Universal clamp for testing semiconductor device

Abstract

The utility model relates to the technical field of clamps, and discloses a universal clamp for testing a semiconductor device, which comprises a base, a clamping assembly, a first supporting tube, a second supporting tube, a first clamping piece, a second clamping piece and a second clamping piece, and is characterized in that the top surface of the base is provided with the semiconductor device, and the top surface of the base is fixedly provided with a PLC (programmable logic controller); the clamping assembly is arranged in the first supporting pipe and used for clamping the semiconductor device in multiple directions, and through mutual cooperation of the base, the semiconductor device, the first supporting pipe, the clamping arm, the second supporting pipe and the movable pipe frame, the effect of clamping the semiconductor device in multiple directions can be achieved. The four sides of the semiconductor device are extruded and limited through the clamping arms, the first fixing plates and the clamping heads, insufficient external support of the semiconductor device is avoided, meanwhile, the clamping force is detected through the pressure sensor, it is guaranteed that the clamping force is not too large, damage to the semiconductor device due to excessive clamping is avoided, and practicability is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of fixture, especially a universal fixture for semiconductor device testing. BACKGROUND

[0002] The fixture refers to the device for fixing the machining object, making it occupy the correct position to accept the construction or detection in the mechanical manufacturing process, and is also called the fixture, and from the broad sense, the device for quickly, conveniently and safely installing the workpiece in the process is also called the fixture, and the fixture is usually composed of the positioning element (determining the correct position of the workpiece in the fixture), the clamping device, the tool guiding element (determining the relative position of the tool and the workpiece or guiding the tool direction), the indexing device (making the workpiece complete the machining of several workstations in one installation, and the indexing device has the rotary indexing device and the straight-line indexing device), the connecting element and the fixture body (the fixture base) and the like, and the fixture needs to be clamped when the semiconductor device is tested.

[0003] The existing PCB clamping mechanism (announcement number: CN221429191U) has at least the following disadvantages:

[0004] In the above patent, the interval of the two first clamping plates is adjusted by adjusting the synchronous reverse sliding of the two movable blocks in the rectangular frame through the driving part, so as to be suitable for placing PCBs of different sizes, but only the two sides of the PCB can be clamped, the supporting force of the other two sides is insufficient, and the clamping force is difficult to control, when the clamping is excessive, the PCB is prone to breakage, and therefore it is necessary to propose a universal fixture for semiconductor device testing to solve the problem. UTILITY MODEL CONTENT

[0005] The utility model aims at solving the defects in the prior art and provides a universal fixture for semiconductor device testing.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0007] The utility model provides a universal fixture for semiconductor device test, including the base, the top surface of base is provided with semiconductor device, the top surface of base is fixedly installed with PLC controller, one side of base is fixedly installed with first support pipe, still include: clamping assembly, clamping assembly is arranged in the inside of first support pipe for the multidirectional clamping of semiconductor device, clamping assembly includes: two clamping arms, two clamping arms are all movably sleeved in the inside of first support pipe, one side of clamping arm is provided with second threaded hole, the inner circular wall surface of second threaded hole is connected with two -way screw rod in thread, one side of first support pipe is fixedly installed with second drive motor, and the driving shaft one end of second drive motor is fixedly installed with two -way screw rod, the outside of first support pipe is fixedly installed with second fixed plate, one side of second fixed plate is provided with first fixed plate, the bottom surface of first support pipe is fixedly installed with second support pipe, and the inside of second support pipe is movably sleeved with mobile pipe frame, one side of mobile pipe frame is provided with first threaded hole, the inner circular wall surface of first threaded hole is connected with first threaded column in thread, one side of base is provided with circular groove, the inner circular wall surface of circular groove is fixedly sleeved with first drive motor, one side of second support pipe is provided with first circular through -hole, and first circular through -hole is movably sleeved with first threaded column, and one end of the driving shaft of first drive motor is fixedly installed with first threaded column, and the inside of mobile pipe frame is movably sleeved with a plurality of clamping heads, and pressure detection subassembly is used for detecting the clamping force of semiconductor device.

