Wafer cleaning equipment

Abstract

The utility model belongs to the field of semiconductor production equipment manufacturing, and particularly relates to wafer cleaning equipment. The wafer cleaning equipment comprises a rack, and a soaking device, a plurality of cleaning devices and a material moving device which are arranged in the rack, the soaking device comprises a soaking tank, wherein a turnover mechanism is arranged in the soaking tank; a multi-grid wafer box is arranged in the turnover mechanism and is used for placing wafers to be cleaned, so that soaking gaps are reserved among the wafers; wherein after a wafer to be cleaned is soaked in the soaking tank, the turnover mechanism turns over to enable the wafer to be in an approximately horizontal state, and the material moving device clamps the wafer in the horizontal state and conveys the wafer to the cleaning devices in the corresponding directions. According to the wafer cleaning equipment, the soaking device is arranged before formal cleaning of the wafers, the wafers in the wafer box are always kept in a wet state while batch pre-cleaning is carried out on the wafers, the wafers do not need to be wetted one by one in the formal cleaning process, and therefore the formal cleaning efficiency is improved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment, and specifically relates to a wafer cleaning device. Background Technology

[0002] In the wafer manufacturing process, wafer cleaning is an integral part of the entire process, including pre-diffusion cleaning, post-etching cleaning, post-ion implantation cleaning, resist removal cleaning, pre / post-film deposition cleaning, and post-mechanical polishing cleaning. These processes are crucial for removing particles, chemical residues, and contaminants generated during the manufacturing process.

[0003] Wafer cleaning is typically performed in batch or single-wafer configurations. Single-wafer cleaning machines offer better cleaning results than batch cleaning machines and are more adaptable to new semiconductor manufacturing processes. However, in some technologies, single-wafer cleaning machines can only clean one wafer at a time and require pre-wetting of the wafer before cleaning, resulting in slower cleaning speeds and impacting wafer cleaning efficiency.

[0004] Therefore, how to avoid excessively slow cleaning speed in single-wafer cleaning machines is a technical problem that urgently needs to be solved by those skilled in the art.

[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Utility Model Content

[0006] This disclosure provides at least one wafer cleaning device.

[0007] In a first aspect, embodiments of this disclosure provide a wafer cleaning apparatus, comprising:

[0008] The frame, and the soaking device, several cleaning devices, and material transfer device installed within the frame;

[0009] The soaking device includes:

[0010] The soaking tank is equipped with a tilting mechanism.

[0011] The flipping mechanism is equipped with multiple wafer boxes to hold the wafers to be cleaned, so that there is an immersion gap between each wafer.

[0012] In this process, after the wafers to be cleaned are immersed in the immersion tank, the flipping mechanism flips them so that the wafers are in an approximately horizontal state, and the transfer device picks up the horizontally positioned wafers and transports them to the cleaning devices in the corresponding positions.

[0013] In one optional embodiment, the flipping mechanism includes a flipping drive, a flipping shaft, and a flipping frame;

[0014] The tilting shaft is connected to the tilting frame and the tilting drive respectively, and the tilting frame is hinged to the support of the soaking tank.

[0015] The flip drive is adapted to drive the flip frame to flip around the hinge point as the axis so that the wafer is in an approximately horizontal state.

[0016] In one alternative embodiment, the bracket is mounted on a support plate on one side of the soaking tank, and the support plate is connected to a motor drive via a first conveyor belt.

[0017] In one optional embodiment, the wafer cassette is provided with a 6-inch wafer clamp and an 8-inch wafer clamp, the 6-inch wafer clamp and the 8-inch wafer clamp being assembled into the wafer cassette via clamp fixing components; and,

[0018] Both the transfer device and the cleaning chamber are compatible with 6-inch and 8-inch wafers.

[0019] In one optional embodiment, a receiving device is also provided, which includes a base and a receiving box. A second conveyor belt is provided below the base, and the second conveyor belt is adapted to drive the receiving device to move up and down.

[0020] In one alternative embodiment, a tilting crank is provided within the base, the tilting crank being connected to a drive cylinder, and...

[0021] The base is also equipped with a baffle.

[0022] In one alternative embodiment, the soaking tank is provided with an overflow port and the bottom of the soaking tank is connected to a replenishment pipe.

[0023] In one alternative embodiment, the soaking tank is further provided with a baffle plate having an inclined slope.

[0024] In one optional embodiment, the transfer device includes:

[0025] robotic grippers and gripper cranks;

[0026] The clamp crank is adapted to drive the robotic gripper to perform up-and-down and rotational movements; and...

[0027] The bottom of the robotic gripper is connected to the third conveyor belt.

