Composite printing backlight lamp panel

Abstract

The utility model discloses a composite printing backlight lamp panel, which belongs to the field of backlight lamp panels and comprises a base material, a silver circuit layer printed on the surface of the base material, a copper circuit layer printed on the surface of the silver circuit layer, a shading layer adhered to the bottom surface of the base material, and a gold plating PAD layer adhered to the top surface of the copper circuit layer. An electronic component is adhered to the top surface of the gold plating PAD layer, a first covering layer is adhered to the surface of the copper circuit layer, and a second covering layer and bonding glue are adhered to the surface of the first covering layer. Silk-screen printing can be realized, so that the main process comprises two steps of printing and drying, strong acid in etching is not used for removing in the manufacturing process, and the manufacturing cost is reduced. According to the invention, no waste liquid is generated in the manufacturing process, so that the cost expenditure in the whole production process is greatly saved, the environmental protection is improved, the typesetting size can be maximized according to the table top of the printing machine, the production effect of high single output is realized, and the production efficiency of the backlight lamp panel is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of backlight panels, and more specifically, to a composite printed backlight panel. Background Technology

[0002] Backlight panels generally refer to backlight components used in electronic devices such as liquid crystal displays (LCDs), televisions, and mobile phones. Traditional backlight panels involve etching copper circuits, which requires copper plating, adhesive coating, exposure, development, etching, and film removal. In particular, the etching process involves the removal of strong acids, resulting in significant pollution. Furthermore, the entire etching process imposes size limitations on the layout requirements, preventing the maximization of layout efficiency and resulting in low output per batch. Therefore, a new type of composite printed backlight panel is needed that can be manufactured without generating waste liquid, maximize the layout size based on the printing press table, and achieve high output per batch. Summary of the Invention

[0003] Technical problems to be solved

[0004] To address the problems existing in the prior art, the purpose of this utility model is to provide a composite printed backlight panel that can be screen printed. Therefore, the main processes are printing and drying. Thus, the strong acid used in etching is not used in this manufacturing process, no waste liquid is generated, and the layout size can be maximized according to the printing machine table, achieving high single-output production effect and greatly improving the production efficiency of backlight panels.

[0005] Technical solution

[0006] To solve the above problems, the present invention adopts the following technical solution.

[0007] A composite printed backlight panel includes a substrate, a silver circuit layer printed on the surface of the substrate, a copper circuit layer printed on the surface of the silver circuit layer, a light-shielding layer adhered to the bottom surface of the substrate, a gold-plated PAD layer adhered to the top surface of the copper circuit layer, an electronic component adhered to the top surface of the gold-plated PAD layer, a cover layer adhered to the surface of the copper circuit layer, and an adhesive adhered to the surface of the cover layer.

[0008] Furthermore, the substrate material can be selected from PET film, PI film, PC / PMMA and other materials that can support printing lines.

[0009] Furthermore, the covering layer is configured as a thin film with PI as the main component.

[0010] Furthermore, the gold-plated PAD layer is configured as a metal coating surface achieved on the copper circuit layer by electroplating or chemical methods.

[0011] Furthermore, the electronic components include LEDs, resistors, capacitors, and ICs.

[0012] Furthermore, the electronic component is attached to the surface of the gold-plated PAD layer of the printed circuit by printing solder paste and reflow soldering, and the bottom side of the electronic component is also bonded with encapsulant.

[0013] Furthermore, the adhesive is a self-adhesive material, and its color is transparent, black, or other colors.

[0014] Furthermore, the substrate, silver circuit layer, copper circuit layer, light-shielding layer, gold-plated PAD layer, cover layer, adhesive and electronic components together constitute the lamp board, which includes three forms: lamp board A, lamp board B and lamp board C.

[0015] Furthermore, the light-shielding layer (4) has a light-shielding or light-masking function, and can be ink printing or PI film.

[0016] Furthermore, the cover layer has openings (8) corresponding to the size of the element. Beneficial effects

[0017] Compared with existing technologies, the advantages of this utility model are:

[0018] This solution utilizes screen printing, with the main processes being printing and drying. No waste liquid is generated during the manufacturing process. The layout size can be maximized based on the printing machine table, resulting in high single-pass output. Furthermore, it is equipped with three types of light panel structures to work with related lighting molds, enabling product diversification and further improving product selectivity and applicability. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall connection structure between the substrate and electronic components in this utility model;

[0020] Figure 2 This is a schematic diagram of the substrate and circuit connection structure in this utility model;

[0021] Figure 3 This is a schematic diagram of the lamp panel A structure in this utility model;

[0022] Figure 4 This is a schematic diagram of the lamp board B structure in this utility model;

[0023] Figure 5 This is a schematic diagram of the lamp board C structure in this utility model;

[0024] Figure 6 This is a schematic diagram of the window opening structure in this utility model.

