Functional film and display device

Abstract

The functional film comprises a composite adhesive tape layer and a buffer structure. The composite adhesive tape layer comprises a first sub-layer, a second sub-layer and a third sub-layer which are arranged in a stacked mode. The buffer structure is positioned on one side of the composite adhesive tape layer along the thickness direction of the composite adhesive tape layer, or is positioned in the composite adhesive tape layer, or is positioned between the first sub-layer and the second sub-layer, or is positioned between the second sub-layer and the third sub-layer.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a functional film and a display device. BACKGROUND

[0002] Organic Light Emitting Diode (OLED) display technology is a technology that uses light-emitting materials to emit light under the drive of current to realize display. OLED display has the advantages of ultra-light, ultra-thin, high brightness, large viewing angle, low voltage, low power consumption, fast response, high definition, shock resistance, bendable, low cost, simple process, less use of raw materials, high luminous efficiency, and wide temperature range. SUMMARY

[0003] In one aspect, a functional film is provided. The functional film comprises: a composite adhesive tape layer and a buffer structure. The composite adhesive tape layer comprises: a first sub-layer, a second sub-layer and a third sub-layer which are stacked. The buffer structure is located on one side of the composite adhesive tape layer along the thickness direction of the composite adhesive tape layer or is located in the composite adhesive tape layer, or is located between the first sub-layer and the second sub-layer, or is located between the second sub-layer and the third sub-layer.

[0004] In some embodiments, the buffer structure comprises a plurality of solid portions. The plurality of solid portions are arranged at intervals.

[0005] In some embodiments, the material of the solid portion comprises a metal material, a plastic foamed material or a glue material.

[0006] In some embodiments, the buffer structure comprises a plurality of solid portions. The plurality of solid portions are connected as a whole.

[0007] In some embodiments, a plurality of hole portions are arranged on the solid portion.

[0008] In some embodiments, among any adjacent three hole portions, the distance between any two adjacent hole portions is not equal, and / or the size of any two adjacent hole portions is not equal.

[0009] In some embodiments, the shape of the hole portion in the orthographic projection plane of the buffer structure comprises: a circle or a polygon.

[0010] In some embodiments, a plurality of grooves are arranged on the solid portion, and the grooves are recessed along the direction perpendicular to the thickness direction of the solid portion.

[0011] In some embodiments, the size of any two adjacent grooves is not equal.

[0012] In some embodiments, the material of the solid portion comprises a foamed material.

[0013] In some embodiments, the material of the first sublayer and the material of the third sublayer are the same.

[0014] In some embodiments, the material of the first sublayer includes a polymer material, and the material of the second sublayer includes a metallic material.

[0015] In some embodiments, the cushioning structure is located on one side of the composite tape layer. The cushioning structure includes: a plurality of solid portions and a flat plate layer connected to the plurality of solid portions. The flat plate layer is located between the composite tape layer and the plurality of solid portions.

[0016] In some embodiments, the material of the flat plate layer is the same as the material of the solid portion.

[0017] In some embodiments, the material of the flat sheet layer includes a metal material, a plastic material, or a foam material.

[0018] On the other hand, a display device is provided. The display device includes: a display panel, a circuit board, and a functional film as described in any of the above embodiments. The circuit board is located on the non-light-emitting side of the display panel, and the functional film is located on the side of the circuit board away from the display panel. The functional film includes: a composite adhesive tape layer and a buffer structure. The buffer structure is located on one side of the composite adhesive tape layer along its thickness direction or within the composite adhesive tape layer.

[0019] In some embodiments, the circuit board includes a plurality of spaced-apart devices. The buffer structure includes a plurality of solid portions. The plurality of solid portions are spaced apart. Along the thickness direction of the circuit board, one of the devices is at least partially opposite to one of the solid portions.

[0020] In some embodiments, the circuit board includes a plurality of spaced-apart devices. The buffer structure includes: a plurality of solid portions and a flat plate layer connected to the plurality of solid portions. The flat plate layer is located between the composite tape layer and the plurality of solid portions. The buffer structure is located on the side of the composite tape layer closest to the circuit board. The solid portions are located between two adjacent devices. The surface of the solid portion away from the composite tape layer contacts the circuit board.

[0021] In some embodiments, there is a gap between the physical portion and the device.

[0022] In some embodiments, a gap exists between the planar layer and the device. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are merely drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. Furthermore, the drawings described below can be considered as schematic diagrams and are not intended to limit the actual dimensions, etc., of the products involved in the embodiments of this disclosure.

[0024] Figure 1 This is a structural diagram of a display device according to some embodiments of the present disclosure;

[0025] Figure 2 This is a structural diagram of another display device according to some embodiments of the present disclosure;

[0026] Figure 3 This is a structural diagram of another display device according to some embodiments of the present disclosure;

[0027] Figure 4 This is a partial structural diagram of a display device according to one possible implementation.