[0008] As a further scheme of the utility model, the pressure detection subassembly includes: two fixed holes, two fixed holes are respectively arranged on one side of the clamping arm and the second fixed plate, a pressure sensor is fixedly sleeved on the inner circular wall surface of the fixed hole, the pressure sensor is electrically connected with the PLC controller, one end of the pressure sensor on one side of the second fixed plate is fixedly installed with the first fixed plate, a rectangular groove is arranged on one side of the clamping arm, a third fixed plate is arranged in the rectangular groove, and one end of the third fixed plate is fixedly installed with the pressure sensor.

[0009] As a further scheme of the utility model, a limiting groove is arranged on one side of the third fixed plate, one side of the first fixed plate and one side of the clamping head.

[0010] As a further scheme of the utility model, a silica gel pad is fixedly installed on the inner wall of the limiting groove, and the side surface of the semiconductor device abuts against the inner wall of the silica gel pad.

[0011] As a further scheme of the utility model, the second limiting hole and the first limiting hole are arranged on one side of the clamping arm, the second limiting hole is movably connected with the movable pipe frame, and the first limiting hole is movably connected with the first fixed plate.

[0012] As a further scheme of the utility model, the bottom surface of the movable pipe frame is provided with a rectangular through hole, and a fixed column is arranged in the rectangular through hole and fixedly connected with the bottom surface of the clamping head.

[0013] As a further scheme of the utility model, the internal width of the first limiting hole is 0.5 times of the width of the first fixed plate.

[0014] As a further scheme of the utility model, a limiting plate is movably connected with the first threaded column.

[0015] Compared with the prior art, the utility model has the beneficial effects that:

[0016] 1. The base, the semiconductor device, the first supporting pipe, the clamping arm, the second supporting pipe and the movable pipe frame are cooperated, the four sides of the semiconductor device are pressed and limited by the clamping arm, the first fixed plate and the clamping head, the semiconductor device is prevented from being insufficiently supported, the clamping force is detected by the pressure sensor, the clamping force is prevented from being too large, the semiconductor device is prevented from being damaged due to excessive clamping, and the practicability is improved.

[0017] 2. The fixed column is manually rotated to drive the plurality of clamping heads to move horizontally, the clamping force is uniformly distributed, the movable pipe frame is supported by the second limiting hole, and the movable pipe frame is prevented from being inclined. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 The utility model provides a kind of overall structure schematic diagram of universal fixture for semiconductor device testing;

[0019] Figure 2 The utility model provides a kind of base structure schematic diagram of universal fixture for semiconductor device testing;

[0020] Figure 3 The utility model provides a kind of semiconductor device structure schematic diagram of universal fixture for semiconductor device testing;

[0021] Figure 4 The utility model provides a kind of first fixed plate structure schematic diagram of universal fixture for semiconductor device testing;

[0022] Figure 5 ForFigure 3 Partial structure schematic view of middle A;

[0023] Figure 6 For Figure 3 Partial structure schematic view of middle B;

[0024] Figure 7 It is a fixed column structure schematic view of a universal clamp for semiconductor device testing.

[0025] In the figure: 1, base; 2, semiconductor device; 3, first support pipe; 4, clamping arm; 5, second support pipe; 6, moving pipe frame; 7, first fixed plate; 8, first limiting hole; 9, first threaded hole; 10, first threaded column; 11, first drive motor; 12, clamping head; 13, second fixed plate; 14, pressure sensor; 15, third fixed plate; 16, limiting groove; 17, silica gel pad; 18, second limiting hole; 19, two-way screw rod; 20, second drive motor; 21, limiting plate; 22, fixed column; 23, second threaded hole; 24, fixed hole. DETAILED DESCRIPTION

[0026] In order to make the technical means, creative features, purposes and effects achieved by the utility model easy to understand, the utility model is further described below in combination with specific embodiments.

