LED lamp bead packaging assembly based on layered heat conduction structure

Abstract

The utility model discloses an LED lamp bead packaging assembly based on a layered heat conduction structure, and relates to the technical field of LED lamp beads. The LED lamp comprises a shell, a heat conduction assembly is fixedly connected to the bottom of an inner cavity of the shell, a sealing cover is arranged on the top of the shell, and positioning assemblies are arranged on the two sides of the shell. The heat conduction assembly adopts a layered design, the heat dissipation plate, the heat conduction sheet and the installation substrate work cooperatively, the heat dissipation plate adopts a fin structure, the heat dissipation area is greatly increased, heat can be rapidly absorbed and conducted to the outside, and the heat conduction sheet is made of silica gel heat conduction materials and has excellent flexibility and high heat conduction coefficient. The heat dissipation plate and the installation substrate can be tightly attached, heat resistance is effectively reduced, high efficiency of heat conduction is ensured, the installation substrate is a ceramic substrate, good insulation performance is achieved, the heat conductivity of the installation substrate is relatively high, and heat generated by the LED chip can be rapidly transmitted to the heat dissipation plate and the heat conduction sheet.

Description

TECHNICAL FIELD

[0001] The utility model belongs to LED lamp pearl technical field, especially, relate to a kind of LED lamp pearl encapsulation subassembly based on layered heat conduction structure. BACKGROUND

[0002] Under the vigorous development of LED lighting industry, as core luminous element, the performance of LED lamp pearl is directly decided the quality of illumination product, with the expanding of LED lamp pearl application scene, from ordinary indoor lighting to high-power industrial lighting, automobile headlamp and other fields, the requirement of its luminous efficiency, stability and service life is increasingly strict.

[0003] The heat conduction performance of the encapsulation material of conventional LED lamp pearl encapsulation subassembly is poor, heat encounters greater resistance in the process of transferring from chip to outside, so that chip is in high temperature environment for a long time, heat is disorderly accumulated in encapsulation, and it is difficult to form efficient heat dissipation channel, so it cannot meet the urgent needs of high-power LED lamp pearl rapid heat dissipation, in addition, in the installation process, it is difficult to guarantee installation precision due to lack of effective positioning structure, and a lot of manpower and time are consumed.

[0004] Therefore, we provide a kind of LED lamp pearl encapsulation subassembly based on layered heat conduction structure to solve the problems in the above. Utility model content

[0005] The utility model aims at providing a kind of LED lamp pearl encapsulation subassembly based on layered heat conduction structure, the heat conduction component and positioning component are matched, the problem that the heat conduction performance of the encapsulation material of LED lamp pearl in prior art is poor and installation precision is difficult to guarantee due to lack of effective positioning structure is solved.

[0006] To solve the above technical problems, the utility model is realized by the following technical schemes.

[0007] The utility model discloses a LED lamp pearl packaging assembly based on layered heat conduction structure, including the shell, the bottom fixed connection of shell inner chamber has the heat conduction component, the top of shell is provided with the cover, both sides of shell are provided with positioning assembly, the heat conduction component includes the heat dissipation plate, the top fixed connection of heat dissipation plate has the heat conduction sheet, the top fixed connection of heat conduction sheet has the installation base plate, the top fixed connection of installation base plate has the LED chip, the positioning assembly includes the movable rod, the number of movable rod is two, movable rod sets up at both sides of shell respectively, the surface of movable rod is equipped with the spring, the surface of movable rod and located spring one side is equipped with the limit plate, one side of limit plate is fixedly connected with the inner wall of shell, both sides of shell top are all seted up with the clamping groove, one side of movable rod extends to the inner chamber of clamping groove, and the heat conduction component is cooperatively formed by multilayer structure, and the bottom layer is the heat dissipation plate, adopts the fin structure design, and the fin is distributed in the heat dissipation plate surface in regular and dense mode, greatly increases the contact area of heat dissipation plate and outside air, when the heat of LED chip work is produced, the heat is first transmitted to the installation base plate, and then is conducted to the heat dissipation plate through the heat conduction sheet, and the heat dissipation plate can quickly absorb the heat and dissipate to the outside environment by its increased heat dissipation area, effectively reduces the temperature of entire packaging assembly, and the installation base plate is located at the top of heat conduction sheet, is made of ceramic substrate, and the ceramic substrate has excellent insulation performance, can effectively avoid the electrical short circuit problem between LED chip and other components, guarantees the safety and stability of LED lamp pearl work, and its thermal conductivity is relatively higher, can quickly transmit the heat of LED chip to the heat conduction sheet, provides stable and efficient heat transfer path for the whole heat dissipation process.

