Transfer device for wafer drying

Abstract

The utility model relates to the field of semiconductor transfer, in particular to a transfer device for wafer drying, which is provided with a horizontal supporting table, and a first transfer support and a second transfer support are arranged at the upper end of the horizontal supporting table. A guide rail and a guide block are mounted at the lower end of the horizontal supporting table, the guide rail is in sliding fit with the guide block, and a limiting block is arranged at the front end of the guide rail; wherein a vertical push rod is arranged above the horizontal supporting table, and the vertical push rod is connected with the guide rail through an L-shaped connecting rod; the vertical push rod can be driven to move leftwards through the movement of the guide rail, and the wafer located in the first transfer support is pushed into the second transfer support. According to the device, through combination of the guide rail sliding block assembly and the vertical push rod, rapid and accurate transfer of a wafer from a plastic support to a metal support can be achieved, then through limiting of the lever assembly, the transfer support II can be transferred only after being placed at a designated position, and the safety and stability of the wafer in the transfer process are ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor transfer process field, concretely relates to a transfer device for wafer drying. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor circuit, and its raw material is silicon. High-purity polysilicon is dissolved and added into silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer.

[0003] Before formal processing, the wafer usually goes through a series of wet cleaning or dry cleaning steps. Wet cleaning mainly uses chemical solution to remove impurities and pollutants on the wafer surface, while dry cleaning mainly uses physical methods such as plasma or laser to remove impurities. These cleaning steps aim to ensure that the wafer surface is as clean as possible and no impurities are left.

[0004] After cleaning, some cleaning solution or moisture may remain on the wafer surface. In order to remove these residues, the wafer will go through a rinsing step, usually using deionized water for rinsing. After rinsing, the wafer will go through a drying step, using high temperature to evaporate the moisture on the surface.

[0005] Traditional wafer transfer methods often rely on manual operation, which not only has low efficiency, but also easily introduces pollutants during the transfer process, affecting the quality of the wafer. In addition, the plastic support may cause the wafer to shift or be damaged due to thermal expansion during the drying process, thereby affecting the subsequent semiconductor manufacturing process. UTILITY MODEL CONTENT

[0006] The utility model aims to provide a transfer device for wafer drying, aiming to overcome the defects of the prior art and solve the problem of low efficiency of manual operation and possible thermal expansion of plastic supports during the drying process.

[0007] To this end, the utility model provides a transfer device for wafer drying, which has a horizontal support table, the horizontal support table upper end places transfer support one and transfer support two; the horizontal support table lower end is installed with guide rail and guide block, the guide rail and the guide block slide fit, and the guide rail front end is provided with limit block; wherein, the horizontal support table upper side sets up vertical push rod, the vertical push rod passes through L shape connecting rod and is connected with the guide rail; through the movement of the guide rail, the vertical push rod can be driven to move left, the wafer in the transfer support one is pushed to the transfer support two, and the transfer process is completed.

[0008] As a preferred technical scheme of the present application, the lower end of the horizontal support table is further provided with a lever assembly, which comprises a lever, a center support block and a top pin located at the left end of the lever; the center support block is arranged on the lever close to the top pin, and in the natural state, the lower left end of the lever is upturned and the top pin protrudes from the upper surface of the horizontal support table, and the right lower end of the lever is declined to abut against the limiting block, thereby playing a limiting role.

[0009] As a preferred technical scheme of the present application, the lever assemblies are arranged in pairs and symmetrically distributed; meanwhile, the lever assemblies are distributed on the front and back sides of the limiting block, and the upper end of the limiting block is provided with an elongated stop block abutting against the top pin.

[0010] As a preferred technical scheme of the present application, the bottom of the horizontal support table is provided with an avoiding groove for avoiding the lever assembly.

[0011] As a preferred technical scheme of the present application, the horizontal support table is further provided with a circular hole matched with the top pin.

[0012] As a preferred technical scheme of the present application, the upper end of the horizontal support table is provided with a plurality of limiting protrusions.

[0013] As a preferred technical scheme of the present application, the side close to the wafer of the vertical push rod is provided with a buffer pad.

[0014] As a preferred technical scheme of the present application, the side of the limiting block is provided with a handle.

