Box-type semiconductor wafer silicon boat

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and discloses a box type semiconductor wafer silicon boat, which comprises a silicon boat body made of polycrystalline columnar silicon with the purity of 99.9999999% as a base material. The silicon boat body comprises a pair of upper supporting parts and a pair of lower supporting parts which are symmetrically arranged, an inclined plane connecting part for connecting the upper supporting parts and the lower supporting parts, and a bottom surface connecting part for connecting the two lower supporting parts; a plurality of supporting grooves which are linearly and uniformly distributed and penetrate through part of the upper supporting part and part of the lower supporting part are formed in the silicon boat body, the supporting grooves are trapezoidal grooves or rectangular grooves, and a plurality of lightweight through holes in a rectangular array are formed in the inclined plane connecting part and the bottom surface connecting part respectively. By arranging the small-angle trapezoidal grooves or rectangular grooves, the stability of wafer placement can be improved, shaking in the machining process is reduced, and therefore the wafer quality is improved; the silicon boat is provided with a plurality of through holes, so that light weight can be realized under the condition that the strength of the silicon boat is ensured.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a box-type semiconductor wafer silicon boat. Background Technology

[0002] A wafer refers to a silicon wafer used in the fabrication of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. Various circuit element structures can be fabricated on silicon wafers to create IC products with specific electrical functions. In the chemical deposition process, a gaseous reactant is introduced to stabilize the reaction on the substrate, and the gas flow rate is a crucial control parameter. Existing silicon boats, such as the one disclosed in Chinese patent application number CN201822193700.3, have V-shaped grooves with a large opening angle of 25°~30°. When the wafer is placed in the furnace, only a small section of the edge contacts the V-shaped groove, and the large opening angle affects the stability of the wafer within the reactor. Variations in flow rate can cause the wafer to wobble, thus affecting the deposition quality on the wafer surface. Utility Model Content

[0003] The purpose of this invention is to provide a box-type semiconductor wafer silicon boat. By setting trapezoidal or rectangular grooves with small angles, the stability of wafer placement can be improved, the shaking during processing can be reduced, and thus the wafer quality can be improved. By setting multiple through holes on the silicon boat, the silicon boat can be made lightweight while maintaining strength.

[0004] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0005] A box-type semiconductor wafer silicon boat includes a silicon boat body made of polycrystalline columnar silicon with a purity of 99.9999999999% as the base material. The silicon boat body includes a pair of symmetrically arranged upper support parts and a pair of lower support parts, an inclined connecting part connecting the upper support parts and the lower support parts, and a bottom connecting part connecting the two lower support parts.

[0006] The silicon boat body has multiple linearly distributed support grooves for the upper and lower support portions, and the openings of the support grooves are formed with chamfers or rounded corners. The inclined connecting portion and the bottom connecting portion are each formed with multiple rectangular arrays of lightweight through holes. The shape of the lightweight through holes can be hexagonal holes, square holes, or other adaptable holes.

[0007] The wafers are placed in support slots, which are linearly and evenly distributed to facilitate spacing between wafers, ensuring orderly and stable placement. The silicon boat's center of gravity is positioned slightly lower, and the flat bottom connection enhances its stability during use. Multiple lightweight through-holes significantly reduce the overall weight of the silicon boat, while the horizontal and vertical support bars between these through-holes maintain the boat's strength while maintaining its lightweight design.

[0008] The present invention is further configured such that the support groove is an isosceles trapezoidal groove with a larger upper section and a smaller lower section.

[0009] The included angle between the two inclined surfaces of the support groove is θ, where 0° < θ ≤ 15°.

[0010] The support groove is in the shape of an isosceles trapezoid, which provides a certain degree of guidance during wafer insertion and facilitates the wafer insertion process.

[0011] This invention can also be configured such that the support groove is a rectangular groove with a depth of 1.5-5.5 mm. The rectangular groove also accommodates wafer insertion and reduces the tilt angle after wafer insertion, while also facilitating processing.

