Printed circuit board and test system

Abstract

The utility model discloses a printed circuit board and a test system, and the printed circuit board is characterized in that a plurality of connecting pieces and a plurality of test contacts are arranged in the printed circuit board, and each connecting piece penetrates through the printed circuit board and is used for respectively connecting a test mainboard and a tested object which are arranged at two opposite sides of the printed circuit board; one or more resistors are arranged on the surface of one side, close to the tested object, of the printed circuit board, and each resistor is connected with the corresponding test contact and the connecting piece; the side, close to the measured object, of the printed circuit board is provided with an avoiding space, and the resistor is arranged in the avoiding space so that the resistor and the measured object can be arranged in a spaced mode. Through the structure, the resistor is arranged between each pair of test contacts and the connecting piece to match impedance and reduce signal reflection, so that the quality of a signal to be tested is improved, stable and reliable measurement data is obtained, and the test accuracy is improved.

Description

TECHNICAL FIELD

[0001] The utility model is applied to the technical field of device testing, in particular to printed circuit board and test system. BACKGROUND

[0002] PCB (Printed Circuit Board), Chinese name is printed circuit board, also called printed wiring board, is an important electronic component, is the support of electronic components, is the carrier of electrical interconnection of electronic components.

[0003] Printed circuit board can be used as a device testing adapter, as a test mainboard and the connecting bridge between the measured device, in order to lead out the transmission signal between the test mainboard and the measured device through the printed circuit board, and then test.

[0004] But due to the adapter setting of printed circuit board, it is easy to bring impedance mismatch, signal reflection and other influences to the test, resulting in inaccurate test. UTILITY MODEL CONTENT

[0005] The utility model provides printed circuit board and test system to solve the problem of inaccurate test.

[0006] In order to solve the above technical problem, the utility model provides a printed circuit board, which comprises: a plurality of connecting pieces and a plurality of test contacts are arranged in the printed circuit board, each connecting piece penetrates the printed circuit board, and is used for connecting a test mainboard and a measured object on opposite sides of the printed circuit board respectively;One or more resistors are arranged on the surface of the side of the printed circuit board close to the measured object, and each resistor is connected with the corresponding test contact and connecting piece;Wherein, the side of the printed circuit board close to the measured object is provided with a avoiding space, and the resistor is arranged in the avoiding space to be spaced apart from the measured object.

[0007] The printed circuit board comprises a first plate piece and a second plate piece arranged in a laminated and adhered manner;The side of the first plate piece away from the second plate piece is used for connecting with the test mainboard, and the side of the second plate piece away from the first plate piece is used for connecting with the measured object;The resistor is arranged on the side of the first plate piece close to the second plate piece, and the second plate piece is formed with a hollow region, and the hollow region corresponds to the position of the resistor to form the avoiding space.

[0008] The first plate piece is provided with a plurality of first connecting pieces on the middle region, and the second plate piece is provided with a plurality of second connecting pieces, the size of the second plate piece is the same as that of the middle region, and the second plate piece is arranged in a adhered manner with the middle region, so that the first connecting piece is connected with the corresponding second connecting piece to form the connecting piece;The plurality of test contacts are arranged on the edge region of the first plate piece.

[0009] The avoiding space and the plurality of connecting pieces are arranged in the middle region.

[0010] The thickness of the first plate ranges from 0.5 to 1.5 mm; and / or the thickness of the second plate ranges from 0.5 to 1.0 mm.

[0011] The printed circuit board is provided with a recess on the side surface close to the measured object, and the recess is recessed to form an avoiding space; and the resistor is mounted in the recess.

[0012] The thickness of the recess ranges from 0.5 to 1.0 mm.

[0013] The resistor comprises a patch resistor.

[0014] To solve the above technical problems, the utility model provides a kind of test system comprising: test mainboard, printed circuit board and measured object, printed circuit board is fixedly connected with one side of test mainboard, and printed circuit board is provided with one or more resistors on the side surface away from test mainboard;Printed circuit board includes the printed circuit board of any one of the above, and measured object is fixedly connected with the side of printed circuit board away from test mainboard;Wherein, printed circuit board is provided with avoiding space, and resistor is arranged in avoiding space to be arranged apart from measured object.

