QFN frame structure, packaging module and electronic equipment

Abstract

The utility model relates to a QFN (Quad Flat No-lead) frame structure, a packaging module and electronic equipment. The QFN frame structure comprises a frame body, a carrying table, a grounding pad, a signal pin and a grounding pin, the carrying table is arranged in the middle of the frame body; the grounding pad is arranged on the frame body and located on the back of the carrying platform. The signal pin is arranged on the periphery of the carrying table, the signal pin comprises a first connecting part and a first extending part, the first connecting part is arranged on the edge of the frame body, and the first extending part extends towards the carrying table from the edge of the frame body; the grounding pins are arranged on the periphery of the carrying platform, connected with the grounding pads and used for isolating interference signals of the signal pins adjacent to the grounding pins. Thus, the wire bonding length is shortened and the signal transmission quality is improved by arranging the first extension parts of the signal pins, and meanwhile, the grounding pins are arranged on the frame body, so that interference signals of the signal pins adjacent to the grounding pins can be isolated, and the signal transmission quality is further improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of chip packaging, in particular, to a QFN frame structure, a packaging module and an electronic device. BACKGROUND

[0002] QFN (Quad Flat No-leads Package, square flat no-lead package) packaging is a common packaging form for consumer products. In the related art, the size of the bare chip is becoming smaller and smaller. The smaller size of the bare chip leads to an increase in the size of the wire when using the conventional QFN packaging under the same packaging size. The increase in the length of the wire causes the quality of signal transmission to deteriorate. At the same time, interference occurs in the transmission process of adjacent signal lines. For example, in the transmission process of wireless signals or power signals, the adjacent signal lines will interfere with the transmission of the wireless signal pins or the power signal pins, causing the quality of signal transmission to deteriorate. CONTENT OF THE UTILITY MODEL

[0003] The purpose of the present disclosure is to provide a QFN frame structure, a packaging module and an electronic device, which can improve the quality of signal transmission to solve the problems in the prior art.

[0004] To achieve the above-mentioned purpose, the first aspect of the present disclosure provides a QFN frame structure, comprising: a frame body; a loading table arranged at the middle part of the frame body; a ground pad arranged at the frame body and located at the back of the loading table; a signal pin arranged at the outer periphery of the loading table, the signal pin comprising a first connecting part and a first extending part, the first connecting part being arranged at the edge of the frame body, and the first extending part extending from the edge of the frame body towards the loading table; and a ground pin arranged at the outer periphery of the loading table and connected with the ground pad, for isolating the interference signal of the signal pin adjacent to the ground pin.

[0005] Optionally, the signal pin comprises a key signal pin, which is arranged immediately adjacent to the ground pin.

[0006] Optionally, the key signal pin comprises at least one of the following: a wireless signal pin, a power signal pin and a high-speed transmission signal pin.

[0007] Optionally, the ground pin comprises a second connecting part and a second extending part, the second connecting part being arranged at the edge of the frame body, and the second extending part extending from the edge of the frame body towards the loading table.

[0008] Optionally, the frame body is rectangular, and the number of the ground pins is four, and the four ground pins are arranged at the four corners of the frame body, respectively.

[0009] Optionally, the first extension of each of the signal pins is equal in distance to the carrier.

[0010] The first connection portions are equidistantly arranged.

[0011] Optionally, at least part of the first extension comprises a first inclined segment, which is inclined from the edge of the frame body towards the frame body.

[0012] Optionally, at least part of the first extension comprises a first straight segment, which extends from the edge of the frame body towards the frame body.

[0013] Optionally, at least part of the first extension comprises a bent segment, which comprises a second straight segment and a second inclined segment, the first end of the second inclined segment is connected with the connection portion, the second end of the second inclined segment is connected with the first end of the second straight segment, and the second inclined segment and the second straight segment both extend from the edge of the frame body towards the frame body.

