Semiconductor pre-module wafer calibration cache device

Abstract

The utility model relates to the technical field of wafer transmission, and particularly discloses a semiconductor pre-module wafer calibration caching device, which comprises a storage mechanism and a detection mechanism, and is characterized in that the storage mechanism is arranged above a wafer centering mechanism and can be used for storing a plurality of wafers after position calibration; the detection mechanism is arranged on the peripheral side of the storage mechanism, the storage mechanism comprises a first mounting plate, a second mounting plate and at least three groups of supporting assemblies, each supporting assembly is mounted between the first mounting plate and the second mounting plate, and each supporting assembly, the first mounting plate and the second mounting plate define a space for bearing wafers. According to the technical scheme, the mechanical arm sequentially and accurately places the calibrated wafers into the storage mechanism for temporary storage, when the wafers are taken out, the calibrated wafers are directly taken out from the supporting assembly, the wafers do not need to be centered any more, and the feeding efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of wafer transmission, and in particular to a semiconductor front-end module wafer calibration and buffering device. BACKGROUND

[0002] A wafer is a raw material for the production of a silicon semiconductor integrated circuit, and in a semiconductor manufacturing factory, the wafer needs to be transmitted in various process equipment, and because the wafer transmission needs to be transmitted in a clean environment, the semiconductor front-end module is needed.

[0003] The semiconductor front-end module is a key equipment between different processing technology modules on a wafer production line, and the wafer transfer box, the mechanical hand and the wafer centering mechanism in the semiconductor front-end module mainly complete the transmission and pre-positioning of the wafer; wherein the wafer transfer box serves as a tool for temporarily storing the wafer and transferring the wafer between machines, can accommodate a certain number of wafers, avoids direct contact of the wafer with the external environment, and prevents the wafer from being damaged in the transportation process; the mechanical hand undertakes the task of wafer transmission, and when transporting the wafer, the wafer fork is located in the front by rotating, and the detection mechanism is located in the rear, so that the wafer fork can contact the wafer, and after the wafer fork contacts the wafer, a vacuum environment is generated through the suction hollow opening to adsorb the wafer on the handling finger, so as to ensure that the wafer will not slip and be damaged in the handling process, and at the same time, the mechanical hand is equipped with an advanced processor, which can receive and execute wafer handling instructions, realize the calibration of the position of the wafer from the wafer transfer box to the wafer centering mechanism, and finally place the wafer on the pre-determined position of the equipment loading.

[0004] In the related art, a semiconductor front-end module wafer transmission process is disclosed in Chinese Patent No. 201710851652.X, and the transmission process is as follows: the mechanical hand takes out the wafer from the wafer transfer box, places the wafer on the wafer alignment device for position calibration, and then the mechanical hand accurately places the calibrated wafer on the pre-determined position of the equipment loading. Because the subsequent wafer processing flow is not processed at a uniform speed, there may be a period of time when no loading is needed, and suddenly a plurality of wafers need to be loaded for a short time, the mechanical hand is idle and cannot quickly take a plurality of wafers at the peak period, resulting in low wafer loading efficiency.

[0005] Because the continuity of the production flow in the related art cannot be guaranteed, the wafer loading efficiency is low, and the application provides a semiconductor front-end module wafer calibration and buffering device. Practical new type content

[0006] In order to quickly take the wafer when needed and improve the wafer loading efficiency, the application provides a semiconductor front-end module wafer calibration and buffering device.

[0007] The application provides a semiconductor front-end module wafer calibration buffer device.

[0008] The semiconductor front-end module wafer calibration buffer device comprises a storage mechanism and a detection mechanism, the storage mechanism is arranged above a wafer centering mechanism and can be used for storing multiple position-calibrated wafers, and the detection mechanism is arranged on the outer periphery of the storage mechanism and is used for detecting whether the wafers are placed on the storage mechanism and whether the positions of the wafers deviate.

