Film laminating structure and circuit board

Abstract

The utility model discloses a film laminating and pressing structure and a circuit board, and the film laminating and pressing structure comprises a substrate, the surface of which is provided with holes; the two stack-up structures are symmetrically arranged on the two sides of the substrate, and each stack-up structure comprises a barrier film, a three-in-one release film, a pressure buffering film and a heat conducting plate which are sequentially stacked on the substrate. According to the flexible-rigid combined board manufacturing method, by symmetrically arranging the stacked structures comprising the barrier films, the three-in-one release films, the pressure buffering films and the heat conduction plates on the two sides of the substrate, the common hole plugging problem during flexible-rigid combined board manufacturing in the traditional technology is solved, for example, the two release films are used as the barrier films and the pressure buffering films respectively, and the manufacturing cost is reduced. Wherein the barrier film is used for preventing a three-in-one release film material from being extruded into a hole in a substrate, and the pressure relieving film plays a role in relieving extrusion, so that the situation that an auxiliary material enters the hole due to uneven or overlarge pressure in the pressing process is effectively prevented, the cleanliness of the hole of the substrate is ensured, electrical faults possibly caused by the cleanliness are avoided, and the service life of the substrate is prolonged. And meanwhile, the appearance quality and the overall performance of the product are greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board manufacturing, particularly to a laminating and pressing structure and a circuit board with the laminating and pressing structure. BACKGROUND

[0002] In the modern electronic manufacturing field, rigid-flex PCB (Printed Circuit Board) is widely used in various high-end electronic products as a kind of integrated rigid and flexible circuit characteristic. This kind of circuit board not only requires high-density wiring capability, but also needs good mechanical flexibility and electrical performance. In order to meet these needs, the outer surface usually needs to be laminated with a film during the manufacturing process to protect the internal circuit from oxidation, corrosion and other environmental factors.

[0003] In the traditional laminating and pressing process, a layer of covering film is first laminated on the outer surface of the rigid-flex PCB, and then the covering film is tightly combined with the substrate by using a pressing machine. However, in this process, due to the pressure on the pressing auxiliary material, part of the material is often extruded into the small holes in the non-laminated area, forming an abnormal "plug hole" phenomenon. This plug hole problem not only affects the appearance quality of the product, but more importantly, it may cause unstable signal transmission or short circuit and other electrical faults, seriously affecting the performance and reliability of the product.

[0004] The existing solutions in the current market are mostly focused on optimizing pressing parameters or improving the material quality of the covering film, but these methods can only alleviate the plug hole problem to a certain extent and cannot fundamentally solve the problem. In addition, with the development of electronic products towards miniaturization and high performance, the quality requirements for rigid-flex PCB are also getting higher and higher, which makes the plug hole problem in the traditional process a bottleneck restricting its application. UTILITY MODEL CONTENTS

[0005] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a laminating and pressing structure, introduces a barrier film and a pressure relief film, effectively prevents the plug hole problem caused by the extrusion of auxiliary materials into the substrate holes during the pressing process, ensures the cleanliness of the holes, improves the appearance quality and electrical performance of the product, not only improves the production efficiency and the qualified rate of finished products, but also reduces the product scrap rate caused by plug hole, significantly enhances the reliability and market competitiveness of the product.

[0006] The utility model also proposes a circuit board with the above-mentioned laminating and pressing structure.

[0007] According to the laminating and pressing structure of the utility model, the laminating and pressing structure comprises:

[0008] a substrate, the surface of the substrate has a hole;

[0009] Two stacked groups are symmetrically arranged on two sides of the substrate, and the stacked group comprises a barrier film, a three-in-one release film, a pressure relief film and a heat conducting plate which are sequentially stacked with the substrate.

