Heat dissipation assembly, display module and display device

Abstract

The utility model relates to the technical field of display devices, in particular to a heat dissipation assembly and a display device, and aims to solve the problem that an existing heat dissipation assembly is prone to badness in the adsorption process. In order to achieve the purpose, the heat dissipation assembly comprises a base layer, a heat dissipation layer and a protection layer, the heat dissipation layer and the protection layer are located on the first surface of the base layer, the whole protection layer is annular and is provided with a protruding part protruding towards the inner side of the annular shape, and the heat dissipation layer is surrounded by the protection layer and is provided with a groove part embedded with the protruding part. In the process of adsorbing the heat dissipation assembly by adopting the adsorption equipment, the adsorption position of a suction nozzle of the adsorption equipment is located in the area, corresponding to the protruding part, of the base layer; as the cohesive force of the protective layer is high, the protective layer can bear high internal stress, the protective layer is not prone to being damaged in the process that the adsorption equipment adsorbs the heat dissipation assembly for transferring, and therefore the yield of the heat dissipation assembly is increased.

Description

Technical Field

[0001] This disclosure relates to the technical field of display devices, specifically providing a heat dissipation component and a display device. Background Technology

[0002] With the increasing popularity of OLED technology, the display resolution of electronic devices is getting higher and higher, and the overall configuration of electronic devices is also getting higher and higher. As a result, the heat generated by electronic devices is increasing, which affects the user experience.

[0003] The current solution involves adding heat dissipation components, including graphite layers, to electronic devices. During the installation of these components and the transport of the electronic parts, equipment is needed to pick up and attach the heat dissipation components. However, during this process, the components are prone to malfunction near the suction nozzle of the equipment, leading to product defects. Utility Model Content

[0004] The purpose of this disclosure is to solve the aforementioned technical problem, namely, to address the issue that existing heat dissipation components are prone to malfunctions during the adsorption process.

[0005] In a first aspect, this disclosure provides a heat dissipation assembly, comprising: a base layer; a heat dissipation layer and a protective layer located on a first surface of the base layer, wherein the protective layer is generally annular and has a protrusion protruding toward the inner side of the annulus, the heat dissipation layer is surrounded by the protective layer and has a groove that engages with the protrusion.

[0006] In some possible implementations, the thickness of the heat dissipation layer is the same as the thickness of the protective layer.

[0007] In some possible implementations, the protrusions include a first group of protrusions and a second group of protrusions spaced apart along the long side of the protective layer, wherein the first group of protrusions and the second group of protrusions each include two protruding sub-parts arranged opposite each other along the short side of the protective layer.

[0008] In some possible implementations, the protruding part is rectangular, circular, or semi-circular in shape.

[0009] In some possible implementations, the heat dissipation assembly further includes: a buffer layer covering the heat dissipation layer and the protective layer; and / or, a mesh adhesive layer covering the buffer layer.

[0010] In some possible implementations, the buffer layer is made of foam.

[0011] In some possible implementations, the heat dissipation assembly further includes: a first adhesive layer located between the base layer and the protective layer and the heat dissipation layer; and / or, a second adhesive layer located between the protective layer and the heat dissipation layer and the buffer layer.

[0012] In some possible implementations, the base layer is a conductive layer; and / or, the heat dissipation layer is made of graphite; and / or, the protective layer is made of PET.

[0013] In a second aspect, the present invention provides a display module, comprising: a display panel; and the aforementioned heat dissipation component located on the backlight side of the display panel.

[0014] In some possible implementations, the display module further includes: a circuit board coupled to a bonding area of ​​the display panel, wherein a ground terminal in the circuit board is coupled to a base layer in the heat dissipation assembly.

[0015] In a third aspect, the present invention provides a display device including the display module described above.