[0012] This invention is further configured such that: the upper support portion includes an inwardly protruding rounded-corner protruding post, and the support groove passes through the rounded-corner protruding post. By providing the rounded-corner protruding post, contact between the wafer and the inclined connecting portion can be avoided when the wafer is placed, thus preventing damage.

[0013] The present invention is further configured such that the lower support portion is thickened at the lower end and outer end of the support groove, which can improve the support strength of the support groove and make the center of gravity of the silicon boat located at the lower part, thereby improving the stability of the entire silicon boat.

[0014] The present invention is further configured such that: a positioning hole is formed on the bottom connecting part, which facilitates the positioning of the silicon boat and the automatic insertion of the wafer into the support groove.

[0015] The present invention is further configured such that there are two positioning holes, which are symmetrically arranged about the center, allowing the silicon boat to be placed in both directions, reducing the requirements for silicon boat placement and facilitating subsequent wafer processing and production.

[0016] The present invention is further configured such that: the bottom of the bottom connecting part is formed with a pair of supporting bosses arranged in front and behind. When the silicon boat is placed, the supporting bosses act as supports, so that there is a certain gap between the bottom connecting part and the plane on which the supporting bosses are placed, thereby reducing the contact area between the silicon boat and the plane, reducing interference with other impurities during placement, and improving the stability of placement.

[0017] The outstanding effect of this utility model is:

[0018] Compared with existing technologies, setting trapezoidal or rectangular slots with small angles can improve the stability of wafer placement, reduce shaking during processing, and thus improve wafer quality; by setting multiple through holes on the silicon boat, the silicon boat can be made lightweight while maintaining strength.

[0019] By setting positioning holes, the silicon boat can be accurately positioned, which facilitates the automatic insertion of the wafer into the support slot and improves wafer processing efficiency.

[0020] Using high-purity polycrystalline columnar silicon as the base material, the expansion consistency of the silicon boat and wafer can be ensured, which can effectively prevent silicon wafer warping, improve the misalignment on the silicon wafer surface, and thus improve the yield of silicon wafers.

[0021] The integrated silicon boat design makes its structure more stable and robust. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of this utility model;

[0023] Figure 2 This is a front view of the present invention;

[0024] Figure 3 for Figure 2 A sectional view of AA;

[0025] Figure 4 for Figure 2 A sectional view of BB;

[0026] Figure 5 This is a schematic diagram of a rectangular support groove.

[0027] Reference numerals: 1. Silicon boat body; 11. Upper support; 12. Lower support; 13. Angled connection; 14. Bottom connection; 15. Support groove; 16. Positioning hole; 17. Support boss; 18. Lightweight through hole;

[0028] 111. Rounded-corner protruding column;

[0029] 90. Wafer. Detailed Implementation

[0030] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0031] The following is for reference Figures 1 to 4 The embodiments of this utility model are described below:

[0032] A type of box-shaped semiconductor wafer silicon boat, such as Figure 1 , Figure 2As shown, the silicon boat body 1 is made of polycrystalline columnar silicon with a purity of 99.9999999999% as the base material. The silicon boat body 1 includes a pair of upper support parts 11 and a pair of lower support parts 12 symmetrically arranged, an inclined connecting part 13 connecting the upper support parts 11 and the lower support parts 12, and a bottom connecting part 14 connecting the two lower support parts 12.

[0033] The silicon boat body 1 has multiple linearly distributed through-part upper support 11 and lower support 12 support grooves 15 formed on it. The opening of the support groove is formed with chamfers or rounded corners. The inclined surface connecting part 13 and the bottom surface connecting part 14 are each formed with multiple rectangular arrays of lightweight through holes 18. The shape of the lightweight through holes can be hexagonal holes, square holes or other adaptive holes.

[0034] The wafer 90 is placed in the support slots. The linear and evenly distributed support slots also facilitate the placement of wafers with gaps, ensuring orderly and stable placement. By setting multiple lightweight through-holes, the weight of the entire silicon boat can be significantly reduced, while the horizontal and vertical support bars between the multiple lightweight through-holes ensure the strength of the silicon boat.