[0028] Figure 5 This is a structural diagram of a functional membrane according to some embodiments of the present disclosure;

[0029] Figure 6 This is a structural diagram of another functional membrane according to some embodiments of the present disclosure;

[0030] Figure 7 This is a structural diagram of a functional membrane and circuit board according to some embodiments of the present disclosure;

[0031] Figure 8 This is a structural diagram of the composite tape layer and circuit board according to one possible implementation;

[0032] Figure 9 This is a structural diagram of another functional membrane according to some embodiments of the present disclosure;

[0033] Figure 10 This is a structural diagram of another functional membrane and circuit board according to some embodiments of this disclosure;

[0034] Figure 11 This is a structural diagram of another functional membrane according to some embodiments of the present disclosure;

[0035] Figure 12 This is a structural diagram of the composite tape layer before and after being subjected to external force compression, according to one possible implementation.

[0036] Figure 13 This is a structural diagram of another functional membrane according to some embodiments of the present disclosure;

[0037] Figure 14 This is a structural diagram of a buffer structure and a circuit board according to some embodiments of the present disclosure;

[0038] Figure 15 This is a structural diagram showing the buffer structure mounted on a circuit board according to some embodiments of this disclosure;

[0039] Figure 16 This is a structural diagram showing the composite tape layer mounted to a flat plate layer according to some embodiments of this disclosure;

[0040] Figure 17 This is a structural diagram of a functional membrane and circuit board according to some embodiments of the present disclosure before being pressed by an external force;

[0041] Figure 18 According to Figure 17 The diagram shows the structure of the functional membrane and circuit board after being pressed by external force. Detailed Implementation

[0042] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0043] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0044] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0045] In describing some embodiments, the terms "coupled" and "connected," and their derivative expressions, may be used. The term "connected" should be interpreted broadly; for example, a "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection via an intermediate medium. The term "coupled," for example, indicates that two or more components have direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0046] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0047] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0048] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0049] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0050] like Figure 1As shown, some embodiments of this disclosure provide a display device 1000, which can be any display device that displays images, whether moving (e.g., video) or fixed (e.g., still images), and whether text or images. More specifically, the display device of the embodiments is contemplated to be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controllers and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0051] The display device 1000 includes a display panel 100 and a cover plate.

[0052] In some examples, the display panel 100 may be an organic light-emitting diode (OLED) display panel.

[0053] In other examples, the display panel 100 may be a liquid crystal display (LCD) panel.

[0054] The cover plate is located on the light-emitting side of the display panel 100. The cover plate protects the display panel 100 from damage such as external impacts. The cover plate can be made of glass.

[0055] like Figure 2 As shown, the display device 1000 may further include a circuit board 200. The circuit board 200 is located on the non-light-emitting side of the display panel 100. The circuit board 200 is connected to the display panel 100 and is used to transmit display drive signals, etc., to the display panel 100. The circuit board 200 may be a printed circuit board (PCB).

[0056] In some examples, such as Figure 2 As shown, a plurality of devices 210 are disposed on the circuit board 200, with the devices 210 spaced apart from each other. These devices 210 can be electronic components, such as chips, resistors, or capacitors, to form a printed circuit board assembly (PCBA). The height or thickness of each device 210 is not equal.

[0057] In some examples, such as Figure 3 As shown, the display device 1000 has two display panels 100, which are arranged opposite to each other along their thickness direction, so that both outer surfaces of the display device along its thickness direction can display images. Figure 3 In the diagram, 100A is the light-emitting side of the display device. This display device can be referred to as a dual-screen display device.

[0058] The display device 1000 also includes two circuit boards 200 located between two display panels and on opposite sides of each other along a first direction X. One circuit board 200 is connected to one display panel 100. The first direction X is perpendicular to the thickness direction Z of the display panel.

[0059] In one possible implementation, such as Figure 4 As shown, the display device 1000' also includes a composite tape layer 300'. The composite tape layer 300' has a certain degree of elasticity. The composite tape layer 300' is located on the side of the circuit board away from the display panel 100 (here, the display panel is the one connected to the circuit board), and the composite tape layer 300' is attached to multiple components on the circuit board. The different components have different heights, causing the composite tape layer 300' to undulate with the height of the components, making it easy for wrinkles to form on the portions of the composite tape layer 300' located on components at different heights (see reference). Figure 4 The area within the dashed box represents the folds. Gas may remain within these folds. During installation or use, if the user presses on the display device, such as pressing on a fold or its corresponding area, the folds are prone to deformation. After the pressure is removed, the adhesive tape layer may spring back, creating a rattling sound. Hearing this noise can lead users to question the product's quality, thus negatively impacting the user experience.