[0015] As a preferred technical scheme of the present application, the bottom of the horizontal support table is provided with four supporting legs.

[0016] As a preferred technical scheme of the present application, the bottom of one of the supporting legs is fixed with a metal piece, and the metal piece is connected with the guide block through a wire.

[0017] The transfer device for wafer drying provided by the present application can realize the rapid and accurate transfer of wafers from plastic supports to metal supports through the combination of the guide rail sliding block assembly and the vertical push rod, and the transfer of the transfer support can be carried out only after the transfer support is placed in the specified position through the limiting of the lever assembly, so as to prevent the sliding or damage of the transfer support; the design intention of the device is to ensure the safety and stability of the wafer during the transfer process.

[0018] The device not only improves the efficiency and accuracy of wafer transfer, but also ensures the safety and quality stability of wafers during the drying step. With the continuous development of semiconductor technology, such transfer device will play an increasingly important role in the future semiconductor manufacturing process.

[0019] In addition to the objects, features and advantages described above, the present application has other objects, features and advantages. The present application will be described in further detail below with reference to the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0020] The accompanying drawings, which form a part of this specification, are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification. The embodiments of the present application, and their

[0021] Fig. 1 It is a front view of the wafer drying transfer device of the utility model;

[0022] Fig. 2 It is a bottom view of the wafer drying transfer device of the utility model;

[0023] The accompanying drawings, which form a part of this specification, are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification. The embodiments of the present application, and their DETAILED DESCRIPTION

[0024] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0025] As Figs. 1-2 The wafer drying transfer device of the utility model, including: guide block 3, limit block 4, horizontal support table 5, lever assembly 6, handle 7, stop block 8, guide rail 9, L-shaped connecting rod 10 and vertical push rod 11.

[0026] Specifically, the horizontal support table 5 upper end is used to place the transfer support one 1 and the transfer support two 2, and the horizontal support table 5 upper end is provided with a plurality of limit protrusions 51, and the limit protrusions 51 can limit the horizontal position of the transfer support one 1 and the transfer support two 2.

[0027] Among them, the vertical push rod 11 is arranged above the horizontal support table 5, the guide rail 9 and the guide block 3 are installed at the lower end of the horizontal support table 5, the guide rail 9 and the guide block 3 are in sliding fit, at the same time, the guide rail 9 front end is provided with the limit block 4, preventing the guide rail 9 from sliding off the guide block 3, and the vertical push rod 11 is connected with the guide rail 9 through the L-shaped connecting rod 10; through the horizontal movement of the guide rail 9, the vertical push rod 11 can be driven to move, and the wafer located in the transfer support one 1 is pushed into the transfer support two 2, and the transfer process is completed.

[0028] The horizontal support table 5 is further provided with a lever assembly 6 at the lower end, the lever assembly 6 extends in the left-right direction, meanwhile, the bottom of the horizontal support table 5 is provided with an avoiding groove 53 for avoiding the lever assembly 6, the lever assembly 6 comprises a lever 63, a center supporting block 61 and a top pin 62 located at the left end of the lever 63; the horizontal support table 5 is further provided with a circular hole matched with the top pin 62, wherein the center supporting block 61 is arranged at the end of the lever close to the top pin 62, the left end of the lever 63 is upturned in the natural state and the top pin 62 protrudes from the upper surface of the horizontal support table 5, the lever 63 is downwardly inclined at the right side and abuts against the limiting block 4, thereby playing a limiting role.

[0029] The lever assembly 6 is arranged in pairs and symmetrically distributed in pairs in the front-rear direction of the horizontal support table 5, meanwhile, the lever assembly 6 is distributed on the two sides of the limiting block 4 in front and back, the elongated stop block 8 is arranged on the upper end of the limiting block 4, so that the lever 63 downwardly inclined at the right side abuts against the stop block 8 on the upper end of the limiting block 4, thereby playing a limiting role.

[0030] When the transfer support two 2 is placed on the upper end of the horizontal support table 5, the metal material transfer support two 2 presses the top pin 62, so that the left side of the lever is lowered, the right side is raised and separated from the stop block 8, so that the limiting block 4 and the guide rail 9 can move freely, thereby pushing the vertical push rod 11 to move left through the handle 7 arranged on the side of the limiting block 4, and the vertical push rod 11 pushes the wafers vertically stacked on the transfer support one 1 to the transfer support two 2.