[0025] Explanation of the labels in the diagram:

[0026] 1. Substrate; 2. Silver circuit layer; 3. Copper circuit layer; 4. Light-shielding layer; 5. Gold-plated PAD layer; 6. Cover layer; 7. Adhesive; 8. Window; 9. Electronic component; 10. Lamp board A; 11. Lamp board B; 12. Lamp board C. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0028] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0029] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Example 1:

[0030] Please see Figure 1-5 A composite printed backlight board includes a substrate 1, a silver circuit layer 2 printed on the surface of the substrate 1, a copper circuit layer 3 printed on the surface of the silver circuit layer 2, a light-shielding layer 4 bonded to the bottom surface of the substrate 1, a gold-plated PAD layer 5 bonded to the top surface of the copper circuit layer 3, an electronic component 9 bonded to the top surface of the gold-plated PAD layer 5, a cover layer 6 bonded to the surface of the copper circuit layer 3, and an adhesive 7 bonded to the surface of the cover layer 6.

[0031] The substrate 1 is made of PET film, PI film, PC / PMMA, or other materials that can support printing lines. The cover layer 6 is a thin film with PI as its main component. The electroplated PAD layer 5 is a metal-plated surface on the copper circuit layer 3 achieved by electroplating or chemical methods. The electronic components 9 include LEDs, resistors, capacitors, and ICs. The electronic components 9 are attached to the surface of the electroplated PAD layer 5 of the printed circuit by printing solder paste and reflow soldering. The bottom side of the electronic components 9 is also bonded with sealant. The adhesive 7 is a self-adhesive, and its color can be transparent, black, or other colors. The substrate 1, silver circuit layer 2, copper circuit layer 3, light-shielding layer 4, electroplated PAD layer 5, cover layer 6, adhesive 7, and electronic components 9 together constitute a light board. The light board includes three forms: light board A10, light board B11, and light board C12. The light-shielding layer 4 has a matte or light-shielding function and can be ink-printed or PI film. The cover layer has windows 8 corresponding to the size of the components.

[0032] Specifically, in addition to being a thin film made of PI material, the cover layer 6 can also be a cover oil film printed on the circuit. In addition to LEDs, resistors, capacitors and ICs, the electronic components 9 also include electronic circuit welding devices that can be used for welding. Since welding is an existing mature technology, some of the components required in the existing technology are also foreseeable technical means, so this application will not elaborate on them.

[0033] The working principle of this utility model is as follows: First, two circuit printing processes are performed on the surface of the substrate 1, namely, the printing of the silver circuit layer 2 and the copper circuit layer 3. Then, the cover layer 6 is bonded on the circuit, but the gaps in the copper circuit layer 3 are left open. The gold-plated PAD layer 5 is bonded in the gaps. The electronic component 9 is bonded to the gaps by the gold-plated PAD layer 5 in conjunction with solder paste and reflow soldering. Then, the surface of the cover layer 6 is covered and protected. Finally, the adhesive 7 is bonded to the surface of the circuit. The assembly and production can be carried out selectively through three forms: lamp board A10, lamp board B11, and lamp board C12.

[0034] The above description is merely a preferred embodiment of this utility model; however, the protection scope of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the technical scope disclosed in this utility model, based on the technical solution and its improved concept, should be included within the protection scope of this utility model.

Claims

1. A composite printed backlight panel, comprising a substrate (1), characterized in that: The substrate (1) has a silver circuit layer (2) printed on its surface, and a copper circuit layer (3) printed on its surface. A light-shielding layer (4) is bonded to the bottom surface of the substrate (1). A gold-plated PAD layer (5) is bonded to the top surface of the copper circuit layer (3). An electronic component (9) is bonded to the top surface of the gold-plated PAD layer (5). A cover layer (6) is bonded to the surface of the copper circuit layer (3). Adhesive (7) is bonded to the surface of the cover layer (6).

2. The composite printed backlight panel according to claim 1, characterized in that: The material of the substrate (1) is selected as PET film, PI film, or PC / PMMA.

3. The composite printed backlight panel according to claim 1, characterized in that: The covering layer (6) is configured as a film with PI as the main component or as a printed ink.

4. The composite printed backlight panel according to claim 1, characterized in that: The gold-plated PAD layer (5) is configured as a metal coating surface on the copper circuit layer (3) achieved by electroplating or chemical methods.

5. A composite printed backlight panel according to claim 1, characterized in that: The electronic components (9) include LEDs, resistors, capacitors and ICs.

6. A composite printed backlight panel according to claim 1, characterized in that: The electronic component (9) is attached to the surface of the gold-plated PAD layer (5) of the printed circuit by printing solder paste and reflow soldering. The bottom side of the electronic component (9) may also be covered with sealant.

7. A composite printed backlight panel according to claim 1, characterized in that: The adhesive (7) is a self-adhesive, and its color is transparent or black.

8. A composite printed backlight panel according to claim 1, characterized in that: The substrate (1), silver circuit layer (2), copper circuit layer (3), light shielding layer (4), gold-plated PAD layer (5), cover layer (6), adhesive (7) and electronic components (9) together constitute the lamp board, which includes three forms: lamp board A (10), lamp board B (11) and lamp board C (12).

9. A composite printed backlight panel according to claim 1, characterized in that: The light-shielding layer (4) has a light-shielding or light-masking function, and can be ink printing or PI film.

10. A composite printed backlight panel according to claim 1, wherein the cover layer has openings (8) corresponding to the size of the components.

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