Independent graphics card heat dissipation case

Abstract

The utility model discloses an independent graphics card heat dissipation case, which comprises a case, a mainboard unit, an independent graphics card unit, a liquid cooling unit, a plurality of heat dissipation units and a power supply unit, an upper space, a side groove and a lower space are sequentially defined by the machine shell from top to bottom. The mainboard unit, the independent graphics card unit, the liquid cooling unit and the heat dissipation unit are arranged in the upper space. The mainboard unit comprises a processor assembly and a memory assembly. The power supply unit is arranged in the lower space. Through the design of the side groove, air around the machine shell can flow into the upper space from the side groove and flow out of the upper space under the guidance of at least one of the heat dissipation units, so that heat energy generated by the independent graphics card unit can be rapidly taken away, and heat dissipation of the independent graphics card unit can be optimized.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of personal computer mainframes, in particular to a kind of independent graphics card cooling machine case. BACKGROUND

[0002] Referring to Figure 1 A known personal computer mainframe for e-sports includes a cabinet 91 in the shape of a rectangular parallelepiped and defining an internal space 90, and a mainboard unit 92, an independent graphics card unit 93, a liquid cooling unit 94, a plurality of heat dissipation units 95, and a power supply unit 96 disposed in the internal space 90. The mainboard unit 92 is disposed on the right side plate of the cabinet 91 (positive Y direction) and extends downward from the bottom of the top cover of the cabinet 91 (negative Z direction) to the top of the power supply unit 96. The mainboard unit 92 includes a processor component 921 and a memory component 922 disposed on the right side plate of the cabinet 91. The independent graphics card unit 93 extends from the back side plate of the cabinet 91 (negative X direction) to the front side plate of the cabinet 91 (positive X direction).

[0003] The liquid cooling unit 94 is disposed on the bottom of the top cover of the cabinet 91 and above (positive Z direction) the independent graphics card unit 93. The liquid cooling unit 94 is mainly used for heat dissipation of the processor component 921 and the memory component 922. The heat dissipation units 95 are respectively disposed on the front side top of the back side plate of the cabinet 91, the bottom of the liquid cooling unit 94, and the back side of the front side plate of the cabinet 91. The power supply unit 96 occupies the bottom of the internal space 90 and is below the independent graphics card unit 93. The power supply unit 96 includes a power supply and various cables, lines, and other components.

[0004] Although the heat generated by the independent graphics card unit 93 can be guided out of the cabinet 91 by the heat dissipation units 95 on the top side and the back side of the internal space 90, the heat generated by the power supply unit 96 flows through the independent graphics card unit 93 through the plurality of heat dissipation holes on the top, resulting in poor heat dissipation effect for the independent graphics card unit 93, which needs to be improved. SUMMARY

[0005] The purpose of the present utility model is to provide an independent graphics card cooling machine case that can at least overcome the shortcomings of the background art.

[0006] The independent graphics card cooling machine case of the present utility model includes a cabinet, a mainboard unit, an independent graphics card unit, a liquid cooling unit, a plurality of heat dissipation units, and a power supply unit.

[0007] The cabinet sequentially defines an upper space, a side slot, and a lower space from top to bottom.

[0008] The mainboard unit is disposed in the upper space and includes a processor component and a memory component.

[0009] The independent graphics card unit, the liquid cooling unit, and the heat dissipation unit are disposed in the upper space.

[0010] The power supply unit is disposed in the lower space.

[0011] Air around the casing can flow into the upper space from the side groove and be guided out of the upper space by at least one of the heat dissipation units to quickly take away the heat generated by the independent graphics card unit.

[0012] The independent graphics card heat dissipation case, the top cover, the support unit, the upper partition plate, the upper front side plate and the upper rear side plate, the upper side plate, the lower partition plate, the lower front side plate and the lower rear side plate, and the lower side plate are defined.

[0013] The upper partition plate, the lower partition plate, and the support unit cooperatively define the side groove.

[0014] The top cover, the support unit, the upper partition plate, the upper front side plate, the upper rear side plate, and the upper side plate define the upper space.

[0015] The bottom plate, the support unit, the lower partition plate, the lower front side plate, the lower rear side plate, and the lower side plate define the lower space.