[0015] The printed circuit board is provided with a plurality of connecting pieces, and one end of each connecting piece is connected with a corresponding pad on the test mainboard; the other end of each connecting piece is connected with a corresponding pin on the measured object.

[0016] The utility model has the advantages that: unlike the prior art, the printed circuit board of the utility model is provided with a plurality of connecting pieces and a plurality of test contacts, each connecting piece penetrates the printed circuit board to connect the test mainboard and the measured object on the opposite sides of the printed circuit board respectively; one or more resistors are arranged on the side surface of the printed circuit board close to the measured object, and each resistor is connected with a corresponding test contact and connecting piece to match the impedance by arranging a resistor between each pair of test contacts and connecting pieces, thereby reducing signal reflection, improving the quality of the to-be-tested signal, obtaining stable and reliable measurement data, and improving test accuracy. The side of the printed circuit board close to the measured object is provided with an avoiding space, and the resistor is arranged in the avoiding space to be arranged apart from the measured object, thereby preventing position conflict between the measured object and the resistor, achieving balanced impedance function of the resistor, and being compatible with the measured object and the resistor arranged on the side of the printed circuit board close to the measured object. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is the explosion structure schematic diagram of the embodiment of the printed circuit board provided by the utility model;

[0018] Figure 2Is another embodiment of the printed circuit board provided by the utility model structural schematic diagram.

[0019] Figure 3 Is the structure schematic diagram of the test system one embodiment provided by the utility model. Specific implementation

[0020] The technical scheme in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0021] It should be noted that if the embodiments of the utility model involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between the components in a certain specific posture (as shown in the drawings), if the specific posture changes, the directional indications also change accordingly.

[0022] In addition, if the embodiments of the utility model involve descriptions of "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one feature. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the utility model.

[0023] Please refer to Figure 1 , Figure 1 Is the explosion structure schematic diagram of the printed circuit board one embodiment provided by the utility model.

[0024] The printed circuit board 100 is used to be arranged between the test mainboard and the measured object, to connect the test mainboard and the measured object respectively, realize the connection and signal transmission between the two, and then facilitate the signal test.

[0025] The printed circuit board 100 is provided with a plurality of connecting pieces 130 and a plurality of test contacts 140. Each connecting piece 130 penetrates the printed circuit board 100 to connect a test mainboard and a measured object on opposite sides of the printed circuit board 100, respectively. The specific number and position of the connecting pieces 130 are set according to the number of signal pins on the measured object to realize one-to-one conversion with corresponding pads on the test mainboard.

[0026] The connecting pieces 130 of the embodiment can include, but are not limited to, metalized holes, metal bases, or connecting lines, etc. to realize the connection between the measured object and the test mainboard. The test contacts 140 can include, but are not limited to, metalized holes, metalized half-holes, metal bases, or pads, etc. to realize the connection between the test contacts 140, the connecting pieces 130, and the resistors 150. The printed circuit board 100 can be a multi-layer circuit board or a single-layer circuit board, and the specific structure is set according to actual needs, which is not limited here.

[0027] The printed circuit board 100 is provided with a plurality of connecting pieces 130 and a plurality of test contacts 140. Each connecting piece 130 penetrates the printed circuit board 100 to connect a test mainboard and a measured object on opposite sides of the printed circuit board 100, respectively. The specific number and position of the connecting pieces 130 are set according to the number of signal pins on the measured object to realize one-to-one conversion with corresponding pads on the test mainboard.

[0028] The test contacts 140 are connected to the corresponding connecting pieces 130 to lead out the signals of the corresponding connecting pieces 130, so that the oscilloscope probe detects the signal transmission by contacting the test contacts 140. At least part of the connecting pieces 130 are connected to the corresponding test contacts 140 for testing, and the number and object of the specific connection are set according to the type of the corresponding signal pins, which is not limited here.

[0029] The printed circuit board 100 is provided with a plurality of connecting pieces 130 and a plurality of test contacts 140. Each connecting piece 130 penetrates the printed circuit board 100 to connect a test mainboard and a measured object on opposite sides of the printed circuit board 100, respectively. The specific number and position of the connecting pieces 130 are set according to the number of signal pins on the measured object to realize one-to-one conversion with corresponding pads on the test mainboard.