[0060] Based on this, such as Figure 5 As shown, an embodiment of this disclosure provides a functional film 300, which can be used in the above-mentioned display device 1000. The functional film 300 is located on the side of the circuit board 200 away from the display panel 100.

[0061] The functional membrane 300 includes: a composite tape layer 310 and a buffer structure 320.

[0062] The integrated circuit cover tape can be used to shield external electric fields or electromagnetic waves, preventing external electric fields from affecting the function of the printed circuit board 200. It can also isolate the printed circuit board 200 from other conductive structures and conduct heat out of the circuit board 200 and the display panel 100, thus playing a heat dissipation role and preventing heat from accumulating in the circuit board 200 and affecting its operation.

[0063] The structure of the composite tape layer 310 can be varied and can be configured according to actual needs. The embodiments disclosed herein do not limit this.

[0064] In some examples, the composite tape layer 310 described above includes a first sublayer and a second sublayer stacked together. The first sublayer is used to provide insulation, and the second sublayer is used to provide heat dissipation.

[0065] In other examples, such as Figure 5 As shown, the composite tape layer 310 includes a first sublayer 311, a second sublayer 312, and a third sublayer 313 stacked together. As an example, the first sublayer 311 and the third sublayer 313 of the composite tape layer 310 are used to achieve insulation and electromagnetic wave shielding functions, while the second sublayer 312 is used to achieve heat dissipation. The examples disclosed herein do not constitute a limitation on the specific functions of each sublayer. For example, in some examples, the composite tape layer may include more or fewer sublayers, or it may include sublayers for other functions. Furthermore, the positions of the sublayers in the composite tape layer can be combined in other ways.

[0066] The buffer structure 320 is located on one side of the composite tape layer 310, or the buffer structure 320 is located inside the composite tape layer 310. For example, the buffer structure 320 is located on the side of the composite tape layer 310 closer to the circuit board 200. Alternatively, the buffer structure 320 is located on the side of the composite tape layer 310 away from the circuit board 200. Furthermore, the buffer structure 320 is located between the first sub-layer 311 and the second sub-layer 312, or between the second sub-layer 312 and the third sub-layer 313.

[0067] The buffer structure 320 can buffer or absorb external forces applied to the functional membrane 300. After the external force is removed, the functional membrane 300 hardly rebounds, thus making the functional membrane 300 hardly make any abnormal noise. Alternatively, after the external force is removed, the functional membrane 300 rebounds slowly or with a small rebound amplitude, making the abnormal noise emitted by the functional membrane 300 during the rebound process less, thereby improving the user experience.

[0068] Embodiments of this disclosure provide a functional film 300 applied in a display 1000. The functional film 300 is located on the side of the circuit board 200 away from the display panel 100. The functional film 300 includes a composite tape layer 310 and a buffer structure 320. The composite tape layer 310 is used to shield the circuit board from external electric fields, isolate it from conductive structures, and dissipate heat. The buffer structure 320 is also provided on one side of the composite tape layer 310 along its thickness direction or within the composite tape layer 310, so that the buffer structure 320 buffers or absorbs external forces. This ensures that the functional film 300 does not rebound or has a small rebound speed and rebound amplitude after the external force is removed, thereby making the functional film 300 produce almost no abnormal noise or very little abnormal noise, thus improving the user experience.

[0069] For example, the material of the second sub-layer 312 mentioned above includes a metallic material. This metallic material can be copper foil, etc. Copper foil has good thermal conductivity, which can quickly conduct heat transferred from the circuit board 200 to the functional film 300 and diffuse it to the outside, avoiding heat accumulation that could affect the function of the circuit board 200.

[0070] The materials of the first sublayer 311 and the third sublayer 313 may be different.

[0071] For example, the materials of the first sublayer 311 and the third sublayer 313 can also be the same.

[0072] The material of the first sublayer 311 can be an insulating material. This insulating material includes polymer materials. For example, the material of the first sublayer 311 can be a polyester film, such as polyethylene terephthalate (PET) film. The material of the third sublayer 313 can also be a polyethylene terephthalate polyester film.

[0073] Therefore, the composite tape layer 310 can have better insulation and electromagnetic wave shielding functions, avoid interference from external electric and magnetic fields to the circuit board 200, and improve the quality of the displayed image of the display device 1000.

[0074] There are various ways to configure the buffer structure 320, which can be configured according to actual needs. The embodiments disclosed herein do not limit this.

[0075] like Figure 6 As shown, the buffer structure 320 includes multiple solid portions 321. For example, the solid portion 321 is a plate-like structure with a certain thickness. The orthographic projection shape of the solid portion 321 onto the plane where the display panel is located can be circular, rectangular, or the like.

