Double-sided water-cooling radiator for IGBT module

Abstract

The utility model discloses an IGBT (Insulated Gate Bipolar Translator) module double-sided water-cooling radiator, which comprises a water-cooling cover plate and a water-cooling bottom plate which are respectively contacted with the upper surface and the lower surface of an IGBT module, the water-cooling cover plate is detachably and fixedly connected with the water-cooling bottom plate, and water-cooling inner cavities are arranged in the water-cooling cover plate and the water-cooling bottom plate. A water inlet pipeline communicated with the water-cooling inner cavity in the water-cooling bottom plate and a water guide pipeline extending upwards are arranged on the water-cooling bottom plate, and a water outlet pipeline and a guide hole which are communicated with the water-cooling inner cavity in the water-cooling cover plate are arranged on the bottom surface of the water-cooling cover plate. The beneficial effects are that the water-cooling cover plate and the water-cooling bottom plate are utilized to assist the upper and lower surfaces of the IGBT module in contact, and the guide holes and the water guide pipelines guide the cooling liquid in an insertion manner, thereby ensuring the smooth circulation of the cooling liquid, remarkably improving the cooling efficiency of the IGBT module, ensuring the compactness and stability of the whole system, and improving the reliability of the system. The water-cooling radiator can provide a more efficient, convenient and stable cooling effect, and the service life of the IGBT module is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of IGBT module cooling, specifically to a double-sided water-cooled heat sink for IGBT modules. Background Technology

[0002] An IGBT (Insulated Gate Bipolar Transistor) module is a semiconductor device that combines the characteristics of MOSFETs and BJTs. It is widely used in the field of power electronics, especially in high-power applications such as frequency converters, electric vehicles, wind power generation, rail transportation, and power conversion. It has the high input impedance characteristics of MOSFETs, while having the low conduction loss and high voltage withstand capability of BJTs.

[0003] Comparing with Chinese utility model patent CN218101241U, which discloses an IGBT heat dissipation module, relating to the field of heat dissipation, including an IGBT device, the bottom of the inner cavity of the IGBT device is filled with a semiconductor substrate, a heat dissipation vent is opened in the middle of one side of the IGBT device, a slot is opened at the bottom end of the semiconductor substrate, the slot is connected to the heat dissipation vent, and a mounting bracket is provided in the middle of one side of the IGBT device, both ends of one side of the mounting bracket are connected to the IGBT device through mounting components.

[0004] The aforementioned patents primarily rely on heat-conducting plates and heat sinks located on one side of the IGBT device, with a cooling fan assisting in heat dissipation. In this structure, the thermal conductivity of air is poor, resulting in relatively low heat dissipation efficiency. Although the use of a cooling fan can improve the heat dissipation effect, the fan will accumulate dust or age over a long period of use, reducing its efficiency. The heat sink and fan rely on external airflow for heat dissipation, which may lead to uneven heat dissipation, especially in confined spaces or environments with poor airflow, where some areas of the heat sink may not be effectively cooled.

[0005] Therefore, providing a double-sided water-cooled heat sink for IGBT modules is a problem worthy of research. Utility Model Content

[0006] In order to overcome the shortcomings of the existing technology, the purpose of this utility model is to ensure smooth circulation of coolant, significantly improve the cooling efficiency of IGBT module, ensure the compactness and stability of the whole system, and extend the service life of IGBT module.

[0007] The purpose of this utility model is achieved as follows:

[0008] This utility model provides a double-sided water-cooled heat sink for an IGBT module, including a water-cooled cover plate and a water-cooled base plate that respectively contact the upper and lower surfaces of the IGBT module. The water-cooled cover plate and the water-cooled base plate are detachably and fixedly connected. Both the water-cooled cover plate and the water-cooled base plate are provided with a water-cooled inner cavity. The water-cooled base plate is provided with an inlet pipe communicating with the water-cooled inner cavity and an upwardly extending guide pipe. The bottom surface of the water-cooled cover plate is provided with an outlet pipe communicating with the water-cooled inner cavity and a guide hole. The guide hole is inserted into the guide pipe to guide the coolant flow.

[0009] To further explain, the surface of the water-cooled base plate has a through hole running from top to bottom, and the water outlet pipe runs through the through hole from top to bottom, and is correspondingly arranged with the water inlet pipe.

