Vacuum cavity for semiconductor equipment

Abstract

The utility model relates to the technical field of semiconductor equipment, in particular to a vacuum cavity for semiconductor equipment, which comprises a vacuum device main body, a lower sealing outer box and a lower sealing inner box which are sleeved and matched with each other are arranged below the vacuum device main body, a sealing plate is arranged above the lower sealing inner box, and a monitoring camera is arranged at the lower end of the sealing plate. Connecting columns are uniformly connected to the lower end of the sealing plate at intervals, a lower positioning plate is jointly fixed to the lower ends of the connecting columns, a semiconductor positioning seat is mounted at the upper end of the lower positioning plate, an upper sealing box is hermetically connected to the upper end of the lower sealing outer box, and an upper sealing door is hermetically hinged and fixed to one side of the upper sealing box; a hydraulic lifting mechanism connected with the sealing plate is installed at the upper end of the lower sealing outer box, and a circle of sealing ring is clamped below the sealing plate. The vacuum cavity for the semiconductor equipment is composed of the upper box body and the lower box body, the double-sealing effect can be achieved, other gases can be conveniently recycled, the lower box body is of a double-layer structure, and the structure is more reliable.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, specifically to a vacuum chamber for semiconductor equipment. Background Technology

[0002] Semiconductors are materials with conductivity between that of conductors and insulators, playing a crucial role in modern electronics. In semiconductor manufacturing, many process steps require operation in a high vacuum or controlled atmosphere to ensure material purity and product performance. Vacuum chambers are one of the key components used in manufacturing semiconductor devices, characterized by high sealing performance, corrosion resistance, temperature control, and high mechanical strength.

[0003] Existing vacuum chambers typically only have a sealable door structure. After the door is sealed, a vacuum process is performed. However, if the door leaks, it will greatly affect the vacuum level. Furthermore, when using gases such as hydrogen or ammonia for semiconductor processing, it will cause problems with gas recovery. Utility Model Content

[0004] The purpose of this utility model is to provide a vacuum chamber for semiconductor equipment, in order to solve the problems mentioned in the background art. Currently, vacuum chambers on the market usually only have a sealable door structure. After the door is sealed, vacuuming is performed. However, if the door leaks, it will greatly affect the vacuum level. Furthermore, when using gases such as hydrogen and ammonia for semiconductor processing, there will be problems with the inconvenience of gas recovery.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a vacuum chamber for semiconductor equipment, comprising a vacuum device body, a lower sealing outer box and a lower sealing inner box fitted together below the vacuum device body, and a sealing plate above the lower sealing inner box. A monitoring camera is installed at the lower end of the sealing plate, and connecting columns are evenly spaced at the lower end of the sealing plate. A lower positioning plate is fixed at the lower end of the connecting columns, and a semiconductor positioning seat is installed at the upper end of the lower positioning plate. An upper sealing box is sealed and connected to the upper end of the lower sealing outer box, and an upper sealing door is sealed and hinged to one side of the upper sealing box. A hydraulic lifting mechanism connected to the sealing plate is installed at the upper end of the lower sealing outer box. A sealing ring is engaged below the sealing plate, and a vacuum pump is also installed on one side of the upper end of the sealing plate.

[0006] Preferably, the upper end of the upper sealing box is fixed with an installation chamber by welding, and the installation chamber corresponds to the position of the vacuum pump.

[0007] Preferably, a heat insulation layer is filled between the lower sealing outer box and the lower sealing inner box, and the upper end of the lower sealing outer box and the lower sealing inner box forms a square hole structure, and the square hole at the upper end of the lower sealing outer box and the lower sealing inner box is tightly engaged with the sealing plate and the sealing ring.

[0008] Preferably, the inner side of the lower sealing inner box is fixed with bolts at even intervals to limit posts, and the limit posts are movably sleeved with shock-absorbing sleeves.

[0009] Preferably, the shock-absorbing sleeve is fastened through the lower positioning plate, and the shock-absorbing sleeve and the upper and lower sides of the inner side of the lower sealed inner box are in shock-absorbing contact contact through rubber pads.

[0010] Preferably, a shock-absorbing frame is engaged around the outer ring of the lower positioning plate, and the shock-absorbing frame is in close contact with the upper inner side of the lower sealed inner box.