[0076] In some embodiments, such as Figure 6 and Figure 9As shown, multiple solid parts 321 are spaced apart. For example, there is a gap between two adjacent solid parts 321.

[0077] For example, such as Figure 7 As shown, along the thickness direction Z of the circuit board 200, the top surface of a device 210 contacts a solid portion 321, and the device 210 and the solid portion 321 are at least partially opposite each other. For example, the orthographic projection of the device 210 onto the plane where the display panel 100 is located partially overlaps with the orthographic projection of the solid portion 321 onto the plane where the display panel 100 is located, or the orthographic projection of the solid portion 321 onto the plane where the display panel 100 is located falls within the orthographic projection range of the device 210 onto the plane where the display panel 100 is located, or the orthographic projection of the device 210 onto the plane where the display panel 100 is located falls within the orthographic projection range of the solid portion 321 onto the plane where the display panel 100 is located.

[0078] In one possible implementation, such as Figure 8 As shown, the composite tape layer 300' is relatively soft and bulges at the position corresponding to the device 210. There is also gas between the composite tape layer 300' and the device 210, resulting in poor adhesion between the composite tape layer 300' and the device 210. Wrinkles are easily formed on the composite tape layer 300'. When the part of the composite tape layer 300' corresponding to the device 210 is subjected to an external force along the third direction Z, the composite tape layer 300' deforms. After the external force is removed, the composite tape layer 300' rebounds, producing abnormal noise and affecting the user experience.

[0079] In the embodiments of this disclosure, such as Figure 6 and Figure 7 As shown, the functional membrane 300 includes a buffer structure 320, in which multiple solid portions 321 are spaced apart, and a device 210 is at least partially opposite to a solid portion. Thus, there is no gas between the solid portion 321 and the device 210. When an external force is applied to the position corresponding to the solid portion 321 or the device 210 in the display device, the solid portion 321 can absorb the external force with almost no deformation. After the external force is removed, the solid portion 321 hardly rebounds, thus producing almost no abnormal noise. Alternatively, the solid portion 321 can buffer the external force, resulting in very small deformation. When the external force is removed, the solid portion 321 and the functional membrane 300 rebound slowly, producing very little abnormal noise, thereby improving the user experience.

[0080] In some examples, such as Figure 7As shown, the aforementioned solid portion 321 has a certain rigidity and provides reinforcement to the functional membrane 300. Exemplarily, the material of the aforementioned solid portion 321 includes either a metal material or a plastic material. For example, the plastic material includes injection-molded sheet. This injection-molded sheet has a certain degree of hardness. The aforementioned plastic material can be polyethylene terephthalate (PET) film, etc. The aforementioned metal material can be an alloy material; optionally, the alloy material can be stainless steel, etc.

[0081] Therefore, as Figure 7 As shown, when the physical part 321 is subjected to an external force, such as pressing the functional membrane 300 or the area in the circuit board 200 corresponding to the device 210, the physical part 321 bears the external force, so that the physical part 321 or the functional membrane 300 does not deform or the deformation is very small. Therefore, after the external force is removed, the functional membrane 300 will hardly produce any abnormal noise, thereby improving the user experience.

[0082] In other examples, such as Figure 9 As shown, the aforementioned solid portion 321 has a certain degree of flexibility, exhibiting minimal or no rebound when pressed. Exemplarily, the material of this solid portion 321 includes: adhesive or foam material. The adhesive material can be a deformable adhesive, or it can be liquid silicone, etc. The foam material can be foam, etc.

[0083] Therefore, as Figure 9 and Figure 10 As shown, when subjected to external force, such as pressing the functional membrane 300 or the area in the circuit board 200 corresponding to the device 210, the solid part 321 absorbs stress and deformation, so that the functional membrane 300 slowly rebounds or does not rebound after the external force is removed, thereby producing almost no abnormal noise and improving the user experience.

[0084] In other embodiments, such as Figure 11 and Figure 12 As shown, the buffer structure 320 includes multiple solid parts 321. The multiple solid parts 321 are connected as a whole. For example, the buffer structure 320 is a single layer structure, and the orthographic projection of the buffer structure 320 on the plane where the display panel is located coincides with or substantially coincides with the orthographic projection of the composite tape layer 310 on the plane where the display panel is located.

[0085] This simplifies the fabrication process of the buffer structure 320 and the functional membrane 300. Furthermore, when any area of ​​the functional membrane 300 is subjected to external pressure, whether it's the portion of the functional membrane 300 corresponding to the device 210 or the portion corresponding to the gap between devices 210, a corresponding solid portion 321 absorbs or buffers the external force. This results in less rebound of the buffer structure 320 or the functional membrane 300, less abnormal noise, and thus improves the user experience.