[0028] In one optional embodiment, the cleaning device includes:

[0029] A cleaning chamber is provided with a lifting component, which is adapted to a material transfer device and is suitable for receiving the immersed wafers.

[0030] The cleaning nozzle is located above the cleaning chamber.

[0031] The beneficial effects of this invention are as follows: Before the formal cleaning of the wafers, this wafer cleaning equipment is equipped with an immersion device. This device performs batch pre-cleaning of the wafers while keeping each wafer in the wafer cassette constantly moist. During the formal cleaning, there is no need to individually wet each wafer, thus accelerating the efficiency of the formal cleaning process. The immersion device is equipped with a flipping mechanism, which flips the wafers to a horizontal position after immersion, facilitating the transfer device to pick up the wafers and transport them to the cleaning device, reducing wafer transportation time. Furthermore, this wafer cleaning equipment is equipped with at least two cleaning devices, allowing for the simultaneous cleaning of multiple wafers. Through the cooperation of these devices, the wafer cleaning time is significantly reduced.

[0032] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description, claims, and drawings.

[0033] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0034] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0035] Figure 1 This is a perspective view of a wafer cleaning apparatus provided in an embodiment of the present disclosure;

[0036] Figure 2 This is a top view of a wafer cleaning apparatus provided in an embodiment of the present disclosure;

[0037] Figure 3 This is a front view of an immersion apparatus and a receiving apparatus for a wafer cleaning equipment provided in an embodiment of the present disclosure;

[0038] Figure 4 This is a perspective view of an immersion apparatus for a wafer cleaning device provided in an embodiment of the present disclosure;

[0039] Figure 5 This is a structural diagram of a wafer cleaning equipment receiving device provided in an embodiment of the present disclosure;

[0040] Figure 6This is a perspective view of a wafer cleaning equipment transfer device, immersion device, and receiving device provided in an embodiment of the present disclosure.

[0041] Figure 7 This is a top view of a wafer cleaning equipment transfer device, immersion device, and receiving device provided in an embodiment of the present disclosure;

[0042] Figure 8 This is a top view of a wafer cleaning apparatus provided in an embodiment of the present disclosure;

[0043] Figure 9 This is a perspective view of a wafer cleaning apparatus provided in an embodiment of the present disclosure;

[0044] In the picture:

[0045] 100. Frame; 200. Immersion device; 210. Tilting mechanism; 211. Tilting drive; 212. Tilting shaft; 213. Tilting frame; 214. Hinge point; 215. Wafer box; 216. Wafer; 217. 8-inch wafer fixture; 218. 6-inch wafer fixture; 219. Fixture fastener; 220. Immersion tank; 221. Bracket; 222. Support plate; 230. First conveyor belt; 240. Motor; 2 50. Liquid replenishment pipe; 260. Overflow port; 270. Water baffle; 300. Cleaning device; 310. Cleaning chamber; 311. Lifting component; 320. Cleaning nozzle; 400. Material receiving device; 410. Material receiving box; 420. Base; 430. Inclined crank; 440. Baffle; 450. Second conveyor belt; 500. Material transfer device; 510. Robotic gripper; 520. Grip crank; 530. Third conveyor belt. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0047] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise clearly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of a feature, step, operation, element, and / or component, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof.

[0048] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0049] Research has revealed the drawbacks of existing technologies: single-wafer cleaning machines can only clean one wafer at a time and require the wafer to be wetted before cleaning, resulting in a slow cleaning speed and affecting wafer cleaning efficiency.

[0050] Therefore, in order to solve the above-mentioned technical problems, this disclosure provides a wafer cleaning device.

[0051] The shortcomings of the above solutions are the result of the utility model inventor's practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as contributions made by the utility model inventor to this disclosure.

[0052] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the figures, the thickness of parts may be exaggerated or reduced for the purpose of effectively depicting the technical content.

[0053] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0054] Please see Figure 1 and Figure 2This disclosure provides a wafer cleaning apparatus, including: a rack 100, and an immersion device 200, a plurality of cleaning devices 300, and a transfer device 500 disposed within the rack 100; the immersion device 200 includes: an immersion tank 220, wherein a flipping mechanism 210 is disposed therein; the flipping mechanism 210 is provided with multiple wafer cassettes 215 for placing wafers 216 to be cleaned, so that there is an immersion gap between each wafer 216, ensuring that all wafers 216 in the wafer cassettes 215 are fully wetted by the immersion solution; wherein, after the wafers 216 to be cleaned are immersed in the immersion tank 220, the flipping mechanism 210 flips them so that the immersed wafers 216 are in an approximately horizontal state, and the transfer device 500 picks up the horizontally positioned wafers 216 and transports them to the cleaning devices 300 in the corresponding positions.

