Novel COF golden finger structure and liquid crystal panel

Abstract

The utility model discloses a novel chip on film (COF) golden finger structure and a liquid crystal panel, and the COF golden finger structure comprises a board body, a first golden finger structure and a second golden finger structure. The first golden finger structure is arranged at the first end of the board body, and the second golden finger structure is arranged at the second end of the board body; wherein the first golden finger structure comprises a plurality of first golden finger sheets which are arranged in parallel, and the outer side edge part of each first golden finger sheet is provided with a first hollow structure; the second golden finger structure comprises a plurality of second golden finger sheets which are arranged in parallel, and the outer side edge part of each second golden finger sheet is provided with a second hollow structure. According to the structure, the edge positions of the golden fingers of the COF are hollowed out, so that the edge positions of the golden fingers are thinned, a jig is easy to punch, the loss cost of raw materials is reduced, meanwhile, the risk of abnormal display pictures caused by poor punching of the COF is reduced, and the product performance of the display panel is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to integrated circuit packaging technical field, concretely relates to a novel COF gold finger design structure. BACKGROUND

[0002] COF (Chip on film or flex, Chip on Film) is a new IC (Integrated Circuit) packaging technology, mainly applied to display field, which is through the die soft film packaging technology of fixing IC on flexible circuit board, uses soft additional circuit board as the chip carrier to combine the chip and soft substrate circuit.

[0003] In addition to Bonding IC, the Film on COF can also be welded with other parts such as resistance, capacitance, etc. on the circuit board according to requirements, and except that the part area cannot be folded, other parts can be folded. The glass substrate end and the printed circuit board end on COF are designed with gold fingers, and through the IC on COF, the signal conduction of the panel can be realized.

[0004] Generally, the COF is in the form of a roll, and the COF needs to be punched by a jig first, and the COF is bonded in a single piece. However, the existing gold finger structure is mostly rectangular structure, and the edge position of COF is wide and hard during punching, and a single gold finger is prone to defects such as skew, chipping and burr, which will cause abnormal display panel picture. UTILITY MODEL CONTENTS

[0005] In order to solve the above problems existing in the prior art, the utility model provides a novel COF gold finger structure and a liquid crystal panel. The technical problems to be solved by the utility model are solved through the following technical schemes:

[0006] In one embodiment of the utility model, the number of the first gold finger pieces is greater than the number of the second gold finger pieces, and the width of the first gold finger piece is smaller than the width of the second gold finger piece.

[0007] The first gold finger structure includes a plurality of first gold finger pieces arranged in parallel, and the outer side edge part of each first gold finger piece has a first hollow structure.

[0008] The second gold finger structure includes a plurality of second gold finger pieces arranged in parallel, and the outer side edge part of each second gold finger piece has a second hollow structure.

[0009] In one embodiment of the utility model, the number of the first gold finger pieces is greater than the number of the second gold finger pieces, and the width of the first gold finger piece is smaller than the width of the second gold finger piece.

[0010] In an embodiment of the utility model, first hollow structure is arranged in the middle position of the outer side edge of first gold finger piece, and includes COF shape die cutting position;Second hollow structure is arranged in the middle position of the outer side edge of second gold finger piece, and includes COF shape die cutting position.

[0011] In an embodiment of the utility model, the shape outline of first hollow structure and second hollow structure is square, triangle or U type.

[0012] In an embodiment of the utility model, the number of first hollow structure on each first gold finger piece is one or more;The number of second hollow structure on each second gold finger piece is one or more.

[0013] In an embodiment of the utility model, the outer side edge portion of each first gold finger piece has a triangular first hollow structure;The outer side edge portion of each second gold finger piece has a U-shaped second hollow structure.

[0014] In an embodiment of the utility model, the outer side edge portion of each first gold finger piece has two U-shaped first hollow structures;The outer side edge portion of each second gold finger piece has two U-shaped second hollow structures.

[0015] In an embodiment of the utility model, the length of first hollow structure is less than the length of first gold finger piece, and the length of first hollow structure on different first gold finger pieces is same or not completely same;The length of second hollow structure is less than the length of second gold finger piece, and the length of second hollow structure on different second gold finger pieces is same or not completely same.

