural provision of the apparatus that improves the electrostatic discharge (ESD) protection of the component carrier structure handled by the apparatus. For example, the at least one electrostatic discharge protection feature can comprise an electrostatic safe chuck configured to handle the component carrier structure by suction in an electrostatic discharge protected manner. It is also possible that the at least one electrostatic discharge protection feature comprises an electrostatic discharge safe table on which the component carrier structure can be placed during handling or processing by the apparatus. Additionally or alternatively, the at least one electrostatic discharge protection feature can comprise an electrostatic discharge safe roller over which the component carrier structure can be conveyed by rolling during handling or processing by the apparatus. Further additionally or alternatively, the at least one electrostatic discharge protection feature can comprise an electrostatic discharge safe grounding means for grounding the apparatus. The electrostatic discharge safe grounding means can for example be implemented by an electrostatic discharge safe foot by which the apparatus stands on the ground.

[0038] In an embodiment, the processing device comprises a layer build-up forming device for attaching and processing one or more additional layer structures to one or both opposite main surfaces of the component carrier structure, in other words, the layer build-up forming device is configured to attach one or more additional layer structures to at least one of the first outer main surface and the second outer main surface of the component carrier structure. Preferably, the writing device can be configured to write at least one further secondary identifier related to the read primary identifier on the outside of the one or more additional layer structures. Thus, the component carrier structure can comprise at least one further secondary identifier on or in the stack, which is associated with the component carrier structure and related to the primary identifier, wherein the secondary identifier is arranged between the primary identifier and the at least one further secondary identifier. Such layer build-up forming can comprise attaching, patterning and / or depositing one or more layers, such as an arrangement of prepreg layers, copper foils, deposited copper layers and / or copper vias, on one or both opposite main surfaces of the component carrier structure being processed. Further, such layer build-up forming can comprise patterning and / or other processes of such layers. After forming such additional layer build-up on the component carrier structure, the secondary identifier previously located on the surface can be hidden by the one or more additional layers, such that the secondary identifier can no longer be read out by a simple optical camera or the like. In this case, it can be advantageous to write one or more further secondary identifiers on the outer surface of the component carrier structure, on which additional outer layers are present. For example, the further secondary identifier can have the same information content as the previously formed secondary identifier. Alternatively, the information content of the one or more further secondary identifiers can differ from the information content of the previously formed one or more secondary identifiers. In any case, the at least one further secondary identifier can comprise information allowing for identifying the assigned component carrier structure. The secondary identifier can be formed at a plurality of different vertical layers or levels of the component carrier structure, for example at least six layers, at least 12 layers or even at least 16 layers. Thus, the process of forming one or more further secondary identifiers can be repeated one or more times, for example after each new layer attachment.

[0039] In an embodiment, the processing apparatus comprises a transport mechanism for transporting the component carrier structures from a loader unit for loading the component carrier structures to the reading and writing position to an unloader unit for unloading the component carrier structures. For example, a source magazine of stacked component carrier structures can be present at the loader unit. The component carrier structures one after the other can be transported from the loader unit via the reading and writing position to the unloader unit for unloading the one after the other processed component carrier structures into a target magazine. The transport mechanism can comprise at least one conveyor belt and / or at least one robotic manipulator or the like for transporting the component carrier structures. This can simplify the handling of the component carrier structures to be processed.

[0040] In an embodiment, the processing apparatus comprises a removal mechanism for removing component carrier structures that are classified as defective, for example due to a detected defect of the primary identifier and / or the secondary identifier. When the inspection of the primary identifier and / or the secondary identifier leads to a result that the inspected identifier or the assigned component carrier structure is defective, for example because the inspected identifier cannot be read out or does not carry the desired information content, the corresponding component carrier structure can be rejected as a defective product from the processing chain of the apparatus. For example, the defective component carrier structures can be stacked as a defective staple. This ensures a correct processing of the component carrier structures and suppresses a risk of defects.

[0041] In an embodiment, the transport mechanism is configured for moving the component carrier structures to be processed between the loader unit and the unloader unit in a further direction transverse to the direction along which the defective component carrier structures are removed. This allows a clear and reliable separation of the good component carrier structures and the defective component carrier structures.

[0042] In an embodiment, the processing apparatus is configured as a single integral machine, all constituent components of the processing apparatus being arranged inside a common housing. Advantageously, all constituent components, in particular the reading device and the writing device and the handling mechanism for handling the component carrier structures, can be arranged inside a common housing or enclosure. This allows manufacturing the apparatus in a highly compact manner, so that the space consumption in the factory is small. Furthermore, this allows improving the safety during operation, for example when X-rays are involved in the operation. This can also prevent an unnecessary foreign body contamination of the component carrier structures.

[0043] In an embodiment, the apparatus can comprise a further constituent component for preventing the radiation from passing through and / or reaching the environment, for example a lead box.

[0044] In embodiments, the primary identifier readable by X-ray comprises a QR code (or another two-dimensional code), a barcode (or another one-dimensional code), a copper pattern (e.g. forming a QR code) and / or a laser direct imaging formed pattern. Correspondingly, the secondary identifier optically readable can comprise a QR code, a barcode (or another one-dimensional code), a laser written code (e.g. formed by laser direct imaging) and / or a human readable code (e.g. an alphanumeric code). For example, the primary and / or secondary identifier can be formed as a copper pattern and thus as an integral part of the component carrier structure. This can allow for manufacturing the respective identifier fully integrated in the component carrier manufacturing process, thus essentially requiring no additional labor.

[0045] In embodiments, each of the primary and secondary identifier is individually configured as a unique identifier of the component carrier structure. Thus, the respective identifier can comprise or encode or carry information for identifying the component carrier structure and for distinguishing the component carrier structure from all other component carrier structures. In other words, thus no two component carrier structures can have an identifier carrying exactly the same content of identification information. In embodiments, a part of the respective identifier tag (e.g. the primary or secondary identifier) can comprise a conductive trace, pad, bump and / or via.

[0046] In some example embodiments, the primary and secondary identifier can have partly the same or exactly the same content of information.

[0047] In some example embodiments, the component carrier structure can comprise at least one further secondary identifier on or in the stack, the at least one further secondary identifier being associated with the component carrier structure and related to the primary identifier, the secondary identifier being arranged between the primary identifier and the at least one further secondary identifier.

[0048] The component carrier, the reading device and the writing device can be fixed relative to each other, preferably along a certain direction from the loading section to the unloading section (the unloading section being for transporting the component carrier structure). This can enable the possibility of a continuously operating machine or device, e.g. not only in a batch process. Optionally, the device can have multiple such movable or locally fixed stations. Advantageously, this can make it possible to provide only one conveyor.

[0049] In an embodiment, the component carrier structure or its component carrier comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier can be a laminate of the mentioned electrically insulating layer structure and electrically conductive layer structure, in particular formed by applying mechanical pressure and / or thermal energy. The mentioned stack can provide a plate-like component carrier which is able to provide a large mounting surface for further components and still be very thin and compact.

[0050] In an embodiment, the component carrier structure or its component carrier is shaped as a plate. This facilitates a compact design, wherein the component carrier still provides a large basis for mounting components thereon. In particular, a bare chip as an example of an electronic component can be surface mounted on a thin plate such as a printed circuit board.

[0051] In an embodiment, the component carrier is configured as one of a printed circuit board, a substrate (in particular an IC substrate), and an interposer.

