Device for reducing optical interference of chip

Abstract

The utility model discloses a device for reducing optical interference of a chip. A three-axis electric displacement platform is arranged in a framework of the equipment, an electric sucker is arranged at the bottom of the three-axis electric displacement platform, feeding and discharging windows are respectively arranged on two sides of the three-axis electric displacement platform, a feeding bracket and a finished product bracket are correspondingly arranged on the inner wall of the three-axis electric displacement platform, a chip clamp is arranged at the top of the bracket, a piezoelectric micro sprayer and a spraying frame are further arranged in the framework, and a black silicon storage bin is arranged at the top and connected with the sprayer through a conveying pipe. During working, the three-axis electric displacement platform transfers a chip, the metering pump accurately controls the conveying amount of a black silicon material, the array type piezoelectric micro spray head with the adjustable spray head diameter performs uniform spraying, and the optical sensor monitors the spraying condition in real time. The equipment effectively overcomes the defects of a traditional method, not only can accurately and efficiently reduce the optical interference of the chip and improve the performance and quality of the chip, but also has relatively high practical value and market prospect due to reasonable structural design and convenience in operation, observation and maintenance.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip processing technical field especially relates to reduce chip optical interference equipment. BACKGROUND

[0002] In today's digital age, chips are widely used in various electronic products, from smartphones, computers to automotive electronic systems, industrial control equipment, etc., and their performance directly affects the overall performance of the equipment. With the continuous progress of technology, chips are developing towards smaller size, higher performance and integration, which makes the requirements for optical performance of chips more stringent.

[0003] On the one hand, the refinement of chip manufacturing process makes the optical elements inside the chip more dense, and the propagation path of light in the chip becomes complex, which is prone to optical interference phenomena such as reflection and scattering. On the other hand, external light such as sunlight and indoor lighting may also affect the chip and interfere with its normal photoelectric signal conversion and processing process. For example, in some optical imaging chips, optical interference can cause image noise and blurring, seriously affecting the imaging quality; in optical communication chips, it can cause signal attenuation and increase the error rate, hindering efficient data transmission.

[0004] Current solutions to chip optical interference have obvious shortcomings. Some technologies use a method of adding light-shielding structures around the chip, but this method not only increases the complexity and cost of chip packaging, but also may affect the heat dissipation and electrical performance of the chip due to unreasonable structure design. Some others use traditional optical coating technology to reduce reflection, but the material and process of coating limit its adaptability to different frequency light, making it difficult to solve the problem of optical interference in all directions. Therefore, it is urgent to develop a new and efficient chip optical interference reduction device, aiming to overcome the drawbacks of existing methods with more scientific design and innovative technology, and improve the optical performance and stability of the chip. SUMMARY

[0005] The utility model discloses a chip optical interference reduction device to solve the shortcomings in the prior art.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0007] The application discloses a device for reducing optical interference of chips, which comprises a frame, a three-axis electric displacement platform arranged in the frame, an electric chuck arranged at the bottom of the three-axis electric displacement platform, an inlet window and an outlet window arranged at the two sides of the frame respectively, a finished product bracket arranged on the inner wall of the frame and close to the outlet window, a feeding bracket arranged on the inner wall of the frame and close to the inlet window, a chip clamp arranged on the top of the feeding bracket and the finished product bracket, a piezoelectric micro-nozzle arranged in the frame, wherein the piezoelectric micro-nozzles are arranged in an array, a black silicon storage bin arranged on the top of the frame, a feeding pipe arranged at the bottom of the black silicon storage bin, and a spraying frame arranged in the frame and used for placing the chips.

[0008] Preferably, the piezoelectric micro-nozzles are provided with optical sensors.

[0009] Preferably, an observation window is arranged on one side of the front end of the frame.

[0010] Further, the feeding pipe is connected with a metering pump.

[0011] Still further, the diameter of the piezoelectric micro-nozzles (11) can be adjusted in the range of 5-50 microns.

[0012] The device for reducing optical interference of chips has the advantages that:

[0013] 1. The device for reducing optical interference of chips can accurately transfer the chips through the three-axis electric displacement platform, accurately control the delivery amount of the black silicon material through the metering pump, uniformly spray through the piezoelectric micro-nozzles which are arranged in an array and have adjustable diameters, and realize real-time monitoring through the optical sensors, so that the spraying effect of the chips is good, the optical interference is effectively reduced, the performance and quality of the chips are improved, the device has a reasonable structure, is convenient to operate, observe and maintain, and the problems of increasing packaging complexity, cost and affecting heat dissipation and electrical performance in the traditional method are overcome through the optimized design.