[0016] Compared with the prior art, this disclosure has the following beneficial effects:

[0017] The heat dissipation assembly disclosed herein includes a base layer, a heat dissipation layer, and a protective layer. The heat dissipation layer and the protective layer are located on the first surface of the base layer. The protective layer is generally annular and has protrusions extending towards the inner side of the annulus. The heat dissipation layer is surrounded by the protective layer and has grooves that engage with the protrusions. During the adsorption process of the heat dissipation assembly, the suction nozzle of the adsorption device adsorbs the heat dissipation assembly in the area corresponding to the protrusions on the base layer. Due to the high cohesion of the protective layer, it can withstand high internal stress. During the transfer of the heat dissipation assembly by the adsorption device, the protective layer is not easily damaged, thereby improving the yield of the heat dissipation assembly. Attached Figure Description

[0018] The preferred embodiments of this disclosure are described below with reference to the accompanying drawings, in which:

[0019] Figure 1 This is a cross-sectional view of a heat dissipation assembly provided in at least one embodiment of this disclosure;

[0020] Figure 2 This is a plan view of the heat dissipation layer and protective layer in a heat dissipation assembly provided in at least one embodiment of the present disclosure;

[0021] Figure 3 This is a plan view of the display panel in the display module provided in at least one embodiment of the present disclosure after it has been unfolded.

[0022] Figure 4 This is a cross-sectional view of a display module provided in at least one embodiment of the present disclosure.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. Heat dissipation component; 11. Base layer; 12. Heat dissipation layer; 120. Recessed portion; 121. First heat dissipation area; 122. Second heat dissipation area; 123. Third heat dissipation area; 13. Protective layer; 130. Protrusion; 14. Buffer layer; 15. Mesh adhesive layer; 2. Display panel; 21. Display area; 22. Bending area; 23. Non-bending area; 3. Optical adhesive layer; 4. Cover plate; 5. Support plate; 6. Circuit board. Detailed Implementation

[0025] Preferred embodiments of the present disclosure will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present disclosure and are not intended to limit the scope of protection of the present disclosure.

[0026] It should be noted that in the description of this disclosure, the terms "upper," "lower," "left," "right," "inner," and "outer," which indicate directional or positional relationships, are based on the directional or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0027] Furthermore, it should be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installation," "setup," and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection, an indirect connection through an intermediate medium, or a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0028] The heat dissipation component includes a base layer, a heat dissipation layer, and a protective layer. The heat dissipation layer and the protective layer are bonded to the first surface of the base layer. The protective layer is in a ring shape, and the heat dissipation layer is surrounded by the protective layer.

[0029] To maximize the area of ​​the heat dissipation layer, the width of the protective layer needs to be relatively small; the area around the edge of the protective layer is insufficient to completely cover the suction nozzle of the adsorption device. Therefore, the suction nozzle of the adsorption device typically adsorbs the base layer of the area where the heat dissipation layer is located.

[0030] In the structure of a display module, heat dissipation components are typically bonded to the non-display side of the display panel. During the bonding process, an adsorption device is used to attach the heat dissipation component to the back of the display panel. Furthermore, when the display panel with the attached heat dissipation component needs to be transported, the adsorption device is used to lift the heat dissipation component and carry the display panel for transport. During this process, one side of the heat dissipation component is fixed by the suction nozzle of the device. Under the weight of the heat dissipation component and the display panel, tensile stress is generated within the heat dissipation component, primarily concentrated at the nozzle location. Moreover, because the cohesion of the heat dissipation layer (e.g., a graphite-based heat dissipation layer) is relatively poor, it is easily damaged at the nozzle, leading to defects such as blistering at the nozzle.

[0031] Based on this, the present disclosure provides a heat dissipation assembly, including: a base layer; a heat dissipation layer and a protective layer located on a first surface of the base layer, wherein the protective layer is generally annular and has a protrusion protruding toward the inner side of the annulus, and the heat dissipation layer is surrounded by the protective layer and has a groove that engages with the protrusion.

[0032] The following describes some specific embodiments of the display panel and its preparation method according to this disclosure.