[0009] By adopting the above technical scheme, during work, the robot takes out the wafers from the wafer transfer box and places them on the wafer centering mechanism to pre-calibrate the positions of the wafers, and then the robot accurately places the multiple calibrated wafers in the storage mechanism for temporary storage; when the wafers are taken out, the robot can directly take out the multiple calibrated wafers from the support assembly and place them on the predetermined position of the equipment for feeding, so that the centering process of the wafers is not needed, the feeding of multiple wafers can be completed in a short time, and the feeding efficiency during peak time is improved; meanwhile, the detection mechanism can monitor the positions of the wafers in real time, so that the accuracy of the feeding is not affected by the position errors of the wafers in the support assembly.

[0010] Preferably, the storage mechanism comprises a first mounting plate, a second mounting plate and at least three groups of support assemblies, the first mounting plate and the second mounting plate are arranged oppositely, each support assembly is mounted between the first mounting plate and the second mounting plate, and each support assembly and the first mounting plate and the second mounting plate enclose a space for carrying the wafers.

[0011] By adopting the above technical scheme, at least three groups of support assemblies are mounted between the first mounting plate and the second mounting plate to form a stable support structure, so that multiple support points are provided for the wafers and the stability of the wafers during the storage process is ensured.

[0012] Preferably, the support assembly further comprises a support plate and multiple support pieces, the support plate is vertically arranged, the support plate is fixedly mounted at both ends to the first mounting plate and the second mounting plate, and the multiple support pieces are connected to the side of the support plate close to the wafers, and the wafers are placed on the multiple support pieces on the same horizontal plane.

[0013] By adopting the above technical scheme, the multiple support pieces can support multiple wafers, the storage space can be effectively utilized, and the support plate makes the support pieces more firmly mounted.

[0014] Preferably, a reinforcing plate is arranged on the support plate, the reinforcing plate is fixed to the side of the support plate away from the support pieces, the reinforcing plate is fixedly connected to the support plate, and the reinforcing plate is fixedly mounted at both ends to the first mounting plate and the second mounting plate.

[0015] By adopting the above technical scheme, the reinforcing plate is located between the two mounting plates and fixedly connected with them, forming a more stable structure, which helps to prevent the mounting plate from deforming or displacing when subjected to external force, thereby ensuring the stability and precision of the storage mechanism. The reinforcing plate is also fixedly connected with the supporting plate, further enhancing the overall structural strength of the supporting assembly.

[0016] Preferably, the first mounting plate and the second mounting plate are provided with hollow openings penetrating the mounting plate, and the two hollow openings are oppositely arranged.

[0017] By adopting the above technical scheme, the weight of the hollow structure is lighter, which can reduce the weight of the overall equipment, and the hollow opening can be used for the sensor of the detection assembly to extend in, so as to monitor the wafer in the storage mechanism in real time.

[0018] Preferably, the supporting piece is provided with a supporting groove for supporting the circumferential side of the wafer on the side close to the wafer, and the supporting piece is in a stepped shape, so that when the edge of the wafer is placed in the supporting groove, the bottom surface of the wafer abuts against the bottom wall of the supporting groove, and the side surface abuts against the side wall of the supporting groove.

[0019] By adopting the above technical scheme, the supporting groove directly supports the circumferential edge of the wafer, which can ensure that the wafer is exactly embedded therein, can provide stable support force for the wafer, and effectively limits the movement of the wafer in the horizontal direction, ensuring the positional accuracy of the wafer during processing. The design of the supporting groove improves the space utilization in the vertical direction, and more supporting pieces can be arranged in the same space, realizing a more compact structure to store more wafers.

[0020] Preferably, the detection mechanism comprises a wafer scanning sensor, the wafer scanning sensor is installed on the mechanical hand, and the wafer scanning sensor is used to scan the number and position of the wafers in the supporting assembly.

[0021] By adopting the above technical scheme, the wafer scanning sensor is used to detect how many wafers are in the supporting assembly and transmit the position of the wafers to the control system.