[0052] In the context of the present application, the term “printed circuit board” (PCB) can in particular denote a plate-like component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, for example by applying pressure and / or by supplying thermal energy. As a preferred material for PCB technology, the electrically conductive layer structures are made of copper, while the electrically insulating layer structures can comprise resin and / or glass fibers, i.e. so-called prepreg or FR4 material. Via-holes through the laminate are formed, for example by laser drilling or mechanical drilling, and via-holes or any other via-connections are formed by partially or completely filling these via-holes with an electrically conductive material, in particular copper, in order to connect the various electrically conductive layer structures to each other in a desired manner. The filled holes connect the entire stack (via-hole connections extending through a plurality of layers or the entire stack), or the filled holes connect at least two electrically conductive layers, referred to as vias. Similarly, optical interconnections can be formed through the individual layers of the stack in order to accommodate an electro-optical circuit board (EOCB). The printed circuit board is typically configured to accommodate one or more components on one or both opposite surfaces of the plate-like printed circuit board. The components can be connected to the respective main surface by soldering. The dielectric part of the PCB can consist of resin with reinforcing fibers such as glass fibers.

[0053] In the context of the present application, the term "substrate" can in particular denote a component carrier. The substrate can be a relatively small component carrier in relation to a PCB, one or more components can be mounted on the component carrier, and the substrate can act as a connection medium between the one or more chips and another PCB. For example, the substrate can have substantially the same size as the components (in particular electronic components) to be mounted on the substrate, for example in the case of a chip scale package (CSP). More specifically, the substrate can be understood as a carrier for electrical connections or electrical networks and as a component carrier comparable to a printed circuit board (PCB), but with a comparably high lateral and / or vertical arrangement of connection density. Lateral connections are for example conductive paths, while vertical connections can be for example drillings. These lateral and / or vertical connections are arranged within the substrate and can be used to provide electrical, thermal and / or mechanical connections between the housed components or non-housed components, such as bare chips, in particular IC chips, and a printed circuit board or an intermediate printed circuit board. Thus, the term "substrate" also includes "IC substrate". The dielectric part of the substrate can consist of a resin with reinforcing particles, such as reinforcing spheres, in particular glass spheres.

[0054] The substrate or interposer can comprise or consist of at least one layer of glass, silicon (Si) or a photoimageable or dry-etchable organic material like an epoxy build-up layer material such as an epoxy build-up film or a polymeric compound which can or can not include photo- and / or thermo- sensitive molecules like polyimide or polybenzoxazole.

[0055] In embodiments, the at least one electrically insulating layer structure comprises at least one of the following: a resin or polymer such as an epoxy resin, a cyanate ester resin, a benzocyclobutene resin, a melamine derivative, polybenzoxazole (PBO), a bismaleimide triazine resin, a polyphenylene derivative (e.g. based on polyphenylene ether, PPE), a polyimide (PI), a polyamide (PA), a liquid crystal polymer (LCP), a polytetrafluoroethylene (PTFE), a bisbenzocyclobutene (BCB), and / or combinations thereof. Reinforcing structures made of glass (multilayer glass), such as meshes, fibers, spheres or other kinds of filler particles, can also be used, e.g. to form a composite material. Semi-impregnated resins combined with reinforcing agents, e.g. fibers impregnated with the above-mentioned resins, are referred to as prepregs. These prepregs are often named after a property describing their flame retardant properties, e.g. FR4 or FR5. While prepregs, in particular FR4, are often preferred for rigid PCBs, other materials, in particular epoxy-based build-up materials (such as epoxy-based build-up films) or photoimageable dielectric materials can also be used. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers and / or cyanate ester resins can be preferred. In addition to these polymers, low-temperature co-fired ceramic (LTCC) or other low-DK, very low-DK or ultra-low-DK materials can be applied as electrically insulating layer structures in the component carrier.

[0056] In embodiments, the at least one electrically conductive layer structure comprises at least one of the following: copper, aluminum, nickel, silver, gold, palladium, tungsten and magnesium. While copper is often preferred, other materials or coated versions thereof are also possible, in particular coated with a superconductive material or an electrically conductive polymer, such as graphene or poly(3,4-ethylenedioxythiophene) (PEDOT), respectively.

[0057] The at least one component can be surface mounted on and / or embedded in the component carrier structure. Such components can be selected from the group consisting of non-conducting inlays, conducting inlays such as metallic inlays, preferably comprising copper or aluminum, heat transfer units such as heat pipes, light guiding elements such as optical waveguides or light conductor connections, electronic components or combinations thereof. The inlays can be, for example, metal blocks, with or without an insulating material coating (IMS inlays), which can be surface mounted to facilitate heat dissipation. Suitable materials are defined by their thermal conductivity, which should be at least 2 W / mK. Such materials are typically based on, but not limited to, metals, metal oxides and / or ceramics, such as copper, aluminum oxide (AI2O3) or aluminum nitride (AIN). To increase the heat exchange capability, other geometrical shapes with increased surface area are also frequently used. Furthermore, the components can be active electronic components (with implemented at least one p-n junction), passive electronic components such as resistors, inductors or capacitors, electronic chips, storage devices such as DRAM or other data storage, filters, integrated circuits such as field-programmable gate arrays (FPGA), programmable array logic (PAL), generic array logic (GAL) and complex programmable logic devices (CPLD), signal processing components, power management components such as field effect transistors (FET), metal oxide semiconductor field effect transistors (MOSFET), complementary metal oxide semiconductor (CMOS), junction field effect transistors (JFET) or insulated-gate field-effect transistor (IGFET), all based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga2O3), indium gallium arsenide (InGaAs) and / or any other suitable inorganic compound), optoelectronic interface elements, light emitting diodes, optocouplers, voltage converters such as DC / DC converters or AC / DC converters, cryptographic components, transmitters and / or receivers, electromechanical transducers, sensors, actuators, microelectromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips and energy harvesting units. However, other components can be surface mounted on the component carrier. For example, magnetic elements can be used as components. Such magnetic elements can be permanent magnetic elements such as ferromagnetic elements, antiferromagnetic elements, multiferroic elements or ferrimagnetic elements, for example ferrite cores, or can be paramagnetic elements. However, the component can also be an IC substrate, an interposer or another component carrier, for example in a board-in-board configuration. The components can be surface mounted on the component carrier and / or can be embedded in the component carrier. Furthermore, other components, in particular those generating and emitting electromagnetic radiation and / or being sensitive to electromagnetic radiation propagating from the environment, can also be used as components.

[0058] In an embodiment, the component carrier structure or its component carriers is a laminate type component carrier structure or component carrier. In such an embodiment, the component carrier is a composite of a multi-layer structure that is stacked and connected together by applying a compressive force and / or heat.

[0059] After processing the inner layer structure of the component carrier structure or its component carriers, one or more further electrically insulating layer structures and / or electrically conductive layer structures can be symmetrically or asymmetrically applied (in particular by lamination) to one main surface or both opposite main surfaces of the processed layer structure. In other words, the build-up can be continued until a desired number of layers is obtained.

[0060] After the formation of the stack of electrically insulating layer structures and electrically conductive layer structures is completed, the obtained layer structure or component carrier can be subjected to a surface treatment.

[0061] In particular, with respect to the surface treatment, an electrically insulating solder resist can be applied to one or both opposite main surfaces of the layer stack or component carrier. For example, such a solder resist can be formed over the entire main surface and subsequently the solder resist layer can be patterned so as to expose one or more electrically conductive surface portions that are to be used for electrically coupling the component carrier to electronic peripherals. The surfaces of the component carrier that are still covered by the solder resist surface portions can be effectively protected against oxidation or corrosion, in particular surface portions comprising copper are effectively protected against oxidation or corrosion.

[0062] With respect to the surface treatment, the exposed electrically conductive surface portions of the component carrier can also be selectively subjected to a surface treatment. Such a surface treatment can be an electrically conductive covering material on the exposed electrically conductive layer structures (such as pads, conductive tracks, etc., in particular comprising or consisting of copper) on the surface of the component carrier. If such exposed electrically conductive layer structures are not protected, the exposed electrically conductive component carrier material (in particular copper) can oxidize, making the component carrier less reliable. The surface treatment can then be formed as, for example, a joint between a surface mounted component and the component carrier. The surface treatment has the function of protecting the exposed electrically conductive layer structures (in particular copper circuitry) and enabling a joining process (for example by soldering) with one or more components. Examples of suitable materials for the surface treatment are organic solderability preservatives (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), gold (in particular hard gold), chemical tin, nickel gold, nickel-palladium gold, etc.

