High-frequency response film capacitor for nuclear magnetic resonance power supply

Abstract

The utility model relates to the technical field of thin-film capacitors, in particular to a high-frequency response thin-film capacitor for a nuclear magnetic resonance power supply, which comprises a main body mechanism serving as a device main body, the main body mechanism comprises a thin-film outer shell, a capacitor inner core, a connecting shell a and a connecting shell b, and a heat dissipation mechanism is arranged in the main body mechanism. The main body mechanism is provided with a connecting mechanism used for simply and conveniently disassembling and assembling the whole device, and the heat dissipation mechanism comprises a plurality of heat dissipation holes formed in a connecting shell a. According to the utility model, through the arrangement of the heat dissipation mechanism, the device can effectively dissipate heat in the film capacitor, heat generated on the inner core of the capacitor is conducted through the plurality of heat transfer sheets, the heat is conducted to the plurality of heat dissipation curved sheets through the plurality of heat conduction sheets, and the heat is absorbed through heat conduction silicone grease on the surfaces of the heat dissipation curved sheets, so that the heat dissipation efficiency is improved. And meanwhile, the heat is further circulated through the air flow of the air outlet holes, so that the heat dissipation effect in the thin-film capacitor is improved.

Description

Technical Field

[0001] This utility model relates to the field of thin film capacitor technology, specifically a high-frequency response thin film capacitor for nuclear magnetic resonance power supply. Background Technology

[0002] High-frequency response film capacitors are mainly used for filtering and decoupling in nuclear magnetic resonance (NMR) power supplies. They effectively filter out high-frequency noise in the power supply, ensuring its stability and providing a clean power supply for NMR equipment. Due to dielectric losses and the presence of internal metal resistance and contact resistance, metallized film capacitors generate heat during operation. When the heat generated exceeds the heat dissipation, the capacitor temperature rises, which may cause the casing to expand, deform, crack, or even burn in severe cases. Utility Model Content

[0003] To address the shortcomings of existing technologies, this invention provides a high-frequency response thin-film capacitor for nuclear magnetic resonance power supplies, which has the advantage of effectively dissipating heat from inside the capacitor. This solves the problem in existing technologies where, when the heat generated exceeds the heat dissipation, the capacitor temperature rises, potentially leading to expansion, deformation, or cracking of the outer casing.

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0005] A high-frequency response thin-film capacitor for nuclear magnetic resonance power supply includes a main body structure serving as the main body of the device. The main body structure includes a thin-film shell, a capacitor core, a connecting shell a, and a connecting shell b. A heat dissipation mechanism is provided inside the main body structure. A connecting mechanism for easy assembly and disassembly of the entire device is provided on the main body structure. The heat dissipation mechanism includes multiple heat dissipation holes on the connecting shell a, multiple air inlets on one side of the connecting shell b, and multiple air outlets on the other side of the connecting shell b. Multiple heat dissipation fins are fixedly connected to the inner wall of the thin-film shell, and heat-conducting plates are fixedly connected to the inner walls of each of the multiple heat dissipation fins. Multiple heat transfer plates are fixedly connected to one side of each of the multiple heat-conducting plates.

[0006] Preferably, the connecting mechanism includes multiple locking blocks fixedly connected to one side of the connecting shell b, a threaded groove is provided on one side of the membrane shell, multiple locking slots are provided on the other side of the membrane shell, a screw ring is fixedly connected to one side of the connecting shell a, an annular groove is provided on the inner side of the connecting shell a, a rotating ring is rotatably connected in the annular groove, and a circular plate is fixedly connected to the inner side of the rotating ring.

[0007] Preferably, the plurality of air inlets and the plurality of air outlets are connected one to one, and the diameter of the plurality of air inlets is larger than the diameter of the plurality of air outlets.

[0008] Preferably, the outer surfaces of the plurality of heat dissipation fins are provided with thermal grease.

[0009] Preferably, one end of each of the plurality of heat transfer plates is in contact with the surface of the capacitor core.

[0010] Preferably, two circular holes are formed on the circular plate, and two wires are installed on one side of the capacitor core, with the two wires located in the two circular holes respectively.