[0010] To further explain, the through hole is located on one side of the center line of the width of the water-cooled base plate, and the water guide pipe is set corresponding to the center line of the width of the water-cooled base plate.

[0011] Further explanation is that the water-cooled inner cavity includes a first cooling cavity and a second cooling cavity located on opposite sides, as well as multiple water-blocking strips located between the first cooling cavity and the second cooling cavity. Adjacent water-blocking strips form a channel connecting the first cooling cavity and the second cooling cavity. The first cooling cavity in the water-cooled cover plate and the water-cooled base plate are arranged vertically correspondingly, and the guide hole extends to the second cooling cavity in the water-cooled cover plate. The water outlet pipe is connected to the first cooling cavity in the water-cooled cover plate.

[0012] To further explain, the upper surface of the water guide pipe is inclined, and the lower end of the inclined surface faces the second cooling cavity in the water-cooled cover plate when the water guide pipe is inserted into the water-cooled inner cavity.

[0013] To further explain, the high end of the water guide pipe is provided with a conical sealing ring.

[0014] To further explain, the water-cooled cover plate and the water-cooled base plate are connected by four corner bolts.

[0015] Further explanation is that the water-cooled base plate has threaded holes at its four corners, and the water-cooled cover plate has through holes at its four corners.

[0016] To further explain, the surfaces of the water-cooled cover plate and the water-cooled base plate are provided with grooves to limit the movement of the IGBT module.

[0017] Positive and beneficial effects:

[0018] By utilizing a water-cooled cover plate and a water-cooled base plate to facilitate contact between the upper and lower surfaces of the IGBT module, and by using a plug-in connection between the guide hole and the water pipe to guide the coolant, which is then discharged through the outlet pipe, the coolant circulation is ensured to be smooth. This significantly improves the cooling efficiency of the IGBT module and ensures that the entire system is compact and stable. This water-cooled radiator can provide a more efficient, convenient and stable cooling effect, extend the service life of the IGBT module, and is suitable for heat dissipation of IGBT modules in confined spaces. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the exploded structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0021] Figure 3 This is a bottom view of the present invention;

[0022] Figure 4 This is a top view of the internal structure of this utility model;

[0023] Figure 5 This is a schematic diagram of the structure of the water-cooled base plate in this utility model;

[0024] The diagram shows: water-cooled cover plate 1, water outlet pipe 101, guide hole 102, water-cooled base plate 2, water inlet pipe 201, through hole 202, water guide pipe 203, sealing ring 204, IGBT module 3, water-cooled inner cavity 4, first cooling cavity 401, second cooling cavity 402, and water baffle 403. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0026] First embodiment:

[0027] See Figures 1-5As shown, this utility model provides a double-sided water-cooled heat sink for an IGBT module, including a water-cooled cover plate 1 and a water-cooled base plate 2 that respectively contact the upper and lower surfaces of the IGBT module 3. It can effectively conduct the heat generated by the module to the water-cooled inner cavity 4, thereby achieving efficient heat dissipation and preventing the module from overheating. The water-cooled cover plate 1 and the water-cooled base plate 2 are detachably connected, facilitating installation, maintenance, and replacement, reducing maintenance costs and complexity after long-term use. Both the water-cooled cover plate 1 and the water-cooled base plate 2 are provided with a water-cooled inner cavity 4. The water-cooled base plate 2 is provided with a water inlet pipe 201 communicating with the water-cooled inner cavity 4 and an upwardly extending water guide pipe 20. 3. The bottom surface of the water-cooled cover plate 1 is provided with a water outlet pipe 101 and a guide hole 102 communicating with the internal water-cooled cavity 4. The guide hole 102 is inserted into the water guide pipe 203 to guide the coolant flow. When in use, the device works in conjunction with a corresponding coolant circulation system, allowing the coolant to enter the water-cooled cavity 4 in the water-cooled base plate 2 through the water inlet pipe 201, and then be transported from the water-cooled base plate 2 to the water-cooled cavity 4 in the water-cooled cover plate 1 through the water guide pipe 203, and finally discharged from the water outlet pipe 101. With the flow of coolant, the cooling efficiency of the IGBT module 3 is greatly improved.

