Chip membrane expansion separation device
By combining a sliding module mechanism and a heating ring pin mechanism in the chip expansion and separation device, the problems of low space utilization and long positioning time in the prior art are solved, and efficient chip separation and improved integration are achieved.
Patent Information
- Application Number
- CN202520209030.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2035-02-10
AI Technical Summary
Existing chip expansion and separation devices have a high center of gravity and overall height due to the slender structure of the chip ejector mechanism and the superposition of a one-dimensional motion module, resulting in low space utilization, long positioning time, and low output.
The first and second sliding module mechanisms set on the support platform, combined with the chip ejector mechanism, enable the wafer to move horizontally in the XY plane, reduce the height of the mechanism and the center of gravity, and improve the separation efficiency through the heating ring and ejector mechanism.
It improves space utilization and stability, reduces positioning time, increases production efficiency, and enhances the integration of the chip expansion and separation device into the die bonding machine.
Smart Images
Figure CN223816390U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chip separation technical field, concretely relates to a chip film expanding separation device. BACKGROUND
[0002] In the chip processing process, the chip needs to be peeled from the blue film. In the prior art, the chip separation process is that the wafer adhered to the blue film is subjected to laser slicing or grinding wheel cutting process, so that it is pre-separated into a plurality of micro-connected crystal grains (i.e. chips), then the blue film is stretched by the film expanding separation mechanism to expand the spacing between the crystal grains and reduce the contact area between the crystal grains and the blue film, then the wafer chucking mechanism is used to adsorb the blue film area under the chip to be taken, so that the adhesion of the blue film area is reduced, then the ejector pin in the ejector pin cap is extended to lift the corresponding chip, and the chip is taken away by the suction cup.
[0003] The chip film expanding separation device is generally integrated in a die bonder (also known as a chip mounter) device. The existing chip film expanding separation device usually stacks a one-dimensional (e.g. X-axis direction) motion module under the chip ejector pin mechanism, and stacks another one-dimensional vertical motion module (e.g. Y-axis direction) on the film expanding ring, thereby achieving the ejection of all crystal grain chips on the wafer plane. Since the chip ejector pin mechanism is of an elongated structure, and a one-dimensional motion module is stacked below, the motion center of gravity of the one-dimensional motion module is high, and the overall height is also high, resulting in low space utilization and long positioning time for each positioning to achieve the set accuracy, thereby reducing the unit per hour (UPH). UTILITY MODEL CONTENTS
[0004] The utility model aims at solving the above problems, and provides a chip film expanding separation device.
[0005] The utility model adopts the following technical scheme to achieve the above purpose, comprising:
[0006] A bearing table is provided with a first sliding module mechanism symmetrically arranged on both sides of the upper part, and a chip ejector pin mechanism is arranged in the middle part of the bearing table.
[0007] A second sliding module mechanism is symmetrically arranged on the first sliding module mechanism, and a wafer to be processed is placed on the second sliding module mechanism.
[0008] As a further description of the above technical scheme, the first sliding module mechanism comprises a first sliding rail, and a first sliding table is detachably installed on the first sliding rail.
[0009] As a further description of the above technical scheme, a first carrier table is installed on the first sliding table, and a first fixing seat is symmetrically arranged on the outer side of the first carrier table.
[0010] As a further description of the above technical solution, a first detection platform is symmetrically arranged on the outer side of the first slide rail, and a first sensor is symmetrically arranged on the first detection platform.
[0011] As a further description of the above technical solution, the second sliding module mechanism includes a second slide rail, on which a second slide table is detachably mounted.
[0012] As a further description of the above technical solution, a second detection platform is symmetrically arranged on the outer side of the second slide rail, and a second sensor is symmetrically arranged on the second detection platform.
[0013] As a further description of the above technical solution, a second platform is installed on the second slide, and a second fixed seat is symmetrically arranged on the outer side of the second platform.
[0014] As a further description of the above technical solution, a support plate is installed in the middle of the second fixing base, an expansion ring is installed in the middle of the support plate, and a wafer is placed on the expansion ring.
[0015] As a further description of the above technical solution, the chip ejector mechanism includes a base, a support seat is installed at the top of the base, a first rotating rod and a second rotating rod are installed on both sides inside the support seat, a first synchronous pulley is installed on the first rotating rod through a bearing, a second synchronous pulley is installed on the second rotating rod through a bearing, the first synchronous pulley and the second synchronous pulley are connected by a synchronous belt drive, the first rotating rod is rotatably connected to a motor, and a cam is coaxially installed on the second synchronous pulley, the top of the cam is in contact with a roller at the bottom of the ejector pin.