[0014] The second aspect of the present disclosure provides a packaging module, comprising a bare chip and the QFN frame structure described above, the bare chip is arranged on the carrier of the QFN frame structure and is connected with the signal pins through wire bonding.

[0015] The third aspect of the present disclosure provides an electronic device, comprising the packaging module described above.

[0016] Through the above technical solution, the bare chip is installed on the carrier arranged in the QFN frame structure, the wire bonding points of the functions of each module of the bare chip are connected with the signal pins through wire bonding by arranging the signal pins, so as to facilitate the signal output of the functions of each module of the bare chip, the first extension of the signal pin is arranged to shorten the wire bonding length and improve the quality of signal transmission, and the ground pin is arranged on the frame body, the ground pin is connected with the ground pad, so as to isolate the interference signals of the signal pins adjacent to the ground pin and further improve the quality of signal transmission.

[0017] Other features and advantages of the present disclosure will be described in detail in the following specific embodiment part. BRIEF DESCRIPTION OF DRAWINGS

[0018] The accompanying drawings are included to provide a further understanding of the present disclosure and constitute a part of the specification, which together with the following specific embodiments serve to explain the present disclosure, but do not constitute a limitation on the present disclosure. In the drawings:

[0019] Figure 1 is a schematic diagram of the QFN frame structure before wire bonding in the exemplary embodiment of the present disclosure;

[0020] Figure 2 is a structure schematic diagram of a first QFN frame structure after wire bonding provided in the exemplary embodiment of the present disclosure;

[0021] Figure 3 is a structure schematic diagram of a second QFN frame structure after wire bonding provided in the exemplary embodiment of the present disclosure.

[0022] Legend of Reference Signs

[0023] 1-frame body; 2-land; 3-ground pad; 4-signal pin; 41-first connecting part; 42-first extending part; 43-first inclined section; 44-first straight section; 45-bent section; 46-second straight section; 47-second inclined section; 401-key signal pin; 402-ground signal pin; 403-ordinary signal pin; 5-wire bonding; 6-ground pin; 61-second connecting part; 62-second extending part; 7-bare chip; 71-main function bare chip; 711-wireless radio frequency module; 72-storage function bare chip. DETAILED DESCRIPTION

[0024] The specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely intended to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.

[0025] In the present disclosure, unless otherwise stated, "inner, outer" refers to the contour of the component itself, for example, for the frame body, the edge of the frame body is outer, the center part of the frame body is inner, for the land, the edge of the land is outer, the center part of the land is inner, "front" can refer to the direction with the paper surface outward as the front, "back" can refer to the direction with the paper surface inward as the back. Figure 1 Figure 1 In the present disclosure, unless otherwise stated, "inner, outer" refers to the contour of the component itself, for example, for the frame body, the edge of the frame body is outer, the center part of the frame body is inner, for the land, the edge of the land is outer, the center part of the land is inner, "front" can refer to the direction with the paper surface outward as the front, "back" can refer to the direction with the paper surface inward as the back.

[0026] ​In the related art, the size of the bare chip used is getting smaller and smaller. The smaller size of the bare chip leads to an increase in the size of the wire when the conventional QFN (Quad Flat No-leads Package) package is used in the same package size. The increase in the length of the wire causes the quality of signal transmission to deteriorate. At the same time, interference occurs in the transmission process of adjacent signal lines. For example, in the transmission process of wireless signal pins, power signal pins, or high-speed transmission signal pins, adjacent signal lines interfere with the transmission of wireless signal pins, power signal pins, or high-speed transmission signal pins, causing the quality of signal transmission to deteriorate.