[0022] Preferably, the detection mechanism further comprises a first detection device and a second detection device, the first detection device and the second detection device are both through-beam sensors, the probe of the first detection device points to the wafer and is used to detect whether the wafer is placed on the supporting assembly, and the probe of the second detection device points to the edge of the wafer and is used to detect whether the position of the wafer on the supporting assembly deviates.

[0023] By adopting the above technical scheme, the state and position of the wafer are continuously monitored by the first detection device and the second detection device, and the detection system can timely discover potential problems and issue a warning, thereby avoiding more serious faults.

[0024] The support assembly comprises a conveying belt, a mounting shaft, a motor and a plurality of support pieces uniformly distributed along the conveying direction of the conveying belt, the mounting shaft is provided in two, and the two mounting shafts are respectively rotatably mounted on the first mounting plate and the second mounting plate, the conveying belt is sleeved on the two mounting shafts and rotates with the two mounting shafts, the motor is used to drive the mounting shaft to rotate, and the support piece is fixed to the outer circumferential side of the conveying belt.

[0025] By adopting the above technical scheme, when in use, the robot places the calibrated wafer on the support piece located at the lowermost layer, and then the three motors of the three support assemblies synchronously drive the mounting shaft and the conveying belt to rotate, thereby driving the support piece carrying the wafer to move upward until another group of support pieces are flipped and moved to the lowermost layer and remain horizontal. The robot only needs to place the wafers in the same position, which facilitates the robot to take and place the wafers more accurately, reduces the burden of scanning the support assembly, and optimizes the feeding process.

[0026] The support assembly further comprises a plurality of transmission rods and a plurality of universal joints, the transmission rod is rotatably mounted on the first mounting plate, the mounting shafts of at least three groups of support assemblies are connected through the transmission rod and the universal joint and synchronously rotate, and the motor synchronously drives each conveying belt to rotate.

[0027] By adopting the above technical scheme, the mounting shaft is driven to rotate by one motor, the mounting shafts of at least three groups of support assemblies are connected through the transmission rod and the universal joint and synchronously rotate, thereby driving the wafer to move along the conveying direction of the conveying belt, and the synchronization of the actions of the conveying belts is ensured.

[0028] In summary, the present application has at least one of the following beneficial technical effects:

[0029] 1. When in operation, the robot takes the wafers from the wafer conveying box, places them in the wafer centering mechanism to pre-calibrate the positions of the wafers, and then accurately places the calibrated wafers in the storage mechanism one by one for temporary storage. When the wafers are taken, the robot can directly take the calibrated wafers from the support assembly and place them in the predetermined position of the equipment feeding, without the need for centering treatment of the wafers. The feeding of multiple wafers can be completed in a short time, and the feeding efficiency during peak hours is improved. At the same time, the detection mechanism monitors the position of the wafer in real time, avoiding the influence of the position error of the wafer in the support assembly on the accuracy of the feeding;

[0030] 2. By installing at least three groups of support assemblies between the first mounting plate and the second mounting plate, a stable support structure is formed, which can provide multiple-point support for the wafer and ensure the stability of the wafer during storage.

[0031] 3. The support groove is directly supported on the peripheral edge of the wafer, which can ensure that the wafer is embedded therein and can provide stable support force for the wafer, effectively limit the movement of the wafer in the horizontal direction, ensure the position accuracy of the wafer in the processing process, and improve the space utilization in the vertical direction, so that more support pieces can be arranged in the same space, and a more compact structure is realized to store more wafers. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 is a schematic diagram of the layout of each station of the present application;

[0033] Figure 2 is a schematic diagram of the overall structure of embodiment 1 of the present application;

[0034] Figure 3 is a schematic diagram of the overall structure of embodiment 2 of the present application;

[0035] Figure 4 is a schematic diagram of the overall structure of embodiment 3 of the present application;

[0036] Figure 5 is a schematic diagram of the structure of the support assembly of embodiment 3 of the present application.