[0063] The above-defined aspects and other aspects of the present utility model are apparent from and will be elucidated with reference to the examples of embodiments described below. BRIEF DESCRIPTION OF DRAWINGS

[0064] Figure 1 A three-dimensional view of the apparatus for processing a component carrier structure to make the component carrier structure traceable according to an example embodiment of the present application is shown.

[0065] Figure 2 Another three-dimensional view of the apparatus for processing a component carrier structure to make the component carrier structure traceable is shown. Figure 1

[0066] Figure 3 A plan view of the apparatus for processing a component carrier structure to make the component carrier structure traceable is shown. Figure 1

[0067] Figure 4 A side view of the apparatus for processing a component carrier structure to make the component carrier structure traceable is shown. Figure 1

[0068] Figure 5 Another side view of the apparatus for processing a component carrier structure to make the component carrier structure traceable is shown. Figure 1

[0069] A three-dimensional view of the apparatus for processing a component carrier structure to make the component carrier structure traceable according to an example embodiment of the present application is shown. Figure 6

[0070] A detailed view of a portion of the interior of the apparatus for processing a component carrier structure to make the component carrier structure traceable is shown. Figure 7 Figure 6 A detailed view of another portion of the interior of the apparatus for processing a component carrier structure to make the component carrier structure traceable is shown.

[0071] Figure 8 Figure 6 An image of a component carrier structure according to an example embodiment of the present application is shown.

[0072] Figure 9 A detailed view of yet another portion of the interior of the apparatus for processing a component carrier structure to make the component carrier structure traceable is shown.

[0073] Figure 10 A flowchart of a method for processing a component carrier structure to make the component carrier structure traceable by a processing apparatus according to an example embodiment of the present application is shown. Figure 6

[0074] Different views of a component carrier structure processed by a processing apparatus according to an example embodiment of the present application are shown. Figure 11

[0075] A cross-sectional view of a component carrier structure of a processing system according to an example embodiment of the present application is shown. Figure 12 DETAILED DESCRIPTION

[0076] Figure 13 A cross-sectional view of a component carrier structure of a processing system according to an example embodiment of the present application is shown. DETAILED DESCRIPTION

[0077] ​​​​​The illustrations in the drawings are schematic. In different drawings, similar or identical elements are provided with the same reference signs.

[0078] Before referring to the drawings, exemplary embodiments will be described in more detail, which have been developed on the basis of some basic considerations, which will be summarized.

[0079] Conventionally, it is not possible to read the inner two-dimensional identification code with optical means, since the code can have been covered by new layers after the layer build-up process, for example by layers of prepreg and / or copper. In addition to this, the conventional method of applying an identifier to the component carrier structure can not allow to track and link all layer information for individual component carrier structures.

[0080] According to exemplary embodiments, the component carrier structure, for example a PCB panel, is provided with two different types of identifiers, allowing to track the identifiers and / or to link the layers of the identifiers in a simple and accurate manner. The reading device of the apparatus according to exemplary embodiments can read the embedded primary identifiers located inside the component carrier structure to obtain identification and / or characterization information identifying and / or characterizing the component carrier structure. In a preferred embodiment, the preferred embodiment can be read by an X-ray reader device capable of detecting masked structural features. A writing device can also be foreseen in the apparatus, and the writing device can be configured for writing secondary identifiers onto the outer surface area of the component carrier structure. Such surface-located secondary identifiers can be easily read out by optical reader devices. Due to the correlation between the second identifiers and the primary identifiers, any of the identifiers can be suitable and sufficient to identify the component carrier structure when tracking the component carrier structure. The outer secondary identifiers can be read in a simple manner by optical cameras. Advantageously, both the reading device and the writing device can operate on the component carrier structure while the component carrier structure remains stationary at a fixed position during the execution of the reading and writing tasks. It can therefore be unnecessary to move the component carrier structure from a reading position and / or orientation to another writing position and / or orientation. The apparatus can therefore be constructed in a highly compact manner with limited factory floor space. In this case, the compact all-in-one customizing machine solution provided by exemplary embodiments can have the greatest advantage.

[0081] More specifically, the apparatus according to the exemplary embodiments can comprise an X-ray scanner and a multi-laser marking machine. Such an apparatus is able to read and decode a plurality of inner layer two-dimensional identifier (2DID) codes by using the X-ray scanner, even after a multi-layer lamination. Moreover, in the apparatus of the embodiments can be provided a plurality of laser heads able to mark a plurality of codes simultaneously on the top and on the bottom. For example, the codes implemented in the first identifier and / or in the second identifier can comprise ECC200 data, matrix code (DMC), QR code, bar code and / or human readable (HR) code.

[0082] In addition to this, the apparatus according to the exemplary embodiments can have a high degree of flexibility in terms of laser marking code format. For example, the apparatus is able to read incoming supplier 2DID codes and laser mark them in exactly the same way, or to selectively grab only specific information from the 2DID codes to mark. The apparatus can also decode incoming 2DID and generate a new set of 2DID code information that can be directly linked to the original incoming 2DID code. This flexible laser marking function can satisfy many different operating model conditions. Moreover, the exemplary embodiments can allow a self-check of the readability and data integrity of the 2DID and / or plaintext after the laser drilling process. For example, if the marked one-dimensional code, two-dimensional code or human readable code result fails, the apparatus according to the exemplary embodiments is able to isolate the (e.g. panel type) component carrier structure to a defective location classified as a defective component carrier structure.

[0083] Therefore, the apparatus according to the exemplary embodiments is able to connect to a company internal and / or external network for enabling data exchange, transmission and traceability from the inner core layer up to the outermost layer. Advantageously, the processing scheme according to the exemplary embodiments of the present application can be adapted to existing production line processes without affecting the existing functional processes. Moreover, the apparatus according to the exemplary embodiments of the present application can be configured to be safe to use on all electrostatic sensitive devices (ESD), for example for embedded chip products (ECP), more generally for manufacturing component carriers having at least one embedded component. Preferably, the apparatus according to the exemplary embodiments can be configured as a compact integrated machine to enable a small machine footprint. The apparatus according to the exemplary embodiments, which can be embodied as a processing station, can have data logging retention for panel or component carrier traceability, defect type and panel location mapping commonality analysis and yield improvement.

[0084] According to exemplary embodiments of the present utility model, a processing device is provided which can combine an X-ray scanner, a code decoder and a plurality of laser marking devices in order to link and trace a panel type component carrier structure from an inner core layer up to an outermost layer of a multi-layered panel stack during a panel stacking phase.

[0085] More specifically, an X-ray scanner can be provided to read a plurality of inner layer codes. A plurality of laser heads (e.g. at the top and bottom) can simultaneously mark a plurality of codes. Such a device can operate in an ESD safe manner. Both the top side and the bottom side can be marked. Advantageously, there is a high flexibility for a selected laser marked code format. Further advantageously, a device according to exemplary embodiments of the present utility model can be configured to link and trace a component carrier structure (e.g. a panel) or a component carrier (e.g. a PCB or IC substrate) separate from the component carrier structure, while the linking and / or tracing can be from an inner core layer up to an outermost layer, even after a multi-layer stack.

[0086] A device according to exemplary embodiments can utilize and combine an X-ray scanner, a code decoder and can be configured for laser marking. All of these can be implemented in one integrated machine for laying down non-optically visible codes after a layer to enable full traceability of a multi-panel layer lay down. Furthermore, laser marked codes can be checked and printed circuit boards can be eliminated in case of readability failure. The X-ray scanner, the code decoder and the marking machine can run on any electrostatic sensitive device and simultaneously laser mark on both the top side and the bottom side of a panel surface. Furthermore, the device can have the ability to reverse check laser marked codes in order to eliminate a panel in case of a marked code result failure.