[0014] The above description is only a summary of the technical scheme of the device for reducing optical interference of chips, and the device can be implemented according to the content of the specification, so that the above and other purposes, characteristics and advantages of the device can be more obvious and easy to understand. The preferred embodiments are described in detail below, and the accompanying drawings are referred to for illustration. DETAILED DESCRIPTION

[0015] Fig. 1 It is an external perspective structure diagram of the device for reducing optical interference of chips.

[0016] Fig. 2 It is an internal front view structure diagram of the device for reducing optical interference of chips.

[0017] Fig. 3The utility model provides a reduce chip optical interference equipment's internal side view structure schematic diagram.

[0018] Fig. 4 The utility model provides a reduce chip optical interference equipment's internal three -dimensional structure schematic diagram.

[0019] In the drawing: 1, frame, 2, three -axis electric displacement platform, 3, electric suction cup, 4, feed window, 5, discharge window, 6, finished product bracket, 7, loading bracket, 8, chip clamp, 9, spraying frame, 10, observation window, 11, piezoelectric micro -spray head, 12, optical sensor, 13, feed pipe, 14, metering pump, 15, black silicon storage bin. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model and not all the embodiments.

[0021] Embodiment 1, refer to Figs. 1 to 4 The utility model relates to a kind of reduce chip optical interference equipment, the technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model and not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without making creative labor are within the scope of the utility model protection.

[0022] Equipment structure overview

[0023] The reduce chip optical interference equipment mainly includes frame 1, three-axis electric displacement platform 2, piezoelectric micro -spray head 11, spraying frame 9 etc. component are arranged in frame 1, frame 1 both sides are equipped with feed window 4 and discharge window 5, the inner wall of frame 1 is equipped with finished product bracket 6 near discharge window 5 side, is equipped with loading bracket 7 near feed window 4 side, frame 1 top is equipped with black silicon storage bin 15.

[0024] Specific implementation steps

[0025] 1. loading preparation

[0026] First, the chip needing to reduce optical interference is placed in the chip clamp 8 on the top of loading bracket 7. Chip clamp 8 can firmly fix chip, prevent chip from shifting or shaking in subsequent operation process, ensure the accuracy and stability of spraying process. Operator can conveniently carry out chip placing operation through feed window 4.

[0027] 2. equipment start and chip transfer

[0028] The equipment is started, and the three-axis electric displacement platform 2 begins operation. The three-axis electric displacement platform 2 can move and position precisely in three mutually perpendicular directions, with its bottom electro-suction cup 3 generating suction force when energized. The three-axis electric displacement platform 2 moves to the loading tray 7, where the electro-suction cup 3 picks up the chip from the chip holder 8, and then, according to a preset program and path, transfers the chip to the coating rack 9. The coating rack 9 also provides stable support for the chip, ensuring its positional accuracy during the coating process.

[0029] 3. Black silicon material conveying

[0030] The black silicon storage chamber 15 is pre-stored with black silicon material to reduce optical interference on the chip. When the equipment is started, the black silicon material is conveyed downwards through the feed pipe 13. The metering pump 14 connected to the feed pipe 13 plays a crucial role, precisely controlling the flow rate and pressure of the black silicon material to ensure that the amount of black silicon material delivered to the piezoelectric micro-nozzle 11 meets process requirements. By adjusting the parameters of the metering pump 14, the required amount of black silicon material for different chips can be accommodated.

[0031] 4. Chip coating operation

[0032] The piezoelectric micro-nozzles 11 are arranged in an array of several, which expands the coverage area of ​​the coating and improves the coating efficiency and uniformity. After the black silicon material is transported to the piezoelectric micro-nozzles 11 through the feed tube 13, the piezoelectric micro-nozzles 11 operate using the piezoelectric effect. When an electrical signal is applied to the piezoelectric micro-nozzles 11, the piezoelectric material deforms, generating a pressure change, thereby ejecting the black silicon material in the form of tiny droplets.