[0016] As a further description of the above technical solution, a connecting ring is installed on the top of the support base, a heating ring is provided above the connecting ring, a pin cap is provided on the top of the heating ring, the middle of the push rod passes through the connecting ring and the heating ring, a spring is provided in the middle of the push rod, the bottom of the push rod is rotatably connected to the roller, and a pin is inserted parallel to the top of the push rod.
[0017] The beneficial effects of this utility model are as follows:
[0018] The chip ejector mechanism is fixed in the middle of the support platform. The expansion ring with the wafer is placed on it and moves horizontally in the XY plane by superimposing the first sliding module mechanism and the second sliding module mechanism. The overall height and center of gravity of the mechanism are low, which improves space utilization and stability while effectively reducing the setting time. The chip expansion separation device can be integrated into the die bonder (also known as a chip mounter) equipment.
[0019] In order to make the structure features and effects of the present application more clear, the present application will be described in detail below with the help of the drawings and specific embodiments. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1 is a structural schematic diagram of a chip film expansion separation device in the prior art;
[0021] Figure 2 is a front view of a chip film expansion separation device in the prior art;
[0022] Figure 3 is a top view of a chip film expansion separation device in the prior art;
[0023] Figure 4 is a structural schematic diagram of a chip film expansion separation device of the present application;
[0024] Figure 5 is a front view of a chip film expansion separation device of the present application;
[0025] Figure 6 is a top view of a chip film expansion separation device of the present application;
[0026] Figure 7 is a structural schematic diagram of a chip needle mechanism in the present application. Figure 4
[0027] REFERENCE SIGNS:
[0028] 1, bearing table; 2, first sliding module mechanism; 21, first sliding rail; 22, first sliding table; 23, first bearing table; 24, first fixed seat; 25, first detection table; 26, first sensor; 3, second sliding module mechanism; 31, second sliding rail; 32, second sliding table; 33, second bearing table; 34, second fixed seat; 35, second detection table; 36, second sensor; 4, chip needle mechanism; 41, base; 42, support seat; 43, first rotating rod; 44, second rotating rod; 45, first synchronous wheel; 46, second synchronous wheel; 47, synchronous belt; 48, motor; 49, cam; 410, jacking rod; 411, roller; 412, connecting ring; 413, heating ring; 414, needle cap; 415, spring; 416, needle; 5, wafer; 6, support plate; 7, film expansion ring. DETAILED DESCRIPTION
[0029] In order to make the structure features and effects of the present application more clear, the present application will be described in detail below with the help of the drawings and specific embodiments.
[0030] The chip film expansion separation device provided by the embodiment of the present application solves the problem of low space utilization rate and low output per hour in the prior art due to the fact that the chip needle mechanism is of an elongated structure, and a one-dimensional motion module is further stacked below the chip needle mechanism, so that the motion center of gravity of the one-dimensional motion module is relatively high, and the overall height is also relatively high, resulting in low space utilization rate, and a relatively long time is required for positioning each time to achieve the set accuracy, so that the output per hour is relatively low. The chip needle mechanism is fixed in the middle of the bearing table, and the film expansion ring in which the wafer is placed is moved horizontally on the XY plane by stacking the first sliding module mechanism and the second sliding module mechanism, so that the overall height and the center of gravity of the mechanism are relatively low, the space utilization rate and stability are improved, the setting time is effectively reduced, and the chip film expansion separation device can be integrated in a die bonder (also known as a chip mounter) device.
[0031] As shown in Figures 1-7 In one embodiment, a chip film expansion separation device includes: a bearing table 1, first sliding module mechanisms 2 are symmetrically arranged on both sides of the upper part of the bearing table 1, and a chip needle mechanism 4 is arranged in the middle of the bearing table 1.
[0032] Second sliding module mechanisms 3 are symmetrically arranged on the first sliding module mechanisms 2, and a wafer 5 to be processed is placed on the second sliding module mechanisms 3.
