Anti-disassembly traceability LED light source module

Abstract

The utility model discloses an anti-disassembly traceable LED light source module. The module comprises a substrate, an LED chip, an RFID chip and fluorescent glue. The LED chip and the RFID chip are arranged on a chip island platform on the front surface of the substrate in parallel and are jointly covered by fluorescent glue; the two power leads are connected with the first electrode and the second electrode of the substrate respectively and serve as radiating antennas of the RFID chip at the same time. According to the module, the TID or EPC code of the RFID chip is bound with the identity information of the light source, so that a tamper-resistant evidence is formed; and during detection, RFID signals radiated by the power supply lead are wirelessly read, and identity tracing is realized by matching evidence information. The module adopts a fluorescent glue integrated packaging structure, the communication function of the RFID chip is destroyed if the module is forcibly dismantled, and the physical anti-dismantling effectiveness is ensured. The anti-counterfeiting system is compact in structure, realizes low-cost and high-reliability product identity tracing through double binding of hardware and data, and is suitable for anti-counterfeiting and supply chain management of lighting equipment.

Description

TECHNICAL FIELD

[0001] The utility model relates to LED light source technical field especially relates to a kind of anti-disassembly traceability LED light source module. BACKGROUND

[0002] At present, many LED lamp brand manufacturers exist in the production, transfer and sales process There are many problems such as channeling phenomenon between different channels, product counterfeiting phenomenon, after-sales warranty string guarantee, etc. RFID tag scheme can perfectly solve the above problems. But the existing RFID tag scheme on the market can not achieve good anti-disassembly ability and anti-metal reading and writing ability. INVENTION CONTENTS

[0003] The utility model aims at providing a kind of anti-disassembly traceability LED light source module, to solve the string goods, counterfeiting problem of LED lamp. Technical scheme is as follows:

[0004] First aspect: a kind of anti-disassembly traceability LED light source module, including substrate, LED chip, first electrode, second electrode and fluorescent glue;The first electrode, second electrode are formed on the front of the substrate, the LED chip is installed on the chip island table in the middle of the substrate front, and the pin and the first electrode, second electrode are electrically connected;The fluorescent glue is covered on the LED chip;

[0005] It further includes RFID chip, annular feed antenna and two power supply leads;

[0006] The RFID chip is installed on the chip island table in the middle of the substrate, and the LED chip is covered by the fluorescent glue;

[0007] The annular feed antenna is formed on the edge area of the front of the substrate, is arranged around the outer side of the first electrode and the second electrode, and the feed end is electrically connected with the RFID chip by gold wire bonding;

[0008] Two power supply leads are electrically connected with the first electrode and the second electrode respectively, and simultaneously as the radiation unit of the RFID chip, the power supply lead extends outward from the edge of substrate to form antenna radiation structure.

[0009] Further, the LED chip is multiple, and is electrically connected with the first electrode and the second electrode after being connected in parallel or series or series-parallel mode.

[0010] Further, it further includes dam glue, is coated on the substrate and forms annular closed structure around the chip island table, and the fluorescent glue is filled in the area defined by the dam glue.

[0011] Further, the line width of the looped feed antenna is 0.1-0.5mm, and the first electrode and the second electrode are kept at a distance of 0.2-1mm.

[0012] Further, the power lead forms an L-shaped bending structure at the extension part of the substrate, the bending angle is 90-135 degrees, the bending length is greater than 2mm, and the lead length is greater than 30mm.

[0013] Further, the pins of the LED chip and the first electrode and the second electrode are electrically connected by gold wire bonding or are electrically connected by soldering in a flip chip manner.

[0014] Further, the substrate is a three-layer composite structure, including an insulating and heat-conducting layer, a metal substrate layer and a surface treatment layer.

[0015] Further, the first electrode, the second electrode and the looped feed antenna are formed on the substrate by printing or etching process.

[0016] Further, the RFID chip works in the ultra-high frequency band.

[0017] Compared with the prior art, the utility model has the remarkable characteristics that:

[0018] The utility model has the compact structure, realizes low cost, high reliable product identity traceability through hardware and data double binding, and is applicable to lighting equipment anti-fake and supply chain management. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is the structure expansion of the anti-disassembly traceability LED light source module of the utility model Figure 1 ;

[0020] Figure 2 is the structure expansion of the anti-disassembly traceability LED light source module of the utility model Figure 2 ;

[0021] Figure 3 is the overall view of the anti-disassembly traceability LED light source module of the utility model. DETAILED DESCRIPTION

[0022] To further illustrate the various embodiments, the utility model provides drawings. These drawings are part of the utility model disclosure, which mainly serves to illustrate the embodiments, and can be combined with the relevant description of the specification to explain the operating principle of the embodiments. With reference to these contents, those skilled in the art should understand other possible embodiments and the advantages of the utility model. The components in the drawings are not drawn to scale, and similar component symbols are usually used to represent similar components.