[0008] The utility model further sets up, the surface of shell is seted up with the heat dissipation groove, the heat dissipation groove is circumferential distribution, and the heat dissipation groove is circumferential distribution on the outer surface of shell, and the design of heat dissipation groove further increases the contact area of shell and outside air, when the heat is transmitted to the shell through the heat conduction component, the heat dissipation groove can accelerate the dissipation of heat to the outside environment.

[0009] The utility model further sets up, the bottom of cover is fixedly connected with the clamping block of cooperation with clamping groove on both sides, one side of clamping block is seted up with the positioning hole, in the installation process, and clamping block and clamping groove interact, ensure that the cover is installed firmly, and the positioning hole of one side of clamping block is cooperated with movable rod, and the positioning precision is further improved, and the stability of cover installation is strengthened.

[0010] The utility model further sets up, the top of cover is provided with the protective plate, and the material quality of protective plate is transparent material quality, and the selection of transparent material quality ensures that the protective plate will not affect the light propagation of LED lamp pearl, can make the light of LED lamp pearl normally transmit outward, guarantees the illumination effect.

[0011] The utility model further sets up, the top fixed connection of shell inner chamber has the limit boss, the bottom fixed connection of cover has the positioning sleeve that is matched with limit boss, positioning sleeve can accurately contact with limit boss when installing cover, play the role of auxiliary positioning.

[0012] The utility model further sets up, the fin structure is adopted to the heat dissipation plate, the heat conduction piece is silica gel heat conduction material, the mounting substrate is ceramic substrate, and the physical and chemical properties of ceramic substrate are stable, can keep good performance under different working environment, is not easy to be interfered by external factors, help to prolong the service life of LED lamp pearl.

[0013] The utility model further sets up, the surface of mounting substrate is equipped with the heat dissipation channel, the inside of heat dissipation channel is filled with paraffin wax phase change material, when LED chip temperature rises, paraffin wax phase change material absorbs heat, and the phase change process from solid to liquid occurs, in this phase change process, paraffin wax phase change material can absorb and store a large amount of heat, further enhance the heat dissipation effect.

[0014] The utility model has the following beneficial effects.

[0015] 1, the utility model discloses a layered design is adopted to the heat conduction component, and the heat dissipation plate, heat conduction piece and mounting substrate work cooperatively, and the heat dissipation plate adopts fin structure, greatly increases the heat dissipation area, can quickly absorb heat and conduct to the outside, and the heat conduction piece selects silica gel heat conduction material, has excellent flexibility and high thermal conductivity, can be closely attached heat dissipation plate and mounting substrate, effectively reduces thermal resistance, ensures the high efficiency of heat conduction, and the mounting substrate adopts ceramic substrate, not only has good insulating property, and its thermal conductivity is relatively higher, can rapidly transmit the heat of LED chip to heat conduction piece and heat dissipation plate.

[0016] 2, the utility model discloses the cooperation design of movable link, spring, limit board and clamping groove, realized convenient and stable installation positioning function, when installing cover, only need to align the shell to cover, press the cover, and movable link is automatically slid into the clamping groove under the elastic force of spring, completes quick positioning, simultaneously, the clamping block of cover bottom both sides is closely matched with clamping groove, and the positioning hole of clamping block one side further improves the positioning accuracy, ensures that cover installation is stable, and is not easy to loosen. ACCURACY OF DRAWINGS

[0017] In order to make the technical scheme of the embodiments of the utility model clearer, the following will briefly introduce the drawings needed to be used in the embodiment description.

[0018] Fig. 1 It is a kind of based on the three-dimensional view of LED lamp pearl packaging assembly of layered heat conduction structure.

[0019] Fig. 2It is a perspective view of a cover in an LED lamp bead packaging assembly based on a layered heat conduction structure.

[0020] Fig. 3 It is a perspective view of a shell in an LED lamp bead packaging assembly based on a layered heat conduction structure.

[0021] Fig. 4 It is a perspective view of a positioning assembly in an LED lamp bead packaging assembly based on a layered heat conduction structure.

[0022] Fig. 5 It is a perspective view of a heat conduction assembly in an LED lamp bead packaging assembly based on a layered heat conduction structure.

