Heat dissipation structure for chip

Abstract

The utility model provides a heat dissipation structure for a chip, which relates to the technical field of chip heat dissipation and comprises a circuit board and a chip arranged on the circuit board. According to the LED lamp, firstly, the first heat dissipation assembly is fixed to the circuit board through the connecting plate, the heat conducting fins and the heat dissipation fins are arranged in the top shell, the heat exchange surface area is increased through the heat dissipation fins, the draught fan installed at one end of the shell accelerates heat discharge by forcing air to flow, the draught fan blows air out through the air outlet, and therefore the heat is taken away; the second heat dissipation assembly is located on the side, close to the shell, of the heat conduction piece, cooling liquid is guided to flow through the flow guide groove, the conveying pipe is connected with the water cooling liquid box, the water pump in the water cooling liquid box conveys the cooling liquid to the flow guide groove through the output pipe, heat is absorbed and taken away through the high heat capacity of the liquid, and stable operation of the circuit board and the chip is guaranteed. By combining two modes of air cooling and water cooling, the temperature of the circuit board and the chip on the circuit board is effectively reduced.

Description

Technical Field

[0001] This utility model relates to the field of chip heat dissipation technology, and in particular to a heat dissipation structure for chips. Background Technology

[0002] As electronic devices become more high-performance and miniaturized, chip power consumption continues to increase, leading to higher chip temperatures that affect their stability and lifespan. Therefore, effective heat dissipation has become a key issue in chip design. Common heat dissipation structures include heat sinks, heat pipes, and phase change materials, which help reduce chip temperature and improve overall performance and reliability by increasing heat conduction efficiency or heat dissipation area.

[0003] However, in actual use, the following shortcomings still exist. For example, the existing heat dissipation structure for chips is simple and the heat dissipation effect is poor, which cannot achieve a good heat dissipation effect for the chips. Excessive temperature will lead to a decrease in chip performance, and may even cause failures such as crashes and blue screens. This is because high temperature will affect the carrier mobility of semiconductor materials, thereby reducing the chip's computing speed and efficiency. High temperature will accelerate the aging process of electronic components and shorten the service life of the equipment. At the same time, high temperature may also cause changes in the internal physical structure of the chip, such as uneven material expansion and contraction, which will further affect the stability and reliability of the chip.

[0004] Therefore, this utility model proposes a heat dissipation structure for chips to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies and propose a heat dissipation structure for chips.

[0006] To achieve the above objectives, this utility model adopts the following technical solution: a heat dissipation structure for chips, comprising:

[0007] Circuit board and the chips mounted on the circuit board;

[0008] The first heat dissipation component is placed on the top of the circuit board. The first heat dissipation component includes a connecting plate disposed on the top of the circuit board. A housing is fixedly connected to the top of the connecting plate. A heat-conducting plate is fixedly connected to the bottom inner part of the housing. A heat dissipation fin is fixedly connected to the top of the heat-conducting plate. A fan is installed at one end of the housing. An exhaust port is opened on the end of the housing away from the fan.

[0009] The second heat dissipation component is located on the side of the connecting plate near the outer shell. The second heat dissipation component includes a guide groove formed in the heat-conducting plate. A delivery pipe is fixedly connected to the side of the heat-conducting plate near the guide groove. A water coolant tank is fixedly connected to the delivery pipe. A water pump is installed on the top of the water coolant tank. The delivery pipe is located at the output end of the water pump. A cooling plate is provided on the side of the connecting plate near the bottom of the water coolant tank.

[0010] Furthermore, the chip is mounted on the connection board.

[0011] The beneficial effects of adopting the above-mentioned further solution are: the chip is mounted on the connection board, which not only provides physical support for the chip, but also helps the chip maintain a low operating temperature through the cooperation of the heat conductor and the heat dissipation system, thus ensuring the efficient operation and stability of the device.

[0012] Furthermore, the connecting plate is provided with a fixing component, which includes a fixing block fixed to one side of the connecting plate.

[0013] The beneficial effects of adopting the above-mentioned further solution are: the fixing component fixes the connecting plate to the circuit board through the fixing block, which plays a supporting and stabilizing role, can enhance the overall stability of the structure, prevent the system from shifting or loosening due to external interference, and thus ensure the normal operation and long-term reliability of the system.