[0011] By means of the above technical solution, this utility model provides a high-frequency response thin-film capacitor for nuclear magnetic resonance power supply, which has at least the following beneficial effects:

[0012] 1. This utility model enables the device to effectively dissipate heat inside the film capacitor by setting up a heat dissipation mechanism. The heat generated on the inner core of the capacitor is conducted through multiple heat transfer plates, and the heat is conducted to multiple heat dissipation fins through multiple heat conduction plates. The heat is absorbed by the thermal grease on the surface of the fins, and the heat is further circulated through the airflow through the vent holes, thereby improving the heat dissipation effect inside the film capacitor.

[0013] 2. This utility model enables the main body to be easily disassembled and separated by setting a connecting mechanism. Multiple locking blocks and multiple locking slots connect the connecting shell b to the membrane shell, and the threaded groove and threaded ring connect the connecting shell a to the membrane shell, allowing workers to easily repair and replace the internal components. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of the present invention, form part of this application:

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0016] Figure 2 This is a schematic diagram of the main structure of the present utility model;

[0017] Figure 3 This is an exploded view of the heat dissipation mechanism of this utility model;

[0018] Figure 4 This is a schematic diagram of the connection mechanism of this utility model.

[0019] Figure label:

[0020] 1. Main body structure; 101. Thin film shell; 102. Wire; 103. Capacitor core; 104. Connecting shell a; 105. Connecting shell b; 2. Heat dissipation mechanism; 201. Heat dissipation hole; 202. Air inlet; 203. Air outlet; 204. Heat transfer plate; 205. Heat conduction plate; 206. Heat dissipation curved plate; 3. Connecting mechanism; 301. Locking block; 302. Threaded groove; 303. Threaded ring; 304. Ring groove; 305. Circular plate; 306. Rotary ring; 307. Locking slot. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] In the prior art, metallized film capacitors generate heat during operation due to dielectric loss, internal metal resistance, and contact resistance. When the heat generated exceeds the heat dissipation, the capacitor temperature rises, which may cause the casing to expand, deform, crack, or even burn in severe cases, thus damaging the capacitor. The following describes some embodiments of this utility model, with reference to the accompanying drawings, of a high-frequency response film capacitor for nuclear magnetic resonance power supplies.

[0023] Example 1:

[0024] To prevent the film capacitor from overheating and being damaged, combined with Figures 1-4 As shown, a high-frequency response thin-film capacitor for nuclear magnetic resonance power supply is proposed. The main body 1 is set as the main body of the device. The heat dissipation mechanism 2 is set inside the main body 1 to effectively dissipate the heat generated inside the thin-film capacitor. The main body 1 is provided with a connecting mechanism 3, which is used to easily disassemble and assemble the whole device, thereby facilitating the maintenance and replacement of internal components by the working heat source.

[0025] To facilitate heat dissipation inside the film capacitor, a heat dissipation mechanism 2 is proposed. This mechanism involves multiple heat dissipation holes 201 on the connecting shell a104, multiple air inlets 202 on one side of the connecting shell b105, and multiple air outlets 203 on the other side of the connecting shell b105. Multiple heat dissipation fins 206 are fixedly connected to the inner wall of the film shell 101. Each heat dissipation fin 206 has a heat-conducting plate 205 fixedly connected to its inner wall. Multiple heat transfer plates 204 are fixedly connected to one side of each heat-conducting plate 205. One end of each heat transfer plate 204 contacts the surface of the capacitor core 103. The air inlets 202 and air outlets 203 are interconnected, allowing the heat generated on the capacitor core 103 to be dissipated through the heat transfer plates 204. Heat is conducted through multiple heat-conducting plates 205 to multiple heat-dissipating fins 206. The outer surfaces of the multiple heat-dissipating fins 206 are coated with thermal grease, which effectively absorbs heat and allows for rapid exchange with the outside air through the ventilation holes, improving heat dissipation efficiency. At the same time, the airflow through the vents 203 further circulates the heat, improving the heat dissipation effect inside the film capacitor. Since the diameter of the multiple air inlets 202 is larger than the diameter of the multiple air outlets 203, when hot air enters through the larger holes and cold air exits through the smaller holes, the overall heat energy of the system is not reduced. However, through heat exchange, the temperature of the local area can be lowered, resulting in a lower temperature of the air entering the interior, further improving the heat dissipation effect of the device.

[0026] Example 2:

[0027] Based on Embodiment 1, the technical solution proposed in Embodiment 1 is used to solve the problem that when the heat generated by the thin film capacitor is greater than the heat dissipation during operation, the temperature of the capacitor rises, which may cause the outer shell to expand, deform, crack, or even burn in severe cases. However, when some components inside the capacitor need to be repaired or replaced, in order to improve its efficiency, the whole device should be easy to disassemble and assemble.

