Silicon wafer impact separation device
By designing a silicon wafer impact separation device, which automatically separates the silicon wafer from the top support using a basket-support component and an impact component, the inefficiency caused by manual intervention is solved, and efficient automated separation is achieved.
Patent Information
- Application Number
- CN202423100676.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2034-12-16
AI Technical Summary
In existing technologies, when the debonding of the silicon wafer and the support fails, manual intervention is required, resulting in low separation efficiency.
Design a silicon wafer impact separation device that uses a basket-supporting component and an impact component to separate silicon wafers from a top support by impact. The impact end is designed to facilitate the entry and separation of the silicon wafer basket, and automatically collects silicon wafers without manual intervention.
This improves the separation efficiency of silicon wafers and the top support, reduces manual intervention, and increases the automation and efficiency of the separation process.
Smart Images
Figure CN223786473U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of silicon wafer production technology, and in particular to a silicon wafer impact separation device. Background Technology
[0002] The typical production method for silicon wafers involves attaching silicon rods and support trays together in a wafer basket and then cutting the silicon rods. After the silicon wafers are cut, the silicon wafers and support trays need to be debonded. During the debonding process, the debonding may fail, requiring external force to separate the silicon wafers from the support trays, such as manual handling of the wafer baskets. However, manual intervention is inefficient. Therefore, a silicon wafer impact separation device is provided, which separates the silicon wafers from the support trays by impact. Utility Model Content
[0003] To overcome the above-mentioned shortcomings, the purpose of this utility model is to provide a silicon wafer impact separation device. By using a basket-supporting component, the movement of the silicon wafer basket is made more flexible. The impact component is used to impact and separate the silicon wafers that have not fallen off the basket. The openings on the top and side of the impact end facilitate the entry of the silicon wafer basket, and the impact is performed on the side without an opening at the impact end, thereby separating the silicon wafers from the top support. The opening on the ground of the impact end is used to collect the silicon wafers that fall off due to the impact. No manual intervention is required, and the separation efficiency of silicon wafers from the top support is high.
[0004] To achieve the above objectives, the technical solution adopted by this utility model is: a silicon wafer impact separation device, comprising:
[0005] The flower basket support assembly includes a first shaft, a second shaft, and a third shaft. The first shaft extends along a first direction, the second shaft extends along a second direction, and the third shaft extends along a third direction. The second shaft is disposed on the first shaft, and the third shaft is disposed on the second shaft.
[0006] An impact component is disposed on the underside of the flower basket support component. The impact component includes an impact end, which is a cuboid shape with a top surface, a bottom surface, and a side opening.
[0007] In this technical solution, the basket-carrying assembly is used to transport the silicon wafer basket and provide power to it. The first shaft is used to drive the silicon wafer basket to move in a first direction, the second shaft is used to drive the silicon wafer basket to move in a second direction, and the third shaft is used to drive the silicon wafer basket to move in a third direction. By using the basket-carrying assembly, the movement of the silicon wafer basket is made more flexible. The impact assembly is used to impact and separate the silicon wafers that have not fallen off the basket. The openings on the top and side of the impact end facilitate the entry of the silicon wafer basket, and the impact is performed on the side without an opening at the impact end, thereby separating the silicon wafers from the top support. The opening on the ground of the impact end is used to collect the silicon wafers that fall off due to the impact. No manual intervention is required, and the separation efficiency of the silicon wafers from the top support is high.
[0008] In some embodiments, the silicon wafer impact separation device further includes a first drive assembly, wherein the second shaft is disposed on the first shaft via the first drive assembly.
[0009] In this technical solution, the first driving component is used to drive the second axis to move along the first axis, thereby driving the silicon wafer basket to move along the first direction.
[0010] In some embodiments, the two first shafts are arranged in parallel, the upper surface of the first shafts is serrated, and the first drive assembly includes a first drive gear, which is engaged with the upper surface of the first shaft.
[0011] In this technical solution, the first drive component drives the second shaft to move along the length direction of the first shaft by using a first drive gear.
[0012] In some embodiments, the silicon wafer impact separation device further includes a second drive assembly, wherein the third shaft is disposed on the second shaft via the second drive assembly.
[0013] In this technical solution, the second driving component is used to drive the third axis to move along the length direction of the second axis, thereby driving the silicon wafer basket to move along the second direction.
[0014] In some embodiments, the side of the second shaft is serrated, and the second drive assembly includes a second drive gear that is engaged with the second shaft.
[0015] In this technical solution, the second drive component drives the third shaft to move along the length direction of the second shaft by using the second drive gear.
[0016] In some embodiments, the silicon wafer impact separation device further includes a third drive assembly, wherein the third shaft is disposed on the second shaft via the third drive assembly.
[0017] In this technical solution, the third driving component is used to drive the third axis to move along the third direction, thereby driving the silicon wafer basket to move along the third direction.
[0018] In some embodiments, the opening on the side of the impact end faces the first direction.