[0087] More specifically, the apparatus according to exemplary embodiments of the present application can comprise a top side high power laser marker to perform code marking on the top side portion of the panel. In addition, the apparatus can comprise a camera system for top side code inspection to check the readability and data integrity of the laser made code located on the top side portion of the panel. In addition to this, an X-ray scanner can be provided to read the inner layer code covered by the upper prepreg and copper foil. In addition to this, the apparatus can be equipped with a high power laser marker on its bottom side to perform code marking on the bottom side portion of the panel at the same time. In addition, a camera system can be provided for bottom side code inspection to check the readability and data integrity of the laser made code located on the bottom side portion of the panel. In addition to this, an ESD material roll can be employed to make the apparatus electrostatic discharge (ESD) safe. This even allows the handling of electrostatic sensitive devices, such as component carriers with embedded components, with the apparatus. It is further advantageous that the apparatus can comprise a bad defect panel location for collecting panels that have been classified as bad. These bad panels can be temporarily kept at the defect panel location if the laser marked code inspection results fail. In addition, a bad defect panel transfer arm can be provided to transfer the panels to the bad defect panel location if the laser marked code inspection results fail.

[0088] According to exemplary embodiments of the present application, the internal primary identifier can be detected at the component carrier structure by means of an X-ray reading device. The primary identifier can be decoded and can be printed in the form of a secondary identifier on the outside of the component carrier structure. In case of a detected defect, the defective component carrier structure, such as a panel, can be identified and treated accordingly.

[0089] Thus, an X-ray image can be taken from the inner core layer in order to detect a two-dimensional primary identifier. The primary identifier can then be decoded to retrieve the identification information identifying the component carrier structure. Thereafter, a laser printer can print the same or other identification information on the top and / or bottom of the component carrier structure in the form of at least one surface-located secondary identifier. Due to the created correlation between the secondary identifier and the primary identifier, the secondary identifier can be read out to identify the corresponding component carrier structure.

[0090] Exemplary embodiments provide an apparatus that is capable of reading one or more internal codes covered by one of the plurality of build layers using an X-ray scanner and simultaneously laser marking a flexible code on both the top side portion and the bottom side portion of the panel surface. The relationship between the read code and the laser marked code can then be linked for traceability, wherein the code can be, for example, a QR code or any other code of the examples given herein.

[0091] Additionally, the apparatus can be configured to counter check the readability, legibility and data integrity of the laser marked codes. Concerns that fail during laser marking or counter checking afterwards can be moved and isolated to a bad location for next action.

[0092] In addition, the apparatus according to the exemplary embodiments of the present application can be configured to be connected to an internal or external network for data exchange and data transmission. Furthermore, the apparatus can be run on any electrostatic sensitive device, as the design of the apparatus can be electrostatic discharge (ESD) safe.

[0093] Figure 1 A three-dimensional view of an apparatus 100 for processing a component carrier structure 102 (a detailed example of which is shown in Figure 13 ) to make the component carrier structure 102 traceable according to the exemplary embodiments of the present application is shown. The component carrier structure 102 can be, for example, a panel for manufacturing a component carrier, such as a printed circuit board or an integrated circuit substrate. Figure 1 A front isometric view of the apparatus 100 is shown without a housing (see Figure 6 reference numeral 142 in

[0094] Figure 2 Another three-dimensional view of the apparatus 100 of Figure 1 is shown. Figure 2 A rear isometric view of the apparatus 100 is shown without a housing. Figure 3 A plan view of the apparatus 100 of Figure 1 is shown. Figure 4 A side view of the apparatus 100 of Figure 1 is shown. Figure 5 Another side view of the apparatus 100 of Figure 1 is shown.

[0095] The apparatus 100 shown is configured to process a component carrier structure 102 to make the component carrier structure fully traceable during the entire manufacturing process and, optionally, also during the use of the manufactured component carrier.

[0096] For the purpose of processing the component carrier structure 102, the apparatus 100 comprises a reading device 104 for reading a primary identifier 106, which is arranged inside the component carrier structure 102. Figure 13An example of such an embedded primary identifier 106 is shown, which can for example be embodied as a QR code formed as a copper pattern. The primary identifier 106 carries or encodes identification information which allows to identify the currently processed component carrier structure 102 and to distinguish it from other component carrier structures. Preferably, the primary identifier 106 is a unique identifier which unambiguously identifies the processed component carrier structure 102 only. In order to allow detection of the primary identifier 106 embedded in the interior of the component carrier structure 102 (cf. again Figure 13 ) a reading device 104 is provided. The reading device 104 comprises an X-ray emitting unit 150 for emitting an X-ray beam and an X-ray detecting unit 152 for detecting the emitted X-ray beam after interaction of the X-ray with the component carrier structure 102. During reading, the component carrier structure 102 is arranged between the X-ray emitting unit 150 and the X-ray detecting unit 152. In other words, the X-ray emitting unit 150 and the X-ray detecting unit 152 are arranged facing opposite two outer major surfaces of the component carrier structure 102, i.e. the first outer major surface and the second outer major surface of the component carrier structure 102, respectively. It is understood that the X-ray emitting unit 150 and the X-ray detecting unit 152 are arranged at a suitable distance on opposite sides of the component carrier structure, respectively, such an arrangement can be such that the X-ray emitting unit 150 and the X-ray detecting unit 152 are functionally interacting with respect to the major surfaces of the component carrier structure 102 to read the identifier in the component carrier structure 102. For example, when the component carrier structure 102 is placed horizontally, the opposite two outer major surfaces are the top and the bottom major surfaces, one of the X-ray emitting unit 150 and the X-ray detecting unit 152 is located at a suitable distance above the top major surface of the component carrier structure 102 and the other of the X-ray emitting unit 150 and the X-ray detecting unit 152 is located at a suitable distance below the bottom major surface of the component carrier structure 102.

[0097] Preferably, the X-ray emitting unit 150 and the X-ray detecting unit 152 create an imaginary line. The component carrier structure 102 can be positioned such that a plane created by the component carrier structure intersects the imaginary line. Preferably, the plane and the line can be perpendicular.

[0098] Accordingly, reference numeral 152 can indicate an X-ray scanner receiver, which can be motorized. When the X-ray detection unit 152 is motorized, if the ordinary primary marker 106, which can be located at the long side of the panel, is defective or unreadable, the X-ray detection unit can be moved to a position corresponding to another primary marker 107, which can be located at the short side of the panel. Accordingly, reference numeral 150 can indicate an X-ray scanner transmitter, which can also be motorized. Reference numeral 127 shows a moving mechanism of the X-ray scanner transmitter.

[0099] Figure 1 It is also shown a processor or control unit 156 for providing processing and / or control tasks. In particular, the processor or control unit 156 can control the entire operation of the apparatus 100 or a part thereof.

[0100] In particular, the processing or control unit 156 comprises a primary analysis unit 116 for analyzing the information read from the primary marker 106, in the present embodiment X-ray detection data. In other words, the data corresponding to the primary marker 106 detected by the X-ray detection unit 152 can be provided to the primary analysis unit 116, which can retrieve identification information of the component carrier structure 102 and / or other information related to the component carrier structure 102 and / or its manufacturing process.

[0101] The retrieved information can be forwarded from the primary analysis unit 116 to a generation unit 118 for generating a first secondary marker 110 and a second secondary marker 111 based on the analyzed primary marker 106. In particular, the generation unit 118 can generate the secondary markers 110, 111 as a data set, which enables the writing unit 108 to physically form the secondary markers 110, 111 when said data set is forwarded to the writing device 108. For example, the generation unit 118 can be configured to generate or define the first secondary marker 110 and the second secondary marker 111 with an additional information content and / or with a reduced information content compared to the analyzed primary marker 106, or with the same information content as the analyzed primary marker 106. Preferably, each of the first secondary marker 110 and the second secondary marker 111 should contain information allowing to unambiguously identify said component carrier structure 102.

