Semiconductor process device

Abstract

The utility model provides a semiconductor process device. An optical flatness detection structure obtains surface topography information of a mechanical arm; the control unit controls the working state of the optical flatness detection structure; and the analysis and judgment unit receives and analyzes the surface topography information, judges whether the mechanical arm needs to be cleaned or not, and controls a driving structure and a cleaning structure of the mechanical arm according to a judgment result. According to the utility model, the optical flatness detection structure is arranged to obtain the surface appearance information of the mechanical arm, accurately judge the surface pollution condition of the mechanical arm, improve the wafer grabbing reliability of the mechanical arm, avoid cross contamination of clean wafers caused by the surface pollution of the mechanical arm, reduce the downtime risk of a machine, and improve the product yield; in addition, the surface pollution of the mechanical arm is detected in time, the maintenance frequency caused by machine shutdown is reduced, and the production efficiency is improved; and finally, an autonomous learning unit is arranged, the mechanical arm surface cleaning alarm accuracy is improved, mechanical arm surface cleaning is guaranteed, and resource waste caused by invalid cleaning of the mechanical arm is avoided.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of semiconductor equipment, especially relates to a semiconductor process device. BACKGROUND

[0002] When the etching machine in the semiconductor process runs for a long time, the surface of the robot arm is easily contaminated due to the uncleaned backside of the wafer or the attachment of particles in the previous process.

[0003] The contaminated surface of the robot arm will reduce the wafer adsorption capacity, and the wafer will be easily offset from the robot arm when the robot arm grabs the wafer, even the wafer will slip, which will seriously affect the stability and reliability of wafer transmission. The contaminated surface of the robot arm will also cause cross contamination to the clean wafer during the process of grabbing the wafer, and the contaminated wafer will easily cause the semiconductor process equipment to be down and the wafer defect problem, thereby reducing the product yield of the wafer.

[0004] In the prior art, when the surface of the robot arm of the machine is contaminated, due to the current structure of the machine, only the EFEM (Equipment Front-End Module) for automatically transmitting the wafer and the VTM (Vacuum Transfer Module) for the vacuum process can be opened to observe whether the surface of the robot arm is contaminated by the naked eye at a close distance. However, this method cannot effectively evaluate the real state of the robot arm, many small pollution particles cannot be found in time, and the naked eye cannot accurately and comprehensively feedback the surface contamination of the robot arm, which cannot accurately determine whether the robot arm needs to be cleaned, and the efficiency of the inspection is also low, thereby reducing the uptime of the machine and the production efficiency.

[0005] Therefore, there is an urgent need for a structure that can improve the comprehensive and effective judgment of the surface contamination of the robot arm grabbing the wafer.

[0006] It should be noted that the above introduction to the technical background is only for the convenience of clearly and completely describing the technical solutions of the present application, and for the convenience of understanding by those skilled in the art, and cannot be considered as the known technical solutions of those skilled in the art only because these solutions are described in the background of the present application. UTILITY MODEL CONTENT

[0007] In view of the above-mentioned defects of the prior art, the purpose of the present application is to provide a semiconductor process device for solving the problems of inaccurate and low efficiency of the surface contamination judgment result of the mechanical arm for grabbing the wafer in the semiconductor process in the prior art.

[0008] To achieve the above object and other related objects, the present application provides the following technical solutions.

[0009] The present application provides a semiconductor process device, which comprises an optical flatness detection structure, a control unit and an analysis and judgment unit.

[0010] The optical flatness detection structure is used for optical detection to obtain the surface topography information of the mechanical arm; the control unit is electrically connected with the optical flatness detection structure and is used for controlling the working state of the optical flatness detection structure; the analysis and judgment unit is electrically connected with the optical flatness detection structure and is used for receiving and analyzing the surface topography information of the optical flatness detection structure to judge whether the detected mechanical arm needs to be cleaned; the analysis and judgment unit is electrically connected with the driving structure and the cleaning structure of the detected mechanical arm to control the driving structure and the cleaning structure of the mechanical arm through the judgment result obtained by the analysis and judgment unit.

[0011] Optionally, the optical flatness detection structure is one or more than one of an optical wave interference detector, a coherent scanning detector, a Hartmann-Shack wavefront sensor, a charge-coupled device imager or a planar laser detector in any combination.

[0012] Optionally, the optical flatness detection structure is a planar laser detector, which comprises a laser emitter, a prism group, a lens group and a laser receiver.

[0013] The laser emitter is used for emitting a laser beam; the prism group is located at the emission port of the laser emitter and is used for converting the laser beam into first planar laser; the lens group is used for converting the second planar laser reflected by the surface of the detected mechanical arm after the first planar laser into the to-be-detected laser aligned with the receiving port of the laser receiver; and the laser receiver is used for receiving the to-be-detected laser and obtaining the surface topography information of the detected mechanical arm according to the to-be-detected laser.

