Calibration structure and semiconductor processing device

Abstract

The utility model provides a calibration structure and a semiconductor processing device, the calibration structure is used for calibrating a manipulator carrying a wafer, the manipulator is used for conveying and placing the wafer to a processing platform in the semiconductor processing device, and the calibration structure comprises a base which can be fixed on the processing platform; the fixing piece is arranged on one side of the base and is far away from the base, the center of the fixing piece and the center of the base are located on the same vertical line, and the fixing piece and the base are relatively horizontal, the fixing piece is used for fixing a carrying platform of the mechanical arm so that the carrying platform and the machining platform can be aligned and are relatively horizontal, and therefore the position between the carrying platform and a mechanical arm of the mechanical arm can be calibrated, adjusted and fixed. According to the calibration structure, the accuracy of the wafer conveying position can be improved, the wafer manufacturing quality is further improved, meanwhile, the equipment calibration time is shortened, and the working efficiency of a factory is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor manufacturing process, and in particular to a calibration structure and a semiconductor manufacturing system comprising the same. BACKGROUND

[0002] In semiconductor manufacturing, when a wafer is subjected to a baking process, a robot is used to transfer the wafer to a heating platform for heating. The center of the robot and the center of the heating platform need to be aligned and the robot and the heating platform need to be relatively horizontal to ensure the accuracy of wafer transfer. If the relative position between the robot and the heating platform has a large deviation, the wafer cannot be placed on the heating platform at the same time during wafer transfer, which ultimately affects the process effect of the wafer.

[0003] Currently, the calibration of the relative position between the robot and the heating platform needs to adjust the position of the robot multiple times while taking and placing the wafer multiple times, so as to align and horizontally position the robot and the heating platform. This calibration method is relatively complicated, which leads to a long equipment preparation time and affects the work efficiency of the factory. Practical new type content

[0004] The present application provides a calibration structure and a semiconductor manufacturing system comprising the same, which can improve the accuracy of wafer transfer position, thereby improving the finished product quality of the wafer, shortening the equipment calibration time, and improving the work efficiency of the factory.

[0005] To solve the above technical problems, the present application provides a calibration structure for calibrating a robot carrying a wafer, the robot being used to carry and place the wafer to a processing platform in a semiconductor manufacturing device, the calibration structure comprising: a base fixed on the processing platform; a holding member arranged on one side of the base and away from the base, the center of the holding member and the center of the base being located on the same vertical line, and the holding member being horizontally positioned relative to the base, wherein the holding member is used to hold a carrying platform of the robot so that the carrying platform and the processing platform are aligned and horizontally positioned, thereby calibrating and adjusting the position between the carrying platform and the mechanical arm of the robot and fixing.

[0006] In some embodiments, the calibration structure further comprises a connecting alignment member arranged between the base and the holding member, wherein the base is fixed at one end of the connecting alignment member, and a part of the holding member is fixed at the other end of the connecting alignment member, and the other part of the holding member is detachably connected to the other end of the connecting alignment member.

[0007] In some embodiments, the holder comprises: a first holding disc, which is fixed on the other end of the connecting alignment member, and which is located on the same vertical line as the center of the base and is horizontally opposite to the base, and the other end of the connecting alignment member passes through the first holding disc; and a second holding disc, which is detachably connected to the other end of the connecting alignment member, and which is provided with an alignment hole, and which is placed on the carrying platform when the second holding disc is separated from the connecting alignment member, and the carrying platform is placed on the first holding disc, and the carrying platform is aligned with the processing platform and locked in the holder by using the connecting alignment member, the alignment hole of the second holding disc and the locking member.

[0008] In some embodiments, the outer surface of the other end of the connecting alignment member is provided with threads, and the locking member is a nut.

[0009] In some embodiments, the carrying platform is provided with at least two slits in the thickness direction, the number of the connecting alignment members is at least three, and the size of the connecting alignment members is matched with the size of the slits so as to pass through the slits respectively.

[0010] In some embodiments, the number of the slits is two, and the number of the connecting alignment members is three, two of the connecting alignment members are used to pass through the same slit, and the other connecting alignment member is used to pass through the other slit.

[0011] In some embodiments, the base is a disc base, and the size of the disc base is slightly larger than the size of the wafer, so that the disc base is abuttingly fixed on the processing platform by using the first guide member provided on the processing platform.