[0055] Preferably, by setting up an immersion device 200 before the formal cleaning of the wafer 216, the immersion device 200 can perform batch pre-cleaning of the wafer 216, reducing the pressure of subsequent formal cleaning; in addition, after being immersed in the immersion solution in the immersion device 200, each wafer 216 in the wafer box 215 remains moist, and there is no need to wet each individual wafer 216 again during formal cleaning, thereby speeding up the efficiency of formal cleaning.

[0056] See Figure 2 In some embodiments, the wafer cleaning equipment is equipped with no less than two cleaning devices 300, which can clean multiple wafers 216 at the same time, greatly reducing the cleaning time of the wafers 216.

[0057] See Figure 3 In some embodiments, the flipping mechanism 210 includes a flipping drive 211, a flipping shaft 212, and a flipping frame 213; the flipping shaft 212 is connected to the flipping frame 213 and the flipping drive 211 respectively, and the flipping frame 213 is hinged on the support 221 of the immersion tank 220. The flipping drive 211 is adapted to drive the flipping frame 213 to flip around the hinge point 214 as the axis so that the immersed wafer 216 is in an approximately horizontal state.

[0058] Specifically, the near-horizontal position of the wafer 216 facilitates the gripping of the transfer device 500, thereby reducing the transportation time of the wafer 216. After the transfer device 500 grips the soaked wafer 216, it transports it to the corresponding cleaning device 300 for formal cleaning.

[0059] See Figure 4 In some embodiments, the bracket 221 is mounted on a support plate 222 on one side of the soaking tank 220, and the support plate 222 is connected to the motor 240 via a first conveyor belt 230.

[0060] Specifically, the first conveyor belt 230 and the motor 240 are adapted to drive the support 221 and the tilting mechanism 210 to move up and down, so as to improve the compatibility between the tilting mechanism 210 and the material transfer device 500.

[0061] See also Figure 4 In some embodiments, a 6-inch wafer clamp 218 and an 8-inch wafer clamp 217 are provided in the wafer box 215. The 6-inch wafer clamp 218 and the 8-inch wafer clamp 217 are assembled in the wafer box 215 by clamp fasteners 219. The transfer device 500 and the cleaning chamber 310 are both compatible with 6-inch and 8-inch wafers.

[0062] Specifically, by disassembling and assembling the fixture fastener 219, the 6-inch wafer fixture 218 and the 8-inch wafer fixture 217 can be flexibly replaced, facilitating maintenance.

[0063] See Figure 5 In some embodiments, the receiving device 400 includes a base 420 and a receiving box 410. A second conveyor belt 450 is provided below the base 420. The second conveyor belt 450 is adapted to drive the receiving device 400 to move up and down, so as to improve the compatibility between the receiving device 400 and the transfer device 500.

[0064] See also Figure 5 The base 420 is provided with an inclined crank 430, which is connected to the drive cylinder, and the base 420 is also provided with a baffle 440.

[0065] Specifically, the tilting crank 430, in conjunction with the drive cylinder, allows the base 420 to tilt at a certain angle. After the empty receiving box 410 is placed on the base 420, it can slide down to the baffle 440 under its own weight, completing the positioning of the receiving box 410. After the receiving box 410 is positioned, the base 420 returns to a horizontal state, waiting for the transfer device 500 to place the cleaned wafer 216 into the empty receiving box 410.

[0066] See Figure 4 In some embodiments, the soaking tank 220 is provided with an overflow port 260 and the bottom of the soaking tank 220 is connected to the replenishment pipe 250.

[0067] Specifically, the replenishment pipe 250 is adapted to continuously replenish the soaking solution to the soaking tank 220, so that the wafers 216 in the soaking tank 220 can be soaked through overflow. After soaking, the stains on the wafers 216 float on the surface of the soaking solution and flow out from the overflow port 260, thereby keeping the soaking solution relatively clean.

[0068] See also Figure 4In some embodiments, the soaking tank 220 is further provided with a baffle plate 270, which has an inclined slope. The baffle plate 270 is adapted to block the soaking liquid splashed out when the flipping mechanism 210 flips, and further, the soaking liquid is adapted to flow back into the soaking tank 220 along the slope of the baffle plate 270.

[0069] See Figure 6 and Figure 7 In some embodiments, the material transfer device 500 includes: a robotic gripper 510 and a gripper crank 520; the gripper crank 520 is adapted to drive the robotic gripper 510 to perform up-and-down and rotational movements; and the bottom of the robotic gripper 510 is connected to a third conveyor belt 530, which can drive the robotic gripper to perform left-and-right movements. The cooperation between the gripper crank 520 and the third conveyor belt 530 makes the robotic gripper 510 more flexible and improves the material transfer efficiency.