[0031] In the scheme, the vertical push rod 11 is provided with a buffer pad 13 close to the side of the wafer, and the buffer pad 13 contacts the wafer during the pushing process of the wafer by the vertical push rod 11, so as to reduce the friction.

[0032] In addition, the bottom of the horizontal support table 5 is provided with four supporting feet 52, one of which is fixed with a metal piece at the bottom, the metal piece is connected with the guide block 3 through the wire 12, and the static electricity generated during the sliding process of the guide block 3 and the guide rail 9 can be transmitted to the static electricity removal workbench through the wire 12 and the metal piece.

[0033] The working principle and working process of the wafer drying transfer device of the utility model are briefly described below.

[0034] Firstly, the transfer support two 2 is placed on the upper end of the horizontal support table 5 and positioned by the limiting protrusion 51, the vertical push rod 11 is stretched to the rightmost side, and then the transfer support one 1 with wafers is placed on the upper end of the horizontal support table 5 and positioned by the limiting protrusion 51.

[0035] When the transfer bracket two 2 is placed on the upper end of the horizontal support table 5, the metal transfer bracket two 2 presses the top pin 62, so that the left side of the lever 63 descends, the right side rises and is separated from the stop block 8, so that the limiting block 4 and the guide rail 9 can move freely, so as to push the vertical push rod 11 to move left through the handle 7 installed on the side of the limiting block 4, and the vertical push rod 11 pushes the wafer vertically stacked on the transfer bracket one 1 to the transfer bracket two 2.

[0036] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Various modifications and changes can be made by those skilled in the art based on the spirit and principles of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A transfer device for wafer baking, characterized by, The utility model provides a horizontal support platform (5) is placed on the upper end of transfer support one (1) and transfer support two (2), the horizontal support platform (5) lower end installs guide rail (9) and guide block (3), guide rail (9) with guide block (3) sliding fit, and the front end of guide rail (9) is provided with limit block (4), wherein the vertical push rod (11) is set up above the horizontal support platform (5), and the vertical push rod (11) is connected with guide rail (9) through L-shaped connecting rod (10), the movement of guide rail (9) can drive the left movement of vertical push rod (11), and the wafer in transfer support one (1) is pushed to the transfer support two (2) in, and the transfer process is completed.

2. The transfer device for wafer baking according to claim 1, wherein, The horizontal support platform (5) lower end is further provided with a lever assembly (6), which comprises a lever (63), a center support block (61) and a top pin (62) located at the left end of the lever (63). The center support block (61) is arranged on the lever (63) close to the end of the top pin (62), and the lever (63) is naturally upwarping at the lower left end and the top pin (62) is protruding from the upper surface of the horizontal support platform (5), and the lever (63) is downwardly inclined at the right side and abuts against the limit block (4), thereby limiting the position.

3. The transfer device for wafer baking according to claim 2, wherein, The lever assembly (6) is arranged in pairs and symmetrically distributed in pairs, and the lever assembly (6) is distributed on the front and back sides of the limit block (4), and the limit block (4) is provided with an elongated stop block (8) at the upper end, which abuts against the top pin (62).

4. The transfer device for wafer baking according to claim 2, wherein, The horizontal support platform (5) is provided with an avoiding groove (53) at the bottom for avoiding the lever assembly (6).

5. The transfer device for wafer baking according to claim 2, wherein, The horizontal support platform (5) is further provided with a circular hole matched with the top pin (62).

6. The transfer device for wafer baking according to claim 1, wherein, The horizontal support platform (5) is provided with a plurality of limiting protrusions (51) at the upper end.

7. The transfer device for wafer baking according to claim 1, wherein The vertical push rod (11) is provided with a buffer pad (13) close to the wafer side.

8. The transfer device for wafer baking according to claim 1, wherein, The limit block (4) is provided with a handle (7) at the side.

9. The transfer device for wafer baking according to claim 1, wherein, The horizontal support platform (5) is provided with four supporting legs (52) at the bottom.

10. The transfer device for wafer baking according to claim 9, wherein, One of the supporting legs (52) is fixed with a metal piece at the bottom, and the metal piece is connected with the guide block (3) through a wire (12).

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