[0027] To solve the above technical problems and improve the quality of signal transmission when the bare chip is packaged, as shown in Figures 1-3 The first aspect of the present disclosure provides a QFN frame structure, comprising: a frame body 1, a carrier 2, a ground pad 3, a signal pin 4, and a ground pin 6, wherein the carrier 2 is arranged at the middle part of the frame body 1; the ground pad 3 is arranged on the frame body 1 and located at the back of the carrier 2, as shown in Figure 1 Figure 1 The front of the carrier is shown, and the back of the carrier is arranged opposite to the front in the inward direction of the paper; the signal pin 4 is arranged at the outer periphery of the carrier 2, and the signal pin 4 comprises a first connecting part 41 and a first extending part 42, the first connecting part 41 is arranged at the edge of the frame body 1, and the first extending part 42 extends from the edge of the frame body 1 towards the carrier 2; the ground pin 6 is arranged at the outer periphery of the carrier 2 and connected with the ground pad 3, and is used to isolate the interference signal of the signal pin 4 adjacent to the ground pin 6.

[0028] Through the above technical solution, by installing a single bare chip on the carrier 2 arranged in the QFN frame structure, the wire points of each module function of the bare chip 7 are connected with the signal pin 4 through the wire 5 by the arrangement of the signal pin 4, thereby facilitating the signal output of each module function on the bare chip 7. The length of the wire 5 is shortened by arranging the first extending part 42 of the signal pin 4, thereby improving the quality of signal transmission. At the same time, by arranging the ground pin 6 on the frame body 1, the ground pin 6 is connected with the ground pad 3, thereby being able to isolate the interference signal of the signal pin 4 adjacent to the ground pin 6. For example, for some signal pins 4 with high signal transmission requirements, at least one side of the signal pin 4 close to the ground pin 6 can be arranged, thereby being able to isolate the interference signal of other signal pins 4 adjacent to the ground pin 6 by arranging the ground pin 6, thereby reducing the influence of the interference signal on signal transmission and further improving the quality of signal transmission to meet the working conditions of high-quality signal transmission.

[0029] ​In some possible implementation manners, the material of the frame body 1 is preferably metal, alloy or other conductive material, the carrier 2 can be located in the middle of the frame body 1, the frame body 1 or the carrier 2 can be rectangular, preferably square, the carrier 2 is connected to the frame body 1 through an insulating support, the bare chip 7 is fixed on the carrier 2 through a die bonding material, the die bonding material has conductivity, for example, the die bonding material can be conductive glue, so as to ensure the electrical connection between the bare chip 7 and the carrier 2, the signal pin 4 can be formed on the frame body 1 through etching, the wire 5 can be a metal wire, one end of the wire 5 is connected to the wire bonding point of the bare chip 7, and the other end can be connected to the first extension part 42 of the signal pin 4; the grounding pad 3 can include an EPAD (Exposed Pad, i.e., exposed grounding pad), the grounding pad 3 is arranged on the frame body 1 and located on the back of the carrier 2, and the grounding pad 3 is connected to the grounding pin 6. In addition, the grounding pad 3 can also include a wave-shaped frame around the carrier 2.

[0030] The four corners of the frame body 1 have a certain redundant space, the grounding pin 6 can be arranged at the corner of the frame body 1 by using the redundant space, so that the grounding pin 6 can be preset by using the redundant space at the corner of the original frame body 1, the preset grounding pin 6 can reduce the occupation of the signal pin 4 to form a grounding pin, so that the wire bonding points of each module function of the bare chip 7 can be connected to the signal pin 4. The grounding pin 6 can be arranged in the structure of the signal pin 4, that is, the grounding pin 6 can include a second connecting part 61 and a second extension part 62, and the second extension part 62 extends from the edge of the frame body 1 towards the carrier 2. In order to shorten the length of the wire 5 connecting the wire bonding point of the bare chip 7 and the signal pin 4 and improve the quality of signal transmission, the bare chip 7 can be offset to the corner of the carrier 2. In addition, the offset arrangement of the bare chip 7 also facilitates arranging the signal pin 4 with high signal transmission requirement close to at least one side of the grounding pin 6, so as to facilitate isolating other signals adjacent to the grounding pin 6 from interfering with the transmission of the signal with high requirement, reducing the influence of the interfering signal on the transmission of the signal with high requirement, and further improving the quality of signal transmission.