[0102] However, it is also possible that the reading process of the reading device 104 may fail to read the primary identifier 106, for example, due to a defect in the primary identifier 106 itself or a reading error. If the primary analysis unit 116 determines that the primary identifier 106 is unreadable, the reading device 104 is instructed (e.g., by the primary analysis unit 116 via a data feedback loop) to read another primary identifier 107 located at another location (e.g., at an edge) within the component carrier structure 102 (see again). Figure 13 The system reads and identifies the processed component carrier structure 102. Therefore, in the event of a failure to read the primary identifier 106, another primary identifier 107 can be used as a backup or copy of the primary identifier 106. This improves the system's fault robustness. Furthermore, if the main analysis unit 116 determines that neither the primary identifier 106 nor the other primary identifier 107 is readable (e.g., because the other primary identifier 107 itself is defective or another reading error has occurred), the suggestion unit 154 can be triggered by the main analysis unit 116 to output a warning, inviting the user to manually provide information for identifying the component carrier structure 102. In this case, the user can use, for example, a handheld scanner or manually input the identification information for identifying the component carrier structure 102.

[0103] Therefore, the identification information used to identify the component carrier structure 102 based on the generation of the first-level identifier 110 and the second-level identifier 111 can be obtained by the writing unit 108 from the generation unit 118 or by the suggestion unit 154 from the user.

[0104] The aforementioned identification information can be provided to the writing device 108, which is used to write the primary identification 110 and the secondary identification 111 (see again) on the exterior of the component carrier structure 102. Figure 13 ,in Figure 13 The component carrier structure 102, constructed after another layer, is shown in more detail below. Both the primary identifier 110 and the secondary identifier 111 are associated with the processed component carrier structure 102 and with the primary identifier 106. More specifically, each of the primary identifier 110 and the secondary identifier 111 can be used as a unique identifier for identifying the component carrier structure 102.

[0105] Advantageously, the writing device 108 is configured to laser-write secondary markers 110, 111 by guiding a laser beam to two opposite primary surfaces of the component carrier structure 102, so as to physically create the primary markers 110 and 111 as physical surface patterns or surface profiles on the outer surface of the component carrier structure 102.

[0106] Alternatively, secondary markers comprising ultraviolet (UV) visible (or detectable) material can be applied (e.g. by using a printing process). This can bring the advantage of labeling or marking the component carrier structure 102 without interfering with its visible optical appearance.

[0107] As shown, the writing device 108 comprises a first writing unit 112 (such as a first laser head) for writing a first secondary marker 110 on one outer major surface of the component carrier structure 102 and comprises a second writing unit 114 (such as a second laser head) for writing a second secondary marker 111 on the opposite other outer major surface of the component carrier structure 102. Preferably, the first writing unit 112 and the second writing unit 114 can be arranged and can be controlled by the processor or control unit 156 such that the first secondary marker 110 and the second secondary marker 111 can be written simultaneously onto the two opposite major surfaces of the component carrier structure 102. For example, the first writing unit 112 can be implemented as a top side laser marker, which can be motorized. Correspondingly, the second writing unit 114 can be implemented as a bottom side laser marker, which can be motorized. When the first writing unit 112 and / or the second writing unit 114 are motorized, the respective writing unit 112, 114 can be flexibly moved to a selectable target position, at which the respective secondary marker 110, 111 (or 130, 131, see below description) shall be printed.

[0108] In short, the identification information for uniquely identifying the component carrier structure 102 can be transferred from the first marker 106 to each of the first secondary marker 110 and the second secondary marker 111. Since the secondary markers 110, 111 are arranged (at least temporarily, i.e. until further build-up on the component carrier structure 102) on the outer surfaces of the component carrier structure 102, reading out the secondary markers is much simpler than reading out the embedded first marker 106. Even when one of the two secondary markers 110, 111 is currently not accessible for an optical reader device, the redundant provision of identification information in the first secondary marker 110 and the second secondary marker 111 allows reading out the identification information from the component carrier structure 102.

[0109] Advantageously, the reading device 104 and the writing device 108 are configured to read the primary identification 106 and to write the secondary identification 110, 111 while the component carrier structure 102 is resting at a predefined constant target position, i.e. at the same predefined resting reading and writing position of the apparatus 100. Thus, both the reading device 104 and the writing device 108 can reach and process the component carrier structure 102 when the component carrier structure 102 is resting at said resting reading and writing position. Thus, the component carrier structure 102 does not need to be transferred from a reading position to another writing position, but the reading and writing can be done while the component carrier structure 102 is kept fixed and resting at the fixed and resting reading and writing position. Preferably, the reading device 104 and / or the writing device 108 are movable with respect to the resting reading and writing position. This further increases the simplicity and flexibility of the operation of the apparatus 100, while avoiding undesired damages to the component carrier structure.

[0110] Still referring to Figures 1 to 5 , the apparatus 100 further comprises a secondary analysis unit 120 for analyzing the written secondary identification 110, 111. By reading out the first secondary identification 110 and / or the second secondary identification 111, it can be verified whether the writing process has been successful. Advantageously, the secondary analysis unit 120 can be implemented as a simple optical camera (e.g. sensitive in the ultraviolet (UV) wavelength range) with signal processing resources. For example, the secondary analysis unit 120 can be implemented as a CCD camera system 123 for top side code inspection and another CCD camera system 125 for bottom side code inspection. In short, the CCD cameras can check whether the laser printed code is acceptable.

[0111] Advantageously, the apparatus 100 comprises a plurality of electrostatic discharge protection features 122, 124, 126, 128 for protecting the component carrier structure 102 from electrostatic discharge (ESD) phenomena during the processing of the apparatus 100. This protects the processed component carrier structure 102 from damages, which can be very advantageous, e.g. when embedding components in the component carrier structure 102.

[0112] According to Figures 1 to 5 the various electrostatic discharge protection features 122, 124, 126, 128 are implemented as follows: As best observable in Figure 2 , the first electrostatic discharge protection feature 122 comprises an electrostatic safe suction cup configured to manipulate the component carrier structure 102 in an electrostatic discharge protected manner by suction force. Descriptively, the point of contact between the apparatus 100 and the component carrier structure 102 can be rendered ESD compatible by the first electrostatic discharge protection component 122. Still referring to Figure 2The second electrostatic discharge protection feature 124 comprises an electrostatic discharge safe table on which the component carrier structure 102 can be placed during handling and processing of the component carrier structure 102 by the apparatus 100. Also shown in Figure 2 The third electrostatic discharge protection feature 126, also shown in

[0113] Now referring again to Figure 1 The apparatus 100 comprises a layer build-up formation device 121, schematically shown in Figure 1 for attaching and processing one or more additional layer structures (see reference signs 146, 148 in Figure 13 The layer build-up formation device 121, which can be controlled by a layer build-up control entity 121' of the processor or control unit 156, can comprise a plurality of sub-units for subjecting the component carrier structure 102 to lamination, patterning, laser drilling, plating, etc. for forming a further layer build-up on one main surface or on both opposite main surfaces of the component carrier structure.

[0114] After attaching the additional layer structures 146, 148 to at least one of the main surfaces of the component carrier structure 102, the secondary identifiers 110, 111 are no longer located on the outer surface of the component carrier structure 102 (see Figure 13 Thus, it is no longer possible to use a simple optical camera to read out information indicating the identity of the component carrier structure 102 with the secondary identifiers 110, 111. In order to re-establish this functionality, the writing device 108 can be configured to write the information indicating the identity of the component carrier structure 102 into the one or more additional layer structures 146, 148 (see Figure 13The further secondary identifiers 130, 131 written on the outer surface of the component carrier structure 102 in relation to the primary identifier 106 and / or in relation to the secondary identifiers 110, 111 can comprise additional information which is not comprised in the primary identifier 106 and / or in the secondary identifiers 110, 111. For example, the further secondary identifiers 130, 131 can comprise information about the further build-up layers of the layer structure 146, 148. The surface-located further secondary identifiers 130, 131 can be read out by a simple optical camera. As for the secondary identifiers 110, 111, the written further secondary identifiers 130, 131 can also be verified by reading out the further secondary identifiers by an optical camera and evaluating whether the further secondary identifiers fulfill one or more predefined criteria.