[0023] The utility model is further illustrated in connection with the drawings and specific embodiments.

[0024] As Figures 1 to 3 The utility model discloses a kind of anti-disassembly traceability LED light source module, including substrate 8, LED chip 5, first electrode 3, second electrode 4, fluorescent glue 1, dam glue 2, RFID chip 6, annular feed antenna 7 and two power supply leads 9,10.First electrode 3, second electrode 4 are formed on the front of the substrate, LED chip 5 is installed on the chip island table in the front middle part of substrate 8, its pin and first electrode 3, second electrode 4 are electrically connected, and fluorescent glue 1 covers on LED chip 5.RFID chip 6 is installed on the chip island table in the middle part of substrate 8, and LED chip 5 is covered by fluorescent glue 1 together.Annular feed antenna 7 is formed on the front edge area of substrate 8, and is arranged around the outside of first electrode 3 and second electrode 4, and its feed end is electrically connected with RFID chip 6 by gold wire bonding.Two power supply leads 9,10 are electrically connected with first electrode 3 and second electrode 4 respectively, and simultaneously as the radiating unit (formed by electromagnetic coupling with annular feed antenna 7) of RFID chip 6, and power supply lead 9,10 extends from the edge of substrate 8 to form antenna radiation structure outside.The module adopts fluorescent glue integrated packaging structure, and if forcibly removed, it will damage RFID chip communication function, to ensure the effectiveness of physical anti-disassembly.

[0025] The number of LED chips 5 is multiple, and is connected in parallel or series or series-parallel mode and electrically connected with the first electrode and the second electrode.

[0026] Dam glue 2 is preferably provided.Dam glue 2 is coated on substrate 8 and forms a ring-shaped closed structure around the chip island table, and fluorescent glue 1 is filled in the area defined by dam glue 2.

[0027] The double-layer packaging structure composed of dam glue 2 and fluorescent glue 1 has the following technical effects to realize anti-disassembly and optimization of optical performance.

[0028] (1) Physical structure stability: dam glue forms a ring-shaped closed structure (width 0.3-0.8mm, height 0.5-1.2mm) on the substrate, accurately defines the filling boundary of fluorescent glue, and prevents liquid fluorescent glue from overflowing to the electrode area before solidification.The combination of the two forms a "hard frame soft core" composite packaging structure, so that the thickness deviation of the fluorescent glue layer is controlled within ±5%, and the light spot color temperature difference (ΔCCT≤100K) caused by uneven distribution of glue is avoided.

[0029] (2) Dual protection of moisture and dust: The dam glue adopts high-viscosity epoxy resin, which blocks the water vapor penetration path with its dense cross-linked network, making the module air-tightness reach IP67 standard; The hydrophobic nano-silicon dioxide particles (particle size 50-100 nm) added to the fluorescent glue reduce the insulation resistance by less than 10% after 1000 hours of damp heat aging test (85°C / 85%RH) after the joint action of the dam glue.

[0030] (3) Light efficiency improvement and heat management: The white light reflecting property (reflectivity ≥ 85%) of the dam glue reflects the lateral light leakage back to the fluorescent glue layer, increasing the light flux by 8% to 12%; The incorporation of aluminum nitride heat-conducting filler (content 15-25wt%) into the fluorescent glue forms a heat-conducting gradient with the dam glue, reducing the LED junction temperature by 6-8°C and ensuring a light decay of less than 3% after 3000 hours.

[0031] (4) Anti-disassembly linkage mechanism: When external force destroys the dam glue structure (deformation amount > 0.2mm), the mechanical stress generated by its fracture is conducted to the RFID chip through the fluorescent glue, which will damage the communication function of the RFID chip. The system cannot read the traceability information, resulting in the loss of warranty benefits of the module.

[0032] (5) Process compatibility optimization: The curing temperature of the dam glue (80-100°C) and the curing conditions of the fluorescent glue (120-140°C) form a step curing process, avoiding the problem of interface delamination, and the interfacial shear strength is ≥ 8MPa, which is significantly higher than that of the traditional single-layer packaging structure (about 5MPa).

[0033] The line width of the ring-shaped feed antenna 7 is 0.1-0.5mm, and the distance between the first electrode 3 and the second electrode 4 is 0.2-1mm. It meets the requirements of feed and electromagnetic coupling.

[0034] The power supply lead 9, 10 forms an L-shaped bending structure outside the substrate extension part, with a bending angle of 90-135 degrees and a bending length greater than 3mm, and the lead length is greater than 30mm. The lead under this structure can provide good electromagnetic radiation performance, and at the same time, the RFID tag composed of the RFID chip 6, the ring-shaped feed antenna 7 and the power supply lead 9, 10 has strong anti-metal ability.