[0031] In some implementable manners, in order to facilitate the process manufacturing of the QFN frame structure, the distance from the one end of the first extension part 42 of each signal pin 4 to the carrier 2 is equal, that is, the distance from the one end of the first extension part 42 of each signal pin 4 to the edge of the carrier 2 is equal, the signal pin 4 can include the first connecting part 41 and the first extension part 42, the frame body 1 and the carrier 2 can both be rectangular, preferably square, the number of signal pins 4 can be multiple, the number of signal pins 4 can be determined according to specific working conditions, and multiple signal pins 4 are arranged along the four edges of the square frame body 1 respectively, wherein the first connecting parts 41 of multiple signal pins 4 located on each edge are arranged equidistantly, and the equidistant arrangement of multiple first connecting parts 41 here means that the distance values between the first connecting parts 41 corresponding to any two adjacent signal pins 4 in the multiple signal pins 4 are equal. The first extension part 42 of at least part of the signal pins 4 includes the first inclined section 43, the first inclined section 43 is inclined from the edge of the frame body 1 toward the frame body 1; the first extension part 42 of at least part of the signal pins 4 includes the first straight section 44, the first straight section 44 extends from the edge of the frame body 1 toward the frame body 1; the first extension part 42 of at least part of the signal pins 4 includes the bending section 45, the bending section 45 includes the second straight section 46 and the second inclined section 47, the first end of the second inclined section 47 is connected with the first connecting part 41, and the second end of the second inclined section 47 is connected with the first end of the second straight section 46, and the second inclined section 47 and the second straight section 46 both extend from the edge of the frame body 1 toward the frame body 1.

[0032] Specifically, as Figure 1As shown, taking the QFN package with 84 pins as an example, a plurality of signal pins 4 and four ground pins 6 are arranged on the same edge of the frame body 1, the signal pins 4 include PIN2-PIN21 located at the first edge, PIN23-PIN42 located at the second edge, PIN44-PIN63 located at the third edge, and PIN65-PIN84 located at the fourth edge, and the four ground pins 6 are PIN1, PIN22, PIN43 and PIN64 respectively. Here, the plurality of signal pins 4 on the fourth edge are taken as an example, the plurality of signal pins 4 on the fourth edge are divided into three groups, wherein the first group refers to the corresponding two signal pins 4 at the center of the fourth edge of the frame body 1, that is, PIN74 and PIN75, at this time, the first extension part 42 corresponding to the two signal pins 4 includes a first straight line segment 44; the second group refers to the signal pins 4 on the fourth edge of the frame body 1 and close to the two sides of the first group, that is, PIN70-PIN73 and PIN76-PIN79, at this time, the first extension part 42 of the plurality of signal pins 4 of the second group includes a first straight line segment 44 and a first bending segment 45; the third group refers to the plurality of signal pins 4 between the end of the fourth edge of the frame body 1 and the second part, that is, PIN65-PIN69 and PIN80-PIN84, at this time, the first extension part 42 of the plurality of signal pins 4 of the third group includes a first inclined segment 43. Thus, by arranging the first extension part 42 of the signal pins 4 of the first group on the fourth edge of the frame body 1 to include the first straight line segment 44, the first extension part 42 of the signal pins 4 of the second group to include the first straight line segment 44 and the first bending segment 45, and the first extension part 42 of the signal pins 4 of the third group to include the first inclined segment 43, the distance from one end of each signal pin 4 on the fourth edge to the carrier 2 can be equal, which facilitates the process manufacturing of the QFN frame structure. At the same time, it is also convenient for the connection points of the bare chips 7 to be connected with the first extension part 42 of the corresponding signal pins 4. The arrangement mode of the plurality of signal pins 4 on the first edge, the second edge and the third edge can refer to the above arrangement of the fourth edge.