[0030] The printed circuit board 100 is provided with a plurality of connecting pieces 130 and a plurality of test contacts 140. Each connecting piece 130 penetrates the printed circuit board 100 to connect a test mainboard and a measured object on opposite sides of the printed circuit board 100, respectively. The specific number and position of the connecting pieces 130 are set according to the number of signal pins on the measured object to realize one-to-one conversion with corresponding pads on the test mainboard.

[0031] In a specific application scenario, the avoidance space 160 can be provided by recessing or elevating the printed circuit board 100, or by hollowing, etc. The specific implementation is not limited here.

[0032] Through the above structure, the printed circuit board of the embodiment is internally provided with a plurality of connecting pieces and a plurality of test contacts, each connecting piece penetrates the printed circuit board to connect a test mainboard and a measured object on opposite sides of the printed circuit board respectively; one or more resistors are arranged on the surface of the side of the printed circuit board close to the measured object, and each resistor is connected with the corresponding test contact and connecting piece, so that the impedance is matched by arranging a resistor between each pair of test contacts and connecting pieces, the signal reflection is reduced, the quality of the to-be-tested signal is improved, the stable and reliable measurement data is obtained, and the test accuracy is improved. The side of the printed circuit board close to the measured object is provided with an avoidance space, and the resistor is arranged in the avoidance space to be spaced apart from the measured object, so as to prevent the positional conflict between the measured object and the resistor, so that the balanced impedance function of the resistor can be realized, and the measured object and the resistor can be simultaneously arranged on the side of the printed circuit board close to the measured object.

[0033] In other embodiments, the printed circuit board 100 includes a first board piece 110 and a second board piece 120 which are laminated and attached; the side of the first board piece 110 away from the second board piece 120 is used to connect with a test mainboard, and the side of the second board piece 120 away from the first board piece 110 is used to connect with a measured object. That is, when the measured object is tested, the measured object, the second board piece 120, the first board piece 110 and the test mainboard are laminated and attached in sequence. The first board piece 110 and the second board piece 120 are both PCB board pieces.

[0034] The resistor 150 is arranged on the side of the first board piece 110 close to the second board piece 120, and the second board piece 120 is formed with a hollow region 170 corresponding to the position of the resistor 150 to form an avoidance space 160.

[0035] The above structure forms the avoidance space 160 accommodating the resistor 150 by elevating the second board piece 120 and arranging the hollow region 170 on the second board piece 120, and the avoidance space 160 is built-in the second board piece 120, so that the resistor 150 does not contact the measured object, thereby avoiding the positional conflict between the resistor 150 and the measured object, and simultaneously compatible with the resistor 150 and the measured object being located on the side of the printed circuit board 100 away from the test mainboard, so that the balanced impedance function of the resistor 150 can be realized, and the measured object and the resistor 150 can be simultaneously arranged on the side of the printed circuit board 100 close to the measured object. The elevation of the second board piece 120 also ensures the stable connection of the measured object and the connecting piece 130, and improves the connection stability.

[0036] In some embodiments, the first plate member 110 is provided with a plurality of first connecting members 111 on the middle region 113, and the second plate member 120 is provided with a plurality of second connecting members 121, the size of the second plate member 120 is the same as that of the middle region 113, and the second plate member 120 is arranged to be attached to the middle region 113, so that the first connecting members 111 and the corresponding second connecting members 121 are accurately matched and connected to form the connecting member 130.

[0037] The number and position of each second connecting member 121 on the second plate member 120 are the same as those of each first connecting member 111 on the first plate member, and when the second plate member 120 is arranged to be attached to the middle region 113, each corresponding second connecting member 121 is connected to the first connecting member 111, which can be fixed by welding or conductive glue bonding.

[0038] A plurality of test contacts 140 are arranged on the edge region 114 of the first plate member 110, and the second plate member 120 is only arranged to be attached to the middle region 113, so that the test contacts 140 are avoided from the second plate member 120, thereby facilitating the contact of the oscilloscope to the test contacts 140.