[0016] The top cover has at least one heat dissipation area.

[0017] The upper partition plate has a plurality of heat dissipation holes.

[0018] The independent graphics card cooling case of this utility model has multiple heat dissipation holes in the lower partition and the lower rear side panel. The heat generated by the power supply unit flows out of the lower space through the heat dissipation holes of the lower partition, and then flows outward from the side groove, or directly flows outward through the heat dissipation holes of the lower rear side panel.

[0019] The beneficial effects of this utility model are as follows: through the design of the side slot, the air around the casing can flow into the upper space from the side slot and flow out of the upper space under the guidance of at least one of the heat dissipation units, so as to quickly remove the heat generated by the discrete graphics card unit, thus enhancing the heat dissipation of the discrete graphics card unit. Attached Figure Description

[0020] Other features and effects of this utility model will be clearly presented in the embodiments with reference to the accompanying drawings, in which the positive X direction represents the front side, the negative X direction represents the rear side, the positive Y direction represents the right side, the negative Y direction represents the left side, the positive Z direction represents the top side, and the negative Z direction represents the bottom side, wherein:

[0021] Figure 1 This is a left view illustrating a known personal computer mainframe; the left side of the outer casing is not shown in the figure.

[0022] Figure 2 This is a perspective view from the left front, illustrating an embodiment of the independent graphics card cooling case of this utility model. The outer shell is omitted from the figure.

[0023] Figure 3 This is a perspective view from the left rear, illustrating this embodiment;

[0024] Figure 4 This is a perspective view from the right front, illustrating this embodiment. The outer shell portion is omitted from the figure.

[0025] Figure 5 This is a left view illustrating this embodiment; the outer casing portion is omitted from the figure.

[0026] Figure 6 This is a perspective view illustrating this embodiment;

[0027] Figure 7 This is a top view illustrating this embodiment;

[0028] Figure 8 This is a front view illustrating this embodiment; the outer casing portion is omitted from the figure.

[0029] Figure 9 This is an exploded view from below, illustrating this embodiment. Detailed Implementation

[0030] SeeFigure 2 、 Figure 3 With Figure 4 The utility model discloses independent graphics card cooling machine case's embodiment contains the cuboid casing 1, and sets up the mainboard unit 21, independent graphics card unit 22, liquid cooling unit 23 (referring to Figure 5 ), several heat dissipation units 24, power supply unit 25 and hard disk unit 26 in the casing 1.

[0031] The casing 1 is sequentially defined from upper (positive Z direction) to lower (negative Z direction) cuboid upper space 100, oblate cuboid side groove 120 and oblate cuboid lower space 130. The casing 1 includes top cover 101 and bottom plate 102 spaced apart, support unit 103 extending and connecting between the right side (positive Y direction) of top cover 101 and the right side of bottom plate 102, upper partition 104 connected with support unit 103 and arranged between top cover 101 and bottom plate 102 spaced apart, upper front side plate 105 (referring to Figure 6 ) and upper rear side plate 106 spaced apart and connected with top cover 101, support unit 103 and upper partition 104, upper side plate 107 spaced apart and connected with top cover 101, upper partition 104, upper front side plate 105 and upper rear side plate 106, lower partition 108 connected with support unit 103 and arranged between bottom plate 102 and upper partition 104 spaced apart, lower front side plate 109 and lower rear side plate 110 spaced apart and connected with bottom plate 102, support unit 103 and lower partition 108, and lower side plate 111 spaced apart and connected with bottom plate 102, lower partition 108, lower front side plate 109 and lower rear side plate 110.

[0032] The top cover 101, the support unit 103, the upper partition 104, the upper front side plate 105, the upper rear side plate 106 and the upper side plate 107 define the upper space 100. The upper partition 104, the lower partition 108, and the support unit 103 cooperatively define the side groove 120. The bottom plate 102, the support unit 103, the lower partition 108, the lower front side plate 109, the lower rear side plate 110 and the lower side plate 111 define the lower space 130.