[0010] The film laminating and pressing structure has at least the following beneficial effects: by symmetrically arranging the stacked group containing the barrier film, the three-in-one release film, the pressure relief film and the heat conducting plate on both sides of the substrate, the common hole plugging problem in the production of the soft and hard combination board in the traditional process is fundamentally solved, for example, two release films are used as the barrier film and the pressure relief film respectively, the barrier film is used to block the three-in-one release film material from being extruded into the hole on the substrate, and the pressure relief film plays a role in slowing down the extrusion, effectively preventing the auxiliary material from entering the hole due to uneven or excessive pressure in the pressing process, thereby not only ensuring the cleanliness of the substrate hole and avoiding possible electrical faults, but also greatly improving the appearance quality and overall performance of the product; in addition, this method also significantly improves the stability and efficiency in the production process, reduces the product scrap rate caused by the hole plugging problem, thereby reducing the production cost and improving the economic benefit.

[0011] According to some embodiments of the utility model, the substrate is a combination board.

[0012] According to some embodiments of the utility model, the substrate is a soft and hard combination board.

[0013] According to some embodiments of the utility model, the substrate is provided with multiple circuit layers, and the hole is used to connect the signals of different circuit layers.

[0014] According to some embodiments of the utility model, the hole can be plugged into resin.

[0015] According to some embodiments of the utility model, the barrier film is a common release film.

[0016] According to some embodiments of the utility model, the pressure relief film is a common release film.

[0017] According to some embodiments of the utility model, the heat conducting plate is a steel plate.

[0018] The circuit board comprises the film laminating and pressing structure.

[0019] The utility model discloses a circuit board has at least the following beneficial effects: through the integration of barrier membrane, three in one release film, slow pressure membrane and heat conduction plate etc.

[0020] Additional aspects and advantages of the utility model will be in part given in the following description, part will become obvious from the following description, or be understood through the practice of the utility model. BRIEF DESCRIPTION OF DRAWINGS

[0021] The above and / or additional aspects and advantages of the utility model will become apparent and more readily appreciated from the following description of the embodiments, with reference to the following drawings, in which:

[0022] Figure 1 The utility model discloses a structure schematic diagram of the film laminating and pressing structure of the embodiment.

[0023] DESCRIPTION OF DRAWINGS

[0024] The substrate 100;

[0025] The utility model discloses a structure schematic diagram of the film laminating and pressing structure of the embodiment. DETAILED DESCRIPTION

[0026] The embodiments of the utility model are described in detail below, and the examples of the embodiments are shown in the drawings, wherein the same or similar signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, only for explaining the utility model, and can not be understood as the limitation of the utility model.

[0027] In the description of the utility model, it is understood that the direction description, such as the direction or positional relation indicated by up, down, front, back, left, right etc., is the direction or positional relation based on the drawing shown, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as the limitation of the utility model.

[0028] In the description of the utility model, the meaning of several is one or more, and the meaning of multiple is more than two, and greater than, less than, more than etc.

[0029] In the description of the utility model, unless otherwise explicitly limited, the words such as setting, installing and connecting should be understood in a broad sense, and the person skilled in the art can reasonably determine the specific meaning of the above words in the utility model according to the specific content of the technical scheme.

[0030] In the description of the utility model, the description of the reference terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the utility model.

[0031] In the modern electronic manufacturing field, the rigid-flex PCB (Rigid-Flex PCB) as a kind of integrated rigid and flexible circuit characteristic printed circuit board is widely used in various high-end electronic products. Such circuit board not only requires high-density wiring capability, but also needs to have good mechanical flexibility and electrical performance. In order to meet these needs, usually need to carry out covering film bonding treatment to outer surface in the production process, to protect the internal circuit from oxidation, corrosion and other environmental factors.

[0032] In the traditional laminating and pressing process, a cover film is first attached to the outer surface of the soft and hard combination board, and then the cover film is tightly combined with the substrate by using a press. However, in this process, due to the pressure on the pressing auxiliary material, part of the material is often extruded into the small hole in the non-attached area, forming an abnormal "plug hole" phenomenon. This plug hole problem not only affects the appearance quality of the product, but more importantly, it can cause unstable signal transmission or electrical faults such as short circuit, seriously affecting the performance and reliability of the product.

