Wafer cleaning device

Abstract

The utility model relates to the technical field of wafer cleaning, in particular to a wafer cleaning device. Comprising a lifting mechanism and a cleaning mechanism, the lifting mechanism can controllably ascend and descend in the direction close to or away from the cleaning mechanism, and the lifting mechanism comprises a lifting body; the bearing mechanism is used for bearing the wafer and comprises a plurality of bearing rods connected to the lifting body, and the bearing rods are distributed in the arc direction of the bottom of the wafer. According to the utility model, the bearing mechanism is provided with a plurality of bearing rods, so that the contact surface is reduced, and the liquid medicine can wash the contact points and dead angles of the wafer, thereby achieving a better cleaning effect.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning technology, and specifically to a wafer cleaning device. Background Technology

[0002] In semiconductor wet process equipment, the cleanliness of the cleaning or the uniformity of the etching determines the product's potential and ultimately affects the chip's positioning and performance. The wafer's mounting method determines the equipment's cleaning capabilities, indirectly influencing the product's grade. Currently, conventional structures on the market use basket cleaning or basketless cleaning with upright structures, which cannot fully meet the application requirements in terms of process technology. Figure 1 As shown, the existing support mechanism has a large contact area with the wafer, resulting in many dead corners during wafer cleaning, poor cleaning effect, long cleaning time, and extremely low efficiency. It consumes a lot of manpower and resources and cannot meet the customer's demand for low cost and high return. Utility Model Content

[0003] The purpose of this invention is to provide a wafer cleaning device to solve the above-mentioned technical problems;

[0004] The technical problem solved by this utility model can be achieved by the following technical solution:

[0005] A wafer cleaning apparatus includes a lifting mechanism and a cleaning mechanism. The lifting mechanism is controllably movable up and down in a direction approaching or away from the cleaning mechanism. The lifting mechanism includes...

[0006] Lifting body;

[0007] A support mechanism for carrying wafers, the support mechanism including a plurality of support rods connected to the lifting body, the support rods being distributed along the bottom arc direction of the wafer.

[0008] Preferably, the longitudinal section of the support rod is a quadrilateral with two acute angles, the first acute angle end of the support rod faces the spraying direction of the cleaning mechanism, and the second acute angle end of the support rod is located diagonally opposite the first acute angle end.

[0009] Preferably, the second acute-angled end is provided with a slot for supporting the wafer.

[0010] Preferably, the longitudinal section of the supporting rod is a parallelogram.

[0011] Preferably, the support rods include a first support rod, a second support rod, a third support rod, and a fourth support rod that are distributed parallel to each other along the bottom arc direction of the wafer.

[0012] Preferably, the first support rod is symmetrical to the fourth support rod, and the second support rod is symmetrical to the third support rod.

[0013] Preferably, the cleaning mechanism includes,

[0014] A cleaning tank, wherein the lifting mechanism is vertically movable within the cleaning tank;

[0015] The spray pipe is connected to the bottom of the cleaning tank and is parallel to the support rod.

[0016] Preferably, the spray pipe has multiple spray nozzles along the length of the support rod.

[0017] Preferably, the spray pipe includes a first spray pipe and a second spray pipe located on both sides below the support mechanism.

[0018] Preferably, the lifting body includes a lifting rod and a connecting plate connected to the lifting rod, and the supporting mechanism is connected to the connecting plate.

[0019] The beneficial effects of this utility model are as follows: By adopting the above technical solution, this utility model sets the support mechanism as several support rods, which reduces the contact area while allowing the liquid to flush the contact points and dead corners of the wafer, thus achieving a better cleaning effect. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a prior art wafer cleaning device;

[0021] Figure 2 This is a schematic diagram of the wafer cleaning device in an embodiment of the present invention;

[0022] Figure 3 This is a front view of the wafer cleaning apparatus in an embodiment of this utility model.

[0023] In the attached diagram: 1. Lifting mechanism; 2. Supporting mechanism; 21. First supporting rod; 22. Second supporting rod; 23. Third supporting rod; 24. Fourth supporting rod; 3. Cleaning mechanism; 31. Cleaning tank; 32. Spray pipe; 321. First spray pipe; 322. Second spray pipe; 4. Wafer. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0026] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0027] A wafer cleaning apparatus, such as Figure 2 , Figure 3 As shown, it includes a lifting mechanism 1 and a cleaning mechanism 3. The lifting mechanism 1 can be controlled to move up and down in a direction closer to or farther from the cleaning mechanism 3. The lifting mechanism 1 includes...

[0028] Lifting body;

[0029] The support mechanism 2 for supporting the wafer 4 includes several support rods connected to the lifting body, which are distributed along the bottom arc direction of the wafer 4.

[0030] Specifically, this invention replaces the support mechanism 2 with a support rod that has a smaller contact area with the wafer 4, thereby reducing the contact area and allowing the cleaning solution to flush the contact points and dead corners of the wafer 4, achieving a better cleaning effect. It can also reduce the volume of the support mechanism 2, thereby reducing the volume of the cleaning tank 31 and reducing the cost of the cleaning solution.

[0031] This utility model adopts a modular design, which can solve the problem of process upgrade by making only slight improvements on the original basis. Moreover, this utility model has a simple structure and low modification cost. For users, the benefits are immediate. It can greatly shorten the process time, improve production efficiency, and indirectly reduce the ineffective loss of special gas and liquid and the power loss of the machine, saving customers a lot of manpower and material resources.

[0032] In a preferred embodiment, the longitudinal section of the support rod is a quadrilateral with two acute angles. The first acute angle end of the support rod faces the spraying direction of the cleaning mechanism 3, and the second acute angle end of the support rod is located diagonally opposite the first acute angle end.