[0028] Preferably, both the water-cooled cover plate 1 and the water-cooled base plate 2 are made of copper, and the water-cooled cover plate 1 and the water-cooled base plate 2 are connected by bolts at the four corners to ensure that the two are tightly connected and form a stable cooling structure. Specifically, the water-cooled base plate 2 has threaded holes at the four corners, and the water-cooled cover plate 1 has through holes at the four corners. When connecting, the bolts pass through the through holes on the water-cooled cover plate 1 and are fixed by threaded connection with the threaded holes, which facilitates bolt fixing connection.

[0029] In addition, grooves are provided on the water-cooled cover plate 1 and the water-cooled base plate 2 to limit and fix the IGBT module 3, effectively preventing the module from shifting during the cooling process, thereby ensuring the stability and safety of the cooling process.

[0030] Furthermore, the surface of the water-cooled base plate 2 has through holes 202 running from top to bottom. The through holes 202 are staggered with the water-cooled inner cavity 4 in the water-cooled base plate 2. The water outlet pipe 101 runs through the through holes 202 from top to bottom and is correspondingly set with the water inlet pipe 201. The bottom surfaces of the water outlet pipe 101 and the water inlet pipe 201 are flush. This simplifies the pipe connection, making it easier to connect the water supply pipe to the water inlet pipe 201 and the water inlet pipe to the water outlet pipe 101. This reduces the complexity of the pipe layout, facilitates installation and later maintenance, helps ensure the smooth flow of coolant, avoids a reduction in cooling efficiency, and is suitable for heat dissipation of IGBT modules in confined spaces.

[0031] The second embodiment differs from the first embodiment in that:

[0032] The water-cooled inner cavity 4 includes a first cooling cavity 401 and a second cooling cavity 402 located on opposite sides, and a water-blocking strip 403 located between the first cooling cavity 401 and the second cooling cavity 402. Adjacent water-blocking strips 403 form a channel connecting the first cooling cavity 401 and the second cooling cavity 402. The first cooling cavities 401 in the water-cooled cover plate 1 and the water-cooled base plate 2 are vertically correspondingly arranged. Specifically, the guide hole 102 communicates with the second cooling cavity 402 in the water-cooled cover plate 1, the water outlet pipe 101 communicates with the first cooling cavity 401 in the water-cooled cover plate 1, and the water inlet pipe 201 communicates with the first cooling cavity 402 in the water-cooled base plate 2. 1. The water guide pipe 203 is connected to the second cooling chamber 402 in the water-cooled base plate 2. The first cooling chamber 401 and the second cooling chamber 402 are located on both sides of the length of the water-cooled inner cavity 4. These two cooling chambers are located on both sides of the water-cooled inner cavity 4 and are used to circulate coolant to effectively dissipate heat. The water baffle 403 is located between the first cooling chamber 401 and the second cooling chamber 402. Its function is to separate the first cooling chamber 401 and the second cooling chamber 402 and to achieve communication through the channel set between adjacent water baffles 403, so as to ensure that the coolant can flow evenly between the two chambers and improve the heat dissipation efficiency. The inlet pipe 201 is connected to the first cooling chamber 401 in the water-cooled base plate 2, providing the source for the coolant to flow in. The guide pipe 203 is connected to the second cooling chamber 402 in the water-cooled base plate 2, ensuring that the coolant can flow to the second cooling chamber 402 and effectively remove heat. The outlet pipe 101 is connected to the first cooling chamber 401 in the water-cooled cover plate 1, discharging the cooled liquid. This not only improves the heat dissipation efficiency but also avoids problems such as poor coolant flow or leakage, ensuring the stability and efficiency of the system.

[0033] The third embodiment differs from the first embodiment in that:

[0034] The through hole 202 is located on one side of the center line of the width of the water-cooled base plate 2, and the water guide pipe 203 is set corresponding to the center line of the width of the water-cooled base plate 2. That is, the through hole 202 is asymmetrically set. When installing the water-cooled cover plate 1 and the water-cooled base plate 2, the water outlet pipe 101 passes through the through hole 202, and the water guide pipe 203 passes through the guide hole 102. This can position the water-cooled cover plate 1 and the water-cooled base plate 2 and improve the accuracy of the installation.