[0033] Of course, the first extension part 42 of the first group in the fourth edge of the above frame body 1 includes the first straight line segment 44, the first extension part 42 of the second group shown includes the first straight line segment 44 and the first bending segment 45, and the first extension part 42 of the third group shown includes the first inclined segment 43, which is illustrative. In other embodiments, the first extension part 42 in the frame body 1 can be selected according to specific working conditions, for example, the first extension part 42 in the frame body 1 can include a combination of the first straight line segment 44 and the first bending segment 45, or a combination of the first straight line segment 44 and the first inclined segment 43 according to specific working conditions.

[0034] In addition, in some implementable manners, the distance between adjacent first connecting portions 41 on the same edge of the frame body 1 is equal, so as to facilitate the process manufacturing of the QFN frame structure, and of course, the equal distance between the adjacent first connecting portions 41 can also avoid short circuit of the adjacent first connecting portions 41, and facilitate the connection of the first connecting portions 41 with external devices or wires.

[0035] In some implementable manners, the signal pins 4 can include key signal pins 401, i.e., signal pins 4 with higher requirements for signal transmission quality, and the key signal pins 401 are formed after the key signal wire bonding points of the bare chip 7 are connected with the signal pins 4, wherein the key signal pins 401 can include at least one of the following: a wireless signal pin, a power signal pin, and a high-speed transmission signal pin. It can be understood that one or more key signal wire bonding points can be arranged on one bare chip 7, so that one or more key signal pins 401 are correspondingly formed in the signal pins 4. In the QFN packaging process, there can be one or more bare chips 7.

[0036] The ground pins 6 can be selectively arranged at the corners of the frame body 1 according to different working conditions, and the key signal pins 401 can be arranged adjacent to the ground pins 6, so as to reduce the interference of the remaining signals on the key signal transmission through the arrangement of the ground pins 6.

[0037] In order to improve the key signal transmission quality, the key signal wire bonding points of the bare chip 7 can be offset and fixed at the corner positions of the carrier 2, so that the key signal wire bonding points of the bare chip 7 are connected with the key signal pins 401 with a shorter wire bonding 5 length, and at this time, the key signal pins 401 are arranged adjacent to the ground pins 6, so as to reduce the interference of the remaining signal transmission on the key signal transmission and improve the quality of the signal transmission when the signal is transmitted.

[0038] In some implementable manners, the ground pins 6 can be prearranged at the four corners of the frame body 1, the number of the key signal pins 401 can be arranged according to the function module with one or more bare chips 7, and the positions of the key signal pins 401 can be arranged according to the positions of the ground pins 6. For example, the number of the ground pins 6 is two, the two ground pins 6 can be arranged at the opposite diagonal corners of the frame body 1, the number of the key signal pins 401 can be two, the two key signal pins 401 correspond to the wireless transmission signal pin and the power signal pin respectively, and the two key signal pins 401 are arranged adjacent to the corresponding ground pins 6, so as to shield the transmission signals around the key signal pins 401 and improve the quality of the key signal transmission.

[0039] As Figure 2As shown, in the embodiment, the number of ground pins 6 is 4, the 4 ground pins 6 are respectively arranged at the 4 corners of the frame body 1, and the ground pins 6 are PIN1, PIN22, PIN43 and PIN64 respectively. The number of signal pins 4 is 80, wherein the key signal pins 401 in the signal pins 4 include PIN2, PIN23, PIN44 and PIN65. PIN2 in the key signal pins 401 can be a wireless radio frequency signal, and PIN23, PIN44 and PIN65 can be power supply signals. The first extension part 42 in the wireless radio frequency signal pin can facilitate the connection of the connection point of the bare chip 7 to the first extension part 42 in the wireless radio frequency signal pin by a shorter wire 5, thereby improving the wireless radio frequency signal transmission quality. The first extension part 42 in the power supply signal pin can facilitate the connection of the connection point of the bare chip 7 to the first extension part 42 in the power supply signal pin by a shorter wire 5, thereby improving the power supply signal transmission quality. In addition, by arranging the 4 ground pins 6 adjacent to the corresponding wireless radio frequency signal pins and power supply signal pins respectively, the interference of the remaining signal transmission around the wireless radio frequency signal pins and the power supply signal pins can be reduced, and the signal transmission quality of the wireless radio frequency signal and the power supply signal can be improved.