[0033] The nozzle diameter of the piezoelectric micro-nozzle 11 is adjustable from 5 to 50 μm. Operators can adjust the nozzle diameter through the equipment's control system according to factors such as the specific size and shape of the chip and the required spraying precision. For example, for smaller chips with higher precision requirements, the nozzle diameter can be reduced; for larger chips with higher requirements for spraying uniformity, the nozzle diameter can be appropriately increased.

[0034] During the spraying process, an optical sensor 12 on one side of the piezoelectric micro-sprayer 11 monitors the spraying status in real time. The optical sensor 12 can detect parameters such as the thickness and uniformity of the spray, and feed the detected information back to the equipment's control system. If uneven spray thickness or thickness that does not meet requirements is detected, the control system can adjust the operating parameters of the piezoelectric micro-sprayer 11 in a timely manner, such as the spraying frequency and spraying pressure, to ensure the spraying quality.

[0035] 5. Observation and monitoring

[0036] During the whole spraying process, the operator can observe the working condition inside the equipment through the observation window 10 opened on the front end side of the frame 1. The observation window 10 is made of transparent material with certain strength and protection performance, which can not only ensure the operator to clearly see the spraying process of the chip, but also prevent the dust and liquid inside the equipment from leaking out. The operator can observe the spraying state of the chip and the running condition of each part of the equipment in real time, and once the abnormal condition such as clogging of the spray head or displacement of the chip is found, the corresponding measures can be taken for processing in time.

[0037] 6. Finished product discharging

[0038] When the chip completes the spraying operation, the three-axis electric displacement platform 2 works again to adsorb and transfer the sprayed chip from the spraying frame 9 to the chip clamp 8 on the top of the finished product bracket 6. The finished product bracket 6 is used for temporarily storing the chip which has completed the process of reducing optical interference, and the operator can take the finished product chip from the equipment through the discharging window 5 for subsequent detection, packaging and other processes.

[0039] Equipment maintenance and care

[0040] In order to ensure the normal operation of the equipment and prolong the service life of the equipment, the equipment needs to be maintained and cared regularly. For example, the black silicon storage bin 15 is cleaned regularly to prevent the black silicon material from caking or deteriorating in the storage bin; whether the material conveying pipe 13 is blocked or leaked is checked, and if there is a problem, it is cleaned or replaced in time; the three-axis electric displacement platform 2, the piezoelectric micro-spray head 11 and other moving parts are lubricated and calibrated to ensure their movement accuracy and working stability.

[0041] In summary, the chip optical interference reduction equipment can efficiently and accurately spray the black silicon material on the chip, effectively reduce the optical interference of the chip and improve the performance and quality of the chip through reasonable structural design and accurate control.

[0042] The above only describes the preferred embodiments of the present application, and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0043] The above only describes the preferred embodiments of the present application, and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A device for reducing optical interference of a chip, comprising a frame (1), characterized in that, The frame (1) is internally provided with a three-axis electric displacement platform (2), the bottom of the three-axis electric displacement platform (2) is provided with an electric suction disc (3), both sides of the frame (1) are respectively provided with an inlet window (4) and an outlet window (5), the inner wall of the frame (1) is provided with a finished product bracket (6) near the outlet window (5), the inner wall of the frame (1) is provided with a feeding bracket (7) near the inlet window (4), the top of the feeding bracket (7) and the finished product bracket (6) is respectively provided with a chip clamp (8) for placing a chip, the frame (1) is internally provided with a piezoelectric micro-nozzle (11), the piezoelectric micro-nozzle (11) is placed in an array of a plurality of numbers, the top of the frame (1) is provided with a black silicon storage bin (15), the bottom of the black silicon storage bin (15) is provided with a conveying pipe (13), the output end of the conveying pipe (13) is connected with the piezoelectric micro-nozzle (11), the frame (1) is further internally provided with a spraying bracket (9) for placing a chip.

2. The reduced chip optical interference device of claim 1, wherein, The piezoelectric micro-nozzle (11) is provided with an optical sensor (12) on one side.

3. The reduced chip optical interference device of claim 1, wherein, The frame (1) is provided with an observation window (10) on one side of the front end.

4. The reduced-chip optical interference device of claim 1, wherein, The conveying pipe (13) is connected with a metering pump (14).

5. The reduced-chip optical interference device of claim 4, wherein, The nozzle diameter of the piezoelectric micro-nozzle (11) can be adjusted in the range of 5-50 microns.

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