[0012] In some embodiments, the second holding disc is a circular holding disc, and the size of the second holding disc is slightly larger than the size of the wafer, so that the second holding disc is abuttingly fixed on the carrying platform by using the second guide member provided on the carrying platform.

[0013] In some embodiments, the diameter of the base or the second holding disc is 300.2mm-300.6mm.

[0014] To solve the above technical problems, the second aspect of the present application further provides a semiconductor processing device, which comprises: a processing platform, which is used for placing a wafer and processing; and a mechanical hand, which is used for carrying a wafer and placing the wafer on the processing platform; wherein the mechanical hand uses any one of the alignment structures as described above to align and adjust the position of the carrying platform of the mechanical hand and the processing platform.

[0015] The application provides a calibration structure for calibrating a wafer carrying robot, which is used to carry and place a wafer to a processing platform in a semiconductor processing device, and the calibration structure comprises a base which can be fixed on the processing platform, and a holder which is arranged on one side of the base and away from the base, the center of the holder is on the same vertical line with the center of the base, and the holder is horizontally opposite to the base, wherein the holder is used to hold a carrying platform of the robot so that the carrying platform and the processing platform are aligned and horizontally opposite, thereby calibrating and adjusting the position between the carrying platform and a mechanical arm of the robot and fixing. The calibration structure can improve the accuracy of wafer transfer position, thereby improving the quality of wafer manufacturing, shortening the equipment calibration time, and improving the work efficiency of the factory. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor. Among them:

[0017] Figure 1 The structural schematic diagram of the semiconductor processing device provided by some embodiments of the present application is shown in the figure;

[0018] Figure 2 The structural schematic diagram of the robot carrying a wafer to above the processing platform provided by some embodiments of the present application is shown in the figure;

[0019] Figure 3 The structural schematic diagram of the calibration structure provided by some embodiments of the present application is shown in the figure;

[0020] Figure 4 The structural schematic diagram of the calibration structure fixed on the processing platform and the carrying platform provided by some embodiments of the present application is shown in the figure;

[0021] Figure 5 The top view of the second holding disc provided by some embodiments of the present application is shown in the figure. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0023] The terms "first" and "second" in this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0024] In this application, all directional indicators (such as up, down, left, right, front, back, top, bottom, etc.) are only used to explain the relative positional relationship and movement of each component in a specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0025] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0026] Unless otherwise defined, the term “approximately” as used in this application can be understood, in relation to numerical quantities or quantitative relationships, as a range of approximately ±15% of a certain value.

[0027] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0028] See Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of a semiconductor manufacturing apparatus provided in some embodiments of this application; Figure 2 This is a schematic diagram illustrating the structure of a robotic arm transporting a wafer to a processing platform according to some embodiments of this application. In some embodiments, the semiconductor process apparatus 10 includes a processing platform 100 and a robotic arm 200, the robotic arm 200 being used to transport and place the wafer 20 onto the processing platform 100. In some embodiments, the processing platform 100 is a heating platform of a wafer heating device, which can implement baking processes such as soft baking, hard baking, and post-baking in the wafer photolithography process.

[0029] In some embodiments, see Figure 1The mechanical hand 200 includes a carrying platform 210, which is provided with a slit 211 penetrating through the thickness direction thereof. See Figure 2 The processing platform 100 is provided with a first needle 110, which is retractable by a cylinder. Meanwhile, the first needle 110 is provided at a position and with a size matching the slit 211 of the carrying platform 210. When the carrying platform 210 with the wafer 20 supported thereon moves to above the processing platform 100 and moves downward, the first needle 110 can penetrate through the slit 211 of the carrying platform 210 and support the wafer 20 instead of the carrying platform 210. At this time, the carrying platform 210 is separated from the wafer 20, and the carrying platform 210 can move away from the processing platform 100 below the wafer 20, so as to realize the transfer of the wafer 20 from the mechanical hand 200 to the processing platform 100. When the first needle 110 is retracted to the bottom of the processing platform 100 by the cylinder, the wafer 20 can move to contact the processing platform 100, so as to realize the heating and baking or other processing technology of the wafer 20 by the processing platform 100. In some embodiments, the semiconductor processing device 100 further includes a temporary storage platform 300 for the transfer or temporary storage of the wafer to be processed, and the wafer to be processed can be transferred from the temporary storage platform 300 to the processing platform 100 by the mechanical hand 200 for heating and baking or other processing technology. The temporary storage platform 300 is provided with a second needle 310, and similarly, the second needle 310 is provided at a position and with a size matching the slit 211 of the carrying platform 210. When the wafer 20 is supported on the second needle 310 of the temporary storage platform 300, the carrying platform 210 can move to between the wafer 20 and the temporary storage platform 300 through the slit 211 and the second needle 310, and after the relative position of the wafer 20 is adjusted, the carrying platform 210 moves upward and supports the wafer 20 instead of the second needle 310, so as to realize the transfer of the wafer 20 from the temporary storage platform 300 to the mechanical hand 200.