[0016] In an embodiment of the utility model, the novel COF gold finger structure further includes the middle IC arranged in the plate body.

[0017] Secondly, the utility model provides a kind of liquid crystal panel, including flexible circuit board, glass substrate and printed circuit board, and flexible circuit board includes the novel COF gold finger structure provided in the first aspect of the utility model, glass substrate is connected with flexible circuit board by first gold finger structure, and printed circuit board is connected with flexible circuit board by second gold finger structure.

[0018] The utility model has the advantages of:

[0019] The utility model provides a novel COF gold finger structure includes the board body, first gold finger structure and second gold finger structure, first gold finger structure sets up in the first end of board body, and second gold finger structure sets up in the second end of board body, wherein, first gold finger structure includes a plurality of parallel arrangement's first gold finger piece, and every first gold finger piece's outside edge portion has first hollow structure, second gold finger structure includes a plurality of parallel arrangement's second gold finger piece, and every second gold finger piece's outside edge portion has second hollow structure.

[0020] The utility model will make further detailed description in combination with the drawings and examples. DRAWINGS

[0021] Figure 1 It is the schematic diagram of a novel COF gold finger structure provided by the utility model example,

[0022] Figure 2 It is the schematic diagram of another novel COF gold finger structure provided by the utility model example,

[0023] Figure 3 It is the schematic diagram of still another novel COF gold finger structure provided by the utility model example,

[0024] Figure 4 It is the schematic diagram of again another novel COF gold finger structure provided by the utility model example,

[0025] Figure 5 It is the structural schematic diagram of liquid crystal panel provided by the utility model example,

[0026] Mark explanation:

[0027] 10-board body, 20-first gold finger structure, 21-first gold finger piece, 22-first hollow structure, 30-second gold finger structure, 31-second gold finger piece, 32-second hollow structure, 40-IC,

[0028] 100-flexible circuit board, 200-glass substrate, 300-printed circuit board. SPECIFIC EMBODIMENTS

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of the present application.

[0030] The present application provides a novel COF gold finger structure in the first aspect, please see Figure 1 , Figure 1 is a schematic diagram of a novel COF gold finger structure provided by the embodiment of the present application, the COF gold finger structure comprises a plate body 10, a first gold finger structure 20 and a second gold finger structure 30; the first gold finger structure 20 is arranged at the first end of the plate body 10, and the second gold finger structure 30 is arranged at the second end of the plate body 10;

[0031] Among them, the first gold finger structure 20 comprises a plurality of first gold finger pieces 21 arranged in parallel, and each first gold finger piece 21 has a first hollow structure 22 at the outer side edge portion;

[0032] The second gold finger structure 30 comprises a plurality of second gold finger pieces 31 arranged in parallel, and each second gold finger piece 31 has a second hollow structure 32 at the outer side edge portion.

[0033] In the embodiment, the first end of the plate body 10 is one end connected with a glass substrate (also called a panel, represented by Panel in English), which can also be called a glass substrate end, and the second end opposite to the first end is one end connected with a printed circuit board (PCB), which is also called a printed circuit board end.

[0034] Generally, the COF monomer mainly comprises a three-layer structure, that is, SR / CU / PI, SR is a solder resist layer, CU is an etched circuit, and PI is a polyimide film, Figure 1 Among them, the surface of the first gold finger structure 20 and the second gold finger structure 30 is CU, without covering SR, so as to carry out Bonding with the gold finger of the Panel and the PCB, and play a role in signal transmission. The rectangular area below the first gold finger structure 20 and the second gold finger structure 30 is a layout wiring area, and this area has a covering SR, which can be used to protect the circuit.

[0035] In addition, the novel COF gold finger structure provided by the embodiment further comprises an intermediate IC 40 arranged in the plate body 10, which can be connected with the first gold finger structure 20 and the second gold finger structure 30 through a circuit to realize signal conduction.