[0014] Furthermore, a telescopic spring is fixedly connected to the bottom of the fixing block.

[0015] The beneficial effects of adopting the above-mentioned further solution are: adding a telescopic spring to the bottom of the fixing block can provide the system with multiple functions such as buffering, shock absorption, and force transmission adjustment. This can not only enhance the adaptability and stability of the fixing components, but also effectively reduce the risks of the system in dynamic environments, extend the service life of the equipment, and improve the reliability of operation.

[0016] Furthermore, a limit plate is fixedly connected to the other end of the telescopic spring.

[0017] The beneficial effects of adopting the above-mentioned further solution are: the design of the combination of telescopic spring and limit plate provides more precise control and protection for the system. The limit plate not only restricts the range of motion of the telescopic spring to prevent excessive stretching or compression, but also adjusts the amount of spring extension and contraction to ensure stable system operation and avoid damage caused by excessive rebound or loss of control.

[0018] Furthermore, screws are provided on the fixing block.

[0019] The beneficial effects of adopting the above-mentioned further solution are: by setting screws on the fixing block, the structural design provides high-strength connection and fixing capabilities, ensuring that the system components can operate stably for a long time. The screws are not only easy to assemble, disassemble and adjust, but can also withstand the action of external forces, ensuring the safety and durability of the components.

[0020] Furthermore, the screw is threaded into the limiting plate.

[0021] The advantages of adopting the above-mentioned further solution are: the screw is connected to the limiting plate by threads, which provides a stable and precise connection, with strong adjustment capability and convenient maintenance characteristics. This design not only ensures that the components remain stable during operation, but also effectively transmits external forces, increasing the reliability and durability of the system.

[0022] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0023] In this invention, firstly, the first heat dissipation component is fixed to the circuit board via a connecting plate. The top outer shell is equipped with heat-conducting plates and heat dissipation fins, which increase the heat exchange surface area. A fan installed at one end of the outer shell accelerates heat dissipation by forcing airflow. The fan blows air out through the exhaust port, thereby carrying away heat. The second heat dissipation component is located on the heat-conducting plate, near the outer shell. It guides the flow of coolant through a guide channel. The delivery pipe is connected to a water-cooled liquid tank. The water pump in the water-cooled liquid tank delivers coolant to the guide channel through the output pipe. The high heat capacity of the liquid absorbs and carries away heat, ensuring the stable operation of the circuit board and the chip. By combining air cooling and water cooling, the temperature of the circuit board and the chip on it is effectively reduced. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of a heat dissipation structure for a chip according to the present invention;

[0025] Figure 2 This is a schematic diagram of the first heat dissipation component of a heat dissipation structure for a chip according to the present invention;

[0026] Figure 3 This is a schematic diagram of the second heat dissipation component structure of a chip heat dissipation structure according to the present invention;

[0027] Figure 4 This is a schematic diagram of the fixed component structure of a heat dissipation structure for a chip according to the present invention.

[0028] Figure label:

[0029] 1. Circuit board; 2. Chip;

[0030] 3. First heat dissipation component; 31. Connecting plate; 32. Housing; 33. Heat-conducting plate; 34. Heat dissipation fins; 35. Fan; 36. Exhaust vent;

[0031] 4. Second heat dissipation component; 41. Guide channel; 42. Delivery pipe; 43. Water coolant tank; 44. Water pump; 45. Cooling element;

[0032] 5. Fixing components; 51. Fixing block; 52. Telescopic spring; 53. Limiting plate; 54. Screw. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] like Figures 1-3 As shown, this embodiment provides a technical solution: a heat dissipation structure for a chip, comprising:

[0035] Circuit board 1 and chip 2 disposed on circuit board 1;

[0036] The first heat dissipation component 3 is placed on the top of the circuit board 1. The first heat dissipation component 3 includes a connecting plate 31 disposed on the top of the circuit board 1. A housing 32 is fixedly connected to the top of the connecting plate 31. A heat-conducting plate 33 is fixedly connected to the bottom inner part of the housing 32. A heat dissipation fin 34 is fixedly connected to the top of the heat-conducting plate 33. A fan 35 is installed at one end of the housing 32. An exhaust port 36 is opened on the end of the housing 32 away from the fan 35.