[0033] Specifically, this utility model sets the shape of the support rod to a quadrilateral structure with two acute angles in the longitudinal section. First, the first acute angle end faces the spraying direction of the cleaning mechanism 3, so as to achieve the effect of breaking the liquid and ensure the passage of the sprayed liquid, avoiding obstruction of the liquid. The second acute angle end is located diagonally opposite to the first acute angle end and is used to support the wafer 4. Supporting the wafer 4 with the second acute angle end can minimize the contact area with the wafer 4 and improve the cleaning effect.

[0034] In a preferred embodiment, a slot for supporting wafer 4 is provided on the second acute-angled end.

[0035] Specifically, the slots are evenly distributed along the length of the support rod, and the wafer 4 is inserted into the slots to place the wafer 4.

[0036] In a preferred embodiment, the longitudinal section of the support rod is a parallelogram.

[0037] More specifically, the parallelogram-shaped longitudinal section of the support rod can better achieve the effect of liquid breaking and cleaning.

[0038] In a preferred embodiment, the support rods include a first support rod 21, a second support rod 22, a third support rod 23, and a fourth support rod 24 that are distributed parallel to each other along the bottom arc direction of the wafer 4.

[0039] In a preferred embodiment, the first support rod 21 is symmetrical to the fourth support rod 24, and the second support rod 22 is symmetrical to the third support rod 23.

[0040] Specifically, basketless cleaning only has a few points of contact with the wafer 4 during transportation and cleaning. Although this allows the cleaning solution to contact the wafer 4 as much as possible and cleans it more thoroughly, the stability of transportation is relatively poor. Therefore, the transportation speed should not be too fast. Based on this, this utility model reasonably sets the number and position of the support rods. By setting a first support rod 21, a second support rod 22, a third support rod 23 and a fourth support rod 24 that are symmetrically arranged along the bottom arc direction of the wafer 4, the stability of the wafer 4 can be improved and the wafer 4 can be kept stable during cleaning.

[0041] In a preferred embodiment, the cleaning mechanism 3 includes,

[0042] The cleaning tank 31 and the lifting mechanism 1 are located vertically within the cleaning tank 31;

[0043] The spray pipe 32 is connected to the bottom of the cleaning tank 31 and is parallel to the support rod.

[0044] In a preferred embodiment, the spray pipe 32 is provided with a plurality of spray nozzles along the length of the support rod.

[0045] Specifically, this utility model modifies the support mechanism 2 in the structure of the prior art, reduces the contact area between the support mechanism 2 and the wafer 4, and changes the contact angle to better guide the flow field of the liquid. In cooperation with the spray pipe 32, it can more stably control the overflow direction of the liquid, ensure the effective flow rate of the flow field to clean the wafer 4, improve the cleanliness and purity of the wafer 4, and greatly reduce the cost of using the liquid.

[0046] In a preferred embodiment, the spray pipe 32 includes a first spray pipe 321 and a second spray pipe 322 located on both sides below the support mechanism 2.

[0047] Specifically, the first inlet pipe and the second inlet pipe are two cylindrical pipes with openings located at the bottom of the cleaning tank 31, which are used to replenish the cleaning tank 31 with clean pure water or medicine, so that the cleaning tank 31 can be stably overflowed for cleaning.

[0048] In a preferred embodiment, the lifting body includes a lifting rod and a connecting plate connecting the lifting rod, and the supporting mechanism 2 is connected to the connecting plate.

[0049] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer cleaning apparatus, characterized in that, It includes a lifting mechanism (1) and a cleaning mechanism (3). The lifting mechanism (1) can be controlled to move up and down in a direction closer to or farther from the cleaning mechanism (3). The lifting mechanism (1) includes... Lifting body; The support mechanism (2) for supporting the wafer (4) includes a plurality of support rods connected to the lifting body, the support rods being distributed along the bottom arc direction of the wafer (4).

2. The wafer cleaning apparatus according to claim 1, characterized in that, The longitudinal section of the support rod is a quadrilateral with two acute angles. The first acute angle end of the support rod faces the spraying direction of the cleaning mechanism (3), and the second acute angle end of the support rod is located diagonally opposite the first acute angle end.

3. The wafer cleaning apparatus according to claim 2, characterized in that, The second acute-angled end is provided with a slot for supporting the wafer (4).

4. The wafer cleaning apparatus according to claim 2, characterized in that, The longitudinal section of the supporting rod is a parallelogram.

5. The wafer cleaning apparatus according to claim 1, characterized in that, The support rods include a first support rod (21), a second support rod (22), a third support rod (23), and a fourth support rod (24) that are distributed parallel to each other along the bottom arc direction of the wafer (4).

6. The wafer cleaning apparatus according to claim 5, characterized in that, The first support rod (21) is symmetrical to the fourth support rod (24), and the second support rod (22) is symmetrical to the third support rod (23).

7. The wafer cleaning apparatus according to claim 1, characterized in that, The cleaning mechanism (3) includes, The cleaning tank (31) is vertically movable within the lifting mechanism (1); The spray pipe (32) is connected to the bottom of the cleaning tank (31) and is parallel to the support rod.

8. The wafer cleaning apparatus according to claim 7, characterized in that, The spray pipe (32) has multiple spray nozzles along the length of the support rod.

9. The wafer cleaning apparatus according to claim 7, characterized in that, The spray pipe (32) includes a first spray pipe (321) and a second spray pipe (322) located on both sides below the support mechanism (2).

10. The wafer cleaning apparatus according to claim 1, characterized in that, The lifting body includes a lifting rod and a connecting plate connected to the lifting rod, and the supporting mechanism (2) is connected to the connecting plate.

Images