[0039] The number of test contacts 140 is the same as that of resistors 150, and each resistor 150 is used to balance the impedance between the corresponding test contact 140 and the connecting member 130, thereby improving the transmission stability of the signal on the test circuit and improving the test accuracy.

[0040] In a specific application scenario, if there are 4 connecting members 130 to be tested, 4 resistors 150 are arranged in the avoidance space 160, and 4 test contacts 140 are arranged on the edge region 114, each test contact 140 is connected to the corresponding resistor 150 and connecting member 130 through the conductive circuit in the printed circuit board 100 in sequence, thereby realizing the signal test of the connecting member 130.

[0041] In a specific application scenario, if there are 9 connecting members 130 to be tested, 9 resistors 150 are arranged in the avoidance space 160, and 9 test contacts 140 are arranged on the edge region 114, each test contact 140 is connected to the corresponding resistor 150 and connecting member 130 through the conductive circuit in the printed circuit board 100 in sequence, thereby realizing the signal test of the connecting member 130.

[0042] In some embodiments, in the intermediate region 113, the avoidance space 160 is spaced apart from the plurality of connectors 130, and the resistor 150 is spaced apart from the plurality of connectors 130 in position by spacing the avoidance space 160 apart from the plurality of connectors 130, and the resistor 150 to be connected and the corresponding connector 130 are connected through the wiring in the printed circuit board 100.

[0043] In some embodiments, the thickness of the first plate 110 ranges from 0.5 to 1.5 mm, and can be 0.5 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.2 mm, 1.4 mm or 1.5 mm, etc.; and / or the thickness of the second plate 120 ranges from 0.5 to 1.0 mm, and can be 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm or 1.0 mm, etc.

[0044] In the above range, the thinner the plate thickness, the shorter the transmission path of the connector 130, which can reduce signal transmission loss and improve signal transmission integrity and reliability. The plate thickness in the above range can improve signal transmission integrity and reliability, and also improve plate rigidity to maintain the structural stability of the printed circuit board.

[0045] Through the above structure, the first plate and the second plate are arranged in a stacked and attached manner, the second plate is raised, and the hollow region is arranged on the second plate to form the avoidance space for accommodating the resistor. The avoidance space is built in the second plate, so that the resistor does not contact the measured object, thereby avoiding the position conflict between the resistor and the measured object. The resistor and the measured object are both located on the side of the printed circuit board away from the test mainboard, which can realize the balanced impedance function of the resistor and also can be compatible with the measured object and the resistor arranged on the side of the printed circuit board close to the measured object. The raised arrangement of the second plate can also ensure the stable connection of the measured object and the connector and improve the connection stability.

[0046] Please refer to Figure 2 , Figure 2 is a structural schematic diagram of another embodiment of the printed circuit board provided by the utility model.

[0047] The printed circuit board 200 of the embodiment is provided with a recess 260 on the side surface close to the measured object, and the recess 260 is recessed to form an avoidance space 270; wherein the resistor 250 is installed in the recess 260.

[0048] The groove 260 is formed on the surface of the printed circuit board 200 close to the measured object, thereby forming the avoiding space 270 containing the resistor 250 through the groove 260, the avoiding space 270 is built in the printed circuit board 200, so that the resistor 250 does not contact the measured object, thereby avoiding the position conflict between the resistor 250 and the measured object, to simultaneously compatible with the resistor 250 and the measured object being located on the side of the printed circuit board 200 away from the test mainboard, which can realize the balanced impedance function of the resistor 250, and can also compatible with the measured object and the resistor 250 being arranged on the side of the printed circuit board 200 close to the measured object. And the other positions of the side of the printed circuit board 200 close to the measured object can contact the measured object, thereby ensuring the stable connection between the measured object and the connecting piece 211, and improving the connection stability.

[0049] In some embodiments, the thickness of the groove 260 ranges from 0.5 to 1.0 millimeters. Specifically, it can be 0.5 millimeters, 0.6 millimeters, 0.7 millimeters, 0.8 millimeters, 0.9 millimeters or 1.0 millimeter, etc.

[0050] The groove 260 within the above thickness range can prevent the resistor 250 inside from contacting the measured object, thereby realizing the compatibility of the resistor 250 and the measured object.