[0086] In some examples, such as Figure 11 As shown, the above-mentioned solid part 321 is provided with a plurality of holes 322.

[0087] Therefore, when the solid part 321 is pressed by an external force, the external force can be released or buffered in multiple holes 322, so that the deformation of the solid part 321 is small under the action of the external force. As a result, after the external force is removed, the rebound amplitude of the solid part 321 is small and the rebound duration is short, resulting in less abnormal noise and a shorter duration of abnormal noise, or almost no abnormal noise, thereby improving the user experience.

[0088] There are various ways to arrange the multiple holes 322 on the solid part 321, which can be set according to the actual situation. The embodiments disclosed herein do not limit this.

[0089] In some examples, such as Figure 11 As shown, the spacing between any two adjacent holes 322 is not equal among the three adjacent holes 322.

[0090] For example, such as Figure 11 As shown, the three adjacent holes 322 are the first hole 3221, the second hole 3222, and the third hole 3223, respectively. The distance between the first hole 3221 and the second hole 3222 is not equal to the distance between the first hole 3221 and the third hole 3223, and is also not equal to the distance between the second hole 3222 and the third hole 3223.

[0091] In one possible implementation, such as Figure 12 As shown, when the composite tape layer 300' is subjected to external pressure, the composite tape layer 300' deforms, and the shape of the deformed composite tape layer is referenced to the composite tape layer 300A. After the external force is removed, the composite tape layer has a shape along... Figure 12 The rebound force, indicated by the dashed arrow, is in the same direction across different parts of the composite tape layer. Under the action of this rebound force, the composite tape layer springs back to the position corresponding to composite tape layer 300B, producing an abnormal sound.

[0092] In the example disclosed above, the solid portion of the buffer structure in the functional membrane 300 includes a plurality of holes 322. Among three adjacent holes 322, the spacing between any two adjacent holes 322 is not equal, thereby enabling the plurality of holes 322 to be arranged irregularly or randomly. When an external force is applied to the solid part 321, the external force is released or buffered in the multiple holes 322. Since the distance between any two adjacent holes 322 is not equal, the direction and magnitude of the external force released by each hole 322 are different. The parts of the solid part 321 located around each hole 322 deform in different directions and with different magnitudes. After the external force is removed, the parts of the solid part 321 located around each hole 322 rebound in different directions and for different durations. This makes it less likely that the parts of the solid part 321 located around holes 322 of different sizes will resonate during the rebound process. As a result, the abnormal noise emitted by the functional membrane 300 is reduced, achieving a noise reduction effect and improving the user experience.

[0093] In other examples, such as Figure 11 As shown, the dimensions of two adjacent holes 322 are not equal.

[0094] Here, the size of the hole 322 can be the area of ​​the orthographic projection of the hole 322 onto the composite tape layer 310, or it can be the size of the hole 322 in a certain direction. For example, as... Figure 11 As shown, two adjacent holes 322 are respectively the fourth hole 3224 and the fifth hole 3225. The orthographic projection area of ​​the fourth hole 3224 on the composite tape layer 310 is not equal to the orthographic projection area of ​​the fifth hole 3225 on the composite tape layer 310, or the dimension of the fourth hole 3224 in a first direction is not equal to the dimension of the fifth hole 3225 in the first direction. The first direction can be the extension direction of the buffer structure 320, and the first direction is perpendicular to the thickness direction of the composite tape layer 310.

[0095] When an external force is applied to the solid portion 321, the force is released or buffered in the multiple holes 322. Since the sizes of adjacent holes 322 are not equal, the direction and magnitude of the released force differ, causing the deformation directions and magnitudes of the portions of the solid portion 321 surrounding the holes 322 of different sizes to differ. Therefore, after the external force is removed, the rebound directions and durations of the portions of the solid portion 321 surrounding the holes 322 of different sizes also differ. This staggered rebound directions and durations result in a lower probability of resonance in the portions of the solid portion 321 surrounding the holes 322 of different sizes during rebound, a smaller overall rebound amplitude of the solid portion 321, and a shorter overall rebound duration. This reduces the noise emitted by the functional membrane 300, achieving a noise reduction effect and improving the user experience.

[0096] In some other examples, such as Figure 11 As shown, among the three adjacent holes 322, the spacing between two adjacent holes 322 is not equal, and the size of two adjacent holes 322 is not equal.

[0097] Therefore, multiple holes 322 can be arranged irregularly or randomly, and the sizes of two adjacent holes 322 are not equal. When an external force is applied to the buffer structure 320 and then removed, the parts of the solid part 321 located around different holes 322 have their rebound directions and rebound durations staggered. This can alleviate or avoid resonance between different parts of the solid part 321, thereby reducing the overall rebound amplitude of the solid part 321 and reducing the overall rebound duration of the solid part 321, resulting in less abnormal noise and improved user experience.