[0011] Compared with existing technologies, the advantages of this invention are as follows: The vacuum chamber for semiconductor equipment consists of two chambers, upper and lower, which provide a double sealing effect and facilitate the recovery of other gases. The lower chamber has a double-layer structure, making it more reliable. This vacuum chamber allows semiconductors to be fed into and out of the upper sealed chamber, and then lifted into the lower sealed chamber. Air in the lower chamber can be drawn into the upper chamber, enabling rapid vacuum processing. Furthermore, it has a heat insulation layer to prevent external temperatures from affecting the vacuum level of the chamber. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of a vacuum chamber structure for a semiconductor device according to the present invention;

[0013] Figure 2 This is a schematic diagram of the sealing plate lowering structure of a vacuum cavity for a semiconductor device according to the present invention;

[0014] Figure 3 This is a top view showing the relative positions of the lower sealed outer casing and the lower sealed inner casing of a vacuum chamber for semiconductor equipment according to this utility model.

[0015] In the diagram: 1. Main body of the vacuum device; 2. Upper sealing box; 201. Upper sealing door; 202. Installation chamber; 3. Sealing plate; 301. Sealing ring; 4. Connecting column; 5. Lower sealing outer box; 6. Lower sealing inner box; 7. Semiconductor positioning seat; 8. Lower positioning plate; 801. Shock-absorbing frame; 9. Limiting column; 901. Shock-absorbing sleeve; 10. Hydraulic lifting mechanism; 11. Vacuum pump; 12. Monitoring camera; 13. Heat insulation layer. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figure 1-3This utility model provides a technical solution: a vacuum chamber for semiconductor equipment, including a vacuum device body 1, with a lower sealing outer box 5 and a lower sealing inner box 6 fitted together below the vacuum device body 1, and a sealing plate 3 above the lower sealing inner box 6. A heat insulation layer 13 is filled between the lower sealing outer box 5 and the lower sealing inner box 6, and the upper ends of the lower sealing outer box 5 and the lower sealing inner box 6 form a square hole structure. The square hole at the upper end of the lower sealing outer box 5 and the lower sealing inner box 6 is tightly engaged with the sealing plate 3 and the sealing ring 301. This structure allows the lower sealing outer box 5 and the lower sealing inner box 6 to have a heat insulation function through the heat insulation layer 13, avoiding the influence of external temperature on the vacuum degree, and at the same time making the structure of the working chamber more stable and reliable. The sealing plate 3 passes through... The sealing ring 301 seals the working chamber. The hydraulic lifting mechanism 10 provides pressure for the sealing plate 3 to ensure the reliability of the sealing structure. A monitoring camera 12 is installed at the lower end of the sealing plate 3. Since there is no viewing window on the main body 1 of the vacuum device, the internal working situation can be clearly understood through the monitoring camera 12, avoiding the installation of a viewing window from affecting the sealing performance. The lower end of the sealing plate 3 is evenly spaced with connecting columns 4, and the lower end of the connecting columns 4 is fixed with the lower positioning plate 8, so that the connecting columns 4 can reliably connect the sealing plate 3 and the lower positioning plate 8. A shock-absorbing frame 801 is engaged around the outer ring of the lower positioning plate 8, and the shock-absorbing frame 801 is in close contact with the upper inner side of the lower sealing inner box 6. This structure ensures that after the lower positioning plate 8 rises to the highest position, The shock-absorbing frame 801 creates two sealed spaces, one above and one below, facilitating the loading and unloading of semiconductors. Similarly, when the sealing plate 3 is attached to the lower sealing outer casing 5, it also creates two sealed spaces, facilitating semiconductor processing within the vacuum chamber. A semiconductor positioning seat 7 is mounted on the upper end of the lower positioning plate 8 for semiconductor positioning. The upper sealing box 2 is sealed to the upper end of the lower sealing outer casing 5, and an upper sealing door 201 is hinged to one side of the upper sealing box 2. An installation chamber 202 is welded to the upper end of the upper sealing box 2, and the installation chamber 202 corresponds to the position of the vacuum pump 11. This structure provides a sealed space for the upper end of the lower sealing inner casing 6 through the upper sealing box 2, thus creating two independent sealed spaces to achieve a vacuum chamber. The double-layer sealing treatment of the body effectively reduces the inconvenience caused by door sealing failure. Simultaneously, after the sealing plate 3 rises, the vacuum pump 11 can enter the installation chamber 202, effectively shortening the height of the upper sealing box 2. Furthermore, a hydraulic lifting mechanism 10 connected to the sealing plate 3 is installed at the upper end of the lower sealing outer box 5. A sealing ring 301 is engaged below the sealing plate 3, and a vacuum pump 11 is also installed on one side of the upper end of the sealing plate 3. Limiting posts 9 are evenly spaced bolted to the inner side of the lower sealing inner box 6, and shock-absorbing sleeves 901 are movably sleeved on the limiting posts 9. This structure allows the shock-absorbing sleeves 901 to move smoothly on the limiting posts 9. The lower sealing inner box 6 provides reliable positioning for the limiting posts 9, and the limiting posts 9 enhance the structural reliability of the lower sealing inner box 6.The shock-absorbing sleeve 901 is securely inserted into the lower positioning plate 8, and the shock-absorbing sleeve 901 and the inner sides of the lower sealing inner box 6 are in shock-absorbing contact contact via rubber pads. This structure allows the shock-absorbing sleeve 901 to provide shock absorption for the lower positioning plate 8 during synchronous lifting and lowering along with the sealing plate 3.