[0033] Referring to Figure 2 、 Figure 4 With Figure 7The top cover 101 has three heat dissipation zones 112 which are in communication with the upper space 100 and the outside of the casing 1. Each of the heat dissipation zones 112 has a plurality of front (positive X direction) and rear (negative X direction) extending and left (negative Y direction) and right (positive Y direction) spaced heat dissipation gaps. It is noted that the number of the heat dissipation zones 112 is not limited to three, and can be one, two, four or more, depending on the actual heat dissipation requirement. The heat dissipation gaps are not limited to front and rear extending and left and right spaced, and can be left and right extending and front and rear spaced, or other implementation forms which are helpful to heat dissipation.

[0034] Referring to Figure 2 , Figure 3 and Figure 6 The upper partition plate 104 has a plurality of heat dissipation holes 113 which are in communication with the upper space 100 and the side groove 120. The upper rear side plate 106 has a plurality of heat dissipation holes 113 which are in communication with the upper space 100 and the outside of the casing 1, and a plurality of main ports. The lower partition plate 108 has a plurality of heat dissipation holes 113 which are in communication with the side groove 120 and the lower space 130. The lower rear side plate 110 has a plurality of heat dissipation holes 113 which are in communication with the lower space 130 and the outside of the casing 1, and a power line port.

[0035] Referring to Figure 2 , Figure 4 and Figure 5 The mainboard unit 21 is disposed in the upper space 100, specifically, the mainboard unit 21 is mounted on the left side of the support unit 103. The mainboard unit 21 includes a processor assembly 211 and a memory assembly 212. The processor assembly 211 can include at least one central processing unit, a built-in graphics card, a built-in memory, or other auxiliary components which are helpful to improve the computing performance. The memory assembly 212 can include at least one external memory.

[0036] Referring to Figure 2 , Figure 5 and Figure 8 The independent graphics card unit 22 is disposed in the upper space 100, specifically, the independent graphics card unit 22 is mounted on the upper rear side plate 106 and extends from the upper rear side plate 106 to the direction of the upper front side plate 105 (see Figure 6 ). The independent graphics card unit 22 is located on the left side of the mainboard unit 21. The independent graphics card unit 22 can be configured with a built-in heat dissipation assembly, for example but not limited to at least one fan. The liquid cooling unit 23 is disposed in the upper space 100, specifically, the liquid cooling unit 23 is mounted on the bottom side of the top cover 101 and located above the independent graphics card unit 22. The liquid cooling unit 23 is mainly used for heat dissipation of the mainboard unit 21.

[0037] Referring to Figure 2 ,Figure 4 and Figure 5 In this embodiment, the number of heat dissipation units 24 is four sets. The first set of heat dissipation units 24a is installed on the bottom side of the liquid cooling unit 23 and includes three fans positioned corresponding to the heat dissipation area 112 of the top cover 101. The fans are used to guide the air in the upper space 100 to flow out of the casing 1 through the heat dissipation area 112 of the top cover 101. The second set of heat dissipation units 24b is installed on the front side of the upper rear side plate 106 near the top cover 101 and includes one fan. The fan is used to guide the air in the upper space 100 through the heat dissipation holes 113 of the upper rear side plate 106 (see...). Figure 3 It flows out to the outside of the casing 1.

[0038] The third set of heat dissipation units 24c is installed on the left side of the support unit 103 and includes two fans arranged vertically. These fans guide air from outside the housing 1 into the upper space 100. The fourth set of heat dissipation units 24d is installed on the top side of the upper partition 104 and includes three fans arranged front to back. These fans guide air around the housing 1 through the side slot 120 and through the heat dissipation holes 113 of the upper partition 104 (see reference). Figure 6 The air around the casing 1 can flow into the upper space 100 from the side slot 120, and then flow out of the upper space 100 under the guidance of at least one of the heat dissipation units 24, so as to quickly remove the heat generated by the discrete graphics card unit 22 from the upper space 100, thereby enhancing the heat dissipation of the discrete graphics card unit 22.

[0039] It should be noted that the number of heat dissipation units 24 is not limited to four sets; depending on actual heat dissipation requirements, there may be two, three, five, or six sets. The number of fans in each heat dissipation unit 24 is not limited to one to three; depending on actual requirements, there may be four or more.