[0070] See Figure 8 and Figure 9 In some embodiments, the cleaning apparatus 300 includes: a cleaning chamber 310, in which a lifting member 311 is disposed, the lifting member 311 being adapted to the transfer device 500 and suitable for receiving the soaked wafer 216; and a cleaning nozzle 320 disposed above the cleaning chamber 310, which is suitable for rinsing the single wafer 216 in the cleaning chamber 310.

[0071] In summary, this wafer cleaning equipment includes an immersion device 200 before the formal cleaning of wafers 216. This device performs batch pre-cleaning of wafers 216 while keeping each wafer 216 in the wafer cassette 215 constantly moist. During the formal cleaning, there is no need to individually wet each wafer 216, thus accelerating the efficiency of the formal cleaning process. The immersion device 200 is equipped with a flipping mechanism 210, which flips the wafers 216 to a horizontal position after immersion, facilitating the transfer device 500 to pick up the wafers 216 and transport them to the cleaning device 300, reducing the transportation time of the wafers 216. In addition, this wafer cleaning equipment is equipped with no fewer than two cleaning devices 300, which can clean multiple wafers 216 simultaneously. Through the cooperation of the above devices, the cleaning time of the wafers 216 is greatly reduced.

[0072] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0073] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0074] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “below” other elements or features would be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0075] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A wafer cleaning device, characterized in that, include: The frame (100) and the soaking device (200), several cleaning devices (300) and the material transfer device (500) disposed within the frame (100); The soaking device (200) includes: The soaking tank (220) is equipped with a tilting mechanism (210). The flipping mechanism (210) is provided with a multi-compartment wafer box (215) to hold the wafers (216) to be cleaned, so that there is an immersion gap between each wafer; In this process, after the wafer (216) to be cleaned is immersed in the immersion tank (220), the flipping mechanism (210) flips it so that the wafer (216) is in an approximately horizontal state, and the transfer device (500) picks up the horizontal wafer (216) and transports it to the cleaning device (300) in the corresponding position.

2. The wafer cleaning equipment as described in claim 1, characterized in that, The flipping mechanism (210) includes a flipping drive (211), a flipping shaft (212), and a flipping frame (213). The flipping shaft (212) is connected to the flipping frame (213) and the flipping drive (211) respectively, and the flipping frame (213) is hinged to the bracket (221) of the soaking tank (220). The flip drive (211) is adapted to drive the flip frame (213) to flip around the hinge point (214) as the axis so that the wafer (216) is in an approximately horizontal state.

3. The wafer cleaning equipment as described in claim 2, characterized in that, The bracket (221) is mounted on a support plate (222) on one side of the soaking tank (220), and the support plate (222) is connected to the motor (240) via a first conveyor belt (230).

4. The wafer cleaning equipment as described in claim 1, characterized in that, The wafer cassette (215) is provided with a 6-inch wafer clamp (218) and an 8-inch wafer clamp (217), which are assembled in the wafer cassette (215) by clamp fasteners (219); and, Both the transfer device (500) and the cleaning chamber (310) are compatible with 6-inch and 8-inch wafers.

5. The wafer cleaning equipment as described in claim 1, characterized in that, A receiving device (400) is also provided, which includes a base (420) and a receiving box (410). A second conveyor belt (450) is provided below the base (420), which is adapted to drive the receiving device (400) to move up and down.

6. The wafer cleaning equipment as described in claim 5, characterized in that, An inclined crank (430) is provided inside the base (420), the inclined crank (430) being connected to a drive cylinder, and, The base (420) is also provided with a baffle (440).

7. The wafer cleaning equipment as described in claim 1, characterized in that, The soaking tank (220) is provided with an overflow port (260) and the bottom of the soaking tank (220) is connected to the replenishment pipe (250).

8. The wafer cleaning equipment as described in claim 7, characterized in that, The soaking tank (220) is also provided with a baffle plate (270) having an inclined slope.

9. The wafer cleaning equipment as described in claim 1, characterized in that, The transfer device (500) includes: Robotic gripper (510) and gripper crank (520); The clamp crank (520) is adapted to drive the robotic gripper (510) to perform up-and-down and rotational movements; and, The bottom of the robotic gripper (510) is connected to the third conveyor belt (530).

10. The wafer cleaning equipment as described in claim 1, characterized in that, The cleaning device (300) includes: A cleaning chamber (310) is provided with a lifting member (311), which is adapted to the transfer device (500) and is suitable for receiving the immersed wafer (216). The cleaning nozzle (320) is located above the cleaning chamber (310).

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