[0037] The second heat dissipation component 4 is located on the connecting plate 31 near the outer casing 32. The second heat dissipation component 4 includes a guide channel 41 formed within a heat-conducting fin 33. A delivery pipe 42 is fixedly connected to the heat-conducting fin 33 near the guide channel 41. A coolant tank 43 is fixedly connected to the delivery pipe 42. A water pump 44 is installed on the top of the coolant tank 43. The delivery pipe 42 is located at the output end of the water pump 44. A cooling fin 45 is located on the connecting plate 31 near the bottom of the coolant tank 43. A first heat dissipation component 3 is installed above the circuit board 1. This component includes a connecting plate 31. The top of the connecting plate 31 is fixedly connected to the outer casing 32. A heat-conducting fin 33 is fixed to the inner bottom of the outer casing 32. A heat dissipation fin 34 is connected to the top of the heat-conducting fin 33 to increase the heat dissipation area and improve heat transfer efficiency. A fan 35 is installed at one end of the outer casing 32 to drive airflow and remove hot air from around the heat dissipation fins 34. An exhaust vent 36 is provided on the end of the outer casing 32 away from the fan 35. Air is pushed into the outer casing 32 by the fan 35 and flows out of the exhaust vent 36, carrying away the heat generated by the chip 2. A second heat dissipation component 4 is provided on the side of the connecting plate 31 near the outer casing 32. This component guides the flow of coolant through the guide groove 41 opened in the heat-conducting plate 33. A delivery pipe 42 is fixed on the heat-conducting plate 33 near the guide groove 41. The delivery pipe 42 is connected to the coolant tank 43. The coolant tank 43 is filled with coolant and is pushed by the water pump 44. The coolant enters the heat-conducting plate 33 in the guide groove 41 through the delivery pipe 42, thereby carrying away heat. The flow of coolant effectively reduces the temperature of the heat-conducting plate 33, further improving the heat dissipation effect. A cooling plate 45 is provided on the connecting plate 31 near the bottom of the coolant tank 43 to further reduce the temperature of the coolant and ensure that the coolant can continuously provide a low temperature environment to improve the cooling effect.

[0038] The above solutions also have the problem that, under normal use, the heat dissipation structure cannot be fixed to circuit board 1, such as... Figure 2 As shown: Chip 2 is mounted on the connecting board 31. The connecting board 31 not only provides physical support for chip 2, but also helps chip 2 maintain a low operating temperature through the cooperation of the heat conductor and the heat dissipation system, ensuring the efficient operation and stability of the device.

[0039] like Figure 1 as well as Figure 4As shown, a fixing component 5 is provided on the connecting plate 31. The fixing component 5 includes a fixing block 51 fixed to one side of the connecting plate 31. The fixing component 5 fixes the connecting plate 31 to the circuit board 1 through the fixing block 51, which plays a supporting and stabilizing role. This can enhance the overall stability of the structure and prevent the system from shifting or loosening due to external interference, thereby ensuring the normal operation and long-term reliability of the system. A telescopic spring 52 is fixedly connected to the bottom of the fixing block 51. The addition of the telescopic spring 52 to the bottom of the fixing block 51 can provide multiple functions such as buffering, shock absorption, and force transmission adjustment for the system. This not only enhances the adaptability and stability of the fixing component 5, but also effectively reduces the risk of the system in dynamic environments, extends the service life of the equipment, and improves the reliability of operation. The other end of the telescopic spring 52 is fixedly connected to a limit plate 53. The design of the combination of the telescopic spring 52 and the limit plate 53 provides the system with more precise positioning. For control and protection, the limiting plate 53 not only restricts the range of motion of the telescopic spring 52 to prevent excessive stretching or compression, but also adjusts the amount of spring extension and contraction to ensure stable system operation and avoid damage caused by excessive rebound or loss of control. The fixing block 51 is equipped with screws 54. By setting screws 54 on the fixing block 51, this structural design provides high-strength connection and fixing capabilities, ensuring that the system components can operate stably for a long time. Screws 54 are not only easy to assemble, disassemble and adjust, but can also withstand the action of external forces, ensuring the safety and durability of the components. The screws 54 are threaded into the limiting plate 53, providing a solid and precise connection with strong adjustment capabilities and convenient maintenance characteristics. This design not only ensures that the components remain stable during operation, but also effectively transmits external forces, increasing the reliability and durability of the system.