[0033] Figure 1 This is a cross-sectional view of a heat dissipation assembly provided in at least one embodiment of this disclosure; Figure 2 This is a plan view of the heat dissipation layer and protective layer in a heat dissipation assembly provided in at least one embodiment of the present disclosure.

[0034] like Figure 1 and Figure 2 As shown, the heat dissipation assembly 1, also known as an SCF (Surface Conductive Film) assembly, includes a base layer 11, which has opposing first and second surfaces. A heat dissipation layer 12 and a protective layer 13 are attached to the first surface of the base layer 11. The protective layer 13 is generally annular, surrounding the heat dissipation layer 12 to protect it. The heat dissipation layer 12 absorbs locally generated heat and rapidly transfers it to all parts of the heat dissipation layer 12, thereby accelerating heat release and reducing the possibility of excessively rapid local temperature rise.

[0035] A first adhesive layer is provided between the base layer 11 and the protective layer 13, as well as between the base layer 11 and the heat dissipation layer 12, to adhere the heat dissipation layer 12 and the protective layer 13 to the base layer 11. For example, the base layer 11 is configured with a single-sided adhesive structure, and the adhesive on the side of the base layer 11 facing the protective layer 13 and the heat dissipation layer 12 is the first adhesive layer. For example, the material of the first adhesive layer is PSA (Pressure Sensitive Adhesive).

[0036] For example, the base layer 11 is a conductive layer made of metals such as copper. The heat dissipation layer 12 is made of materials with fast thermal conductivity and good heat dissipation, such as graphite. The protective layer 13 is made of materials with strong cohesion, such as PET (polyethylene-glycol-terephthalate).

[0037] For example, the heat dissipation layer 12 and the protective layer 13 have the same thickness. Even if the heat dissipation component 1 is deformed by an external force, the heat dissipation layer 12 and the protective layer 13 are not prone to delamination.

[0038] For example, the heat dissipation layer 12 includes a first heat dissipation area 121, a second heat dissipation area 122, and a third heat dissipation area 123, with the base layer 11 surrounding both the first and second heat dissipation areas 121 and 122. The first heat dissipation area 121 has the largest area and is located in the center of the base layer 11, while the second and third heat dissipation areas 122 and 123 are located at the top of the base layer 11. When the heat dissipation component 1 is installed on the display panel 2, the first heat dissipation area 121 corresponds to at least a portion of the display area 21 of the display panel 2 to assist the display panel 2 in heat dissipation; the second heat dissipation area 122 corresponds to the area where the in-screen camera is located to assist the in-screen camera in heat dissipation; and the third heat dissipation area 123 corresponds to the area where the in-screen photosensitive element is located to assist the in-screen photosensitive element in heat dissipation.

[0039] In the example disclosed herein, the protective layer 13 is arranged in a ring shape, with a protruding portion 130 facing the inner side of the ring. The heat dissipation layer 12 has a recessed portion 120 that fits into the protruding portion 130. The area of ​​the protruding portion 130 is sufficient to cover the suction nozzle of the adsorption device. During the adsorption process of the heat dissipation component 1, the adsorption position of the suction nozzle of the adsorption device is located in the area of ​​the base layer 11 corresponding to the protruding portion 130. Because the protective layer 13 has high cohesion and can withstand high internal stress, the protective layer 13 is not easily damaged during the transfer of the heat dissipation component 1 by the adsorption device, thereby improving the yield of the heat dissipation component 1.

[0040] For example, the recessed portion 120 is located in the first heat dissipation area 121, and the protrusion 130 is located on the inner side of the protective layer 13 surrounding the first heat dissipation area 121, so that there is enough area to provide the protrusion 130 to ensure that the protrusion 130 can cover the area adsorbed by the suction nozzle.

