Benchmarking structure for light-proof substrate
By setting a marker structure with marking points and holes on the opaque substrate and mold, the problem of CCD cameras being unable to recognize the markings was solved, the structure was simplified, and the efficiency of thin film deposition was improved.
Patent Information
- Application Number
- CN202520265543.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-19
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2035-02-19
AI Technical Summary
In the prior art, during the semiconductor manufacturing process, the CCD industrial camera cannot recognize the markings on the front of the opaque substrate, and the installation of complex structures such as prisms will block the thin film deposition area, resulting in poor deposition effect.
By adopting a benchmarking structure with marking points and holes on the substrate and mold, it is simplified into a substrate benchmarking structure and a mold benchmarking structure, which facilitates the identification of CCD industrial cameras and reduces the impact on thin film deposition.
It enables accurate positioning of opaque substrates by CCD industrial cameras, avoids complex installation structures, and reduces interference with the effective area of thin film deposition.
Smart Images
Figure CN223798693U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor manufacturing. Specifically, this utility model relates to a benchmark structure for an opaque substrate. Background Technology
[0002] In the vacuum manufacturing process of semiconductors, opaque substrates, such as silicon wafers or coated glass, are inevitably required. However, due to the opaque nature of these substrates, commonly used reflective image measurement methods cannot detect markings on the front of the substrate. CCD industrial cameras are too large and complex, and when mounted at the bottom of the substrate, they severely obstruct the thin film deposition effect, resulting in a significant loss of effective deposition area. Therefore, it is impossible to mount CCD industrial cameras under the substrate. Existing technologies primarily reduce the impact of the bottom mechanism on the effective thin film growth area by adding two prisms to the bottom marking pattern area of the substrate and mold to deflect light by 180° before transmitting it to the CCD. However, this requires adding prisms, sliding tracks, springs, and other devices to traditional alignment devices, resulting in a complex design, higher failure rate, and inconvenient maintenance.
[0003] To address the aforementioned problems, patent document publication number 116895584A discloses a method for fabricating a semiconductor device structure with overlapping markings. This semiconductor device structure includes a substrate, a first light-emitting feature, a first pattern, and a second pattern. The first light-emitting feature is disposed on the substrate. The first pattern is disposed on the first light-emitting feature. The second pattern is disposed on the first pattern. The first light-emitting feature is configured to emit light of a first wavelength. The first pattern has a first transmittance for the light of the first wavelength. The second pattern has a second transmittance for the light of the first wavelength. The first transmittance is different from the second transmittance, but this method fails to solve the aforementioned problems.
[0004] Therefore, in order to improve or solve at least one of the above problems, a benchmark structure for opaque substrates is provided. Utility Model Content
[0005] This utility model is designed to solve the aforementioned problems. Its purpose is to provide a benchmark structure for an opaque substrate that is easily recognizable by CCD industrial cameras, eliminates the need for complex structures such as prisms, and helps reduce the impact of the benchmark structure on the effective area of thin film deposition. To achieve this objective, the technical solution adopted by this utility model is as follows:
[0006] This utility model provides a alignment structure for an opaque substrate, characterized by including a substrate and a mold disposed at the bottom of the substrate, wherein the substrate is provided with a substrate alignment structure and the mold is provided with a mold alignment structure.
[0007] In the benchmark structure for opaque substrates provided by this utility model, it may also have the following features: the substrate includes a first substrate, the mold includes a first mold, and the first mold is located at the bottom of the first substrate.
[0008] The alignment structure for opaque substrates provided by this utility model may also have the following features: the substrate alignment structure includes a first marking point disposed on the first substrate, and the mold alignment structure includes a first marking hole disposed on the first mold, with the first marking hole located on both sides of the first substrate.
[0009] In the benchmark structure for opaque substrates provided by this utility model, it may also have the following feature: the substrate includes a second substrate and a third substrate, with the third substrate located above the second substrate.
[0010] In the benchmark structure for opaque substrates provided by this utility model, it may also have the following feature: the mold includes a second mold, which is located at the bottom of the second substrate.
[0011] The alignment structure for opaque substrates provided by this utility model may also have the following features: the substrate alignment structure includes a second marking point disposed on a second substrate, a second marking hole disposed on a third substrate, and a third marking point disposed on a third substrate.
[0012] The alignment structure for opaque substrates provided by this utility model may also have the following feature: the mold alignment structure includes a third marking hole provided on the second mold.