[0037] Reference signs: 1, storage mechanism; 11, support assembly; 111, support piece; 112, support groove; 113, support plate; 12, first mounting plate; 13, second mounting plate; 131, hollow opening; 14, reinforcing plate; 2, detection mechanism; 21, first detection device; 22, second detection device; 23, wafer scanning sensor; 3, motor; 6, transmission rod; 7, conveying belt; 8, mounting shaft; 9, universal joint. DETAILED DESCRIPTION

[0038] The following will be described in detail in combination with the accompanying Figures 1-5 The present application will be further described in detail.

[0039] Embodiments of the present application disclose a semiconductor front-end module wafer calibration buffer device.

[0040] Embodiment 1

[0041] Reference Figure 1 and Figure 2 A semiconductor front-end module wafer calibration buffer device includes a storage mechanism 1 and a detection mechanism 2, the storage mechanism 1 is arranged above the wafer centering mechanism and can be used to store a plurality of position calibrated wafers; the detection mechanism 2 is arranged on the outer peripheral side of the storage mechanism 1 and is used to detect whether the wafer is placed in the storage mechanism 1 and whether the position of the wafer deviates.

[0042] In operation, the robot takes wafers from the wafer transfer box and places them into the wafer centering mechanism to pre-align the wafer positions, and then places the aligned wafers into the storage mechanism 1 one by one for temporary storage. When the wafers are needed, the robot can directly take the aligned wafers from the storage mechanism 1 and place them into the predetermined position of the equipment for feeding, without the need for centering treatment, so that the feeding of multiple wafers can be completed in a short time, improving the feeding efficiency during peak hours. At the same time, the detection mechanism 2 monitors the positions of the wafers in real time, avoiding the influence of position errors of the wafers in the storage mechanism 1 on the feeding accuracy.

[0043] Further, the storage mechanism 1 includes a first mounting plate 12, a second mounting plate 13, and at least three sets of support assemblies 11. The first mounting plate 12 and the second mounting plate 13 are oppositely arranged and have horizontal plate surfaces. Each support assembly 11 is vertically mounted between the first mounting plate 12 and the second mounting plate 13, and each support assembly 11 is circumferentially distributed. The first mounting plate 12, the second mounting plate 13, and the support assemblies 11 enclose a space for storing wafers.

[0044] In this embodiment, three sets of support assemblies 11 are arranged at the three vertices of an isosceles triangle, and the robot takes and places wafers from the long side of the isosceles triangle.

[0045] Further, referring to Figure 1 , the support assembly 11 further includes a support plate 113 and a plurality of support pieces 111. The support plate 113 is vertically arranged and fixedly mounted at the first mounting plate 12 and the second mounting plate 13 at both ends. The plurality of support pieces 111 are arranged in a longitudinal direction on the side of the support plate 113 close to the wafers. The support pieces 111 are integrally formed on the support plate 113, and each support piece 111 has at least one horizontal bearing surface for abutting against the bottom of the wafer to provide support for the wafer. In this embodiment, the support pieces 111 of the three sets of support assemblies 11 located on the same horizontal plane form three support points on the bottom of the wafer, and the three support points are arranged at the three vertices of an isosceles triangle to provide stable support for the wafer.

[0046] Preferably, referring to Figure 1 , the intervals between adjacent support pieces 111 are the same, so that the design of the transmission equipment such as the wafer transfer box and the robot is more standardized, which helps to simplify the wafer transmission process on the production line and improve the overall production efficiency.

[0047] Preferably, the spacing between the support piece 111 close to the second mounting plate 13 and the second mounting plate 13 is greater than the thickness of the conventional mechanical hand, so as to provide sufficient operation space for the mechanical hand, and ensure that the mechanical hand can smoothly place and take the wafer. In specific use, the mechanical hand can place multiple wafers in the order from top to bottom on the support pieces 111 located on the same horizontal plane; since the space below the wafer is larger, when taking the wafer, the mechanical hand can take the wafer located at the lowermost position first, which is more convenient for the movement of the mechanical hand and reduces the risk of the mechanical hand touching the support assembly 11 or other wafers by mistake.