[0035] The upper surface of the water guide pipe 203 is inclined. When the water guide pipe 203 is inserted into the water-cooled inner cavity 4 inside the water-cooled cover plate 1, the lower end of the inclined surface faces the second cooling cavity 402 in the water-cooled cover plate 1. When the water guide pipe 203 is inclinedly inserted into the guide hole 102, the coolant can be directly guided to the water-cooled inner cavity through the inclined insertion port, which improves the cooling effect and reduces the coolant delivery problem caused by the small liquid delivery gap of the water guide pipe 203. It also reduces the resistance of the coolant in the cavity and improves the overall cooling performance and stability of the system.

[0036] In addition, the high end of the water guide pipe 203 is provided with a conical sealing ring 204. The conical sealing ring 204 forms a tight seal by contacting the guide hole 102 in the water-cooled cover plate 1, thereby preventing coolant leakage. The structure of the conical sealing ring not only improves the sealing effect, but also can adapt to minor installation errors, ensuring that the cooling system can operate stably under different working conditions and avoiding coolant loss or system pressure fluctuations caused by poor sealing. Furthermore, the conical design allows the sealing ring to withstand greater compressive force, thereby reducing the use of sealant and further enhancing the reliability and durability of the seal.

Claims

1. A double-sided water-cooled heat sink for an IGBT module, comprising a water-cooled cover plate (1) and a water-cooled base plate (2) respectively in contact with the upper and lower surfaces of the IGBT module (3), characterized in that: The water-cooled cover plate (1) and the water-cooled base plate (2) are detachably and fixedly connected. Both the water-cooled cover plate (1) and the water-cooled base plate (2) are provided with water-cooled inner cavities (4). The water-cooled base plate (2) is provided with an inlet pipe (201) communicating with the water-cooled inner cavity (4) inside it and an upwardly extending guide pipe (203). The bottom surface of the water-cooled cover plate (1) is provided with an outlet pipe (101) communicating with the water-cooled inner cavity (4) inside it and a guide hole (102). The guide hole (102) is connected to the water guide pipe (203) to guide the coolant flow.

2. The IGBT module double-sided water-cooled heat sink according to claim 1, characterized in that: The surface of the water-cooled base plate (2) has a through hole (202) running from top to bottom. The water outlet pipe (101) runs through the through hole (202) from top to bottom and is correspondingly arranged with the water inlet pipe (201).

3. The IGBT module double-sided water-cooled heat sink according to claim 2, characterized in that: The through hole (202) is located on one side of the width center line of the water-cooled base plate (2), and the water guide pipe (203) is set corresponding to the width center line of the water-cooled base plate (2).

4. The IGBT module double-sided water-cooled heat sink according to claim 2, characterized in that: The water-cooled inner cavity (4) includes a first cooling cavity (401) and a second cooling cavity (402) located on opposite sides, and multiple water-blocking strips (403) located between the first cooling cavity (401) and the second cooling cavity (402). A channel is formed between two adjacent water-blocking strips (403) to connect the first cooling cavity (401) and the second cooling cavity (402). The first cooling cavity (401) in the water-cooled cover plate (1) and the water-cooled base plate (2) are arranged vertically and vertically, and the guide hole (102) extends to the second cooling cavity (402) in the water-cooled cover plate (1). The water outlet pipe (101) is connected to the first cooling cavity (401) in the water-cooled cover plate (1).

5. The IGBT module double-sided water-cooled heat sink according to claim 4, characterized in that: The upper surface of the water guide pipe (203) is inclined and inserted into the water-cooled inner cavity (4) inside the water-cooled cover plate (1), with the lower end of the inclined surface facing the second cooling cavity (402) in the water-cooled cover plate (1).

6. The IGBT module double-sided water-cooled heat sink according to claim 4, characterized in that: The high end of the water guide pipe (203) is provided with a conical sealing ring (204).

7. The IGBT module double-sided water-cooled heat sink according to claim 1, characterized in that: The water-cooled cover plate (1) and the water-cooled base plate (2) are connected by four corner bolts.

8. The IGBT module double-sided water-cooled heat sink according to claim 7, characterized in that: The water-cooled base plate (2) has threaded holes at its four corners, and the water-cooled cover plate (1) has through holes at its four corners.

9. A double-sided water-cooled heat sink for an IGBT module according to claim 7, characterized in that: The surfaces of the water-cooled cover plate (1) and the water-cooled base plate (2) are provided with grooves that limit the IGBT module (3).

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