[0098] For example, such as Figure 11 As shown, the orthographic projection shape of the hole 322 onto the plane containing the buffer structure 320 includes: a circle or a polygon. The polygon can be a triangle, a parallelogram, a pentagon, or a hexagon, etc.

[0099] For example, the orthographic projections of two adjacent holes 322 onto the plane containing the buffer structure 320 have the same shape.

[0100] For example, the shapes of the orthographic projections of two adjacent holes 322 onto the plane of the buffer structure 320 are different. Therefore, when an external force is transmitted to these two adjacent holes 322, the two holes 322 buffer or absorb the external force differently. After the external force is removed, the rebound directions and rebound amplitudes of the portions of the solid part 321 located around the two holes 322 are different. This avoids resonance between the portions of the solid part 321 located around the two holes 322, thereby reducing the volume of abnormal noise emitted by the solid part 321 and the functional membrane 300, and improving the user experience.

[0101] In some other examples, such as Figure 13 As shown, a plurality of grooves 323 are provided on the solid part 321, and the grooves 323 are recessed along the direction perpendicular to the thickness of the solid part.

[0102] For example, the indentation direction of two adjacent grooves 323 can be the same, such as... Figure 12 The first groove 3231 and the second groove 3232 in the middle. For example, the concave directions of two adjacent grooves 323 are different, such as... Figure 12 The third groove 3233 and the fourth groove 3234 in the middle.

[0103] Therefore, when an external force is applied to the solid portion 321, the force is released or buffered in the multiple grooves 323, resulting in smaller deformation of the portion of the solid portion 321 located around the grooves 323. Consequently, after the external force is removed, the portion of the solid portion 321 located around different grooves 323 has a shorter rebound duration and a smaller rebound amplitude, thereby reducing the noise emitted by the functional diaphragm 300 and shortening its duration, achieving a noise reduction effect and improving the user experience.

[0104] For example, such as Figure 13 As shown, the dimensions of two adjacent grooves 323 are not equal. The dimensions of the groove 323 here may include the depth of the groove 323 and the dimensions of the bottom wall of the groove 323. Since the thickness of the solid portion 321 is small, the depth of the groove 323 can be the length of the groove sidewall.

[0105] For example, the depths of two adjacent trenches 323 are not equal, or the dimensions of the bottom walls of two adjacent trenches 323 are not equal.

[0106] Therefore, when an external force is applied to the solid part 321, the external force is released or buffered in multiple grooves 323. The direction and magnitude of the external force released by the grooves 323 of different sizes are different, resulting in different deformation directions and magnitudes of the portions of the solid part 321 located around the grooves 323 of different sizes. Consequently, after the external force is removed, the portions of the solid part 321 located around the grooves 323 of different sizes rebound in different directions, with the rebound directions and durations being staggered. This results in a lower probability of resonance in the portions of the solid part 321 located around the grooves 323 of different sizes during rebound, a smaller overall rebound amplitude of the solid part 321, and a shorter overall rebound duration. This reduces the noise emitted by the functional membrane 300 and shortens its duration, achieving a noise reduction effect and improving the user experience.

[0107] For example, such as Figure 13 As shown, the aforementioned solid portion 321 is provided with at least one hole 322 and at least one groove 323. Therefore, the hole 322 and the groove 323 can respectively buffer external forces, resulting in a smaller rebound amplitude and shorter rebound duration of the solid portion 321. This reduces the noise emitted by the functional membrane 300 and shortens its duration, achieving a noise reduction effect and improving the user experience.

[0108] For example, the material of the above-mentioned physical part 321 includes a foamed material.

[0109] The foamed material has a strong sound-absorbing effect, which can further reduce the noise generated by the functional membrane 300 during the rebound process.

[0110] For example, the aforementioned foaming materials include foam.

[0111] In some other embodiments, such as Figures 14-16 As shown, the buffer structure 320 includes: a plurality of solid parts 321 and a flat plate layer 324 connected to the plurality of solid parts 321.

[0112] For example, the flat plate layer 324 is a flat plate structure with a certain thickness, and its two surfaces perpendicular to the thickness direction are relatively flat. The solid portion 321 is a columnar structure with a larger thickness. The thickness of the solid portion 321 is greater than or equal to the thickness of the flat plate layer 324.

[0113] The thickness of the multiple solid parts 321 is equal or approximately equal. The shape of the orthographic projection of the solid part 321 onto the plane of the display panel includes: a circle or a rectangle.