[0023] Fig. 6 It is a bottom perspective view of an LED lamp bead packaging assembly based on a layered heat conduction structure.

[0024] In the drawings: 1, shell; 2, heat conduction assembly; 201, heat dissipation plate; 202, heat conduction sheet; 203, mounting substrate; 204, LED chip; 3, cover; 4, positioning assembly; 401, movable rod; 402, spring; 403, limiting plate; 404, clamping groove; 5, heat dissipation groove; 6, clamping block; 7, positioning hole; 8, protection plate; 9, limiting boss; 10, positioning sleeve; 11, heat dissipation channel. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. The described embodiments are only some of the embodiments of the present application, not all.

[0026] Embodiment one

[0027] Please refer to Figs. 1-6 The present application is an LED lamp bead packaging assembly based on a layered heat conduction structure, which comprises a shell 1, a heat conduction assembly 2 fixedly connected to the bottom of the inner cavity of the shell 1, a cover 3 arranged on the top of the shell 1, positioning assemblies 4 arranged on both sides of the shell 1, the heat conduction assembly 2 comprising a heat dissipation plate 201, the heat dissipation plate 201 having a heat conduction sheet 202 fixedly connected to the top thereof, the heat conduction sheet 202 having a mounting substrate 203 fixedly connected to the top thereof, the mounting substrate 203 having an LED chip 204 fixedly connected to the top thereof, the positioning assembly 4 comprising a movable rod 401, the number of the movable rods 401 being two, the movable rods 401 being arranged on both sides of the shell 1 respectively, the movable rods 401 having springs 402 sleeved on the surfaces thereof, the movable rods 401 having limiting plates 403 sleeved on the surfaces thereof and located on one side of the springs 402, one side of the limiting plates 403 being fixedly connected to the inner wall of the shell 1, both sides of the top of the shell 1 being provided with clamping grooves 404, and one side of the movable rods 401 extending into the inner cavities of the clamping grooves 404.

[0028] Specifically: the heat conduction assembly 2 is composed of a multi-layer structure, the bottom layer is a heat dissipation plate 201, which is designed in a fin structure, the fins are distributed on the surface of the heat dissipation plate 201 in a regular and dense manner, greatly increasing the contact area of the heat dissipation plate 201 with the outside air, when the LED chip 204 works and generates heat, the heat is first transmitted to the mounting substrate 203, and then conducted to the heat dissipation plate 201 through the heat conduction sheet 202, the heat dissipation plate 201 can quickly absorb and dissipate heat to the outside environment due to its increased heat dissipation area, effectively reducing the temperature of the entire packaging assembly, the mounting substrate 203 is located on the top of the heat conduction sheet 202, which is made of a ceramic substrate, the ceramic substrate has excellent insulation performance, which can effectively avoid the electrical short circuit problem between the LED chip 204 and other components, ensuring the safety and stability of the LED lamp bead work, and its thermal conductivity is relatively high, which can quickly transmit the heat generated by the LED chip 204 to the heat conduction sheet 202, providing a stable and efficient heat transfer path for the entire heat dissipation process.

[0029] Example two

[0030] Please refer to Figs. 1-6 On the basis of example one, the surface of the shell 1 is provided with a heat dissipation groove 5, the heat dissipation groove 5 is distributed in a circle, the bottom of the cover 3 is fixedly connected with a clamping block 6 matched with the clamping groove 404, one side of the clamping block 6 is provided with a positioning hole 7, the top of the cover 3 is provided with a protective plate 8, the material of the protective plate 8 is transparent, the top of the inner cavity of the shell 1 is fixedly connected with a limiting boss 9, the bottom of the cover 3 is fixedly connected with a positioning sleeve 10 matched with the limiting boss 9, the heat dissipation plate 201 adopts a fin structure, the heat conduction sheet 202 is made of silica gel heat conduction material, the mounting substrate 203 is a ceramic substrate, the surface of the mounting substrate 203 is provided with a heat dissipation channel 11, the heat dissipation channel 11 is filled with paraffin phase change material.