[0115] The described process of forming further build-up layers of the layer structure 146, 148 on the outer surface of the component carrier structure 102 and the formation of new secondary identifiers 130, 131 can be repeated one or more times until a predefined layer build-up has been constructed.

[0116] Further, the apparatus 100 comprises a transport mechanism 132 for transporting the component carrier structure 102 from a loader unit 134 for loading the component carrier structure 102 to a reading and writing position and further to an unloader unit 136 for unloading the component carrier structure 102. In addition to the transport mechanism 132, a robotic arm can be installed. Further, the apparatus 100 comprises a removal mechanism 138 for removing component carrier structures 102 which are classified as defective, e.g. due to a detected defect of the primary identifier 106 and / or of the secondary identifiers 110, 111. Thus, reference 138 can indicate an arm and transport mechanism for defective panels. Reference 129 indicates a pick arm for defective panels. A defective panel buffer is indicated with reference 131. Descriptively, the laser marked panels can be classified as good or defective. In one embodiment, the transport mechanism 132 is configured to move the component carrier structures 102 to be processed between the loader unit 134 and the unloader unit 136 in a further direction transverse to the direction along which the defective component carrier structures are removed.

[0117] According to Figures 1 to 5The apparatus 100 is capable of decoding different incoming two-dimensional marker code formats. Furthermore, the apparatus 100 can be configured to read multiple inner two-dimensional marker codes covered by multiple prepreg and copper foil layers. The motorized X-ray scanner emitter can cover different or even all panel size inner two-dimensional marker locations. The apparatus 100 can also be configured for linking the inner two-dimensional marker to the current layer laser marked two-dimensional marker.

[0118] To provide the described functionality, the apparatus 100 is provided with a top side high power laser marker. Furthermore, a camera system for top side code inspection is provided. The apparatus 100 can be flexibly operated by marking different formats of codes (such as two-dimensional markers, one-dimensional markers, human readable codes, etc.) on the top side of the panel. The apparatus 100 can also be configured to check the readability and data integrity of the laser marked codes on the panel top side.

[0119] Furthermore, the apparatus 100 has a bottom side high power laser marker. A CCD camera system for bottom side code inspection can also be provided. The apparatus 100 provides the functionality of flexible format code marking on the bottom side of the panel simultaneously with the top laser marker.

[0120] Furthermore, the apparatus 100 is capable of checking the readability and data integrity of the laser marked codes at the panel bottom side.

[0121] The apparatus 100 is safe for the handling of the electrostatic sensitive component carrier structure 102. In this context, the apparatus 100 can provide the functionality of preventing the accumulation of static charge in the machine. Furthermore, the apparatus 100 can prevent the sudden surge of high power electrostatic discharge that can damage the expensive chips embedded inside the panel.

[0122] Furthermore, the apparatus 100 is provided with a defective panel transfer arm and a positioning box. If the laser marked code inspection result fails, the apparatus 100 can transfer the panel to a bad defective panel location. In addition to this, the apparatus 100 can be adapted to temporarily store the panel in case of a failed laser marked code inspection result. Also, the apparatus 100 can prevent the automatic rejection of any bad panel without an engineer confirmation.

[0123] Reference Figure 5 The reference numeral 190 denotes a pick-up shaft for bad defective panels, the reference numeral 192 denotes a transfer shaft for bad defective panels, and the reference numeral 194 denotes a moving mechanism for the bottom side laser marker.

[0124] Figure 6 A three-dimensional view of the apparatus 100 for handling the component carrier structure 102 so that the component carrier structure 102 is traceable according to an exemplary embodiment of the present utility model is shown.Figure 6 It is shown that the apparatus 100 can be configured as a single, integral machine 140 having the reference Figures 1 to 5 All constituent parts are shown and described. This enables a compact design of the apparatus 100 and a moderate space consumption in the factory.

[0125] Figure 7 It is shown Figure 6 a detailed view of a portion of the interior of the apparatus 100. Figure 8 It is shown Figure 6 a detailed view of another portion of the interior of the apparatus 100, wherein reference 163 denotes a bad defect panel position. Figure 9 It is shown an X-ray image of the component carrier structure 102 according to the exemplary embodiment of the present utility model, wherein reference 167 indicates decoded information from the two-dimensional markers. Figure 10 It is shown Figure 6 a detailed view of yet another portion of the interior of the apparatus 100.

[0126] Now referring in more detail to Figure 9 it is shown a test panel after a two-layer lay-up process. More specifically, it is shown X-ray images of two inner layer panel two-dimensional markers (see reference 106, 107) covered by two layers of prepreg and copper foil. Furthermore, decoded information from the two-dimensional markers is shown with reference 167, the two-dimensional markers corresponding to the inner core layer panel two-dimensional marker (see reference 106) and the inner DIP1 layer panel two-dimensional marker (see reference 107). Accordingly, the corresponding apparatus 100 is capable of decoding different incoming two-dimensional marker code formats. Furthermore, the apparatus 100 can be configured to read multiple inner layer two-dimensional marker codes covered by multiple layers of prepreg and copper foil. The motorized X-ray scanner emitter can cover all panel size inner layer two-dimensional marker positions. Furthermore, the corresponding apparatus 100 can also be configured to link the inner layer two-dimensional markers to the current layer laser marked two-dimensional markers.

[0127] The apparatus 100 has a top side high power laser marker and a camera system for top side code inspection. This can provide the functionality of performing code marking in flexible formats on the top side of the panel. Furthermore, the apparatus 100 is capable of performing inspection of the readability and data integrity of laser made codes on the panel top side. For example, the apparatus 100 can operate based on two-dimensional DMC codes and human readable codes marked by the laser marker.

[0128] Advantageously, the apparatus 100 can be completely enclosed by radiation shielding material to ensure X-ray scanner and laser marker operation safety and to be able to comply with ecological and safety requirements.

[0129] Figure 11 A flowchart 200 of a method of processing a component carrier structure 102 to make it traceable by a processing apparatus according to an exemplary embodiment of the present application is shown.

[0130] As shown in block 202, the method can comprise moving the component carrier structure 102, such as a panel, into the apparatus 100.

[0131] As shown in block 204, the method can comprise reading the primary identifier 106 arranged inside the component carrier structure 102 and identifying the processed component carrier structure 102. Thus, the inner layer code can be read with an X-ray scanner.

[0132] As shown in block 206, the method can comprise determining whether the primary identifier 106 has been correctly read.

[0133] As shown in block 208, the method can comprise, if the determination in block 206 is positive, writing a secondary identifier 110, 111 associated with the processed component carrier structure 102 and related to the primary identifier 106 on the outside of the component carrier structure 102. More specifically, block 208 can comprise marking the top side and the bottom side with the respective codes for both opposite main surfaces of the panel using a high power laser marker.

[0134] Advantageously, reading the primary identifier 106 in block 204 and writing the secondary identifier 110, 111 in block 208 are performed while the component carrier structure 102 remains at the rest reading and writing position of the apparatus 100.

[0135] As shown in block 210, the method can comprise analyzing the written secondary identifier 110, 111 using the secondary analysis unit 120. Descriptively, the top side code and the bottom side code can be checked with a CCD camera.

[0136] As shown in block 212, the method can comprise determining whether the secondary identifier 110, 111 is correctly readable. Descriptively, it can be checked whether the written code is readable and the data integrity is correct. If the determination is positive, the method proceeds to block 214. If the determination is negative, the method proceeds to block 222.

[0137] As shown in block 214, the method can comprise, if the determination in block 212 is positive, moving the processed component carrier structure 102 out of the apparatus 100. Thus, the correctly processed panel can be moved out.