[0114] In some examples, such as Figure 16As shown, the buffer structure 320 is located on one side of the composite tape layer 310. The flat plate layer 324 is located between the composite tape layer 310 and the plurality of solid parts 321.

[0115] Therefore, the composite tape layer 310 can cover the flat plate layer 324 in the buffer structure 320 relatively smoothly, resulting in fewer wrinkles on the composite tape layer 310, or wrinkles are not easily formed on the composite tape layer 310. In this way, when the composite tape layer 310 or the functional film 300 is pressed by external force, it is not easy to press onto the aforementioned wrinkles, thereby reducing the probability of abnormal noise and improving the user experience.

[0116] Figures 14-16 The structural diagram shown illustrates the process of installing the functional membrane 300. Specifically, Figure 14 This indicates the preparation of a buffer structure 320. Figure 15 This indicates that the buffer structure 320 is mounted onto the circuit board 200. Figure 16 This indicates that the composite tape layer 310 is installed on the flat plate layer 324 of the buffer structure 320, thus completing the installation of the functional membrane 300.

[0117] In some examples, such as Figure 16 As shown, the aforementioned buffer structure 320 is located on the side of the composite tape layer 310 closest to the circuit board 200, and the solid portion 321 is located between two adjacent devices 210 in the circuit board 200. The surface of the solid portion 321 away from the composite tape layer 310 is in contact with the circuit board 200.

[0118] Therefore, the solid portion 321 fills the gap between two adjacent devices 210, which to a certain extent allows the surface of multiple devices 210 away from the display panel to be nearly flush with or flush with the surface of the solid portion 321 near the flat layer 324. The height difference between the multiple devices 210 and the solid portion 321 is small, so that the flat layer 324 is placed on a relatively flat surface. The surface of the flat layer 324 away from the circuit board is relatively flat, which in turn makes the composite tape layer 310 attached to the flat layer 324 relatively flat, resulting in fewer wrinkles in the composite tape layer 310. Thus, when the composite tape layer 310 or the functional film 300 is pressed by external force, it is not easy to press into the aforementioned wrinkles, thereby reducing the probability of abnormal noise and improving the user experience.

[0119] In some examples, such as Figure 15 As shown, there is a gap between the physical part 321 and the device 210. Therefore, the physical part 321 and the device 210 do not come into contact, avoiding the physical part 321 from squeezing the device 210, thus avoiding affecting the function of the device 210 and ensuring the normal operation of the circuit board.

[0120] In some examples, the thicknesses of the multiple devices 210 are not equal. The thickness of the solid portion 321 is greater than the thickness of any one of the devices 210. A gap exists between the planar layer 324 and the devices 210.

[0121] Therefore, the flat plate layer 324 can be supported by multiple solid parts 321, avoiding the flat plate layer 324 from squeezing the device 210, thus avoiding affecting the function of the device 210 and ensuring the normal operation of the circuit board.

[0122] For example, the material of the flat plate layer 324 is the same as the material of the solid portion 321. Therefore, the flat plate layer and the solid portion 321 can be formed using the same or similar processes, which helps to simplify the fabrication process of the buffer structure 320.

[0123] The material of the flat layer 324 may include metal, plastic, or foam. The material of the solid part 321 may also include metal, plastic, or foam.

[0124] The aforementioned metallic materials include alloy materials, such as stainless steel, molybdenum-containing stainless steel, chromium- and nickel-containing stainless steel, and galvanized steel. The metallic materials have a high surface finish and low roughness. During the application of the composite tape layer 310 to the flat plate layer 324 composed of this metallic material, the adhesion between the composite tape layer 310 and the flat plate layer 324 is smoother, which helps reduce the number of wrinkles formed on the composite tape layer 310.

[0125] The aforementioned plastic materials include: film materials formed by die-cutting processes, and injection molded parts formed by injection molding processes. Film materials may include: thermoplastic polyurethane (PU), polyethylene terephthalate, etc. Injection molded parts include polycarbonate (PC), acrylonitrile butadiene styrene copolymer (ABS), etc. Injection molded parts may undergo sanding or polishing treatments to achieve a high surface smoothness and low roughness. During the process of setting the composite tape layer 310 on the flat layer 324 formed by the injection molded part, the adhesion between the composite tape layer 310 and the flat layer 324 is smoother, which helps to reduce the number of wrinkles formed on the composite tape layer 310.

[0126] The aforementioned foaming materials include: foam, PU foam, or polyethylene (PE) foam, etc. The Shore hardness range of the foaming materials is 20 to 30 degrees. For example, the Shore hardness of the foaming materials can be 20, 25, or 30 degrees. The foaming materials can absorb stress and stress-induced deformation, resulting in less or slower rebound of the composite tape layer 310 or functional film 300, thereby reducing or eliminating abnormal noise.