[0041] For example, the protrusion 130 includes a first group of protrusions 130 and a second group of protrusions 130 spaced apart along the long side direction (i.e., the X direction) of the protective layer 13, wherein the first group of protrusions 130 and the second group of protrusions 130 each include two protruding sub-parts arranged opposite each other along the short side direction (i.e., the Y direction) of the protective layer 13. For example, the shape of the protruding sub-parts is rectangular, circular, or semi-circular.

[0042] It should be noted that the area and number of protrusions 130 are related to the size and number of suction nozzles of the adsorption device. The larger the area of ​​the suction nozzles of the adsorption device, the larger the area of ​​the protrusions 130 needs to be; at the same time, the more suction nozzles of the adsorption device, the more protrusions 130 need to be provided. Of course, the size and number of suction nozzles of the adsorption device are related to the area of ​​the heat dissipation component 1, and also to the weight of the component (such as the display panel) to which the heat dissipation component 1 is attached. Calculations and designs are required based on the adsorption force of the adsorption device and the weight of the component (such as the display panel) to which the heat dissipation component 1 is attached.

[0043] In some examples, the heat dissipation assembly 1 further includes a buffer layer 14 located on the side of the heat dissipation layer 12 away from the base layer 11, and the buffer layer 14 covers the heat dissipation layer 12 and the protective layer 13. The buffer layer 14 is used to buffer impacts on the heat dissipation layer 12 and the protective layer 13, and can also buffer impacts on components (such as display panels) to which the heat dissipation assembly 1 is attached. For example, the buffer layer 14 is made of a material with a certain degree of deformation capability, such as foam.

[0044] For example, a second adhesive layer is provided between the protective layer 13 and the buffer layer 14, and / or between the heat dissipation layer 12 and the buffer layer 14, to adhere the protective layer 13 and the buffer layer 14 and / or the heat dissipation layer 12 and the buffer layer 14. For example, the heat dissipation layer 12 and / or the protective layer 13 have a single-sided adhesive structure, and the adhesive on the side of the heat dissipation layer 12 and / or the protective layer 13 facing the buffer layer 14 is the second adhesive layer. For example, the material of the second adhesive layer is PSA (Pressure Sensitive Adhesive).

[0045] For example, a mesh adhesive layer 15 is provided on the side of the buffer layer 14 away from the base layer 11 to provide support for the buffer layer 14, and also has a certain adhesive force to attach the heat dissipation component 1 to the component to be attached (such as the display panel).

[0046] In summary, the heat dissipation component 1 provided in this disclosure has the following advantages:

[0047] A protruding portion 130 is provided on the inner side of the protective layer 13, and the heat dissipation layer 12 has a groove portion 120 that fits into the protruding portion 130. During the adsorption process of the heat dissipation component 1, the suction nozzle of the adsorption device is located in the area of ​​the base layer 11 corresponding to the protruding portion 130. Because the protective layer 13 has high cohesion and can withstand high internal stress, the protective layer 13 is not easily damaged during the transfer of the heat dissipation component 1 by the adsorption device, thereby improving the yield of the heat dissipation component 1.

[0048] Figure 3 This is a plan view of the display panel in the display module provided in at least one embodiment of the present disclosure after it has been unfolded. Figure 4 This is a cross-sectional view of a display module provided in at least one embodiment of the present disclosure.

[0049] This disclosure also provides a display module, such as Figure 3 and Figure 4 As shown, the display module includes a display panel 2 and the aforementioned heat dissipation component 1. The heat dissipation component 1 is located on the backlight side of the display panel 2, wherein the mesh adhesive layer 15 is attached to the backlight side of the display panel 2.

[0050] Display panel 2 is specifically a flexible display panel, including a display area 21 and a bonding area. The bonding area includes a bending area 22 and a non-bending area 23. The bending area 22 bends towards the non-display side of the display module, causing the non-bending area 23 to bend to the non-display side of the display module. Since most of the bonding area is hidden to the non-display side of the display module after bending, the display area 21 of display panel 2 occupies a larger proportion on the display side of the display module, resulting in a better display effect for the display module.