[0048] With reference to Figure 1 , each support piece 111 is provided with a support groove 112 close to the side of the wafer, and the support piece 111 is in a stepped shape. When the edge of the wafer is placed in the support groove 112, the bottom surface of the wafer abuts against the bottom wall of the support groove 112, and the side surface abuts against the side wall of the support groove 112. In the embodiment, the side wall of the support groove 112 is in an arc structure and is adapted to the curvature of the edge of the wafer, so that the wafer can be exactly embedded therein, so as to ensure that the wafer can be stably placed on the three support pieces 111 on the same horizontal plane, provide stable support force for the wafer, and effectively limit the movement of the wafer in the horizontal direction, so as to ensure the positional accuracy of the wafer in the processing process.

[0049] In addition, the design of the support groove 112 improves the space utilization in the vertical direction, more support pieces 111 can be arranged in the same space, and a more compact structure is realized to store more wafers.

[0050] With reference to Figure 1 , the first mounting plate 12 and the second mounting plate 13 are provided with a hollow opening 131 penetrating through the first mounting plate 12 and the second mounting plate 13. The hollow structure is lighter in weight, which can reduce the weight of the whole device, and the hollow opening 131 can be used for the detection probe of the detection mechanism 2 to extend into, so as to keep real-time monitoring on the wafers in the storage mechanism 1.

[0051] The detection mechanism 2 includes a wafer scanning sensor 23, which is installed behind the wafer fork of the mechanical hand. The wafer scanning sensor 23 is used to scan the condition of the wafers stored in the support assembly 11. After each start of the device, the wafer scanning sensor 23 is first driven by the mechanical hand to scan the number of wafers currently stored in the support assembly 11, and the data is transmitted to the processor, so as to facilitate the subsequent taking and placing of the wafers by the mechanical hand and avoid positional conflicts when the wafers are placed.

[0052] The detection mechanism 2 further includes a first detection device 21 and a second detection device 22. The first detection device 21 is used to detect whether the wafers are placed on the support assembly 11, and the second detection device 22 is used to detect whether the position of the wafers on the support assembly 11 deviates.

[0053] The first detection device 21 and the second detection device 22 in this embodiment 1 can be a pair of sensors. The transmitting end and the receiving end of the first detection device 21 are respectively installed on the first mounting plate 12 and the second mounting plate 13, and the probes of the transmitting end and the receiving end are respectively located at the hollow openings 131 of the first mounting plate 12 and the second mounting plate 13. When the wafer is placed on the support assembly 11, the first detection device 21 detects a signal change and feeds back to the processor to determine whether the support assembly 11 is empty or not.

[0054] The transmitting end and the receiving end of the second detection device 22 are respectively installed on the first mounting plate 12 and the second mounting plate 13, and the probes of the transmitting end and the receiving end are respectively located at the edges of the first mounting plate 12 and the second mounting plate 13, and the connecting line between the two probes is close to the edge of the wafer. When the wafer is displaced and moves outward, the second detection device 22 detects a signal change and feeds back to the processor to monitor the position of the wafer on the support assembly 11.

[0055] In order to improve the stability of the support assembly 11, a reinforcing plate 14 is arranged on the support plate 113, which is located on the side of the support plate 113 away from the support sheet 111. The reinforcing plate 14 is fixedly connected with the support plate 113, and the two ends of the reinforcing plate 14 are fixedly installed between the first mounting plate 12 and the second mounting plate 13.

[0056] The implementation principle of the embodiment 1 of the present application is that the support assembly 11 of the semiconductor pre-module wafer calibration buffer device can temporarily store a plurality of wafers. When starting the semiconductor pre-module, the detection mechanism 2 is used to detect the number and position of the wafers. When the wafers are taken, the robot can directly take the calibrated wafers from the support assembly 11 and place them at the predetermined position of the equipment feeding device, without the need for centering treatment of the wafers. The feeding efficiency of the wafers during peak period can be improved in a short time. At the same time, the detection mechanism 2 monitors the position of the wafers in real time, so as to avoid the position error of the wafers in the support assembly 11, which affects the feeding accuracy.