[0033] The existing solutions in the current market are mainly focused on optimizing the pressing parameters or improving the cover film material, but these methods can only alleviate the plug hole problem to a certain extent and cannot fundamentally solve the problem. In addition, as electronic products are developing towards miniaturization and high performance, the quality requirements for soft and hard combination boards are becoming higher and higher, which makes the plug hole problem in the traditional process a bottleneck restricting its application.

[0034] For example, in some existing pressing and stacking applications, three-in-one release film, kraft paper and steel plate are stacked on one side of the product, and three-in-one release film, kraft paper and steel plate are also symmetrically stacked on the other side (not shown in the figure). However, during the pressing process, part of the material is often extruded into the small hole in the non-attached area, forming an abnormal "plug hole" phenomenon.

[0035] Therefore, as shown in Figure 1 The laminating and pressing structure of the present application comprises a substrate 100 and two symmetrically arranged stacking groups 200 on both sides of the substrate 100. The surface of the substrate 100 has a hole, and the stacking group 200 comprises a barrier film 210, a three-in-one release film 220, a pressure relief film 230 and a heat conducting plate 240, which are stacked in order on the substrate 100. It should be noted that by symmetrically arranging the stacking group 200 containing the barrier film 210, the three-in-one release film 220, the pressure relief film 230 and the heat conducting plate 240 on both sides of the substrate 100, the common plug hole problem in the traditional process of making soft and hard combination boards is fundamentally solved. For example, two release films are used as the barrier film 210 and the pressure relief film 230, respectively. The barrier film 210 is used to block the three-in-one release film 220 material from being extruded into the hole on the substrate 100, and the pressure relief film 230 plays a role in slowing down the extrusion, effectively preventing the auxiliary material from entering the hole due to uneven or excessive pressure during the pressing process. In this way, not only is the cleanliness of the hole in the substrate 100 guaranteed, but also the electrical faults that may be caused by this are avoided, and the appearance quality and overall performance of the product are greatly improved. In addition, this method also significantly improves the stability and efficiency of the production process, reduces the product scrap rate caused by the plug hole problem, thereby reducing the production cost and improving the economic benefit.

[0036] Optionally, the substrate 100 is a bonding plate. By using the bonding plate as the substrate 100, it can ensure that the transition between different materials and functional areas is smoother, while ensuring the stability and reliability of the overall structure. For this reason, it is not only suitable for general printed circuit boards, but also particularly suitable for complex structures with rigid and flexible parts combined, improving the performance of the rigid-flexible board in actual application, especially in situations that require high-density wiring and complex mechanical forms. Further, the substrate 100 is a rigid-flexible board. It should be noted that the rigid-flexible board plays a crucial role in modern electronic devices due to its unique combination of flexibility and rigidity. By adopting the technical solution, the common hole plugging problem in the lamination and pressing process can be effectively solved without compromising the original characteristics of the rigid-flexible board. As a result, it not only maintains the flexibility and durability of the rigid-flexible board, but also improves its electrical performance and appearance quality, meeting the dual needs of high-end electronic products for high performance and aesthetics. In addition, the substrate 100 is provided with multiple layers of circuit layers, and the holes are used to connect the signals of different circuit layers. Further, it allows efficient transmission of current or signals between multiple layers, enhancing the overall connectivity and functionality of the circuit. By adopting the technical solution, not only can the problem of unstable signal transmission caused by hole plugging in traditional processes be avoided, but also the integrity and accuracy of signal transmission between layers can be ensured. This is particularly important for high-end electronic products that require high-speed data processing and complex signal routing, greatly improving the reliability and market competitiveness of the product. Specifically, the holes can be plugged with resin, which is to further protect the internal circuit from the external environment. By filling resin in the holes, not only can the mechanical strength of the circuit board be enhanced, but also its waterproof, dustproof and other protection performance can be improved. Combined with the lamination and pressing technology provided in the present application, the cleanliness of the holes can be ensured when filling resin, preventing impurities from entering and affecting subsequent operations. As a result, it not only guarantees the functional integrity of the circuit board, but also prolongs its service life, especially for electronic products working in harsh environments.