[0030] In some embodiments, the mechanical hand 200 includes a carrying platform 210, a connecting arm 220 and a mechanical arm 230. See Figure 2The carrying platform 210 is fixedly connected with the horizontal part 221 of the connecting arm 220 through the first screw 240, and the vertical part 222 of the connecting arm 220 is fixedly connected with the mechanical arm 230 through the second screw 250. Thus, the carrying platform 210 of the mechanical hand 200 can adjust its position in the horizontal direction through the first screw 240, and adjust its angle in the relative vertical direction through the second screw 250, so as to adjust the relative position between the carrying platform 210 and the processing platform 100. At present, the adjustment of the relative position between the carrying platform 210 and the processing platform 100 needs to adjust the position of the carrying platform 210 for multiple times in the process of taking and placing the wafer 20, that is, the positions of the first screw 240 and the second screw 250 are adjusted for multiple times, so as to realize the alignment and relative horizontal of the carrying platform 210 and the processing platform 100. This calibration method is relatively complicated, not only the accuracy is low, but also the equipment preparation time is long, which affects the work efficiency of the factory.

[0031] To solve the above technical problems, the present application provides a calibration structure 400 for calibrating the mechanical hand 200 carrying the wafer 20. Referring to Figure 3 and Figure 4 , Figure 3 The structural schematic diagram of the calibration structure provided by some embodiments of the present application is shown in the following figure: Figure 4The calibration structure 400 includes a base 410 and a holder 420. The base 410 can be fixed on the processing platform 100, i.e., when the base 410 is disposed on the processing platform 100, the base 410 and the processing platform 100 do not move relative to each other. At the same time, the center of the base 410 and the center of the processing platform 100 are located on the same vertical line and the base 410 and the processing platform 100 are relatively horizontal, i.e., when the base 410 is fixed on the processing platform, the base 410 and the processing platform 100 are aligned and relatively horizontal. The holder 420 is disposed on one side of the base 410 and away from the base 410, the center of the holder 420 and the center of the base 410 are located on the same vertical line and the holder 420 and the base 410 are relatively horizontal, i.e., the holder 420 and the base 410 are aligned and relatively horizontal. The holder 420 is used to hold the carrier platform 210 of the robot 200, when the holder 420 holds the carrier platform 210, the center of the holder 420 and the center of the carrier platform 210 are located on the same vertical line and the holder 420 and the carrier platform 210 are relatively horizontal, i.e., when the holder 420 holds the carrier platform 210, the holder 420 and the carrier platform 210 are aligned and relatively horizontal. Therefore, when the base 410 of the calibration structure 400 is fixed on the processing platform 100 and the holder 420 holds the carrier platform 210, the carrier platform 210 and the processing platform 100 are aligned and relatively horizontal, so that by adjusting and fixing the positions of the first screw 240 and the second screw 250, the positions between the carrier platform 210 and the robot 230 are calibrated and adjusted and fixed.

[0032] Continuing to refer to Figure 3 In some embodiments, the calibration structure 400 further includes a connecting alignment member 430, which is disposed between the base 410 and the holder 420. The base 410 is fixed at one end 431 of the connecting alignment member 430, i.e., the base 410 is fixedly connected to the connecting alignment member 430. The holder 420 is disposed at the other end 432 of the connecting alignment member 430, i.e., the holder 420 is disposed at the end of the connecting alignment member 430 away from the base 410. At the same time, a part of the holder 420 can be fixed at the other end 432 of the connecting alignment member 430, and the other part of the holder 420 can be detachably connected at the other end 432 of the connecting alignment member 430, and the holder 420 holds the carrier platform 210 through the part fixedly connected to the connecting alignment member 430 and the part detachably connected to the connecting alignment member 430.