[0051] In some embodiments, a plurality of connecting pieces 211 are arranged on the middle region 213 of the printed circuit board 200, and each connecting piece 211 penetrates the printed circuit board 200 to connect the test mainboard and the measured object on the opposite sides of the printed circuit board 200, respectively.

[0052] A plurality of test contacts 240 are arranged on the edge region 214 of the printed circuit board 200, and each test contact 240 is connected with a corresponding connecting piece 211 to lead out the signal of the corresponding connecting piece 211, so that the oscilloscope probe detects the signal transmission by contacting the test contact 240. At least part of the connecting pieces 211 are connected with the corresponding test contacts 240 one by one for testing, and the number and object of the specific connection are set based on the type of the corresponding signal pin, which is not limited here.

[0053] Through the above structure, the groove is arranged on the surface of the printed circuit board close to the measured object, and the avoiding space is formed in the groove. The resistor is installed in the groove, so that the resistor does not contact the measured object, thereby avoiding the position conflict between the resistor and the measured object, to simultaneously compatible with the resistor and the measured object being located on the side of the printed circuit board away from the test mainboard, which can realize the balanced impedance function of the resistor, and can also compatible with the measured object and the resistor being arranged on the side of the printed circuit board close to the measured object.

[0054] Since the resistor of the embodiment can be arranged on the surface of the printed circuit board, the resistor in any of the above embodiments can be a surface mount resistor device, that is, an independent resistor device. Compared with an embedded deposition resistor, the surface mount resistor device of the embodiment has high flexibility when mounted on the surface of the printed circuit board close to the measured object on one side, and can replace the surface mount resistor with the required resistance value according to the requirements, and the resistance value accuracy and tolerance are easy to control. The surface mount resistor has strong market circulation, does not need to be specially prepared and customized, has low cost and high accuracy. The repair and replacement materials are simple. The wiring design of the conductive circuit in the printed circuit board is simple. The surface mount resistor has high mechanical strength, high accuracy and low assembly cost, and can be matched with automatic assembly equipment.

[0055] Please refer to Figure 3 , Figure 3 is a structural schematic diagram of an embodiment of the test system provided by the utility model.

[0056] The test system 300 of the embodiment includes a test mainboard 330, a printed circuit board 320 and a measured object 310. The test mainboard 330 includes but is not limited to a memory stick or other functional mainboard with a test function. The measured object 310 includes but is not limited to electronic devices such as a storage grain and a chip. The test system 300 can be used for SI (Signal Integrity) test or other types of test, which is not limited here.

[0057] The printed circuit board 320 is fixedly connected to one side of the test mainboard 330, and the measured object 310 is fixedly connected to the side of the printed circuit board 320 away from the test mainboard 330.

[0058] The surface of the side of the printed circuit board 320 away from the test mainboard 330 is provided with one or more resistors 311; the printed circuit board 320 includes the printed circuit board of any of the above embodiments, including the printed circuit board 100 and the printed circuit board 200.

[0059] The printed circuit board 320 is provided with a relief space 312, and the resistor 311 is arranged in the relief space 312 to be spaced apart from the measured object 310. Thus, the position contradiction between the measured object 310 and the resistor 311 is prevented, and the balanced impedance function of the resistor 311 is realized, and the measured object 310 and the resistor 311 can be simultaneously arranged on the side of the printed circuit board 320 close to the measured object 310.

[0060] And because the resistor 311 is arranged on the side surface of the printed circuit board 320 away from the test mainboard 330, a SMD resistor device, namely an independent resistor device, can be used, so that the flexibility is high when the resistor 311 is installed on the side surface of the printed circuit board 320 close to the measured object 310, the required resistance value of the surface-mounted resistor can be replaced according to the requirement, the resistance value precision and tolerance are easy to control. The surface-mounted resistor has strong market circulation, does not need to be specially prepared and customized, has low cost and high precision. The repair and replacement materials are simple. The wiring design of the conductive circuit in the printed circuit board is simple. The SMD resistor has high mechanical strength, high precision and low assembly cost, and can be matched with automatic assembly equipment.