[0036] It can be understood that the number of the first gold finger pieces 21 arranged at the glass substrate end is greater than the number of the second gold finger pieces 31 arranged at the printed circuit board end, and the width of the first gold finger pieces 21 is smaller than the width of the second gold finger pieces 31.

[0037] Optionally, as an implementation manner, the number of the first gold finger pieces 21 is about 1000, and the number of the second gold finger pieces 31 is about 100. The length of the first gold finger pieces 21 is generally not more than 5 mm, and the length of the second gold finger pieces 31 is generally not more than 6 mm.

[0038] Further, in the embodiment, the first hollow structure 22 is arranged at the middle position of the outer side edge of the first gold finger piece 21 and includes a COF shape punching position; and the second hollow structure 32 is arranged at the middle position of the outer side edge of the second gold finger piece 31 and includes a COF shape punching position.

[0039] It can be understood that the length Y1 of the first hollow structure 22 is smaller than the length of the first gold finger piece 21, the width X1 of the first hollow structure 22 is smaller than the width of the first gold finger piece 21, the length Y2 of the second hollow structure 32 is smaller than the length of the second gold finger piece 31, and the width Y1 of the second hollow structure 32 is smaller than the width of the second gold finger piece 31, as shown in Figure 1 .

[0040] Optionally, as an implementation manner, the shape contour of the first hollow structure 22 and the second hollow structure 32 can be square, triangular or U-shaped.

[0041] It can be understood that the first hollow structure 22 and the second hollow structure 32 can adopt the same shape contour or different shape contours.

[0042] Optionally, as an implementation manner, the number of the first hollow structure 22 on each first gold finger piece 21 can be one or more, and the number of the second hollow structure 32 on each second gold finger piece 31 can also be one or more.

[0043] For example, Figure 1 as shown in the COF gold finger structure, each first gold finger piece 21 includes one first hollow structure 22, and each second gold finger piece 31 includes one second hollow structure 32. The shape contour of the first hollow structure 22 and the second hollow structure 32 is square.

[0044] Another embodiment of the utility model also provides a novel COF gold finger structure, wherein the first hollow structure 22 and the second hollow structure 32 adopt different shape contours. For example, in Figure 2As shown in another schematic view of the novel COF gold finger structure, the outer edge portion of each first gold finger piece 21 has a triangular first hollow structure 22; the outer edge portion of each second gold finger piece 31 has a U-shaped second hollow structure 32.

[0045] A further embodiment of the utility model also provides a novel COF gold finger structure, wherein each first gold finger piece 21 includes a plurality of first hollow structures 22; each second gold finger piece 31 includes a plurality of second hollow structures 32. Figure 3 As shown in another schematic view of the novel COF gold finger structure, the outer edge portion of each first gold finger piece 21 has a triangular first hollow structure 22; the outer edge portion of each second gold finger piece 31 has a U-shaped second hollow structure 32.

[0046] In addition, as an implementation manner, the lengths of the first hollow structures 22 on different first gold finger pieces 21 can be the same or not completely the same; the lengths of the second hollow structures 32 on different second gold finger pieces 31 can be the same or not completely the same.

[0047] For example, as shown in another schematic view of the novel COF gold finger structure, the outer edge portion of each first gold finger piece 21 has a triangular first hollow structure 22; the outer edge portion of each second gold finger piece 31 has a U-shaped second hollow structure 32. Figure 4 As shown in another schematic view of the novel COF gold finger structure, the outer edge portion of each first gold finger piece 21 has a triangular first hollow structure 22; the outer edge portion of each second gold finger piece 31 has a U-shaped second hollow structure 32.

[0048] The novel COF gold finger structure provided by the utility model makes the gold finger edge position thin through hollow design, so that the gold finger edge position is easy to be punched by a jig, the material loss cost is reduced, the risk of display picture abnormality caused by poor COF punching is reduced, and the product performance of the display panel is improved.