[0040] In some implementable modes, the signal pins 4 can be connected to different wire points by the wire 5, that is, the signal pins 4 can form key signal pins 401, ground signal pins 402 or ordinary signal pins 403. Figure 3 As shown, the position of the key signal pin 401 can be located at a non-corner of the frame body 1, at this time, the key signal pin 401 is away from the ground pin 6 at the corner, and an additional ground signal pin 402 needs to be arranged, the ground signal pin 402 can be connected to the ground pad 3 by the wire 5, and the ground signal pin 402 is arranged adjacent to the key signal pin 401 to realize the isolation of the interference signal when the ordinary signal pin 403 adjacent to the key signal pin 401 transmits signals. Figure 3 In the embodiment, the key signal pin 401 can be a wireless signal pin, the key signal pin 401 can be PIN80, the ground signal pin 402 can be PIN79, and the ordinary signal pin 403 can be PIN78, thereby isolating other signal transmission of the ordinary signal pin 403 near the key signal pin 401 from wireless signal transmission, reducing the interference of other signal transmission on wireless signal transmission, and improving the transmission quality of the signal on the wireless signal pin.

[0041] Of course, the key signal pin 401 can be a wireless signal pin, when the signal transmission interference on both sides of the wireless signal pin is large, the ground wires can be arranged on both sides of the wireless signal pin at the same time, at this time, the two ground wires can be arranged at the corner and non-corner of the frame body 1 respectively, that is, one of the two ground wires can be the ground signal pin 402, and the other is the ground pin 6 at the corner, and the wireless signal pin can be located between the ground pin 6 at the corner and the ground signal pin 402, in this way, the interference signals on both sides of the wireless signal pin can be isolated through the arrangement of the ground pin 6 at the corner and the ground signal pin 402, and the quality of wireless signal transmission is improved.

[0042] It can be understood that the ground wires arranged on both sides of the wireless signal pin above can also be the ground signal pins 402 arranged on the same edge and located on both sides of the key signal pin 401. Thus, by arranging the ground wires on both sides of the wireless signal pin at the same time, the interference signals of the adjacent signals on the wireless signal pin are reduced, and the transmission quality of the signals on the wireless signal pin is improved.

[0043] The key signal pin 401 above is a wireless signal pin for illustration, in other embodiments, the key signal pin 401 can also be a power signal pin or a high-speed transmission signal pin, of course, it can also be any combination of the power signal pin, the high-speed transmission signal pin and the wireless signal pin, and the present disclosure is not limited specifically.

[0044] The second aspect of the present disclosure provides a packaging module, which comprises a bare chip 7 and the QFN frame structure above, the bare chip 7 is arranged on the carrier 2 of the QFN frame structure and connected with the signal pin 4 through the wire 5. The packaging module can shorten the length of the wire 5 connected with the corresponding bare chip 7 through the arrangement of the QFN frame structure, that is, through the first extension part 42 in the signal pin 4, and can improve the transmission signal quality of the bare chip 7 and the signal pin 4, in addition, for the key signal pin 401 in the signal pin 4, it should be arranged close to the ground pin 6, so as to reduce the interference signals generated in the transmission process of the signal pins 4 adjacent to the key signal pin 401, and improve the quality of key signal transmission.