[0033] Please continue to refer to Figures 4-7 In this embodiment, the first sliding module mechanisms 2 include first sliding rails 21, and first sliding platforms 22 are detachably installed on the first sliding rails 21. First bearing tables 23 are installed on the first sliding platforms 22, so that the second sliding module mechanisms 3 installed above the first bearing tables 23 can reciprocate (for example, in the X-axis direction) on the first sliding rails 21 through the first sliding platforms 22.
[0034] Further, first fixing seats 24 are symmetrically arranged on the outside of the first bearing tables 23, first detection tables 25 are symmetrically arranged on the outside of the first sliding rails 21, and first sensors 26 are symmetrically arranged on the first detection tables 25. When the second sliding module mechanisms 3 reciprocate, the first sensors 26 can detect the motion stroke.
[0035] Please continue to refer to Figures 4-7 In this embodiment, the second sliding module mechanisms 3 include second sliding rails 31, and second sliding platforms 32 are detachably installed on the second sliding rails 31. Second bearing tables 33 are installed on the second sliding platforms 32, so that the film expansion rings 7 installed above the second bearing tables 33 can reciprocate (for example, in the Y-axis direction) on the second sliding rails 31 through the second sliding platforms 32.
[0036] Further, the second fixed seat 34 is symmetrically arranged outside the second sliding rail 31, and the second detection table 35 is symmetrically arranged outside the second sliding rail 31, and the second sensor 36 is symmetrically arranged on the second detection table 35, so that the movement stroke of the film expanding ring 7 can be detected by the second sensor 36 when the film expanding ring 7 reciprocates.
[0037] Further, the support plate 6 is installed in the middle of the second fixed seat 34, and the film expanding ring 7 is installed in the middle of the support plate 6, and the wafer 5 to be processed is placed on the film expanding ring 7.
[0038] It can be understood that the chip needle mechanism 4 is fixed in the middle of the bearing table 1, and the film expanding ring 7 on which the wafer 5 is placed is moved horizontally on the XY plane by the first sliding module mechanism 2 and the second sliding module mechanism 3 arranged in a stack. The overall structure of the mechanism is low in height, and the gravity center is designed reasonably, which not only effectively improves the space utilization of the equipment, but also enhances the stability, avoids the influence of vibration or deviation on the working precision; at the same time, the design of low gravity center reduces the motion inertia of the equipment, so that the setting and debugging time is greatly shortened, and the production efficiency is improved.
[0039] Please continue to refer to Figures 4-7 In this embodiment, the chip needle mechanism 4 includes a base 41, wherein the base 41 is provided with a support seat 42 at the top end, and a transmission mechanism is installed on the support seat 42 for driving the lifting of the top rod 410, so as to drive the needle 416 on the top rod 410 to pierce the blue film and facilitate the separation of the processed chip;
[0040] The support seat 42 is provided with a connecting ring 412 at the top, and a heating ring 413 is arranged above the connecting ring 412, which can be connected with an external heating device (such as a heat conducting wire) to heat the top rod 410 and the needle 416, so that the blue film is more easily broken, thereby improving the separation efficiency;
[0041] The heating ring 413 is provided with a needle cap 414 at the top, and a plurality of expansion holes are formed in the needle cap 414 for the needle 416 to extend and retract, and the needle cap 414 is in contact with the lower end surface of the blue film before separation, and then the needle 416 extends out of the expansion hole and contacts and pierces the blue film.
[0042] Further, the first rotating rod 43 and the second rotating rod 44 are installed on both sides of the support seat 42, wherein the first rotating rod 43 is provided with a first synchronous wheel 45 through a bearing, and the second rotating rod 44 is provided with a second synchronous wheel 46 through a bearing, and the first synchronous wheel 45 and the second synchronous wheel 46 are drivingly connected through a synchronous belt 47, and the first rotating rod 43 is drivingly connected with a motor 48, so that when the motor 48 rotates, the first synchronous wheel 45 can be driven to rotate through the first rotating rod 43, and the second synchronous wheel 46 can be driven to rotate through the synchronous belt 47.
[0043] Meanwhile, the second synchronous wheel 46 is coaxially provided with a cam 49, and the roller 411 at the bottom of the cam 49 is in contact with the top rod 410, so that the cam 49 is rotated synchronously with the second synchronous wheel 46, and the roller 411 at the bottom of the top rod 410 is rotated synchronously and pushes the top rod 410 to rise axially.