[0051] The heat dissipation component 1 covers the display panel 2 located in the display area 21 to provide support and cushioning for the display panel 2, while also helping to dissipate heat from the display panel 2.

[0052] An optical adhesive layer 3 and a cover plate 4 are sequentially disposed on the display side of the display panel 2. The cover plate 4 typically extends beyond the optical adhesive layer 3 to protect the internal structure of the display module.

[0053] In some examples, a portion of the non-bending area 23 covers a portion of the heat dissipation component 1. In this case, a support plate 5 can be provided between the non-bending area 23 and the heat dissipation component 1 to support the non-bending area 23, thereby maintaining the stability of the bending area 22.

[0054] In some embodiments, the display module further includes a circuit board 6, which is coupled to the bonding area of ​​the display panel 2. For example, the circuit board 6 may be a printed circuit board (PCB) or a flexible printed circuit board (FPC).

[0055] For example, circuit board 6 includes a ground terminal, and the base layer 11 in heat dissipation assembly 1 is coupled to the ground terminal on circuit board 6, so that the base layer 11 is at zero potential.

[0056] At least one embodiment of this disclosure also provides a display device, including the display module described above. The display device can be any product or component with display functionality, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator; the embodiments of this disclosure do not limit this.

[0057] The display panel 2 provided in the embodiments of this disclosure, or the display panel 2 obtained by the preparation method provided in the embodiments of this disclosure, can be used in a display device. The display device can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. The embodiments of this disclosure do not limit this.

[0058] The following points also need to be explained:

[0059] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0060] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0061] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0062] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A heat dissipation component, characterized in that, include: Grassroots (11); A heat dissipation layer (12) and a protective layer (13) are located on the first surface of the base layer (11), wherein the protective layer (13) is generally annular and has a protrusion (130) protruding toward the inner side of the annulus, and the heat dissipation layer (12) is surrounded by the protective layer (13) and has a groove (120) that fits into the protrusion (130).

2. The heat dissipation assembly according to claim 1, characterized in that, The thickness of the heat dissipation layer (12) is the same as the thickness of the protective layer (13).

3. The heat dissipation assembly according to claim 1 or 2, characterized in that, The protrusion (130) includes a first group of protrusions and a second group of protrusions spaced apart along the long side of the protective layer (13), wherein the first group of protrusions and the second group of protrusions each include two protruding sub-parts arranged opposite each other along the short side of the protective layer (13).

4. The heat dissipation assembly according to claim 3, characterized in that, The protruding part is rectangular, circular, or semi-circular in shape.

5. The heat dissipation assembly according to claim 1, characterized in that, The heat dissipation component also includes: A buffer layer (14) covering the heat dissipation layer (12) and the protective layer (13); and / or, A mesh adhesive layer (15) covers the buffer layer (14).

6. The heat dissipation assembly according to claim 5, characterized in that, The buffer layer (14) is made of foam.

7. The heat dissipation assembly according to claim 5 or 6, characterized in that, Also includes: A first adhesive layer located between the base layer (11), the protective layer (13), and the heat dissipation layer (12); and / or, A second adhesive layer located between the protective layer (13), the heat dissipation layer (12), and the buffer layer (14).

8. The heat dissipation assembly according to claim 1, characterized in that, The base layer (11) is a conductive layer; and / or, The heat dissipation layer (12) is made of graphite; and / or, The protective layer (13) is made of PET.

9. A display module, characterized in that, include: Display panel (2); The heat dissipation component as described in any one of claims 1 to 7 is located on the backlight side of the display panel (2).

10. The display module according to claim 9, characterized in that, The display module also includes: The circuit board (6) is coupled to the bonding area of ​​the display panel (2), and the ground terminal in the circuit board (6) is coupled to the base layer (11) in the heat dissipation assembly.

11. A display device, characterized in that, Includes the display module as described in claim 9 or 10.

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