[0040] See Figure 2 , Figure 4 and Figure 9 The power supply unit 25 is located on the rear side of the lower space 130 and is connected to the power supply port of the lower rear panel 110 (see reference). Figure 3 An external power cord is used to supply power to the entire host unit. The heat generated by this power supply unit 25 can be dissipated through the ventilation holes 113 of the lower partition 108 (see...). Figure 3 The water flows out of the lower space 130 and then outward from the side groove 120, or directly through the heat dissipation holes 113 of the lower rear side plate 110 (see...). Figure 3The heat generated by the power supply unit 25 flows outwards, therefore, the heat generated by the power supply unit 25 will not affect the heat dissipation of the discrete graphics card unit 22. The hard disk unit 26 is located at the front of the lower space 130, therefore, the heat generated by the hard disk unit 26 will not affect the heat dissipation of the discrete graphics card unit 22.

[0041] In summary, the independent graphics card cooling chassis of this utility model, through the design of the side slot 120, allows the air around the chassis 1 to flow into the upper space 100 through the side slot 120, and then flow out of the upper space 100 under the guidance of at least one of the cooling units 24, so as to quickly remove the heat generated by the independent graphics card unit 22, thus achieving the purpose of this utility model.

[0042] Moreover, the heat generated by the power supply unit 25 can flow out of the lower space 130 through the heat dissipation holes 113 of the lower partition 108, and then flow out to the outside of the casing 1 through the side groove 120. Therefore, the heat generated by the power supply unit 25 will not affect the heat dissipation of the independent graphics card unit 22, so it can indeed achieve the purpose of this utility model.

[0043] The above description is merely an embodiment of this utility model and should not be construed as limiting the scope of this utility model. Any simple equivalent changes and modifications made in accordance with the claims and description of this utility model shall still fall within the scope of this utility model.

Claims

1. A stand-alone graphics card cooling chassis, characterized by: Comprising: a casing defining, from top to bottom, an upper space, a side slot, and a lower space; a mainboard unit disposed in the upper space and including a processor assembly and a memory assembly; a discrete graphics card unit disposed in the upper space; a liquid cooling unit disposed in the upper space; a plurality of heat dissipation units disposed in the upper space; and a power supply unit disposed in the lower space; air around the casing can flow into the upper space from the side slot and be guided out of the upper space by at least one of the heat dissipation units to rapidly remove heat generated by the discrete graphics card unit. The casing includes a top cover and a bottom plate spaced apart from each other, a support unit extending between a side of the top cover and a side of the bottom plate, an upper partition plate connected to the support unit and disposed between the top cover and the bottom plate, an upper front side plate and an upper rear side plate spaced apart from each other and connected to the top cover, the support unit, and the upper partition plate, an upper side plate spaced apart from the support unit and connected to the top cover, the upper partition plate, the upper front side plate, and the upper rear side plate, a lower partition plate connected to the support unit and disposed between the bottom plate and the upper partition plate, a lower front side plate and a lower rear side plate spaced apart from each other and connected to the bottom plate, the support unit, and the lower partition plate, and a lower side plate spaced apart from the support unit and connected to the bottom plate, the lower partition plate, the lower front side plate, and the lower rear side plate.

2. The stand-alone video card cooling chassis of claim 1, wherein: The upper partition plate, the lower partition plate, and the support unit cooperatively define the side slot.

3. The stand-alone video card cooling enclosure of claim 2, wherein: The top cover, the support unit, the upper partition plate, the upper front side plate, the upper rear side plate, and the upper side plate define the upper space.

4. The stand-alone video card cooling enclosure of claim 2, wherein: The bottom plate, the support unit, the lower partition plate, the lower front side plate, the lower rear side plate, and the lower side plate define the lower space.

5. The stand-alone video card cooling enclosure of claim 2, wherein: The top cover has at least one heat dissipation area.

6. The stand-alone video card cooling enclosure of claim 2, wherein: The upper partition plate has a plurality of heat dissipation holes.

7. The stand-alone video card cooling enclosure of claim 2, wherein: The lower partition plate and the lower rear side plate both have a plurality of heat dissipation holes, and heat generated by the power supply unit flows out of the lower space through the heat dissipation holes of the lower partition plate and then out of the side slot, or directly out of the heat dissipation holes of the lower rear side plate.

8. The stand-alone video card cooling enclosure of claim 2, wherein: ​

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