Solder paste coating tool for riveting holes of circuit board

Abstract

The utility model discloses a solder paste coating tool for a riveting hole of a circuit board, which comprises a bottom support plate, an upper positioning plate is arranged on a guide pillar, a storage groove is further arranged on the upper surface of the upper positioning plate, a flow guide hole corresponding to the riveting hole on a circuit board body is arranged at the bottom in the storage groove, and a pressurizing mechanism is further arranged in a hollow groove. The pressurizing mechanism comprises an air storage cylinder, the air storage cylinder is arranged in the hollowed-out groove, a piston pad is movably arranged in the air storage cylinder, a piston rod is arranged on one side of the piston pad, a positioning disc is arranged at the end of the piston rod, a reset spring is connected to the piston rod in a sleeving mode, and the air storage cylinder is connected with the material storage groove through an air guide structure; a material collecting mechanism is further arranged on the bottom carrying plate. According to the automatic solder paste coating device, solder paste can be automatically coated in the riveting holes of the circuit board body, the solder paste coating efficiency is improved, meanwhile, the coating uniformity is guaranteed, excessive overflowing solder paste can be collected in a centralized mode, and the utilization rate of the solder paste is improved.

Description

Technical Field

[0001] This utility model belongs to the technical field, specifically relating to a solder paste coating fixture for riveting holes on circuit boards. Background Technology

[0002] During circuit board manufacturing, solder-lead plating is essential in the riveting holes to ensure proper electrical connections and mechanical fixation. The main purpose of soldering is to prevent solder balls from forming in the riveting holes and to ensure that no solder resist ink enters, thus avoiding problems such as solder balls and unevenness.

[0003] Currently, during the soldering process of PCB rivet holes, solder paste is usually applied manually to the rivet holes. Manual application is inefficient, uneven, and it is also impossible to collect excess solder paste, which easily leads to solder paste waste.

[0004] Therefore, those skilled in the art urgently need to study a solder paste coating fixture for riveting holes on circuit boards. Utility Model Content

[0005] The purpose of this utility model is to provide a solder paste coating fixture for rivet holes of circuit boards, so as to solve the problem mentioned in the background art that the current process of soldering the rivet holes of circuit boards usually requires manual application of solder paste into the rivet holes. Manual application is inefficient, uneven, and cannot collect excess solder paste, which easily leads to solder paste waste.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A solder paste coating fixture for riveting holes on a circuit board includes: a bottom carrier plate, wherein a plurality of guide posts are provided on the bottom carrier plate, and a material collection mechanism for collecting overflowing solder paste is also provided on the bottom carrier plate;

[0008] An upper positioning plate is provided on a plurality of guide posts. A material storage trough is also provided on the upper positioning plate. A hollow groove is provided at the bottom of the upper positioning plate, and an air storage cylinder is provided in the hollow groove.

[0009] The bottom of the storage tank is provided with a guide hole corresponding to the riveting hole on the circuit board body, and the hollowed-out groove is also provided with a pressure mechanism for automatically coating solder paste.

[0010] The pressurizing mechanism is equipped with an air storage cylinder, which is connected to the storage tank through an air guiding structure. A piston pad is movably installed inside the air storage cylinder. A piston rod is installed on one side of the piston pad, and a positioning plate is installed at the end of the piston rod. A return spring is sleeved on the outside of the piston rod, and one end of the return spring is connected to the positioning plate.

[0011] In one embodiment, the air guiding structure includes an air supply pipe, one end of which is connected to a diversion pipe disposed in a hollow groove. The diversion pipe is connected to a corresponding air inlet through a guide pipe. The air inlets are equidistantly disposed on the inner wall of the storage tank, which can uniformly transport the airflow in the air storage cylinder to the storage tank and pressurize the solder paste in the storage tank.

[0012] In one embodiment, slots are provided on both sides of the storage tank, and a sealing cover is provided in the slot. The sealing cover can be quickly fixed in the storage tank by means of the slot.

[0013] In one embodiment, positioning grooves are also provided on both sides of the hollow groove for positioning the extension of the circuit board body, which can position the extension of the circuit board.

[0014] In one embodiment, the material collection mechanism includes a material collection tank, and the material collection tank is further provided with a platform. The platform is provided with an elongated hole corresponding to the riveting hole to facilitate the diversion of overflowing solder paste.