[0127] The material of the solid part 321 can also be a high-strength metal, thereby providing effective support for the flat layer 324. This metal material can also have electromagnetic interference resistance, preventing the circuit board from being affected by external electromagnetic interference.

[0128] The material of the solid portion 321 may also be different from the material of the flat layer 324. For example, the material of the solid portion 321 may be metal, while the material of the flat layer 324 may be plastic or foam.

[0129] refer to Figure 17 The flat layer 324 is made of foamed material, and the solid part 321 is made of metal. The composite adhesive tape layer 310 is attached to the side of the flat layer 324 away from the solid part 321 to press the functional film 300. The specific pressing position is shown in the reference [reference needed]. Figure 17 The area enclosed by the dashed line. Refer to the image after pressing. Figure 18 The area enclosed by the dashed box contains the 324-layer flat plate, which absorbs external forces and deforms. After deformation, it does not spring back or has minimal springback, producing almost no or very little noise, thus improving the user experience.

[0130] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A functional membrane, characterized in that, The functional membrane includes: A composite tape layer; the composite tape layer includes: a first sub-layer, a second sub-layer, and a third sub-layer stacked together; The buffer structure is located on one side of the composite tape layer along its thickness direction, or between the first sub-layer and the second sub-layer, or between the second sub-layer and the third sub-layer.

2. The functional membrane according to claim 1, characterized in that, The buffer structure includes multiple solid parts; the multiple solid parts are spaced apart.

3. The functional membrane according to claim 2, characterized in that, The material of the solid part includes metal, plastic foam, or adhesive.

4. The functional membrane according to claim 1, characterized in that, The buffer structure includes multiple solid parts; the multiple solid parts are connected as one unit.

5. The functional membrane according to claim 4, characterized in that, The solid part is provided with multiple holes.

6. The functional membrane according to claim 5, characterized in that, In three adjacent holes, the spacing between any two adjacent holes is not equal; and / or, the dimensions of two adjacent holes are not equal.

7. The functional membrane according to claim 5 or 6, characterized in that, The orthographic projection shape of the hole on the plane of the buffer structure includes: a circle or a polygon.

8. The functional membrane according to claim 4, characterized in that, The solid part is provided with a plurality of grooves, which are recessed along the direction perpendicular to the thickness of the solid part.

9. The functional membrane according to claim 8, characterized in that, The dimensions of two adjacent trenches are not equal.

10. The functional membrane according to claim 4, characterized in that, The material of the solid part includes foamed material.

11. The functional membrane according to claim 1, characterized in that, The material of the first sublayer is the same as that of the third sublayer.

12. The functional membrane according to claim 11, characterized in that, The material of the first sublayer includes a polymer material, and the material of the second sublayer includes a metallic material.

13. The functional membrane according to claim 1, characterized in that, The buffer structure is located on one side of the composite tape layer along its thickness direction; The buffer structure includes: a plurality of solid parts and a flat plate layer connected to the plurality of solid parts; The flat plate layer is located between the composite tape layer and the plurality of solid parts.

14. The functional membrane according to claim 13, characterized in that, The material of the flat plate layer is the same as the material of the solid portion.

15. The functional membrane according to claim 14, characterized in that, The material of the flat plate layer includes metal, plastic or foam.

16. A display device, characterized in that, The display device includes: Display panel; A circuit board is located on the non-light-emitting side of the display panel; and, The functional film as described in any one of claims 1 to 15; the functional film is located on the side of the circuit board away from the display panel; the functional film comprises: a composite tape layer and a buffer structure; the composite tape layer comprises: a first sub-layer, a second sub-layer and a third sub-layer stacked thereon; the buffer structure is located on one side of the composite tape layer along its thickness direction, or, located between the first sub-layer and the second sub-layer, or, located between the second sub-layer and the third sub-layer.

17. The display device according to claim 16, characterized in that, The circuit board includes multiple devices spaced apart; the buffer structure includes multiple solid portions; the multiple solid portions are spaced apart. Along the thickness direction of the circuit board, one of the devices is at least partially opposite to one of the physical portions.

18. The display device according to claim 16, characterized in that, The circuit board includes multiple devices spaced apart. The buffer structure includes: a plurality of solid parts and a flat plate layer connected to the plurality of solid parts; the flat plate layer is located between the composite tape layer and the plurality of solid parts; The buffer structure is located on the side of the composite tape layer closest to the circuit board; the solid part is located between two adjacent devices; the surface of the solid part away from the composite tape layer is in contact with the circuit board.

19. The display device according to claim 18, characterized in that, There is a gap between the physical part and the device.

20. The display device according to claim 18 or 19, characterized in that, There is a gap between the flat plate layer and the device.

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