[0138] As shown in block 216, the method can comprise continuing the process in the device 100 for the next component carrier structure 102, for example for the next panel. The process can return to block 202.

[0139] As shown in block 218, the method can comprise instructing the reading means 104 to read another primary identifier 107 arranged inside the component carrier structure 102 and to identify the processed component carrier structure 102, if the determination in block 206 is negative, i.e. in case the primary analysis unit 116 determines that the primary identifier 106 is not readable. Thus, it can be determined whether the inner layer backup code can be read correctly or not. If the result of this determination is positive, the method continues with block 208 and uses the identification information provided by the other primary identifier 107 for further processing. If the result of this determination is negative, the method continues with block 220.

[0140] As shown in block 220, the method can comprise inviting the user to manually provide information for identifying the component carrier structure 102, if the primary analysis unit 116 determines that the primary identifier 106 as well as the other primary identifier 107 is not readable. In block 220, it can also be determined whether the manual input was successful or not. If the result of this determination is positive, the method continues with block 208 and uses the manually provided identification information for further processing. If the result of this determination is negative, the method continues with block 222.

[0141] As shown in block 222, the method can comprise classifying the component carrier structure 102 for which no identification information has been retrieved as defective or as a reject. The failed panel can continue to a reject panel location.

[0142] Figure 12 Different views of a component carrier structure 102 processed by a processing device according to an exemplary embodiment of the present application are shown.

[0143] More specifically, Figure 12 It is shown that the primary identifier 106 can be formed on the layer structure 146, 148, for example on the core. The primary identifier 106 is still readable by the X-ray reading means 104 from the outside of the component carrier structure 102 even after a process 161 has been performed to form an additional layer stack in the form of a lamination of an additional layer structure 146, 148, thereby embedding the primary identifier 106 inside the stack 144. The identification information read out from the embedded primary identifier 106 can then be used to define the surface-located secondary identifier 110 and subsequently to form the surface-located secondary identifier 110 by the writing means 108, which comprises for example the same identification information.

[0144] Figure 13 A cross-sectional view of a component carrier structure 102 in a processing system according to an exemplary embodiment of the present utility model is shown. The illustrated component carrier structure 102 can be a panel for the simultaneous manufacturing of multiple component carriers (such as printed circuit boards or integrated circuit substrates) by a batch manufacturing process. Alternatively, the component carrier structure 102 can be a single component carrier (such as a PCB or IC substrate) or an array of several component carriers, for example an array of six PCBs or IC substrates. After processing the component carrier structure 102 as a whole, the component carrier structure can be divided into individual component carriers (not shown). It can be desirable to track the component carrier structure 102 and / or the individual component carriers during the manufacturing process and during use. This can be achieved by various markers 106, 107, 110, 111, 130, 131 which can be physically connected to or integrally formed with the component carrier structure 102 and / or the individual component carriers, as described below.

[0145] For example, the component carrier structure 102 can comprise a laminated layer stack 144 comprising a plurality of electrically conductive layer structures 146 and electrically insulating layer structures 148, see also details 149. The electrically conductive layer structures 146 can comprise patterned copper layers which can form horizontal pads and / or horizontal wiring structures. Additionally or alternatively, the electrically conductive layer structures 146 can comprise vertical through connections such as copper pillars and / or copper filled laser vias. Furthermore, the stack 144 of the component carrier structure 102 can comprise one or more electrically insulating layer structures 148 (such as prepreg or resin sheets). Furthermore, a surface finish (such as ENIG or ENEPIG, etc.) can be applied on the top side and / or the bottom side of the stack 144 (not shown). The uppermost and / or the lowermost electrically insulating layer structure can be a solder mask or a solder resist. Such a solder mask can support the correct intermetallic connection, for example soldering, of surface mounted components (not shown) and the component carrier structure 102 on an underlying mounting base (not shown, for example another printed circuit board). Not shown are components (such as semiconductor dies and / or passive components like capacitors) which can be embedded in the component carrier structure 102.

[0146] As already mentioned, the component carrier structure 102 can be manufactured to be traceable based on readable identifiers 106, 107, 110, 111, 130, and 131. For this purpose, the stack 144 includes not only a plurality of electrically conductive layer structures 146 and a plurality of electrically insulating layer structures 148, but also readable identifiers 106, 107, 110, 111, 130, and 131 that can be formed in or on the stack 144. Furthermore, at least a portion of the readable identifiers 106, 107, 110, 111, 130, and 131 can be formed as integrated portions of the layer structures 146 and 148. For example, the readable identifier 106 can be a patterned copper structure forming a QR code within the stack 144. More generally, the readable identifier 106 can be a patterned metal structure that encodes identification information regarding the component carrier structure 102.

[0147] More specifically, in Figure 13 The following types of readable identifiers 106, 107, 110, 111, 130, and 131 can be foreseen in the component carrier structure 102:

[0148] The primary identifier 106 may be disposed within the stack 144, such as in or on the central core, and may be configured to identify the component carrier structure 102. In other words, reading the primary identifier 106 can provide identification information that is unique only to the specific component carrier structure 102 or a group of component carrier structures (e.g., a common manufacturing batch). Due to its arrangement embedded within the stack 144, the primary identifier 106 can be read by X-ray detection. For example, the primary identifier 106 may be a buried copper pattern forming a readable QR code.

[0149] like Figure 13 As shown, another main marker 107 is formed at the same vertical height as the main marker 106, which provides backup information and can be used when the main marker 106 cannot be read correctly.

[0150] Further, a first secondary identifier 110 and a second secondary identifier 111, which can be optically read, are also provided inside the stack 144, but closer to the outside of the stack 144 than the primary identifier 106. Each of the first secondary identifier 110 and the second secondary identifier 111 is also associated with the processed component carrier structure 102, e.g. allowing to provide, when read out, identification information for identifying the component carrier structure 102. Each of the first secondary identifier 110 and the second secondary identifier 111 can be formed by laser direct imaging, and can be, e.g., a QR code. Each of the first secondary identifier 110 and the second secondary identifier 111 is related to the primary identifier 106, such that the information content of said identifiers 106, 110, 111 all indicate the same identification information uniquely identifying only said particular component carrier structure 102. In accordance with the manufacturing process of the component carrier structure 102 according to Figure 13 At the processing stage of manufacturing the component carrier structure 102, where the first secondary identifier 110 and the second secondary identifier 111 still form part of the outer surface of the corresponding preform of the component carrier structure 102 (i.e. before the outer layer buildup 153, 155 is formed), the first secondary identifier 110 and the second secondary identifier 111 can be formed by laser direct imaging (LDI) on the respective outer main surface of the preform of the component carrier structure 102. The first secondary identifier 110 and the second secondary identifier 111 can be defined and formed to carry or encode information content for uniquely identifying the component carrier structure 102. This can be advantageous, as the inner primary identifier 106 cannot be read by an optical camera, as the primary identifier is embedded inside the stack 144 and can only be read out by more complex techniques such as X-ray analysis. By replicating the identity information about the component carrier structure 102 in the form of the first secondary identifier 110 and the second secondary identifier 111 to the respective exposed main surface of the preform of the component carrier structure 102, the identification information that can be used for tracking or tracing the component carrier structure 102 can be read out from the outside of the preform of the component carrier structure 102 by an optical camera in a simple manner.

[0151] However, the first secondary identifier 110 and the second secondary identifier 111 can be covered by the additional layer structure 146, 148 during the formation of the build-up layers 153, 155, such that the first secondary identifier 110 and the second secondary identifier 111 are no longer readable from the outside of the component carrier structure 102 by a simple optical camera. However, in order to allow full traceability of the component carrier structure 102 in a simple manner, a first further secondary identifier 130 and a second further secondary identifier 131 can be formed on the outer surface of the stack 144 after the formation of further build-up layers 153, 155. Corresponding to the association of the first secondary identifier 110 and the second secondary identifier 111 with the primary identifier 106, the first further secondary identifier 130 and the second further secondary identifier 131 can not only be associated with the component carrier structure 102, but also with the primary identifier 106 and / or the first secondary identifier 111 and the second secondary identifier 112. The association of the first further secondary identifier 130 and the second further secondary identifier 131 with the component carrier structure 102 can be such that each of the three carries information indicating the identity of the component carrier structure 102. As shown, each of the first secondary identifier 110 and the second secondary identifier 111 is arranged between the primary identifier 106 on the one hand and a respective one of the first further secondary identifier 130 and the second further secondary identifier 131 on the other hand.