[0018] Working principle: When using the vacuum chamber of this semiconductor equipment, during semiconductor processing via the main body 1 of the vacuum device, the hydraulic lifting mechanism 10 pulls the sealing plate 3 upward, causing the sealing plate 3 to move the lower positioning plate 8 upward via the connecting column 4. This allows the semiconductor positioning seat 7 to enter the upper sealing box 2 until the shock-absorbing sleeve 901 and the shock-absorbing frame 801 contact the upper inner wall of the lower sealing inner box 6, separating the inner area of ​​the lower sealing inner box 6 from the inner area of ​​the upper sealing box 2. At this time, the vacuum pump 11 is placed in the installation chamber 202. Then, the upper sealing door 201 is opened, allowing the semiconductor to be placed on the semiconductor positioning seat 7. The positioning status of the semiconductor can be monitored by the monitoring camera 12. After closing the upper sealing door 201, the process is repeated... The hydraulic lifting mechanism 10 is activated, causing the sealing plate 3, connecting column 4, and lower positioning plate 8 to move down synchronously, ensuring that the semiconductor moves into the lower sealing inner box 6 until the sealing plate 3 is engaged in the square groove formed by the upper end of the lower sealing outer box 5 and the lower sealing inner box 6. The sealing ring 301 plays a sealing role. At the same time, the lower positioning plate 8 is subjected to shock absorption treatment relative to the lower sealing inner box 6 through the shock-absorbing sleeve 901. The limiting column 9 provides movement limit treatment for both the lower positioning plate 8 and the shock-absorbing sleeve 901. After the lower sealing inner box 6 forms a sealing structure through the sealing plate 3, the vacuum pump 11 is activated to perform vacuum treatment on the lower sealing box. The heat insulation layer 13 plays a heat insulation role for the lower sealing box to avoid affecting the vacuum degree, thereby completing a series of operations.

[0019] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A vacuum chamber for semiconductor equipment, comprising a vacuum device body (1), characterized in that: The vacuum device body (1) below is provided with a matched lower sealing outer box (5) and a lower sealing inner box (6), and the lower sealing inner box (6) is provided with a sealing plate (3) above, the sealing plate (3) is provided with a monitoring camera (12) at the lower end, and the sealing plate (3) is uniformly and interval connected with a connecting column (4) at the lower end, the connecting column (4) is fixed with a lower positioning plate (8) at the lower end, and the lower positioning plate (8) is provided with a semiconductor positioning seat (7) at the upper end, the lower sealing outer box (5) is sealingly connected with an upper sealing box (2) at the upper end, one side of the upper sealing box (2) is sealingly hinged and fixed with an upper sealing door (201), and the lower sealing outer box (5) is provided with a hydraulic lifting mechanism (10) connected with the sealing plate (3) at the upper end, the sealing plate (3) is clamped with a sealing ring (301) below, and the sealing plate (3) is provided with a vacuum pump (11) at one side of the upper end.

2. The vacuum chamber for semiconductor equipment according to claim 1, wherein: The upper sealing box (2) is fixed with a mounting chamber (202) at the upper end by welding, and the mounting chamber (202) corresponds to the position of the vacuum pump (11).

3. The vacuum chamber for semiconductor equipment according to claim 1, wherein: The lower sealing outer box (5) and the lower sealing inner box (6) are filled with a heat insulation layer (13), and the upper end between the lower sealing outer box (5) and the lower sealing inner box (6) forms a square hole structure, and the square hole of the upper end of the lower sealing outer box (5) and the lower sealing inner box (6) is tightly clamped with the sealing plate (3) and the sealing ring (301).

4. The vacuum chamber for semiconductor equipment according to claim 1, wherein: The lower sealing inner box (6) is uniformly and interval bolted with a limiting column (9) inside, and the limiting column (9) is movably sleeved with a damping sleeve (901).

5. A vacuum chamber for semiconductor equipment according to claim 4, characterized in that: The damping sleeve (901) is tightly penetrated into the lower positioning plate (8), and the damping sleeve (901) is in contact with the inner side of the lower sealing inner box (6) through the rubber pad damping contact at the upper and lower sides.

6. The vacuum chamber for semiconductor equipment according to claim 1, wherein: The lower positioning plate (8) is clamped with a damping frame (801) at the outer circle, and the damping frame (801) is in close contact with the inner side of the lower sealing inner box (6) at the upper side.

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