[0061] In some embodiments, a plurality of connecting pieces 321 are arranged in the printed circuit board 320. One end of each connecting piece 321 is connected to a corresponding pad 331 on the test mainboard 330, and one end of each connecting piece 321 is connected to a corresponding pin 313 on the measured object 310, so as to realize the connection between the test mainboard 330 and the corresponding signals of the measured object 310. The specific connection mode can be welding or conductive glue bonding, which is not limited here.

[0062] The packaging form of the measured object 310 of the embodiment includes but is not limited to DIP (Dual In-line Package), QFP (Quad Flat Package), BGA (Ball Grid Array), LGA (Land Grid Array), QFN (Quad Flat No-lead), SOP (Small Outline Package) and the like.

[0063] Through the above structure, the test system of the embodiment sets a resistor on the side surface of the printed circuit board close to the measured object, and the resistor is connected to the corresponding test contact and connecting piece, so as to match the impedance by setting the resistor between each pair of test contact and connecting piece, reduce the signal reflection, improve the quality of the to-be-tested signal, obtain stable and reliable measurement data, and improve the test accuracy. The side surface of the printed circuit board close to the measured object is provided with a clearance space, and the resistor is arranged in the clearance space to be spaced apart from the measured object, so as to prevent the position conflict between the measured object and the resistor, so that the balanced impedance function of the resistor can be realized, and the measured object and the resistor can be compatible with each other and arranged on the side surface of the printed circuit board close to the measured object.

[0064] The above is only an embodiment of the present application, and does not limit the patent range of the present application, and any equivalent structure or equivalent process transformation using the content of the present application specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection range of the present application.

Claims

1. A printed circuit board, characterized in that, The printed circuit board is provided with multiple connectors and multiple test contacts. Each connector passes through the printed circuit board and is used to connect the test motherboard and the object under test on opposite sides of the printed circuit board, respectively. One or more resistors are provided on the surface of the printed circuit board near the object under test, and the resistors are respectively connected to the corresponding test contacts and connectors. The printed circuit board has a clearance space on the side closest to the object under test, and the resistor is disposed within the clearance space at an interval from the object under test.

2. The printed circuit board according to claim 1, characterized in that, The printed circuit board includes a first board and a second board that are stacked and attached together; the side of the first board away from the second board is used to connect to the test motherboard, and the side of the second board away from the first board is used to connect to the object under test. The resistor is disposed on the side of the first plate near the second plate. A hollow area is formed on the second plate, and the hollow area corresponds to the position of the resistor to form the clearance space.

3. The printed circuit board according to claim 2, characterized in that, The first plate has a plurality of first connectors in the middle area, and the second plate has a plurality of second connectors. The second plate has the same size as the middle area and is fitted to the middle area so that the first connectors are connected to the corresponding second connectors to form the connectors. Multiple test contacts are disposed on the edge region of the first plate.

4. The printed circuit board according to claim 3, characterized in that, Within the intermediate region, the clearance space is spaced apart from the plurality of connectors.

5. The printed circuit board according to any one of claims 2-4, characterized in that, The thickness of the first plate is in the range of 0.5-1.5 mm; and / or The thickness of the second plate ranges from 0.5 to 1.0 mm.

6. The printed circuit board according to claim 1, characterized in that, A groove is provided on the surface of the printed circuit board near the object under test, and the groove is recessed to form the clearance space; wherein, the resistor is installed in the groove.

7. The printed circuit board according to claim 6, characterized in that, The thickness of the groove ranges from 0.5 to 1.0 mm.

8. The printed circuit board according to claim 1, characterized in that, The resistors include surface mount resistors.

9. A testing system, characterized in that, The testing system includes: Test motherboard; A printed circuit board, wherein the printed circuit board is fixedly connected to one side of the test motherboard, and one or more resistors are disposed on the surface of the printed circuit board away from the test motherboard; the printed circuit board includes the printed circuit board according to any one of claims 1-8. The object under test is fixedly connected to the side of the printed circuit board away from the test motherboard; The printed circuit board has a clearance space, and the resistor is disposed within the clearance space at an interval from the object being tested.

10. The testing system according to claim 9, characterized in that, The printed circuit board is provided with multiple connectors, one end of each connector is connected to a corresponding pad on the test motherboard, and the other end of each connector is connected to a corresponding pin on the object under test.

Images