[0031] Specifically: the heat dissipation grooves 5 are circumferentially distributed on the outer surface of the shell 1, and the design of the heat dissipation grooves 5 further increases the contact area of the shell 1 with the external air; when heat is transmitted to the shell 1 through the heat conduction assembly 2, the heat dissipation grooves 5 can accelerate the dissipation of heat to the external environment; during installation, the clamping blocks 6 interact with the clamping grooves 404 to ensure that the cover 3 is firmly installed; the positioning holes 7 formed on one side of the clamping blocks 6 cooperate with the movable rods 401 to further improve the positioning accuracy and enhance the stability of the cover 3 after installation; the transparent material ensures that the protective plate 8 does not affect the propagation of light emitted by the LED lamp beads, so that the light of the LED lamp beads can be normally transmitted outward, and the lighting effect is ensured; during installation of the cover 3, the positioning sleeve 10 can accurately contact the limiting protrusions 9 to play an auxiliary positioning role; the physical and chemical properties of the ceramic substrate are stable, and the ceramic substrate can maintain good performance in different working environments and is not easily disturbed by external factors, which helps to prolong the service life of the LED lamp beads; when the temperature of the LED chip 204 rises, the paraffin phase change material absorbs heat and undergoes a phase change process from solid to liquid; in this phase change process, the paraffin phase change material can absorb and store a large amount of heat, and the heat dissipation effect is further enhanced.

[0032] The working principle of the utility model is as follows: when installing the cover 3, only the cover 3 is aligned with the top of the shell 1, and the cover 3 is pressed downward, the clamping blocks 6 push the movable rods 401 to move outward, and the compression springs 402 are compressed; when the clamping blocks 6 are completely aligned with the clamping grooves 404, the movable rods 401 rapidly slide into the clamping grooves 404 under the elastic force of the springs 402, and rapid positioning is completed.

[0033] The preferred embodiments disclosed above are only used to help describe the utility model, and the preferred embodiments do not describe all the details and do not limit the utility model to only the specific implementation mode; the embodiments are selected and specifically described in the specification in order to better explain the principle and practical application of the utility model, so that the technical personnel in the technical field can well understand and utilize the utility model.

Claims

1. A LED lamp bead packaging assembly based on layered heat conduction structure, comprising a shell (1), characterized in that: The bottom of the inner cavity of the shell (1) is fixedly connected with a heat conduction assembly (2), the top of the shell (1) is provided with a cover (3), and the two sides of the shell (1) are provided with positioning assemblies (4). The heat conduction assembly (2) comprises a heat dissipation plate (201), the top of the heat dissipation plate (201) is fixedly connected with a heat conduction sheet (202), the top of the heat conduction sheet (202) is fixedly connected with a mounting base plate (203), and the top of the mounting base plate (203) is fixedly connected with an LED chip (204). The positioning assembly (4) comprises a movable rod (401), the number of the movable rod (401) is two, the movable rod (401) is arranged on the two sides of the shell (1), respectively, the surface of the movable rod (401) is sleeved with a spring (402), the surface of the movable rod (401) and on one side of the spring (402) is sleeved with a limiting plate (403), one side of the limiting plate (403) is fixedly connected with the inner wall of the shell (1), the two sides of the top of the shell (1) are provided with clamping grooves (404), and one side of the movable rod (401) extends to the inner cavity of the clamping groove (404).

2. The LED lamp bead packaging assembly based on the layered heat conduction structure according to claim 1, characterized in that: The surface of the shell (1) is provided with a heat dissipation groove (5), and the heat dissipation groove (5) is circumferentially distributed.

3. The LED lamp bead packaging assembly based on the layered heat conduction structure according to claim 1, characterized in that: The bottom of the cover (3) is fixedly connected with a clamping block (6) used in cooperation with the clamping groove (404) on the two sides, and the side of the clamping block (6) is provided with a positioning hole (7).

4. The LED lamp bead packaging assembly based on the layered heat conduction structure according to claim 1, characterized in that: The top of the cover (3) is provided with a protective plate (8), and the material of the protective plate (8) is transparent.

5. The LED lamp bead packaging assembly based on the layered heat conduction structure according to claim 1, characterized in that: The top of the shell (1) is fixedly connected with a limiting boss (9), and the bottom of the cover (3) is fixedly connected with a positioning sleeve (10) matched with the limiting boss (9).

6. The LED lamp bead packaging assembly based on the layered heat conduction structure according to claim 1, characterized in that: The heat dissipation plate (201) adopts a fin structure, the heat conduction sheet (202) is made of silica gel heat conduction material, and the mounting base plate (203) is a ceramic base plate.

7. The LED lamp bead packaging assembly based on the layered heat conduction structure according to claim 1, characterized in that: The surface of the mounting base plate (203) is provided with a heat dissipation channel (11), and the heat dissipation channel (11) is filled with paraffin phase change material.

Images