[0027] In the description of the utility model, it should be pointed out that the orientation or position relationship indicated by the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like is the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the utility model. In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0028] In the description of the utility model, it should be pointed out that unless otherwise explicitly specified and limited, the terms "mounting", "provided with", "connection" and the like should be understood broadly, for example, "connection" can be fixed connection, can also be detachable connection, or integrally connected; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication inside two elements. For ordinary skilled persons in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0029] Reference Figures 1-7A universal clamp for semiconductor device testing, including base 1, the top surface of base 1 is provided with semiconductor device 2, the top surface of base 1 is fixedly installed with PLC controller, one side of base 1 is fixedly installed with first support pipe 3, further comprising: clamping assembly, clamping assembly is arranged in the inside of first support pipe 3, for multidirectional clamping of semiconductor device 2, clamping assembly includes: two clamping arms 4, two clamping arms 4 are movably sleeved in the inside of first support pipe 3, one side of clamping arm 4 is provided with second threaded hole 23, the inner circular wall surface of second threaded hole 23 is screw connected with bidirectional screw rod 19, one side of first support pipe 3 is fixedly installed with second drive motor 20, one end of the drive shaft of second drive motor 20 is fixedly installed with bidirectional screw rod 19, the outside of first support pipe 3 is fixedly installed with second fixed plate 13, one side of second fixed plate 13 is provided with first fixed plate 7, the bottom surface of first support pipe 3 is fixedly installed with second support pipe 5, the inside of second support pipe 5 movably sleeved with moving pipe frame 6, one side of moving pipe frame 6 is provided with first threaded hole 9, the inner circular wall surface of first threaded hole 9 is screw connected with first threaded column 10, one side of base 1 is provided with circular groove, the inner circular wall surface of circular groove is fixedly sleeved with first drive motor 11, one side of second support pipe 5 is provided with first circular through hole, first circular through hole is movably sleeved with first threaded column 10, one end of the drive shaft of first drive motor 11 is fixedly installed with first threaded column 10, the inside of moving pipe frame 6 movably sleeved with several clamping heads 12, pressure detection assembly, pressure detection assembly is used for detecting the clamping force of semiconductor device 2.

[0030] When in use, the rotating bidirectional screw rod 19 and the second threaded hole 23 convert the rotary motion into linear motion, so that the two clamping arms 4 move towards each other, the clamping arms 4 moving towards each other drive the third fixed plate 15 to move, and the third fixed plate 15 is abutted on both sides of the semiconductor device 2 through the silica gel pad 17, in the process of contact, the pressure between the third fixed plate 15 and the clamping arm 4 is detected through the pressure sensor 14, so that the second drive motor 20 stops under appropriate pressure, avoiding excessive clamping on both sides of the semiconductor device 2, then, the first drive motor 11 is started to drive the first threaded column 10 to rotate, the rotary motion is converted into linear motion through the first threaded column 10 and the first threaded hole 9, so that the moving pipe frame 6 moves to one side of the semiconductor device 2 in the second support pipe 5, driving the limiting groove 16 on one side of the several clamping heads 12 to abut against the semiconductor device 2, and then the clamping is completed.