[0049] The second aspect of the utility model also provides a liquid crystal panel. Figure 5 , Figure 5 is a structural schematic view of the liquid crystal panel provided by the utility model embodiment. The liquid crystal panel comprises a flexible circuit board 100, a glass substrate 200 and a printed circuit board 300, wherein the flexible circuit board 100 comprises the novel COF gold finger structure provided by the first aspect of the utility model, the glass substrate 200 is connected with the flexible circuit board 100 through the first gold finger structure 20 to realize signal conduction, and the printed circuit board 300 is connected with the flexible circuit board 100 through the second gold finger structure 30 to realize signal conduction.

[0050] In the description of the utility model, the terms "first", "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "multiple" is two or more than two, unless otherwise specifically limited.

[0051] In addition, unless otherwise specifically defined and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0052] The above is a further detailed description of the utility model in combination with specific preferred embodiments, which cannot be considered as limiting the specific implementation of the utility model to these descriptions. For ordinary skilled in the art to which the utility model belongs, without departing from the concept of the utility model, a number of simple deductions or substitutions can be made, which should be considered as belonging to the protection scope of the utility model.

Claims

1. A novel COF gold finger structure, characterized in that, The new COF gold finger structure comprises a board body (10), a first gold finger structure (20) and a second gold finger structure (30); the first gold finger structure (20) is arranged at a first end of the board body (10), and the second gold finger structure (30) is arranged at a second end of the board body (10). The first gold finger structure (20) comprises a plurality of first gold finger pieces (21) arranged in parallel, and each first gold finger piece (21) has a first hollow structure (22) at an outer side edge portion. The second gold finger structure (30) comprises a plurality of second gold finger pieces (31) arranged in parallel, and each second gold finger piece (31) has a second hollow structure (32) at an outer side edge portion.

2. A novel COF gold finger structure according to claim 1, characterized in that, The number of the first gold finger pieces (21) is greater than the number of the second gold finger pieces (31), and the width of the first gold finger pieces (21) is smaller than the width of the second gold finger pieces (31).

3. A novel COF gold finger structure according to claim 1, characterized in that, The first hollow structure (22) is arranged at a middle position of the outer side edge of the first gold finger piece (21) and comprises a COF shape die-cut position; and the second hollow structure (32) is arranged at a middle position of the outer side edge of the second gold finger piece (31) and comprises a COF shape die-cut position.

4. A novel COF gold finger structure according to claim 1, characterized in that, The shape of the first hollow structure (22) and the second hollow structure (32) is square, triangular or U-shaped.

5. A novel COF gold finger structure according to claim 1, characterized in that, The number of the first hollow structure (22) on each first gold finger piece (21) is one or more, and the number of the second hollow structure (32) on each second gold finger piece (31) is one or more.

6. A novel COF gold finger structure according to claim 1, characterized by, The outer side edge portion of each first gold finger piece (21) has a triangular first hollow structure (22), and the outer side edge portion of each second gold finger piece (31) has a U-shaped second hollow structure (32).

7. A novel COF gold finger structure according to claim 1, characterized by, The outer side edge portion of each first gold finger piece (21) has two U-shaped first hollow structures (22), and the outer side edge portion of each second gold finger piece (31) has two U-shaped second hollow structures (32).

8. A novel COF gold finger structure according to claim 1, characterized by, The length of the first hollow structure (22) is smaller than the length of the first gold finger piece (21), and the lengths of the first hollow structures (22) on different first gold finger pieces (21) are the same or not completely the same; and the length of the second hollow structure (32) is smaller than the length of the second gold finger piece (31), and the lengths of the second hollow structures (32) on different second gold finger pieces (31) are the same or not completely the same.

9. A novel COF gold finger structure according to claim 1, characterized by, The new COF gold finger structure further comprises an intermediate IC (40) arranged on the board body (10).

10. A liquid crystal panel comprising a flexible circuit board (100), a glass substrate (200), and a printed circuit board (300), characterized in that, The flexible circuit board (100) comprises the new COF gold finger structure according to any one of claims 1-8, the glass substrate (200) is connected to the flexible circuit board (100) through the first gold finger structure (20), and the printed circuit board (300) is connected to the flexible circuit board (100) through the second gold finger structure (30).

Images