[0057] Embodiment 2

[0058] Reference Figure 3 The difference between this embodiment and the embodiment 1 is that the support assembly 11 includes a conveying belt 7, a mounting shaft 8, a motor 3 and a plurality of support sheets 111 uniformly distributed along the conveying direction of the conveying belt 7. The mounting shaft 8 is provided in two, and the two mounting shafts 8 are respectively rotatably installed on the first mounting plate 12 and the second mounting plate 13. The conveying belt 7 is sleeved on the two mounting shafts 8 and rotates with the two mounting shafts 8. The motor 3 is installed on the first mounting plate 12, and the output shaft thereof is coaxially connected with the top mounting shaft 8. The support sheet 111 is integrally formed on the outer circumferential side of the conveying belt 7.

[0059] In use, the robot places the calibrated wafer on the support sheet 111 at the lowermost layer, and then the three motors 3 of the three support assemblies 111 are synchronously driven to rotate the mounting shafts 8 and the conveyor belts 7, thereby driving the support sheet 111 carrying the wafer to move upwards until another set of support sheets 111 is flipped to the lowermost layer and kept horizontal. The robot only needs to place the wafer at the same position, which facilitates the robot to take and place the wafer more accurately, reduces the burden of scanning the support assemblies 111, and optimizes the feeding process.

[0060] The implementation principle of the embodiment 2 is that, since the three sets of support assemblies 11 have the same initial state, the three motors 3 work simultaneously to drive the mounting shafts 8 connected with the three motors 3 to rotate, and the rotation of the mounting shafts 8 drives the conveyor belts 7 to rotate, thereby driving the wafer to move in the conveying direction of the conveyor belts 7. Therefore, the robot can place the pre-calibrated wafers into the support sheets 111 at the lowermost layer of the storage mechanism 1 each time.

[0061] Embodiment 3

[0062] Reference Figure 4 and Figure 5 The difference between the embodiment and the embodiment 2 is that the three sets of support assemblies 11 are provided with only one motor 3 and a synchronous transmission structure, and the single motor 3 simultaneously drives the three conveyor belts 8 to rotate, thereby avoiding the action error between different conveyor belts 7 and improving the stability of the wafer on the support assemblies 11.

[0063] Specifically, the support assembly 11 includes a transmission rod 6 and a universal joint 9. The transmission rod 6 is rotatably installed on the first mounting plate 12, and two transmission rods 6 are sequentially connected between the three mounting shafts 8. The universal joint 9 is provided with four universal joints 9 corresponding to the transmission rods 6 and is respectively installed at the end of the two transmission rods 6. That is, the output shaft of the motor 3 is coaxially connected to one of the mounting shafts 8, and the mounting shaft 8 is sequentially connected with the other two mounting shafts 8 through the two transmission rods 6 and the universal joint 9, and rotates synchronously.

[0064] In use, the output shaft of the driving motor 3 is rotated to drive the mounting shaft 8 directly connected thereto to rotate, and at the same time, each transmission rod 6 and mounting shaft 8 synchronously rotates under the connection of the universal joint 9, thereby driving the three conveyor belts 7 to synchronously rotate, ensuring the synchronization of the actions between the conveyor belts 7, that is, ensuring that the three support sheets 111 of a set are maintained on the same horizontal plane, improving the stability of the support, and providing a guarantee for the accuracy of feeding.

[0065] The implementation principle of the embodiment 2 of the application is that the output shaft of the motor 3 is coaxially connected to one of the installation rotating shafts 8, the installation rotating shafts 8 are sequentially connected to the other two installation rotating shafts 8 through the two transmission rods 6 and the universal joints 9, and keep synchronous rotation to drive the wafer to move along the conveying direction of the conveying belt 7, so as to ensure the synchronization of the actions between the conveying belts 7.

[0066] The above are the preferred embodiments of the application, and do not limit the protection scope of the application, so: all equivalent changes made according to the structure, shape, principle of the application should be covered in the protection scope of the application.