[0031] In the embodiment, the pressure detection assembly comprises two fixing holes 24, the fixing holes 24 are arranged on one side of the clamping arm 4 and the second fixed plate 13 respectively, the inner wall surface of the fixing hole 24 is fixedly sleeved with a pressure sensor 14, the pressure sensor 14 is electrically connected with a PLC controller, one end of the pressure sensor 14 located on one side of the second fixed plate 13 is fixedly installed with the first fixed plate 7, a rectangular groove is arranged on one side of the clamping arm 4, a third fixed plate 15 is arranged in the rectangular groove, the third fixed plate 15 is fixedly installed with one end of the pressure sensor 14, a limiting groove 16 is arranged on one side of the third fixed plate 15, one side of the first fixed plate 7 and one side of the clamping head 12 respectively, a silica gel pad 17 is fixedly installed on the inner side wall of the limiting groove 16, the side surface of the semiconductor device 2 abuts against the inner wall of the silica gel pad 17, a second limiting hole 18 and a first limiting hole 8 are arranged on one side of the clamping arm 4, the second limiting hole 18 is movably sleeved with the moving pipe frame 6, the first limiting hole 8 is movably sleeved with the first fixed plate 7, a rectangular through hole is arranged on the bottom surface of the moving pipe frame 6, a fixed column 22 is arranged in the rectangular through hole, the fixed column 22 is fixedly installed with the bottom surface of the clamping head 12, the inner width of the first limiting hole 8 is 1.5 times of the width of the first fixed plate 7, a limiting plate 21 is movably sleeved with the first threaded column 10, the extrusion force is detected through the pressure sensor 14, and then the pushing force of the clamping head 12 is controlled.

[0032] In use, the fixed column 22 is arranged, the fixed column 22 is manually driven to drive a plurality of clamping heads 12 to move transversely, so that the clamping force is uniformly distributed, the single force is avoided to be too large, the moving pipe frame 6 is supported through the second limiting hole 18, and the moving pipe frame 6 is avoided to be skewed.

[0033] From the above description, it can be seen that the above-mentioned embodiments of the utility model realize the following technical effects:

[0034] When the user needs to clamp the semiconductor device 2 of different sizes, the semiconductor device 2 is picked up, the front side is abutted against the limiting groove 16 on one side of the first fixed plate 7, the second drive motor 20 is started to drive the bidirectional screw rod 19 to rotate, the rotating bidirectional screw rod 19 and the second threaded hole 23 convert the rotary motion into linear motion, so that the two clamping arms 4 move towards each other, the third fixed plate 15 is moved by the clamping arms 4 moving towards each other, and is abutted against the two sides of the semiconductor device 2 through the silica gel pad 17, in the contact process, the pressure between the third fixed plate 15 and the clamping arms 4 is detected through the pressure sensor 14, so that the second drive motor 20 stops under the appropriate pressure, and the clamping of the two sides of the semiconductor device 2 is avoided, then the first drive motor 11 is started to drive the first threaded column 10 to rotate, the rotary motion is converted into linear motion through the first threaded column 10 and the first threaded hole 9, so that the moving pipe frame 6 moves to one side of the semiconductor device 2 in the second support pipe 5, and the limiting groove 16 on one side of the clamping head 12 abuts against the semiconductor device 2, the semiconductor device 2 is pushed to the first fixed plate 7 to exert pressure on the two pressure sensors 14 on one side of the second fixed plate 13, the extrusion force is detected through the two pressure sensors 14, and then the pushing force of the clamping head 12 (which is realized by controlling the start and stop and power size of the drive motor, and the prior art is not described again) is controlled, and finally the effect of multi-directional clamping of the semiconductor device 2 is realized, the four sides of the semiconductor device 2 are extruded and limited by the clamping arms 4, the first fixed plate 7 and the clamping head 12, the external support of the semiconductor device 2 is avoided, and at the same time, the clamping force is detected through the pressure sensor 14, so that the clamping force is not too large, the semiconductor device 2 is avoided from being damaged due to excessive clamping, and the practicability is improved.

[0035] The basic principle and main features of the utility model and the advantages of the utility model are shown and described. It should be understood by those skilled in the art that the utility model is not limited by the above examples, and the above examples and descriptions in the specification are only to illustrate the principle of the utility model, and various changes and improvements can be made to the utility model without departing from the spirit and scope of the utility model, and these changes and improvements all fall within the scope of the utility model claimed.