[0045] In some implementable modes, as Figure 2As shown, the number of the bare chips 7 can be two, one of which is a main function bare chip 71 and the other is a storage function bare chip 72, both of which are arranged on the carrier 2, and the main function bare chip 71 is located below the storage function bare chip 72, and when the two are stacked, the storage function bare chip 72 is stacked above the power module of the main function bare chip 71, the main function bare chip 71 can include a wireless radio frequency module 711, and the storage function bare chip 72 can be a NOR device, which generally refers to a NOR flash device, in order to avoid mutual interference between the wireless radio frequency module 711 and the NOR device, the wireless radio frequency module 711 and the NOR device can be arranged at opposite corners of the carrier 2, and the wireless radio frequency signal pin corresponding to the wireless radio frequency module 711 and the signal pin 4 corresponding to the NOR device are respectively arranged adjacent to the ground pin 6 arranged at the opposite corner of the frame body 1, that is, the wireless radio frequency signal pin is arranged adjacent to the ground pin 6 at the corresponding corner, and the signal pin 4 corresponding to the NOR device is arranged adjacent to the ground pin 6 at the corresponding corner, so that the transmission quality of the wireless radio frequency signal in the main function bare chip 71 and the storage signal in the storage function bare chip 72 can be improved.

[0046] Of course, the above packaging module can be applied to a Bluetooth chip, a WIFI chip, or a 2.4GHz wireless communication chip.

[0047] The third aspect of the present disclosure provides an electronic device comprising the above packaging module. The electronic device can be any one of a smart watch, a Bluetooth speaker, a Bluetooth headset, a Bluetooth voice remote control, and a Bluetooth transceiver. The above electronic device includes all the beneficial effects of the packaging module, which will not be described here.

[0048] The preferred embodiments of the present disclosure are described in detail above with reference to the drawings, but the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.

[0049] In addition, it should be noted that each specific technical feature described in the above specific embodiments can be combined in any appropriate manner without contradiction, and in order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0050] In addition, any combination of various different embodiments of the present disclosure can also be made, as long as it does not deviate from the idea of the present disclosure, and it should also be considered as disclosed by the present disclosure.

Claims

1. A QFN frame structure, characterized in that, The QFN frame structure comprises: a frame body; a carrier provided in the middle of the frame body; a grounding pad provided on the frame body and located at the back of the carrier; a signal pin provided on the periphery of the carrier, the signal pin comprising a first connecting portion and a first extending portion, the first connecting portion being provided on the edge of the frame body, and the first extending portion extending from the edge of the frame body towards the carrier; and a grounding pin provided on the periphery of the carrier and connected with the grounding pad, for isolating the interference signal of the signal pin adjacent to the grounding pin. The signal pin comprises a key signal pin, which is arranged adjacent to the grounding pin.

2. The QFN frame structure of claim 1, wherein, The key signal pin comprises at least one of a wireless signal pin, a power signal pin and a high-speed transmission signal pin. The grounding pin comprises a second connecting portion and a second extending portion, the second connecting portion being provided on the edge of the frame body, and the second extending portion extending from the edge of the frame body towards the carrier.

3. The QFN frame structure of claim 2, wherein, The frame body is rectangular, and the number of the grounding pins is four, and the four grounding pins are respectively provided at the four corners of the frame body.

4. The QFN frame structure of claim 1, wherein, The distance from the first extending portion of each signal pin to the carrier is equal; and / or 5. The QFN frame structure of claim 1, wherein, The first connecting portions are arranged equidistantly. At least part of the first extending portion comprises a first inclined segment, which is inclined from the edge of the frame body towards the frame body.

6. The QFN frame structure of claim 1, wherein, At least part of the first extending portion comprises a first straight segment, which extends from the edge of the frame body towards the frame body.

7. The QFN frame structure of claim 1, wherein, At least part of the first extending portion comprises a bending segment, which comprises a second straight segment and a second inclined segment, the first end of the second inclined segment being connected with the connecting portion, and the second end of the second inclined segment being connected with the first end of the second straight segment, and the second inclined segment and the second straight segment both extend from the edge of the frame body towards the frame body.

8. The QFN frame structure of claim 1, wherein, The QFN frame structure comprises a bare chip and the QFN frame structure according to any one of claims 1-8, the bare chip being provided on the carrier of the QFN frame structure and connected with the signal pin by wire bonding.

9. A packaging module, characterized by The package module comprises the package module according to claim 9.

10. An electronic device, comprising: ​

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