Claims

1. A semiconductor front-end module wafer calibration cache device, characterized in that, The application relates to a wafer storage and detection device, which comprises a storage mechanism (1) and a detection mechanism (2), wherein the storage mechanism (1) is arranged above a wafer centering mechanism and can be used for storing a plurality of position-calibrated wafers; and the detection mechanism (2) is arranged at the outer circumferential side of the storage mechanism (1) and is used for detecting whether a wafer is placed in the storage mechanism (1) and whether the position of the wafer deviates.

2. The semiconductor front module wafer calibration buffer apparatus of claim 1, wherein, The storage mechanism (1) comprises a first mounting plate (12), a second mounting plate (13) and at least three groups of support assemblies (11), each of the support assemblies (11) is mounted between the first mounting plate (12) and the second mounting plate (13), and each of the support assemblies (11) and the first mounting plate (12) and the second mounting plate (13) enclose a space for carrying wafers.

3. The semiconductor front module wafer calibration buffer apparatus of claim 2, wherein, The support assembly (11) comprises a support plate (113) and a plurality of support pieces (111), the support plate (113) is fixedly mounted at both ends of the first mounting plate (12) and the second mounting plate (13), and the plurality of support pieces (111) are connected to the side of the support plate (113) close to the wafers, and the wafers are placed on the plurality of support pieces (111) located on the same horizontal plane.

4. The semiconductor front module wafer calibration buffer apparatus of claim 3, wherein, The support plate (113) is provided with a reinforcing plate (14), the reinforcing plate (14) is fixed to the side of the support plate (113) away from the support pieces (111), and the reinforcing plate (14) is fixedly mounted at both ends of the first mounting plate (12) and the second mounting plate (13).

5. The semiconductor front module wafer calibration buffer apparatus of claim 2, wherein, The first mounting plate (12) and the second mounting plate (13) are provided with hollow openings (131) penetrating through the mounting plates, and the two hollow openings (131) are oppositely arranged.

6. The semiconductor front module wafer calibration buffer apparatus of claim 3, wherein, The support piece (111) is provided with a support groove (112) for supporting the circumferential side of the wafer close to the wafer, and when the edge of the wafer is placed in the support groove (112), the bottom surface of the wafer abuts against the bottom wall of the support groove (112), and the side surface abuts against the side wall of the support groove (112).

7. The semiconductor front module wafer calibration cache device of claim 1, wherein, The detection mechanism (2) comprises a wafer scanning sensor (23), the wafer scanning sensor (23) is mounted on a mechanical hand, and the wafer scanning sensor (23) is used for scanning the number and position of the wafers in the support assembly (11).

8. The semiconductor front module wafer calibration cache device of claim 1, wherein, The detection mechanism (2) further comprises a first detection device (21) and a second detection device (22), the probe of the first detection device (21) points to the wafer and is used for detecting whether the wafer is placed on the support assembly (11), and the probe of the second detection device (22) points to the edge of the wafer and is used for detecting whether the position of the wafer on the support assembly (11) deviates.

9. The semiconductor front module wafer calibration buffer apparatus of claim 2, wherein, The support assembly (11) comprises a conveying belt (7), mounting shafts (8), a motor (3) and a plurality of support pieces (111) uniformly distributed along the conveying direction of the conveying belt (7), the mounting shafts (8) are provided in two, the two mounting shafts (8) are respectively rotatably mounted on a first mounting plate (12) and a second mounting plate (13), the conveying belt (7) is sleeved on the two mounting shafts (8) and rotates with the two mounting shafts (8); the motor (3) is used for driving the mounting shafts (8) to rotate; and the support pieces (111) are fixed to the outer circumferential side of the conveying belt (7).

10. The semiconductor front module wafer calibration buffer apparatus of claim 9, wherein, The support assembly (11) further comprises a plurality of transmission rods (6) and a plurality of universal joints (9), the transmission rods (6) are rotatably mounted on the first mounting plate (12), the mounting shafts (8) of at least three groups of support assemblies (11) are connected through the transmission rods (6) and the universal joints (9) and synchronously rotate, and the motor (3) synchronously drives each conveying belt (7) to rotate.

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