Claims

1. A universal clamp for semiconductor device testing, comprising a base (1), the top surface of the base (1) is provided with a semiconductor device (2), the top surface of the base (1) is fixedly installed with a PLC controller, one side of the base (1) is fixedly installed with a first support pipe (3), characterized in that, Also includes: The clamping assembly is arranged inside the first supporting pipe (3), which is used for multi-directional clamping of the semiconductor device (2). The clamping assembly comprises two clamping arms (4), both of which are movably sleeved inside the first supporting pipe (3). One side of the clamping arm (4) is provided with a second threaded hole (23). The inner circular wall surface of the second threaded hole (23) is threadedly connected with a bidirectional screw rod (19). One side of the first supporting pipe (3) is fixedly installed with a second driving motor (20). One end of the driving shaft of the second driving motor (20) is fixedly installed with the bidirectional screw rod (19). The outer side of the first supporting pipe (3) is fixedly installed with a second fixed plate (13). One side of the second fixed plate (13) is provided with a first fixed plate (7). The bottom surface of the first supporting pipe (3) is fixedly installed with a second supporting pipe (5). The inside of the second supporting pipe (5) is movably sleeved with a moving pipe frame (6). One side of the moving pipe frame (6) is provided with a first threaded hole (9). The inner circular wall surface of the first threaded hole (9) is threadedly connected with a first threaded column (10). One side of the base (1) is provided with a circular groove. The inner circular wall surface of the circular groove is fixedly sleeved with a first driving motor (11). One side of the second supporting pipe (5) is provided with a first circular through hole. The first circular through hole is movably sleeved with the first threaded column (10). One end of the driving shaft of the first driving motor (11) is fixedly installed with the first threaded column (10). The inside of the moving pipe frame (6) is movably sleeved with a plurality of clamping heads (12). The pressure detection assembly is used for detecting the clamping force of the semiconductor device (2).

2. A universal fixture for testing semiconductor devices as defined in claim 1, wherein, The pressure detection assembly comprises two fixed holes (24) arranged on one side of the clamping arm (4) and the second fixed plate (13). The inner circular wall surface of the fixed hole (24) is fixedly sleeved with a pressure sensor (14). The pressure sensor (14) is electrically connected with the PLC controller. One end of the pressure sensor (14) on one side of the second fixed plate (13) is fixedly installed with the first fixed plate (7). One side of the clamping arm (4) is provided with a rectangular groove. The inside of the rectangular groove is provided with a third fixed plate (15). One end of the third fixed plate (15) is fixedly installed with the pressure sensor (14).

3. A universal fixture for testing semiconductor devices as defined in claim 2, wherein, One side of the third fixed plate (15), one side of the first fixed plate (7) and one side of the clamping head (12) are respectively provided with a limiting groove (16).

4. A universal chuck for testing semiconductor devices as defined in claim 3, wherein The inner wall of the silica gel pad (17) is fixedly installed with a silica gel pad (17). The side surface of the semiconductor device (2) abuts against the inner wall of the silica gel pad (17).

5. The universal fixture for testing semiconductor devices of claim 1, wherein, One side of the clamping arm (4) is provided with a second limiting hole (18) and a first limiting hole (8). The second limiting hole (18) is movably sleeved with the moving pipe frame (6). The first limiting hole (8) is movably sleeved with the first fixed plate (7).

6. A universal fixture for testing semiconductor devices as recited in claim 1, wherein, The bottom surface of the mobile pipe frame (6) is provided with a rectangular through hole, and a fixed column (22) is arranged in the rectangular through hole.

7. A universal fixture for testing semiconductor devices as defined in claim 5, wherein, The internal width of the first limiting hole (8) is 1.5 times the width of the first fixed plate (7).

8. The universal fixture for testing semiconductor devices of claim 1, wherein, The second supporting pipe (5) is internally fixed with a limiting plate (21), and the limiting plate (21) is movably sleeved with the first threaded column (10).

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