[0013] The technical effects of this utility model are as follows: The alignment structure for opaque substrates provided by this utility model includes a substrate and a mold disposed at the bottom of the substrate. The substrate is provided with a substrate alignment structure, and the mold is provided with a mold alignment structure. The substrate alignment structure and the mold alignment structure can facilitate alignment between the substrate and the mold, which is convenient for CCD industrial cameras to capture and identify the substrate position. Moreover, the substrate alignment structure and the mold alignment structure have simple structures, which helps to reduce the impact of the alignment structure on the effective area of thin film deposition.
[0014] Therefore, the alignment structure for opaque substrates provided by this invention can be easily identified by CCD industrial cameras, and can eliminate the need for complex structures such as prisms, which helps to reduce the impact of the alignment structure on the effective area of thin film deposition. Attached Figure Description
[0015] This manual includes the following figures, which illustrate the following:
[0016] Figure 1 This is a schematic diagram of the structure of the opaque substrate in Embodiment 1 of this utility model in the top view direction.
[0017] Figure 2 This is a schematic diagram of the structure of the opaque substrate in Embodiment 1 of this utility model in the front view direction.
[0018] Figure 3 This is a schematic diagram of the structure of the CCD industrial camera recognizing the image in Embodiment 1 of this utility model;
[0019] Figure 4 This is a schematic diagram of the structure of the opaque substrate in Embodiment 2 of this utility model from the top view direction.
[0020] Figure 5 This is a schematic diagram of the structure of the opaque substrate in Embodiment 2 of this utility model in the front view direction;
[0021] Figure 6 This is a schematic diagram of the substrate in the top view direction in Embodiment 2 of this utility model;
[0022] Figure 7 This is a schematic diagram of the mold in the top view direction in Embodiment 2 of this utility model;
[0023] Figure 8 This is a schematic diagram of the structure of the CCD industrial camera recognizing the image in Embodiment 2 of this utility model. The components are labeled as follows: substrate-10, first substrate-11, second substrate-12, third substrate-13, mold-20, first mold-21, second mold-22, substrate alignment structure-30, first marking point-31, second marking point-32, second marking hole-33, third marking point-34, mold alignment structure-40, first marking hole-41, third marking hole-42. Detailed Implementation
[0024] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings, in order to help those skilled in the art to have a more complete, accurate and in-depth understanding of the inventive concept and technical solution of the present invention, and to facilitate its implementation.
[0025] <Example 1>
[0026] Figure 1 This is a schematic diagram of the structure of the opaque substrate in Embodiment 1 of this utility model in the top view direction. Figure 2 This is a schematic diagram of the structure of the opaque substrate in the front view direction in Embodiment 1 of this utility model.
[0027] like Figure 1 and Figure 2As shown, the alignment structure for opaque substrates provided by this invention includes a substrate 10 and a mold 20 disposed at the bottom of the substrate 10. The substrate 10 is provided with a substrate alignment structure 30, and the mold 20 is provided with a mold alignment structure 40. The substrate alignment structure 30 and the mold alignment structure 40 can facilitate alignment between the substrate 10 and the mold 20, making it convenient for CCD industrial cameras to capture and identify the positions of the substrate 10 and the mold 20. Moreover, the substrate alignment structure 30 and the mold alignment structure 40 have simple structures, which helps to reduce the impact of the alignment structure on the effective area of thin film deposition. This makes the alignment structure for opaque substrates provided by this invention easy for CCD industrial cameras to identify, eliminating the need for complex structures such as prisms, and further reducing the impact of the alignment structure on the effective area of thin film deposition.
[0028] like Figure 1 and Figure 2 As shown, in this embodiment, the substrate 10 includes a first substrate 11, which is an opaque substrate. The mold 20 includes a first mold 21, which is located at the bottom of the first substrate 11. The front side of the first substrate 11 is attached to the first mold 21. The substrate alignment structure 30 includes a first marking point 31 disposed on the first substrate 11. The first marking point 31 is circular and located on both sides of the first substrate 11. The mold alignment structure 40 includes a first marking hole 41 disposed on the first mold 21. The first marking hole 41 is circular and located on both sides of the first substrate 21. There is at least a 2mm distance between the first marking point 31 and the first marking hole 41 to ensure that the first substrate 11 completely covers the pattern on the first mold 21.
[0029] Figure 3 This is a schematic diagram of the structure of the CCD industrial camera recognizing the image in Embodiment 1 of this utility model.
[0030] like Figure 3 As shown, the images of the first marker point 31 and the first marker hole 41 are captured by a CCD industrial camera, which facilitates the identification of the distance between the first marker point 31 and the first marker hole 41, obtains the error, and facilitates position correction. The structure and positional relationship of the first marker point 31 and the first marker hole 41 are simple, which helps to reduce the influence of the benchmark structure on the effective area of thin film deposition.