[0015] In one embodiment, the bottom of the elongated hole is connected to the unloading port, which is located at the bottom of the platform and can guide the overflowing solder paste into the unloading port.

[0016] In one embodiment, the bottom carrier plate is further provided with multiple sets of limiting posts. The limiting posts are used to install and position the circuit board body. By setting the limiting posts, the installation of the circuit board body can be limited, ensuring the installation accuracy of the circuit board body.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] This invention enables solder paste to be automatically applied into the riveting holes of the circuit board body by pressing the upper positioning plate and the bottom carrier plate together, thereby improving the solder paste application efficiency and ensuring the uniformity of the application.

[0019] In the solder paste coating process, this invention can collect the overflowing solder paste through a collection mechanism, which facilitates subsequent processing and reuse of the solder paste and avoids the problems of excessive solder paste loss and high cost. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model.

[0021] Figure 2 This is a structural schematic diagram of the upper positioning plate from a first-view perspective in one embodiment of the present invention.

[0022] Figure 3 This is a structural schematic diagram of the upper positioning plate from a second perspective in one embodiment of the present invention.

[0023] Figure 4 for Figure 3 A magnified structural diagram of point A in the middle.

[0024] Figure 5 This is a half-sectional view of the upper positioning plate in one embodiment of the present invention.

[0025] Figure 6 for Figure 5 A magnified structural diagram at point B in the middle.

[0026] Figure 7 This is a schematic diagram of the bottom carrier plate in one embodiment of the present invention. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figures 1-6 This utility model provides a solder paste coating fixture for riveting holes on circuit boards, including a bottom carrier plate 4, a guide post 3, an upper positioning plate 1 on the guide post 3, a storage tank 6 on the upper surface of the upper positioning plate 1, a guide hole 9 corresponding to the riveting hole on the circuit board body 5 at the bottom of the storage tank 6, a hollow groove 11 at the bottom of the upper positioning plate 1, and a pressure mechanism 13 for automatically coating solder paste in the hollow groove 11.

[0029] The pressurizing mechanism 13 includes an air storage cylinder 131, which is set in a hollow groove 11. A piston pad 138 is movably arranged inside the air storage cylinder 131. A piston rod 132 is arranged on one side of the piston pad 138. A positioning plate 134 is arranged at the end of the piston rod 132. The positioning plate 134 can assist in positioning the circuit board body 5 and drive the piston rod 132 to move. A return spring 133 is sleeved on the piston rod 132. One end of the return spring 133 is connected to the positioning plate 134. The return spring 133 can drive the piston rod 132 to automatically return and move. The air storage cylinder 131 is connected to the storage tank 6 through an air guiding structure.

[0030] The air guiding structure includes an air supply pipe 137. One end of the air supply pipe 137 is connected to a diversion pipe 136, and the other end of the air supply pipe 137 is connected to an air storage cylinder 131. The airflow in the air storage cylinder 131 can be transported to the diversion pipe 136 through the air supply pipe 137. The diversion pipe 136 is set in the hollow groove 11. The diversion pipe 136 is connected to the corresponding air inlet 139 through a guide pipe 135. The air inlets 139 are equidistantly arranged on the inner wall of the storage tank 6. The airflow in the air storage cylinder 131 can be evenly transported to the storage tank 6 and pressurize the solder paste in the storage tank 6.

[0031] The upper positioning plate 1 is also provided with fixing ears 2 on both sides. The upper fixing plate can be installed on the small press through the fixing ears 2, which facilitates the movement of the upper positioning plate 1.

[0032] First, solder paste is injected into the storage tank 6. Then, the upper positioning plate 1 is fixed to the small press by the fixing lug 2, and the bottom carrier plate 4 is fixed to the processing table. The circuit board body 5 is positioned on the bottom carrier plate 4. The upper positioning plate 1 moves downward along the guide post 3. When the positioning plate 134 is in contact with the circuit board, as the upper positioning plate 1 moves downward, the positioning plate 134 drives the piston rod 132 to move. The piston rod 132 drives the piston pad 138 to move. The movement of the piston pad 138 delivers the airflow in the air storage cylinder 131 to the distribution pipe 136 through the air supply pipe 137. The distribution pipe 136 delivers the airflow to the storage tank 6 through the air inlet 139. When the upper positioning plate 1 is in contact with the bottom carrier plate 4, under the action of air pressure, the solder paste in the storage tank 6 flows out through the guide hole 9 and is injected into the riveting hole on the circuit board body 5 to tin the riveting hole.