[0044] Further, the top rod 410 is provided with the spring 415 at the middle part, so that the top rod 410 can rebound quickly when it is lowered, and the top needle 416 rebounds quickly.
[0045] Working principle:
[0046] Firstly, the first sliding table 22 is driven to slide on the first guide rail by the motor 48 or the cylinder, and then the first carrier table 23 is driven to move, and the movement stroke is detected by the first sensor 26, and the first carrier table 23 stops moving when it reaches the position; subsequently, the second sliding table 32 is driven to slide on the second guide rail by the motor 48 or the cylinder, and then the second carrier table 33 is driven to move, and the movement stroke is detected by the second sensor 36, and the second carrier table 33 stops moving when it reaches the position.
[0047] The top needle cap 414 and the blue film are attached and the blue film is heated, so that the adhesion of the blue film is reduced, then the motor 48 is started, the first synchronous wheel 45 is rotated by the first rotating rod 43, the second synchronous wheel 46 is rotated by the synchronous belt 47, the cam 49 is rotated synchronously with the second synchronous wheel 46, the roller 411 at the bottom of the top rod 410 is rotated synchronously and pushes the top rod 410 to rise axially, then the top needle 416 extends out of the telescopic hole and contacts the blue film and pierces the blue film to lift the chip, then the chip to be processed is sucked by the suction cup on the upper side and separated from the blue film.
[0048] The above description of the disclosed embodiments enables a person skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A chip extension film separation device, characterized by, Include: The bearing table (1) upper two sides symmetrically provided with first sliding module mechanism (2), the bearing table (1) middle part is provided with chip needle mechanism (4); The first sliding module mechanism (2) is symmetrically provided with second sliding module mechanism (3) on the upper, the second sliding module mechanism (3) is placed with the wafer (5) to be processed.
2. The chip expansion membrane separation device according to claim 1, characterized in that, The first sliding module mechanism (2) includes first slide rail (21), and the first slide rail (21) is detachably installed with first sliding table (22).
3. The chip expansion membrane separation device according to claim 2, characterized in that, The first sliding table (22) is installed with first carrier (23), and the first carrier (23) is symmetrically provided with first fixed seat (24) outside.
4. The chip expansion membrane separation device according to claim 2, wherein, The first slide rail (21) is symmetrically provided with first detection table (25) outside, and the first detection table (25) is symmetrically provided with first sensor (26) on the upper.
5. The chip expansion membrane separation device of claim 1, wherein, The second sliding module mechanism (3) includes second slide rail (31), and the second slide rail (31) is detachably installed with second sliding table (32).
6. The chip expansion film separation apparatus according to claim 5, wherein The second slide rail (31) is symmetrically provided with second detection table (35) outside, and the second detection table (35) is symmetrically provided with second sensor (36) on the upper.
7. The chip expansion film separation device according to claim 5, wherein, The second sliding table (32) is installed with second carrier (33), and the second carrier (33) is symmetrically provided with second fixed seat (34) outside.
8. The chip expansion membrane separation device of claim 7, wherein, The second fixed seat (34) is installed with support plate (6) in the middle part, the support plate (6) is installed with film expansion ring (7) in the middle part, and the wafer (5) is placed on the film expansion ring (7).
9. The chip expansion membrane separation device of claim 1, wherein, The chip needle mechanism (4) includes base (41), and the base (41) top end is installed with support seat (42), and the support seat (42) is internally installed with first rotating rod (43) and second rotating rod (44) on both sides, the first rotating rod (43) is installed with first synchronous wheel (45) through bearing, the second rotating rod (44) is installed with second synchronous wheel (46) through bearing, the first synchronous wheel (45) and second synchronous wheel (46) are drivenly connected through synchronous belt (47), the first rotating rod (43) and motor (48) are rotatably connected, the second synchronous wheel (46) is coaxially installed with cam (49), and the cam (49) top and roller (411) bottom of top rod (410) are in contact.
10. The chip expansion film separation apparatus according to claim 9, wherein The support seat (42) top is installed with connecting ring (412), and the connecting ring (412) is provided with heating ring (413) above, the heating ring (413) top is provided with needle cap (414), the top rod (410) is penetrated through the connecting ring (412) and the heating ring (413), the top rod (410) is provided with spring (415) in the middle part, and the top rod (410) bottom and roller (411) are rotatably connected, and the top rod (410) top is inserted with needle (416) in parallel.