[0031] <Example 2>
[0032] Figure 4 This is a schematic diagram of the structure of the opaque substrate in Embodiment 2 of this utility model from the top view direction. Figure 5 This is a schematic diagram of the structure of the opaque substrate in Embodiment 2 of this utility model in the front view direction; Figure 6 This is a schematic diagram of the substrate in the top view direction in Embodiment 2 of this utility model; Figure 7 This is a schematic diagram of the mold in the top view direction in Embodiment 2 of this utility model.
[0033] like Figure 4 , Figure 5 , Figure 6 as well as Figure 7 As shown, in this second embodiment, the substrate 10 includes a second substrate 12 and a third substrate 13, with the third substrate 13 located above the second substrate 12. The second substrate 12 is an opaque substrate, and the third substrate 13 is a transparent substrate. The mold 20 includes a second mold 22 located at the bottom of the second substrate 12. The substrate alignment structure 30 includes a second marking point 32 disposed on the second substrate 12, a second marking hole 33 disposed on the third substrate 13, and a third marking point 34 disposed on the third substrate 13. Alignment between the second substrate 12 and the third substrate 13 is performed through the second marking point 32 and the second marking hole 33, thereby combining the second substrate 12 and the third substrate 13 into a combined substrate. The mold alignment structure 40 includes a third marking hole 42 disposed on the second mold 22. Alignment between the third substrate 13 and the second mold 22 is performed through the third marking point 34 and the third marking hole 42, ensuring that the second substrate 12 completely covers the pattern on the second mold 22.
[0034] Figure 8 This is a schematic diagram of the structure of the CCD industrial camera recognizing the image in Embodiment 2 of this utility model.
[0035] like Figure 8 As shown, the images of the third marker point 34 and the third marker hole 42 are captured by a CCD industrial camera, which facilitates the identification of the distance between the third marker point 34 and the third marker hole 42, obtains the error between the third substrate 13 and the second mold 22, and facilitates position correction. The structure and positional relationship of the third marker point 34 and the third marker hole 42 are simple, which helps to reduce the influence of the benchmark structure on the effective area of thin film deposition.
[0036] The role and effect of the embodiments
[0037] The alignment structure for opaque substrates provided by this invention includes a substrate 10 and a mold 20 disposed at the bottom of the substrate 10. The substrate 10 is provided with a substrate alignment structure 30, and the mold 20 is provided with a mold alignment structure 40. The substrate alignment structure 30 and the mold alignment structure 40 can facilitate alignment between the substrate 10 and the mold 20, making it convenient for CCD industrial cameras to capture and identify the positions of the substrate 10 and the mold 20. Moreover, the substrate alignment structure 30 and the mold alignment structure 40 have simple structures, which helps to reduce the impact of the alignment structure on the effective area of thin film deposition. This makes the alignment structure for opaque substrates provided by this invention easy for CCD industrial cameras to identify, eliminating the need for complex structures such as prisms, and further reducing the impact of the alignment structure on the effective area of thin film deposition.
[0038] The present invention has been described above by way of example with reference to the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvements made using the inventive concept and technical solution of the present invention; or the direct application of the inventive concept and technical solution to other situations without modification, are all within the protection scope of the present invention.
Claims
1. A mark structure for an opaque substrate, characterized by, The device comprises a substrate (10) and a mold (20) arranged at the bottom of the substrate (10), wherein the substrate (10) is provided with a substrate alignment structure (30), and the mold (20) is provided with a mold alignment structure (40).
2. The alignment structure for an opaque substrate according to claim 1, wherein The substrate (10) comprises a first substrate (11), and the mold (20) comprises a first mold (21) arranged at the bottom of the first substrate (11).
3. The alignment structure for an opaque substrate according to claim 2, wherein The substrate alignment structure (30) comprises a first identification point (31) arranged on the first substrate (11), and the mold alignment structure (40) comprises a first identification hole (41) arranged on the first mold (21), wherein the first identification hole (41) is arranged on both sides of the first substrate (11).
4. The alignment structure for an opaque substrate according to claim 1, wherein The substrate (10) comprises a second substrate (12) and a third substrate (13), wherein the third substrate (13) is arranged above the second substrate (12).
5. The alignment structure for an opaque substrate according to claim 4, wherein The mold (20) comprises a second mold (22) arranged at the bottom of the second substrate (12).
6. The alignment structure for an opaque substrate according to claim 5, wherein The substrate alignment structure (30) comprises a second identification point (32) arranged on the second substrate (12), a second identification hole (33) arranged on the third substrate (13), and a third identification point (34) arranged on the third substrate (13).
7. The alignment structure for an opaque substrate according to claim 6, wherein The mold alignment structure (40) comprises a third identification hole (42) arranged on the second mold (22).