[0040] Working principle: such as Figures 1-4As shown, the heat dissipation structure is first set on the chip 2. A first heat dissipation component 3 is installed above the circuit board 1. This component includes a connecting plate 31, the top of which is fixedly connected to the outer shell 32. A heat-conducting plate 33 is fixed to the bottom of the inner side of the outer shell 32. A heat dissipation fin 34 is connected to the top of the heat-conducting plate 33 to increase the heat dissipation area and improve the heat conduction efficiency. A fan 35 is installed at one end of the outer shell 32 to drive airflow and remove the hot air around the heat dissipation fin 34. An exhaust port 36 is opened on the outer shell 32 away from the fan 35. Air enters the outer shell 32 by the fan 35 and flows out of the exhaust port 36, removing the heat generated by the chip 2. A second heat dissipation component 4 is set on the side of the connecting plate 31 near the outer shell 32. This component guides the flow of coolant through a guide groove 41 opened in the heat-conducting plate 33. A delivery pipe 42 is fixed on the heat-conducting plate 33 near the guide groove 41. The delivery pipe 42 is connected to a coolant tank 43. The coolant tank 43 contains coolant and is pumped by a water pump 44. The coolant flows through the delivery pipe 42 into the heat-conducting fins 33 in the guide channel 41, thus carrying away heat. The flow of coolant effectively reduces the temperature of the heat-conducting fins 33, further improving the heat dissipation effect. Cooling fins 45 are provided on the connecting plate 31 near the bottom of the coolant tank 43 to further reduce the temperature of the coolant, ensuring that the coolant can continuously provide a low temperature environment to improve the cooling effect. The fixing assembly 5 connects the fixing block 51, the telescopic spring 52 and the limiting plate 53 together through the connecting plate 31. One side of the fixing block 51 is fixed to the connecting plate 31, and the bottom is connected to the limiting plate 53 through the telescopic spring 52. The screw 54 is threaded into the limiting plate 53 for fixing and adjusting the position of the limiting plate 53. The telescopic spring 52 provides elastic force, allowing the limiting plate 53 to move or adjust within a certain range, so that the heat dissipation structure can be stably fixed on the circuit board 1 and can provide a buffer protection for the heat dissipation structure to prevent damage to the circuit board 1 and the chip 2 caused by external forces.

[0041] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A heat dissipation structure for a chip, characterized in that, include: Circuit board (1) and chip (2) disposed on circuit board (1); The first heat dissipation component (3) is placed on the top of the circuit board (1). The first heat dissipation component (3) includes a connecting plate (31) disposed on the top of the circuit board (1). A shell (32) is fixedly connected to the top of the connecting plate (31). A heat-conducting plate (33) is fixedly connected to the bottom of the shell (32). A heat dissipation fin (34) is fixedly connected to the top of the heat-conducting plate (33). A fan (35) is installed at one end of the shell (32). An exhaust port (36) is opened on the end of the shell (32) away from the fan (35). The second heat dissipation component (4) is placed on the connecting plate (31) on the side near the outer shell (32). The second heat dissipation component (4) includes a guide groove (41) opened in the heat-conducting plate (33). A delivery pipe (42) is fixedly connected to the side of the heat-conducting plate (33) near the guide groove (41). A water coolant tank (43) is fixedly connected to the delivery pipe (42). A water pump (44) is installed on the top of the water coolant tank (43). The delivery pipe (42) is set on the output end of the water pump (44). A cooling plate (45) is provided on the side of the connecting plate (31) near the bottom of the water coolant tank (43).

2. The heat dissipation structure for a chip according to claim 1, characterized in that: The chip (2) is mounted on the connecting board (31).

3. The heat dissipation structure for a chip according to claim 1, characterized in that: The connecting plate (31) is provided with a fixing component (5), which includes a fixing block (51) fixed to one side of the connecting plate (31).

4. The heat dissipation structure for a chip according to claim 3, characterized in that: A telescopic spring (52) is fixedly connected to the bottom of the fixing block (51).

5. A heat dissipation structure for a chip according to claim 4, characterized in that: The other end of the telescopic spring (52) is fixedly connected to a limiting plate (53).

6. A heat dissipation structure for a chip according to claim 3, characterized in that: Screws (54) are provided on the fixing block (51).

7. A heat dissipation structure for a chip according to claim 6, characterized in that: The screw (54) is threaded into the limiting plate (53).

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