[0152] The process of copying the identification information from the previously exposed, now internal secondary identifier to the more external, now exposed further secondary identifier on the additional build-up layer can be repeated one or more times until the entire build-up of the component carrier structure 102 is completed. This ensures that the manufactured component carrier structure 100 is always traceable by an optical camera or the like.

[0153] It should be noted that the term "comprising" does not exclude other elements or steps and "a" or "an" does not exclude a plurality. Elements described in association with different embodiments can also be combined.

[0154] It should also be noted that the use of the terms "preferably", "preferably", "more preferred", "most preferred" and the like are not used to limit the scope of a claim but to emphasize different embodiments.

[0155] The implementation forms of the utility model are not limited to the preferred embodiments shown in the drawings and described above. Alternatively, even in fundamentally different embodiments, the use of the shown solutions and a variety of variants according to the principles of the utility model is possible.

Claims

1. A processing apparatus, the processing apparatus (100) processing a component carrier structure (102) to enable the component carrier structure (102) to be tracked, characterized in that, The processing device (100) comprises: a reading device (104) comprising an X-ray emitting unit (150) and an X-ray detecting unit (152) arranged facing opposite first and second outer main surfaces of the component carrier structure (102), respectively, the reading device (104) reading a primary identifier (106) arranged in the interior of the component carrier structure (102) and identifying the processed component carrier structure (102); and a writing device (108) arranged at the exterior of the component carrier structure (102) facing at least one of the first and second outer main surfaces of the component carrier structure (102) to write a secondary identifier associated with the processed component carrier structure (102) and corresponding to the primary identifier (106); wherein at least one of the reading device (104) and the writing device (108) is movable relative to a stationary reading and writing position at which the component carrier structure (102) is held, so that the reading device (104) reads the primary identifier (106) and the writing device (108) writes the secondary identifier.

2. The processing device of claim 1, wherein, The writing device comprises a laser source for emitting a laser beam directed onto at least one of the first and second outer main surfaces of the component carrier structure (102) so that the writing device (108) writes the secondary identifier laser-wise.

3. The processing device of claim 1, wherein, The writing device (108) comprises a first writing unit (112) arranged above the first outer main surface of the component carrier structure (102) to be processed to write a first secondary identifier (110) on the first outer main surface and a second writing unit (114) arranged above the second outer main surface of the component carrier structure (102) to be processed to write a second secondary identifier (111) on the second outer main surface.

4. The processing device of claim 3, wherein, The first and second writing units (112, 114) are arranged so that the first and second secondary identifiers (110, 111) can be written simultaneously.

5. The processing device of claim 1, wherein, The processing device (100) comprises a primary analysis unit (116) to which data corresponding to the primary identifier (106) detected by the X-ray detecting unit (152) is provided, the primary analysis unit (116) analyzing the data corresponding to the primary identifier (106).

6. The processing device of claim 5, wherein, The processing device (100) comprises a generating unit (118) which generates the secondary identifier on the basis of the analyzed primary identifier (106), the generated secondary identifier being forwarded to the writing means (108).

7. The processing device of claim 6, wherein, The generating unit (118) generates the secondary identifier with additional information content and / or with reduced information content compared to the analyzed primary identifier (106).

8. The processing device according to any one of claims 5 to 7, characterized in that, The component carrier structure (102) comprises a further primary identifier (107) arranged inside the component carrier structure, the further primary identifier (107) being in a different position than the primary identifier (106), the reading means (104) reading the further primary identifier (107) in the case that the primary analysis unit (116) determines that the primary identifier (106) cannot be read and identifying the processed component carrier structure (102).

9. The processing device according to any one of claims 5 to 7, characterized in that, The processing device (100) comprises a suggestion unit (154) coupled with the primary analysis unit (116), the suggestion unit (154) being triggered by the primary analysis unit (116) and outputting a warning to invite the provision of information for identifying the component carrier structure (102) in the case that the primary analysis unit (116) determines that the primary identifier (106) cannot be read.

10. The processing device according to any one of claims 5 to 7, characterized in that, The processing device (100) comprises a secondary analysis unit (120) which analyzes the written secondary identifier.

11. The processing device of claim 10, wherein, The secondary analysis unit (120) comprises an optical camera.

12. The processing device according to any one of claims 1 to 7, characterized in that, The processing device (100) comprises at least one electrostatic discharge protection feature (122, 124, 126, 128) for protecting the component carrier structure (102), the electrostatic discharge protection feature comprising an electrostatic safety chuck which manipulates the component carrier structure (102) in an electrostatic discharge-protected manner by suction force.

13. The processing device according to any one of claims 1 to 7, characterized in that, The processing device (100) comprises a layer build-up forming device (121) which attaches and processes one or more additional layer structures (146, 148) to at least one of the first and second outer main surfaces of the component carrier structure (102); wherein the writing means (108) write at least one further secondary identifier (130, 131) related to the read primary identifier (106) on the outside of the one or more additional layer structures (146, 148).

14. The processing device according to any one of claims 1 to 7, characterized by, The processing device (100) comprises a conveying mechanism (132) which conveys the component carrier structure (102) from a loader unit (134) for loading the component carrier structure (102) to the stationary reading and writing position and further to an unloader unit (136) for unloading the component carrier structure (102).

15. The processing device of claim 14, wherein, The processing device (100) comprises a removal mechanism (138) for removing component carrier structures (102) classified as defective due to defects of the primary identifier (106) and / or defects of the secondary identifier.

16. The processing device of claim 15, wherein, The transport mechanism (132) moves the component carrier structures (102) to be processed between the loader unit (134) and the unloader unit (136) in a further direction transverse to the direction along which defective component carrier structures are removed.

17. The processing device according to any one of claims 1 to 7, characterized by, The processing device is configured as a single, integral machine (140), all constituent components of the processing device being arranged inside a common housing (142).

18. A processing system, comprising: The processing system comprises a processing device (100) according to any one of claims 1 to 17; and a traceable component carrier structure (102) which is traceable by the processing device (100), the component carrier structure (102) comprising: a stack (144) comprising a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures; a primary identifier (106) readable by X-rays arranged inside the stack (144) and identifying the component carrier structure (102); and a secondary identifier readable optically, the secondary identifier being located at or closer to the outside of the stack (144) than the primary identifier (106), the secondary identifier being associated with the component carrier structure (102) and related to the primary identifier (106).

19. The processing system of claim 18, wherein, The component carrier structure is configured as a panel, an array or a component carrier.

20. The processing system of claim 18, wherein, The primary identifier (106) readable by X-rays comprises a QR code, a barcode, a copper pattern and / or a laser direct imaging formed pattern.

21. The processing system of claim 18, wherein, The secondary identifier readable optically comprises a QR code, a barcode, a laser written code and / or a human readable code.

22. The processing system according to any one of claims 18-21, wherein, Each of the primary identifier (106) and the secondary identifier is individually configured as a unique identifier for the component carrier structure (102).

23. The processing system according to any one of claims 18-21, wherein, The primary identifier (106) and the secondary identifier have partly identical or completely identical information content.

24. The processing system of any one of claims 18-21, wherein, The component carrier structure (102) comprises at least one further secondary identifier (130, 131) on or in the stack (144), the at least one further secondary identifier (130, 131) being associated with the component carrier structure (102) and related to the primary identifier (106), wherein the secondary identifier is arranged between the primary identifier (106) and the at least one further secondary identifier (130, 131).

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