[0033] Referring to Figures 3-5 , Figure 5This is a top view of a second holding plate provided in some embodiments of this application. In some embodiments, the holding member 420 includes a first holding plate 421 and a second holding plate 422. The first holding plate 421 can be fixed to the other end 432 of the connecting alignment member 430. The center of the first holding plate 421 is on the same vertical line as the center of the base 410, and the first holding plate 421 is relatively horizontal with respect to the base 410, that is, the first holding plate 421 is aligned with the base 410 and is relatively horizontal. Meanwhile, the other end 432 of the connecting alignment member 430 passes through the first holding plate 421. When the holding member 420 holds the transport platform 210, the first holding plate 421 is located on the side of the transport platform 210 closer to the processing platform 100. In some embodiments, the first holding plate 421 is detachably connected to the connecting alignment member 430, and the distance between the first holding plate 421 and the base 410 can be adjusted according to the actual distance between the processing platform 100 and the transport platform 210. In other embodiments, the first holding plate 421 may also be configured to be fixedly connected to the connecting alignment member 430; that is, the distance between the first holding plate 421 and the base 410 is not adjustable, which can improve the stability of the relative position between the first holding plate 421 and the base 410. The second holding plate 422 is detachably connected to the other end 432 of the connecting alignment member 430, that is, the second holding plate 422 can be detached from the connecting alignment member 430 and placed on the transport platform 210, and as... Figure 5 As shown, the second holding plate 422 is provided with an alignment hole 4221 corresponding to the connecting alignment member 430. When the second holding plate 422 is fixedly connected to the connecting alignment member 430 through the alignment hole 4221, the center of the second holding plate 422 and the center of the first holding plate 421 are on the same vertical line and the second holding plate 422 and the first holding plate 421 are relatively horizontal, that is, the second holding plate 422 and the first holding plate 421 are aligned and relatively horizontal, which indicates that the base 410 of the second holding plate 422 is aligned and relatively horizontal. When the holding member 420 holds the transport platform 210, the second holding plate 422 is located on the side of the transport platform 210 away from the processing platform 100, and the transport platform 210 is locked in the holding member 420 by means of the alignment hole 4221 and the locking member 433. In some embodiments, when the first holding plate 421 is configured to be detachably connected to the connecting alignment member 430, the first holding plate 421 is also provided with an alignment hole 4221 corresponding to the connecting alignment member 430. Figure 5 The same alignment hole shown in the diagram corresponds to the connecting alignment member 430, which extends from the alignment hole of the first retaining plate 421 and is also fixed by the locking member 433, so that the first retaining plate 421 is aligned with the base 410 and is relatively horizontal. In some embodiments, the outer surface of the other end 432 of the connecting alignment member 430 is provided with threads, and the locking member 433 is a nut. In other embodiments, other connection methods can be used between the connecting alignment member 430 and the retaining member 420 according to different needs.

[0034] Referring to Figure 1 and Figure 3 The carrying platform 210 of the robot 200 is provided with at least two slits 211, the calibration structure 400 is provided with at least three connecting alignment members 430, and the size of the connecting alignment members 430 and the size of the slits 211 of the carrying platform 210 are matched so that the connecting alignment members 430 can pass through the slits 211 of the carrying platform 210 respectively. In this way, the connecting alignment members 430 can pass through the alignment holes 4221 and the slits 211 respectively, pass through the carrying platform 210 and the second holding disc 422, and fix the carrying platform 210 between the first holding disc 421 and the second holding disc 422 through the locking members 433. In some embodiments, the carrying platform 210 is provided with two slits 211, such as a first slit 2111 and a second slit 2112 as shown in Figure 1 , and the calibration structure 400 is provided with three connecting alignment members 430, two of which are used to pass through the same slit 211 of the carrying platform 210, i.e. the first slit 2111, and the other connecting alignment member 430 is used to pass through the slit 211 of another carrying platform 210, i.e. the second slit 2112. Meanwhile, in some embodiments, the length of the first slit 2111 is longer than the length of the second slit 2112, so that the first slit 2111 can pass through the two connecting alignment members 430. In other embodiments, the slits 211 of the carrying platform 210 and the connecting alignment members 430 of the calibration structure 400 can also be provided in other numbers and structures according to different needs, which are not limited herein.