[0035] The overall thickness of the substrate 8 is 1.2-3.0mm (preferably 1.6mm), which adopts a three-layer composite structure:

[0036] Insulating and heat-conducting layer (upper layer): thickness 0.2-0.4mm, alumina ceramic substrate (thermal conductivity ≥ 25W / m·K), realizing the dual functions of electrical isolation and heat conduction;

[0037] Metal substrate layer (middle layer): thickness 0.8-2.0mm, 6063 aluminum alloy (tensile strength ≥ 180MPa), as the main heat dissipation channel and mechanical support;

[0038] Surface treatment layer (lower layer): thickness 0.05-0.1mm, anodic oxide film (hardness ≥ 400HV), improve corrosion resistance and surface adhesion.

[0039] The first electrode 3, the second electrode 4 and the annular feed antenna 7 are formed on the insulating and heat-conducting layer of the substrate 8 by a printing or etching process, and the thickness is 18-105 μm.

[0040] Compared with the traditional aluminum substrate, the three-layer composite structure can play a role in enhancing heat dissipation: the 1.6mm-thick substrate can stabilize the LED junction temperature below 85℃ (ambient temperature 25℃) under natural convection, and the light decay control is less than 2% for 3000 hours, and can bear 100W-level power.

[0041] In the application, the RFID chip 6 adopts ultra-high frequency RFID, and the working frequency band is in the UHF frequency band, and the global general range is 860-960MHz, and the specific application range is determined according to the standard of the country. The RFID tag is a high-performance passive tag, and the read-write distance can reach 3-12 meters in an ideal environment (no obstacle, no interference); the read-write distance can reach 0.5-5 meters in a complex environment (near metal / liquid); and the maximum read distance of the high-gain antenna reader can reach 15-20 meters. The requirements of long-distance reading and writing such as retail inventory management and logistics pallet tracking can be met.

[0042] The utility model discloses a traceability management method as follows:

[0043] In production, the TID or EPC code of the RFID chip is bound with the light source identity information (traceability code of the light source) to form an inalterable record;

[0044] In detection, the RFID signal radiated by the power supply lead is read wirelessly, and the identity traceability is realized by matching the record information.

[0045] In summary, the utility model has compact structure, realizes low-cost and high-reliability product identity traceability through hardware and data double binding, and is suitable for lighting equipment anti-counterfeiting and supply chain management.

[0046] Although the utility model is specifically shown and introduced in combination with the preferred embodiments, those skilled in the art should understand that various changes can be made to the utility model in form and detail without departing from the spirit and scope of the utility model defined in the appended claims, and all are within the protection scope of the utility model.

Claims

1. A tamper-evident LED light source module, comprising a substrate, an LED chip, a first electrode, a second electrode and a phosphor glue; the first electrode and the second electrode are formed on the front surface of the substrate, the LED chip is mounted on a chip island in the middle of the front surface of the substrate, and the pins of the LED chip are electrically connected to the first electrode and the second electrode; the phosphor glue covers the LED chip; characterized in that, it further comprises an RFID chip, a loop feed antenna and two power supply leads; the RFID chip is mounted on a chip island in the middle of the substrate and is covered by the phosphor glue together with the LED chip; the loop feed antenna is formed on the edge area of the front surface of the substrate and is arranged outside the first electrode and the second electrode, and the feed end of the loop feed antenna is electrically connected to the RFID chip through gold wire bonding; the two power supply leads are electrically connected to the first electrode and the second electrode respectively and simultaneously serve as the radiation unit of the RFID chip, and the power supply leads extend outward from the edge of the substrate to form an antenna radiation structure. the LED chip is a plurality of LED chips connected in parallel or in series and electrically connected to the first electrode and the second electrode.

2. The tamper-evident LED light module of claim 1, wherein, it further comprises a dam glue coated on the substrate and forming a ring-shaped closed structure around the chip island, and the phosphor glue is filled in the area defined by the dam glue.

3. The tamper-evident LED light module of claim 1, wherein, the line width of the loop feed antenna is 0.1-0.5mm, and the distance between the loop feed antenna and the first electrode and the second electrode is 0.2-1mm.

4. The tamper-evident LED light module of claim 1, wherein, the power supply leads form an L-shaped bending structure in the extended part outside the substrate, the bending angle is 90-135 degrees, the bending length is greater than 2mm, and the lead length is greater than 30mm.

5. The tamper-evident LED light module of claim 1, wherein, the pins of the LED chip are electrically connected to the first electrode and the second electrode through gold wire bonding, or are electrically connected to the first electrode and the second electrode through soldering by flip-chip.

6. The tamper-evident LED light module of claim 1, wherein, the substrate is a three-layer composite structure comprising an insulating and heat-conducting layer, a metal substrate layer and a surface treatment layer.

7. The tamper-evident LED light module of claim 1, wherein, the first electrode, the second electrode and the loop feed antenna are formed on the substrate by printing or etching process.

8. The tamper-evident LED light module of claim 1, wherein, the RFID chip works in the ultra-high frequency band.

9. The tamper-evident LED light module of claim 1, wherein, ​

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