[0037] Optionally, based on cost-effectiveness and practicality considerations, the barrier film 210 is a common release film, which can significantly improve product quality and production efficiency without increasing additional costs, and is an economical and efficient solution. It is easy to understand that the common release film is not only easy to obtain, but also reduces production costs while ensuring good barrier effect. In application, the common release film as the barrier film 210 can effectively prevent the three-in-one release film 220 material from extruding into the substrate 100 hole, solving the problem of abnormal hole plugging, while not affecting the smooth progress of the entire film laminating and pressing process. Similarly, in some embodiments of the present application, the slow-pressing film 230 also selects a common release film, which aims to protect the substrate 100 hole from extrusion damage by slowing down the pressure transmission. The common release film as the slow-pressing film 230 can uniformly distribute the pressure during the pressing process, reducing the pressure concentration on the substrate 100 hole, thereby avoiding the possible abnormal hole plugging phenomenon. In addition, using a common release film as the slow-pressing film 230 also simplifies the production process, reduces the operation difficulty, and helps to improve the stability and consistency of production.

[0038] Optionally, in some embodiments of the present application, the heat-conducting plate 240 is a steel plate, which has excellent heat-conducting performance and sufficient mechanical strength. During the film laminating and pressing process, the steel plate can quickly and uniformly distribute heat to the entire surface of the substrate 100, ensuring that the film is tightly combined with the substrate 100 while reducing the risk of material deformation or damage caused by local overheating. For this reason, using a steel plate as the heat-conducting plate 240 not only improves the quality of film laminating and pressing, but also enhances the stability of the entire structure, ensuring that the product can perform excellent performance under various working conditions.

[0039] According to the circuit board of the present application, the film laminating and pressing structure is integrated with the barrier film 210, the three-in-one release film 220, the slow-pressing film 230, and the heat-conducting plate 240, which not only prevents auxiliary materials from extruding into the substrate 100 hole during the pressing process, ensuring the cleanliness of the hole and the reliability of signal transmission, but also greatly improves the appearance quality and electrical performance of the product. The barrier film 210 effectively prevents the three-in-one release film 220 material from entering the hole, avoiding possible electrical faults, and the slow-pressing film 230 plays a role in uniformly dispersing pressure during the pressing process, protecting the substrate 100 from local high-pressure damage. In addition, the application of the heat-conducting plate 240 ensures uniform heat distribution during the entire pressing process, improving the adhesion quality between the film and the substrate 100, and further enhancing the stability and durability of the final product. By using this designed circuit board, the product yield is improved, and the product scrap rate caused by hole plugging is significantly reduced, thereby reducing production costs and improving economic benefits. The present application provides a more reliable and efficient solution for the electronic manufacturing field, and has a wide application prospect and market competitiveness.

[0040] Other configurations and operations of the circuit board according to the embodiments of the present application are known to those skilled in the art, and will not be described in detail herein.

[0041] The embodiments of the present application are described in detail above with reference to the drawings, but the present application is not limited to the above-described embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present application.

Claims

1. A film-laminated structure, characterized by comprising: The application relates to a laminated structure comprising: a substrate having a surface with a hole; two laminated groups symmetrically arranged on two sides of the substrate, each laminated group comprising, in sequence, a barrier film, a three-in-one release film, a pressure relief film and a heat-conducting plate.

2. The film-coated structure according to claim 1, characterized in that: The substrate is a bonded plate.

3. The film-coated structure according to claim 2, wherein: The substrate is a rigid-flex bonded plate.

4. The coated structure according to any one of claims 1 to 3, wherein: The substrate is provided with multiple circuit layers, and the hole is used for signal communication between different circuit layers.

5. The film-coated structure according to claim 4, wherein: The hole can be filled with resin.

6. The film-coated structure according to claim 1, wherein: The barrier film is a common release film.

7. The film-coated structure according to claim 1, wherein: The pressure relief film is a common release film.

8. The film-coated structure according to claim 1, wherein: The heat-conducting plate is a steel plate.

9. A circuit board, characterized by: The application further relates to a laminated structure as claimed in any one of claims 1 to 8.

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