[0035] Referring to Figure 2 In some embodiments, the processing platform 100 comprises a plurality of first guide members 120 arranged around the wafer 20, for defining the specific position of the wafer 20 when placed on the processing platform 100 and subjected to the baking process. The shape surrounded by the plurality of first guide members 120 is a circle, and the diameter of the circle is slightly larger than the diameter of the wafer 20, and the center of the circle coincides with the center of the processing platform 100. Similarly, the carrying platform 210 comprises a plurality of second guide members 212 arranged around the wafer 20, for defining the specific position of the wafer 20 when placed on the carrying platform 210 and subjected to the conveying process. The shape surrounded by the plurality of second guide members 212 is a circle, and the diameter of the circle is slightly larger than the diameter of the wafer 20, and the center of the circle coincides with the center of the carrying platform 210.

[0036] Referring to Figure 3 and Figure 4In some embodiments, the base 410 is a disc-shaped base, and the size of the base 410 is slightly larger than the size of the wafer 20, so that the base 410 is fixed on the processing platform 100 by abutting against the first guide 120 arranged on the processing platform 100. At this time, the center of the base 410 and the center of the circle formed by the plurality of first guides 120 are located on the same vertical line, so that the base 410 is aligned with the processing platform 100. Similarly, in some embodiments, the second holding disc 422 is a disc-shaped holding disc, and the size of the second holding disc 422 is slightly larger than the size of the wafer 20, so that the second holding disc 422 is fixed on the carrying platform 210 by abutting against the second guide 212 arranged on the carrying platform 210. At this time, the center of the second holding disc 422 and the center of the circle formed by the plurality of second guides 212 are located on the same vertical line, so that the second holding disc 422 is aligned with the carrying platform 210. Since the second holding disc 422 is aligned with the base 410, the processing platform 100 and the carrying platform 210 can be aligned through the calibration structure 400.

[0037] In some embodiments, the diameter of the wafer 20 is 300 mm, and in order to improve the stability of the base 410 fixed on the processing platform 100 and the second holding disc 422 fixed on the carrying platform 210, the diameter of the base 410 and / or the second holding disc 422 is set to 300.2 mm-300.6 mm. Among them, the optimal length of the diameter of the base 410 and / or the second holding disc 422 is 300.4 mm. In order to further improve the stability of the base 410 fixed on the processing platform 100 and the second holding disc 422 fixed on the carrying platform 210, and avoid the deformation of the base 410 and / or the second holding disc 422 and the relative sliding between the base 410 and the processing platform 100 and between the second holding disc 422 and the carrying platform when the positions between the carrying platform 210 and the mechanical arm 230 are adjusted and fixed, the thickness of the base 410 and / or the second holding disc 422 is set to be greater than the thickness of the wafer 20. In some embodiments, the thickness of the base 410 and / or the second holding disc 422 is set to 3 mm-8 mm. Among them, the optimal length of the thickness of the base 410 and / or the second holding disc 422 is 5 mm. In some embodiments, the material of the calibration structure 400 is a metal with high hardness, which can further avoid the deformation of the calibration structure 400 caused by stress when the positions between the carrying platform 210 and the mechanical arm 230 are adjusted and fixed. In some embodiments, the material of the calibration structure 400 is aluminum.

[0038] The calibration structure 400 provided in the present application includes the following steps when calibrating the position of the wafer transferred by the mechanical hand 200 to the processing platform 100:

[0039] Step S1: fixing the base 410 to the processing platform 100, fixing the first holding disc 421 to the connecting alignment member 430, and aligning and horizontally positioning the first holding disc 421 relative to the base 410;

[0040] Step S2: loosening the first screw 240 and the second screw 250 to allow the relative movement between the carrier platform 210 and the mechanical arm 230;

[0041] Step S3: moving the carrier platform 210 above the processing platform 100, i.e. above the first holding disc 421, and allowing the connecting alignment member 430 to pass through the gap 211 of the carrier platform 210 to tightly connect the carrier platform 210 to the first holding disc 421;

[0042] Step S4: placing the second holding disc 422 on the carrier platform 210, allowing the connecting alignment member 430 to pass through the alignment hole 4221, and tightening the locking member 433 to lock the carrier platform 210 between the first holding disc 421 and the second holding disc 422 by using the connecting alignment member 430, the alignment hole 4221 of the second holding disc 422, and the locking member 433. At this time, the carrier platform 210 is aligned and horizontally positioned relative to the processing platform 100;

[0043] Step S5: tightening the first screw 240 and the second screw 250 to prevent the relative movement between the carrier platform 210 and the mechanical arm 230;

[0044] Step S6: removing the calibration structure 400, transferring the wafer 20 to the processing platform 100 by the mechanical hand 200, and rechecking whether the relative position between the carrier platform 210 and the processing platform 100 is aligned and horizontally positioned.