[0028] To facilitate the maintenance and replacement of internal components by staff, combined with Figure 1 and Figure 3 as well as Figure 4As shown, a connecting mechanism 3 is proposed. Multiple locking blocks 301 are fixedly connected to one side of the connecting shell b105. A threaded groove 302 is provided on one side of the membrane shell 101, and multiple locking slots 307 are provided on the other side. A threaded ring 303 is fixedly connected to one side of the connecting shell a104. An annular groove 304 is provided on the inner side of the connecting shell a104. A rotating ring 306 is rotatably connected within the annular groove 304. A circular plate 305 is fixedly connected to the inner side of the rotating ring 306. The multiple locking blocks 301 connect to multiple locking blocks 307. The slots 307 engage to connect the connecting shell b105 to the membrane shell 101. The threaded grooves 302 and the screw rings 303 connect the connecting shell a104 to the membrane shell 101, allowing workers to easily repair and replace the internal components. The circular plate 305 has two circular holes, and the two wires 102 are located in the two circular holes respectively. The ring grooves 304, the swivel rings 306, and the circular plate 305 prevent the connecting shell a104 from damaging the wires 102 during disassembly and assembly.

[0029] To construct the main body of the film capacitor, a main body structure 1 is proposed, which is mainly composed of a film shell 101, a capacitor core 103, a connecting shell a104, and a connecting shell b105. Two wires 102 are installed on one side of the capacitor core 103, and the main body of the device is connected through the wires 102.

[0030] It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-frequency response thin film capacitor for a nuclear magnetic resonance power supply, comprising a main body mechanism (1) as a device main body, the main body mechanism (1) including a thin film case (101), a capacitor inner core (103), and a connection case a (104) and a connection case b (105), characterized by: The inside of the main body mechanism (1) is provided with a heat dissipation mechanism (2), and the main body mechanism (1) is provided with a connecting mechanism (3) for conveniently disassembling the device as a whole. The heat dissipation mechanism (2) comprises a plurality of heat dissipation holes (201) formed in the connecting shell a (104), a plurality of air inlet holes (202) formed in one side of the connecting shell b (105), a plurality of air outlet holes (203) formed in the other side of the connecting shell b (105), a plurality of heat dissipation curved sheets (206) fixedly connected to the inner wall of the film shell (101), a plurality of heat conduction sheets (205) fixedly connected to the inner wall of each of the plurality of heat dissipation curved sheets (206), and a plurality of heat transfer sheets (204) fixedly connected to one side of each of the plurality of heat conduction sheets (205).

2. The high-frequency-response thin-film capacitor for a nuclear magnetic resonance power supply according to claim 1, characterized by: The connecting mechanism (3) comprises a plurality of clamping blocks (301) fixedly connected to one side of the connecting shell b (105), a threaded groove (302) formed in one side of the film shell (101), a plurality of clamping grooves (307) formed in the other side of the film shell (101), a screw ring (303) fixedly connected to one side of the connecting shell a (104), a ring groove (304) formed in the inner side of the connecting shell a (104), a rotating ring (306) rotatably connected in the ring groove (304), and a circular plate (305) fixedly connected to the inner side of the rotating ring (306).

3. The high-frequency-response thin-film capacitor for a nuclear magnetic resonance power supply according to claim 2, characterized by: The plurality of air inlet holes (202) and the plurality of air outlet holes (203) are in one-to-one correspondence, and the diameter of the plurality of air inlet holes (202) is greater than the diameter of the plurality of air outlet holes (203).

4. The high-frequency-response thin-film capacitor for a nuclear magnetic resonance power supply according to claim 1, characterized by: The outer surface of each of the plurality of heat dissipation curved sheets (206) is coated with heat-conducting silicone grease.

5. The high-frequency-response thin-film capacitor for a nuclear magnetic resonance power supply according to claim 1, characterized by: One end of each of the plurality of heat transfer sheets (204) is in contact with the surface of the capacitor inner core (103).

6. The high-frequency-response thin-film capacitor for a nuclear magnetic resonance power supply according to claim 2, characterized by: Two circular holes are formed in the circular plate (305), and two wires (102) are mounted on one side of the capacitor inner core (103), with the two wires (102) located in the two circular holes respectively.

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