[0033] In one embodiment, slots 8 are provided on both sides of the storage tank 6, and sealing caps 7 are provided in the slots 8. By setting the slots 8, the extensions on both sides of the sealing caps 7 can be inserted into the slots 8 and locked with bolts, so that the sealing caps 7 can be quickly fixed in the storage tank 6, thereby sealing the storage tank 6.

[0034] In one embodiment, positioning grooves 12 are also provided on both sides of the hollow groove 11 for positioning the extension of the circuit board body 5, which can position the extension of the circuit board.

[0035] Please see Figure 7 The bottom carrier plate 4 is also provided with a material collection mechanism for collecting overflow solder paste. The material collection mechanism includes a material collection tank 41 and a carrier platform 44. The carrier platform 44 is provided with an elongated hole 45 corresponding to the riveting hole to facilitate the guidance of overflow solder paste. The bottom of the elongated hole 45 is connected to the unloading port 43. The unloading port 43 is located at the bottom of the carrier platform 44 and can guide the overflow solder paste into the unloading port 43.

[0036] When applying solder paste to the riveting holes on the circuit board body 5, the overflowing solder paste flows into the elongated hole 45. The solder paste can be guided into the discharge port 43 through the elongated hole 45, and the overflowing solder paste can be collected through the collection tank 41, which facilitates the processing and reuse of the solder paste.

[0037] In one embodiment, the bottom carrier plate 4 is also provided with multiple sets of limiting posts 42. The limiting posts 42 are used to install and position the circuit board body 5. By setting the limiting posts 42, the installation of the circuit board body 5 can be limited, ensuring the installation accuracy of the circuit board body 5.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A solder paste coating fixture for riveting holes on a circuit board, characterized in that, include: The bottom carrier plate is provided with multiple guide posts and a material collection mechanism for collecting overflowing solder paste. An upper positioning plate is provided on a plurality of guide posts. A material storage trough is also provided on the upper positioning plate. A hollow groove is provided at the bottom of the upper positioning plate, and an air storage cylinder is provided in the hollow groove. The bottom of the storage tank is provided with a guide hole corresponding to the riveting hole on the circuit board body, and the hollowed-out groove is also provided with a pressure mechanism for automatically coating solder paste. The pressurizing mechanism is equipped with an air storage cylinder, which is connected to the storage tank through an air guiding structure. A piston pad is movably installed inside the air storage cylinder. A piston rod is installed on one side of the piston pad, and a positioning plate is installed at the end of the piston rod. A return spring is sleeved on the outside of the piston rod, and one end of the return spring is connected to the positioning plate.

2. The solder paste coating fixture for rivet holes on a circuit board according to claim 1, characterized in that, The air guiding structure includes an air supply pipe, one end of which is connected to a diversion pipe disposed in a hollow groove. The diversion pipe is connected to a corresponding air inlet through a guide pipe. The air inlets are equidistantly disposed on the inner wall of the storage tank.

3. The solder paste coating fixture for rivet holes on a circuit board according to claim 1 or 2, characterized in that, The storage tank is also provided with slots on both sides, and a sealing cover is provided in the slot.

4. The solder paste coating fixture for rivet holes on a circuit board according to claim 1 or 2, characterized in that, The hollowed-out groove is also provided with positioning grooves on both sides for positioning the extension of the circuit board body.

5. The solder paste coating fixture for rivet holes on a circuit board according to claim 1, characterized in that, The material collection mechanism includes a material collection trough, and a platform is also provided in the material collection trough. The platform is provided with elongated holes corresponding to the riveting holes.

6. The solder paste coating fixture for rivet holes on a circuit board according to claim 5, characterized in that, The bottom of the elongated hole is connected to the discharge port, which is located at the bottom of the platform.

7. The solder paste coating fixture for riveting holes on a circuit board according to claim 1, characterized in that, The bottom carrier plate is also provided with multiple sets of limiting posts, which are used to install and position the circuit board body.

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