[0019] In this technical solution, the flower basket support component drives the silicon wafer flower basket to move in the first reverse direction and impact the impact end, thereby causing the silicon wafer to fall off.
[0020] In some embodiments, the impact assembly further includes a collecting end disposed below the impact end, the collecting end being connected to and conducting the collecting end.
[0021] In this technical solution, the collecting end is used to collect the silicon wafers that fall off when the silicon wafer basket collides with the impact end.
[0022] In some embodiments, the impact assembly further includes a mounting base comprising a crossbeam extending in a second direction, the collecting end being slidably connected to the crossbeam.
[0023] In this technical solution, the mounting base is used to install the collecting end and the impact end. By setting the collecting end and the crossbeam to a sliding connection, it is easy to remove the collecting end, thereby collecting the silicon wafers collected in the collecting end.
[0024] In some embodiments, the collecting end is provided with a handle on its side along the second direction.
[0025] In this technical solution, the handle facilitates pushing and pulling the collection end, thereby removing the collection end from the mounting base, or installing the collection end into the collection base.
[0026] The beneficial effects of this utility model are that the movement of the silicon wafer basket is more flexible by using the basket-bearing component, the impact component is used to impact and separate the silicon wafers that have not fallen off the basket, the openings on the top and side of the impact end facilitate the entry of the silicon wafer basket, and the impact is performed on the side without opening at the impact end, thereby separating the silicon wafers from the top support, and the opening on the ground of the impact end is used to collect the silicon wafers that fall off due to the impact. No manual intervention is required, and the separation efficiency of silicon wafers from the top support is high. Attached Figure Description
[0027] Figure 1 This is a schematic diagram of the overall structure of a silicon wafer impact separation device according to an embodiment of the present invention;
[0028] Figure 2 This is a schematic diagram of the impact component of a silicon wafer impact separation device according to an embodiment of the present invention. Figure 1 ;
[0029] Figure 3This is a schematic diagram of the impact component of a silicon wafer impact separation device according to an embodiment of the present invention. Figure 2 ;
[0030] Figure 4 This is a schematic diagram showing the connection of the first shaft, second shaft, and third shaft of a silicon wafer impact separation device according to an embodiment of the present invention.
[0031] In the diagram: 1. First shaft; 2. Second shaft; 3. Third shaft; 4. Impact assembly; 41. Impact end; 42. Collection end; 43. Mounting base; 44. Handle; 5. First drive assembly; 51. First drive gear; 6. Second drive assembly; 7. Third drive assembly; 71. Third drive gear; x, first direction; y, second direction; z, third direction. Detailed Implementation
[0032] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.
[0033] Combined with appendix Figure 1 To be continued Figure 3 As shown, this utility model provides a silicon wafer impact separation device, comprising:
[0034] The flower basket support assembly includes a first shaft 1, a second shaft 2, and a third shaft 3. The first shaft 1 extends along a first direction x, the second shaft 2 extends along a second direction y, and the third shaft 3 extends along a third direction z. The second shaft 2 is disposed on the first shaft 1, and the third shaft 3 is disposed on the second shaft 2.
[0035] Impact component 4 is disposed on the lower side of the flower basket support component. The impact component 4 includes an impact end 41, which is a cuboid shape with a top surface, a bottom surface and a side opening.
[0036] The basket-carrying assembly is used to transport silicon wafer baskets and provides power to the baskets. The first shaft 1 drives the basket to move along the first direction x, the second shaft 2 drives the basket to move along the second direction y, and the third shaft 3 drives the basket to move along the third direction z. The basket-carrying assembly makes the movement of the basket more flexible. The impact assembly 4 is used to impact and separate the silicon wafers that have not fallen off the basket. The openings on the top and sides of the impact end 41 facilitate the entry of the basket and impact the unopened side of the impact end 41 to separate the silicon wafers from the top support. The opening on the ground of the impact end 41 is used to collect the silicon wafers that fall off due to the impact. No manual intervention is required, and the separation efficiency of the silicon wafers from the top support is high.
[0037] Continue to combine with the appendix Figure 4 As shown, in some embodiments, the silicon wafer impact separation device further includes a first driving component 5, and the second shaft 2 is disposed on the first shaft 1 through the first driving component 5. The first driving component 5 is used to drive the second shaft 2 to move along the first shaft 1, thereby driving the silicon wafer basket to move along the first direction x.
[0038] In some embodiments, the two first shafts 1 are arranged in parallel, the upper surface of the first shafts 1 is serrated, the first drive assembly 5 includes a first drive gear 51, the first drive gear 51 is engaged with the upper surface of the first shafts 1, and the first drive assembly 5 drives the second shaft 2 to move along the length direction of the first shafts 1 by using the first drive gear 51.
[0039] Continue to combine with the appendix Figure 4 As shown, in some embodiments, the silicon wafer impact separation device further includes a second driving component 6. The third shaft 3 is disposed on the second shaft 2 via the second driving component 6. The second driving component 6 is used to drive the third shaft 3 to move along the length direction of the second shaft 2, thereby driving the silicon wafer basket to move along the second direction y.