[0035] like Figure 3 , Figure 4 As shown, the support groove 15 in this embodiment has an isosceles trapezoidal groove with a larger top and a smaller bottom.

[0036] The included angle between the two inclined surfaces of the support groove 15 is θ, where 0° < θ ≤ 15°.

[0037] The support groove is in the shape of an isosceles trapezoid, which provides a certain degree of guidance during wafer insertion and facilitates the wafer insertion process.

[0038] like Figure 5 As shown, the support groove 15 can also be configured as a rectangular groove, with a groove depth of 1.5-5.5 mm. The rectangular groove also facilitates wafer insertion and reduces the tilt angle after wafer insertion, while also simplifying manufacturing.

[0039] like Figure 2 As shown, the upper support portion 11 includes an inwardly protruding rounded-corner protrusion 111, through which the support groove 15 passes. By providing the rounded-corner protrusion 111, contact between the wafer and the inclined surface connection portion can be avoided when placing the wafer, thus preventing damage.

[0040] The lower support portion 12 is thickened at the lower and outer ends of the support groove 15, which can improve the support strength of the support groove and make the center of gravity of the silicon boat located at the lower part, thereby improving the stability of the entire silicon boat.

[0041] like Figure 1As shown, the bottom connecting part 14 of this embodiment is formed with positioning holes 16. By setting the positioning holes, the silicon boat can be positioned easily, and the wafer can be automatically inserted into the support groove.

[0042] There are two positioning holes 16, which are symmetrically arranged about the center, allowing the silicon boat to be placed in both directions, reducing the requirements for silicon boat placement and facilitating subsequent wafer processing and production.

[0043] like Figure 2 As shown, the bottom of the bottom connecting part 14 in this embodiment is formed with a pair of supporting bosses 17 arranged in front and behind. When the silicon boat is placed, the supporting bosses can provide support so that there is a certain gap between the bottom connecting part and the plane on which the supporting bosses are placed, thereby reducing the contact area between the silicon boat and the plane, reducing interference with other impurities during placement, and improving the stability of placement.

[0044] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model. These improvements and modifications assumed above should also be considered within the protection scope of the present utility model.

Claims

1. A box-type semiconductor wafer silicon boat, comprising a silicon boat body (1), characterized in that: The silicon boat body (1) includes a pair of upper support parts (11) and a pair of lower support parts (12) arranged symmetrically, an inclined connecting part (13) connecting the upper support parts (11) and the lower support parts (12) and a bottom connecting part (14) connecting the two lower support parts (12). The silicon boat body (1) has multiple linearly distributed through-part upper support (11) and lower support (12) support grooves (15) formed on it, and multiple rectangular array lightweight through holes (18) are formed on the inclined surface connection part (13) and the bottom surface connection part (14).

2. The box-type semiconductor wafer silicon boat according to claim 1, characterized in that: The support groove (15) is an isosceles trapezoidal groove with a larger top and a smaller bottom.

3. The box-type semiconductor wafer silicon boat according to claim 2, characterized in that: The included angle between the two inclined surfaces of the support groove (15) is θ, where 0° < θ ≤ 15°.

4. The box-type semiconductor wafer silicon boat according to claim 1, characterized in that: The support groove (15) is a rectangular groove.

5. A box-type semiconductor wafer silicon boat according to claim 1, characterized in that: The upper support (11) includes an inwardly protruding rounded corner protrusion (111), and the support groove (15) passes through the rounded corner protrusion (111).

6. The box-type semiconductor wafer silicon boat according to claim 1, characterized in that: The lower support (12) is thickened at the lower end and outer end of the support groove (15).

7. A box-type semiconductor wafer silicon boat according to claim 1, characterized in that: The bottom connecting part (14) is formed with positioning holes (16).

8. A box-type semiconductor wafer silicon boat according to claim 7, characterized in that: There are two positioning holes (16), and the two positioning holes (16) are arranged symmetrically about the center.

9. A box-type semiconductor wafer silicon boat according to claim 1, characterized in that: The bottom of the bottom connecting part (14) is formed with a pair of supporting bosses (17) arranged front and rear.

Images