[0045] The calibration structure 400 is used for calibrating the mechanical hand 200 for carrying the wafer 20 and placing the wafer 20 on the processing platform 100 in the semiconductor processing device 10. The calibration structure 400 comprises a base 410 and a holding member 420. The base 410 is fixed on the processing platform 100. The holding member 420 is arranged on one side of the base 410 and away from the base 410. The center of the holding member 420 and the center of the base 410 are located on the same vertical line, and the holding member 420 is horizontally positioned relative to the base 410. The holding member 420 is used for holding the carrier platform 210 of the mechanical hand 200 to align and horizontally position the carrier platform 210 and the processing platform, thereby calibrating and fixing the position between the carrier platform 210 and the mechanical arm 230 of the mechanical hand 200. Thus, the calibration structure 400 can improve the accuracy of the wafer transfer position, improve the quality of the wafer, shorten the calibration time of the equipment, and improve the work efficiency of the factory.

[0046] The above merely describes the embodiments of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields, which is made by using the content of the present application specification and drawings, is also included in the patent protection scope of the present application.

Claims

1. A calibration structure, characterized by, A calibration structure for calibrating a wafer carrying robot used for carrying and placing a wafer to a processing platform in a semiconductor processing device, the calibration structure comprising: a base fixed on the processing platform; a holder arranged on one side of the base and away from the base, the center of the holder and the center of the base are on the same vertical line, and the holder is horizontally opposite to the base, wherein the holder is used to hold a carrying platform of the robot so that the carrying platform and the processing platform are aligned and horizontally opposite, thereby calibrating and adjusting the position between the carrying platform and a mechanical arm of the robot.

2. The calibration structure of claim 1, wherein, Further comprising: a connecting alignment member arranged between the base and the holder; wherein the base is fixed on one end of the connecting alignment member, and a part of the holder is fixed on the other end of the connecting alignment member, and the other part of the holder is detachably connected to the other end of the connecting alignment member.

3. The calibration structure of claim 2, wherein, The holder comprises: a first holding disc fixed on the other end of the connecting alignment member, the first holding disc is on the same vertical line with the center of the base and is horizontally opposite to the base, and the other end of the connecting alignment member passes through the first holding disc; a second holding disc detachably connected to the other end of the connecting alignment member, the second holding disc is provided with an alignment hole, the second holding disc is placed on the carrying platform when it is separated from the connecting alignment member, the carrying platform is moved and placed on the first holding disc, and the carrying platform is aligned with the processing platform and locked in the holder by using the connecting alignment member, the alignment hole of the second holding disc and a locking member.

4. The calibration structure according to claim 3, wherein an outer surface of the other end of the connecting alignment member is provided with threads, and the locking member is a nut.

5. The calibration structure according to claim 3, wherein the carrying platform is provided with at least two slits in the thickness direction; the number of the connecting alignment members is at least three, and the size of the connecting alignment members is matched with the size of the slits so as to pass through the slits respectively.

6. The calibration structure according to claim 5, wherein the number of the slits is two, and the number of the connecting alignment members is three, two of the connecting alignment members are used to pass through the same slit, and the other connecting alignment member is used to pass through the other slit.

7. The calibration structure according to claim 1, wherein the base is a disc base, and the size of the disc base is slightly larger than the size of the wafer, so that the disc base is abuttingly fixed on the processing platform by using a first guide member arranged on the processing platform.

8. The calibration structure according to claim 3, wherein the second holding disc is a circular holding disc, and the size of the second holding disc is slightly larger than the size of the wafer, so that the second holding disc is abuttingly fixed on the carrying platform by using a second guide member arranged on the carrying platform.

9. The calibration structure according to claim 7, wherein The diameter of the base is 300.2mm-300.6mm.

10. The calibration structure of claim 8, wherein, The diameter of the second holding disc is 300.2mm-300.6mm.

11. A semiconductor processing apparatus, characterized by comprising: comprising: a processing platform for placing a wafer and processing; a robot for carrying the wafer and placing the wafer on the processing platform; wherein the robot uses the calibration structure of any one of claims 1-10 to calibrate the position of the carrying platform of the robot and the processing platform.

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