[0040] In some embodiments, the second shaft 2 has a serrated side surface, and the second drive assembly 6 includes a second drive gear. The second drive gear is engaged with the second shaft 2, and the second drive assembly 6 drives the third shaft 3 to move along the length direction of the second shaft 2 by using the second drive gear.
[0041] Continue to combine with the appendix Figure 4 As shown, in some embodiments, the silicon wafer impact separation device further includes a third drive assembly 7. The third shaft 3 is disposed on the second shaft 2 via the third drive assembly 7. The side of the third shaft 3 is serrated. The third drive assembly 7 includes a third drive gear 71, which is engaged with the third shaft 3. The third drive assembly 7 is used to drive the third shaft 3 to move along the third direction z, thereby driving the silicon wafer basket to move along the third direction z.
[0042] Continue to combine with the appendix Figure 2 and attached Figure 3 As shown, in some embodiments, the opening on the side of the impact end 41 faces the first direction x, and the flower basket carrying assembly drives the silicon wafer flower basket to move in the first reverse direction to impact the impact end 41, thereby causing the silicon wafer to fall off.
[0043] Continue to combine with the appendix Figure 2 and attached Figure 3As shown, in some embodiments, the impact assembly 4 further includes a collection end 42, which is disposed below the impact end 41. The collection end 42 is connected to and conducts through the impact end 41. The collection end 42 is used to collect silicon wafers that fall off when the silicon wafer basket collides with the impact end 41.
[0044] Continue to combine with the appendix Figure 1 To be continued Figure 3 As shown, in some embodiments, the impact assembly 4 further includes a mounting base 43, which includes a crossbeam extending along a second direction y. The collecting end 42 is slidably connected to the crossbeam. The mounting base 43 is used to mount the collecting end 42 and the impact end 41. By setting the collecting end 42 and the crossbeam to be slidably connected, it is convenient to remove the collecting end 42, thereby collecting the silicon wafers collected in the collecting end 42.
[0045] Continue to combine with the appendix Figure 3 As shown, in some embodiments, the collecting end 42 is provided with a handle 44 on its side along the second direction y. The handle 44 facilitates pushing and pulling the collecting end 42, thereby removing the collecting end 42 from the mounting base 43, or installing the collecting end 42 into the collecting base.
[0046] In summary, this utility model provides a silicon wafer impact separation device. By using a basket-supporting component, the movement of the silicon wafer basket becomes more flexible. The impact component is used to impact and separate the silicon wafers that have not fallen off the basket. The openings on the top and side of the impact end facilitate the entry of the silicon wafer basket, and the impact is performed on the side without an opening at the impact end, thereby separating the silicon wafers from the top support. The opening on the ground of the impact end is used to collect the silicon wafers that fall off due to the impact. No manual intervention is required, and the separation efficiency between the silicon wafers and the top support is high.
[0047] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it. They cannot be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the protection scope of this utility model.
Claims
1. A silicon wafer impact separation device, characterized in that, include: The flower basket support assembly includes a first shaft, a second shaft, and a third shaft. The first shaft extends along a first direction, the second shaft extends along a second direction, and the third shaft extends along a third direction. The second shaft is disposed on the first shaft, and the third shaft is disposed on the second shaft. An impact component is disposed on the underside of the flower basket support component. The impact component includes an impact end, which is a cuboid shape with a top surface, a bottom surface, and a side opening.
2. The silicon wafer impact separation device according to claim 1, characterized in that, It also includes a first drive component, wherein the second shaft is mounted on the first shaft via the first drive component.
3. The silicon wafer impact separation device according to claim 2, characterized in that, Two first shafts are arranged in parallel, the upper surface of the first shaft is serrated, and the first drive assembly includes a first drive gear, which is engaged with the upper surface of the first shaft.
4. The silicon wafer impact separation device according to claim 1, characterized in that, It also includes a second drive assembly, wherein the third shaft is mounted on the second shaft via the second drive assembly.
5. The silicon wafer impact separation device according to claim 4, characterized in that, The second shaft has a serrated side surface, and the second drive assembly includes a second drive gear, which is engaged with the second shaft.
6. The silicon wafer impact separation device according to claim 1, characterized in that, It also includes a third drive assembly, wherein the third shaft is mounted on the second shaft via the third drive assembly.
7. The silicon wafer impact separation device according to claim 1, characterized in that, The opening on the side of the impact end faces the first direction.
8. The silicon wafer impact separation device according to claim 7, characterized in that, The impact assembly also includes a collection end, which is disposed below the impact end and is connected to and conducts through the collection end.
9. The silicon wafer impact separation device according to claim 8, characterized in that, The impact assembly also includes a mounting base, the mounting base including a crossbeam extending in a second direction, and the collecting end being slidably connected to the crossbeam.
10. The silicon wafer impact separation device according to claim 9, characterized in that, The collecting end is provided with a handle on its side along the second direction.