Variable-frequency circuit board heat dissipation structure
By combining a heat sink and a fan on the inverter circuit board to form a heat dissipation channel, the problem of untimely heat dissipation of high-heat components in the electrical box is solved, achieving a more efficient heat dissipation effect and adaptability to dusty environments.
Patent Information
- Application Number
- CN202422691644.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-05
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2034-11-05
AI Technical Summary
The fans in conventional electrical boxes are not cooling enough, which leads to the inability to dissipate heat from high-heat components in a timely manner, and precision electronic components are easily damaged by dust contamination in dusty environments.
The inverter circuit board is combined with a heat sink. The heat sink has heat dissipation strips and holes. The inverter part extends into the holes and, together with the cooling fan, blows air upward to form a heat dissipation channel, increasing the contact area and heat dissipation efficiency.
It improves the heat dissipation effect of the frequency converter, avoids damage caused by insufficient heat dissipation, and adapts to the heat dissipation requirements of dusty environments.
Smart Images

Figure CN223816260U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a variable frequency circuit board heat dissipation structure. BACKGROUND
[0002] In industrial production, the conventional electric box adopts sheet metal outer package, and the internal fan heat dissipation is such conventional structure. INNOVATION CONTENT
[0003] The utility model provides a variable frequency circuit board heat dissipation structure, including variable frequency circuit board and heat dissipation plate, be provided with a plurality of heat dissipation strips and heat dissipation hole on the heat dissipation plate, the heat dissipation hole penetrates heat dissipation plate before and after, the heat dissipation hole is located between heat dissipation strip, a plurality of heat dissipation strips are spaced apart and integrally formed, the variable frequency circuit board is provided with frequency converter, the frequency converter part penetrates heat dissipation hole, one side surface of variable frequency circuit board is pasted with heat dissipation plate.
[0004] In one or more embodiments, the heat dissipation plate is also provided with a bottom plate, which is pasted with the variable frequency circuit board.
[0005] In one or more embodiments, the heat dissipation plate is vertically arranged, and a heat dissipation fan is arranged at the bottom of the heat dissipation plate.
[0006] In one or more embodiments, a space is arranged between the two adjacent heat dissipation strips, the space forms a heat dissipation air duct, and the heat dissipation fan blows air upward and through the heat dissipation air duct to carry away the heat of the frequency converter and the heat of the heat dissipation plate.
[0007] The utility model has the advantages that the heating element of the frequency converter is directly installed on the heat dissipation aluminum plate, the heat dissipation effect is obtained, the variable frequency circuit board and the heat dissipation aluminum plate are installed and pressed flat to improve the contact area and improve the heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS
[0008] Fig. 1 It is partial section schematic view of variable frequency circuit board heat dissipation structure.
[0009] Fig. 2 It is side surface schematic view of variable frequency circuit board heat dissipation structure installation in electric box. DETAILED DESCRIPTION
[0010] The application scheme is further described as follows in combination with the drawings:
[0011] Referring to the drawings Figs. 1-2The utility model provides a variable frequency circuit board heat dissipation structure, including variable frequency circuit board 3 and heat dissipation plate 2, heat dissipation plate 2 is heat dissipation aluminum plate, be provided with a plurality of heat dissipation strips 21 and heat dissipation hole 22 on heat dissipation plate 2, heat dissipation hole 22 penetrates heat dissipation plate 2 before and after, heat dissipation hole 22 is located between heat dissipation strip 21, a plurality of heat dissipation strips 21 interval arrangement and integrated, variable frequency circuit board 3 is provided with frequency converter 31, and frequency converter 31 partially enters heat dissipation hole 22, and one side of variable frequency circuit board 3 is pasted with heat dissipation plate 2.
[0012] Further, the heat dissipation plate 2 is also provided with a bottom plate 23, and the bottom plate 23 is pasted with the variable frequency circuit board 3.
[0013] Further, the heat dissipation plate 2 is vertically arranged, and a heat dissipation fan 4 is arranged at the bottom of the heat dissipation plate 2.
[0014] Further, a gap is arranged between the two adjacent heat dissipation strips 21, and the gap forms a heat dissipation air duct, and the heat dissipation fan 4 blows air upward and passes through the heat dissipation air duct to carry away the heat of the frequency converter 31 and the heat of the heat dissipation plate 2.
[0015] In the description of the utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, structure and operation, and therefore cannot be understood as limiting the utility model.
[0016] In addition, the terms "first" and "second" are only for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise explicitly specified.
[0017] In the utility model, unless another definite provision and limitation, the terms "mount", "link", "connect", "fix" and so on should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or be integrated;Can be mechanical connection, also can be electrical connection;Can be direct connection, also can pass through intermediate medium indirectly connect, can be two element internal communication or two element's mutual action relation, unless another definite limitation.For the ordinary skilled person in the art, can understand the specific meaning of the above terms in the utility model according to specific circumstances.
[0018] In the utility model, unless another definite provision and limitation, the terms "mount", "link", "connect", "fix" and so on should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or be integrated;Can be mechanical connection, also can be electrical connection;Can be direct connection, also can pass through intermediate medium indirectly connect, can be two element internal communication or two element's mutual action relation, unless another definite limitation.For the ordinary skilled person in the art, can understand the specific meaning of the above terms in the utility model according to specific circumstances.
[0019] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms is not necessarily for the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, the skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of different embodiments or examples without contradiction.
[0020] The above preferred embodiments should be regarded as the illustration of the embodiment of the present application, and any technical deduction, replacement, improvement and the like made similarly, approximately or based on the present application should be regarded as the protection scope of the present patent.
Claims
1. A variable frequency circuit board heat dissipation structure, characterized in that, Including variable frequency circuit board and heat dissipation plate, the heat dissipation plate is provided with a plurality of heat dissipation strips and heat dissipation holes, the heat dissipation holes are through the front and back of the heat dissipation plate, the heat dissipation holes are located between the heat dissipation strips, a plurality of heat dissipation strips are spaced and integrally formed, the variable frequency circuit board is provided with a frequency converter, the frequency converter is partially inserted into the heat dissipation hole, and one side of the variable frequency circuit board is attached to the heat dissipation plate.
2. The variable frequency circuit board heat dissipation structure of claim 1, wherein, The heat dissipation plate is also provided with a bottom plate, and the bottom plate is attached to the variable frequency circuit board.
3. The variable frequency circuit board heat dissipation structure of claim 1, wherein, The heat dissipation plate is vertically arranged, and a heat dissipation fan is arranged at the bottom of the heat dissipation plate.
4. The variable frequency circuit board heat dissipation structure of claim 3, wherein, An interval is arranged between two adjacent heat dissipation strips, the interval forms a heat dissipation air duct, and the heat dissipation fan blows air upward and through the heat dissipation air duct to carry away the heat of the frequency converter and the heat of the heat dissipation plate.