[0014] Optionally, the semiconductor process device further comprises a moving track and a first moving structure; the moving track is fixed at the preset position of the chamber where the detected mechanical arm is located, the planar laser detector is slidably connected with the moving track; and the first moving structure is used for driving the planar laser detector to slide on the moving track so that the laser emitter can scan the preset to-be-detected surface of the detected mechanical arm with the first planar laser.

[0015] Optionally, the angle between the laser beam and the surface of the robotic arm being inspected is 75°-80°.

[0016] Optionally, the semiconductor process apparatus further includes a second moving structure, which is used to adjust the angle of the laser beam emitted by the laser emitter of the planar laser detector and the position of the prism group and the lens group, so that the laser emitter scans the preset surface to be detected of the robotic arm with a first planar laser, and the laser receiver can always receive the laser to be detected.

[0017] Optionally, the semiconductor process apparatus is located within the transition chamber of the semiconductor process.

[0018] Optionally, the semiconductor process apparatus is located in the transition chamber of the device front-end module and / or the vacuum transfer module, and is used to detect the surface morphology of the robotic arm in the device front-end module and / or the vacuum transfer module.

[0019] Optionally, the semiconductor process apparatus further includes an alarm unit electrically connected to the analysis and judgment unit, used to issue an alarm prompt when the analysis and judgment unit obtains a judgment result that the robotic arm needs to be cleaned.

[0020] Optionally, the semiconductor process apparatus further includes a self-learning unit, which includes a topography input terminal, a wafer gripping input terminal, an error reporting input terminal, an analysis and learning module, and a feedback output terminal. The topography input terminal is electrically connected to the optical flatness detection structure and is used to receive the surface topography information of the optical flatness detection structure. The wafer gripping input terminal is electrically connected to the analysis and judgment unit and is used to receive the drive control signal from the analysis and judgment unit to the drive structure of the robotic arm. The error reporting input terminal is electrically connected to the wafer quality detection structure corresponding to the wafer operated by the robotic arm and is used to receive the error signal when the wafer quality detection structure determines that the wafer quality is abnormal. The feedback output terminal is connected to the analysis and judgment unit. The judgment unit is electrically connected and used to provide feedback correction on the judgment result of the analysis and judgment unit. The analysis and learning module is electrically connected to the topography input terminal, the wafer gripping input terminal, the error reporting input terminal, and the feedback output terminal to analyze the surface topography information of the optical flatness detection structure, the drive control signal of the robotic arm drive structure, and the error signal of wafer quality anomaly. It determines whether the drive control signal corresponding to the surface topography information of the optical flatness detection structure will generate an error signal, and outputs a correction signal to the feedback output terminal to correct the judgment result of the analysis and judgment unit. The analysis and judgment unit controls the drive structure and cleaning structure of the robotic arm through the correction signal.

[0021] As described above, the semiconductor process apparatus of this invention has the following beneficial effects:

[0022] This invention uses an optical flatness detection structure to detect the surface morphology of the robotic arm, which can accurately determine whether the robotic arm needs to be cleaned. This avoids the decrease in the ability to adsorb wafers due to surface contamination of the robotic arm, and improves the stability and reliability of the robotic arm in grasping wafers.

[0023] This invention uses an optical flatness detection structure to accurately determine the surface morphology of the robotic arm, and can also avoid cross-contamination of the clean wafer by the contamination on the surface of the robotic arm, reduce the risk of machine downtime, and improve product yield.

[0024] This invention, by timely detection of the surface morphology of the robotic arm, can reduce the frequency of machine alarms and shutdowns for maintenance caused by surface contamination of the robotic arm, thereby improving overall production efficiency.

[0025] This invention, through the setting of a self-learning unit, can accumulate a large amount of actual surface morphology data of the robotic arm and corresponding abnormal error reports, thereby improving the accuracy of the alarm for cleaning the surface of the robotic arm. While ensuring that the surface cleaning of the robotic arm meets the process requirements, it avoids the waste of resources caused by frequent and ineffective cleaning of the robotic arm. Attached Figure Description

[0026] Figure 1 This diagram illustrates the working principle of a planar laser detector inspecting the surface of a robotic arm in an example of a semiconductor process apparatus according to Embodiment 1 of this utility model.

[0027] Figure 2 This diagram illustrates the working principle of the optical path emitted by a planar laser detector when inspecting the surface of a robotic arm, as shown in an example of a semiconductor process apparatus according to Embodiment 1 of this utility model.

[0028] Figure 3 This diagram illustrates the working principle of the optical receiving path of a planar laser detector when inspecting the surface of a robotic arm, as shown in an example of a semiconductor process apparatus according to Embodiment 1 of this utility model.

[0029] Figure 4 The diagram shown is a schematic diagram of the structure of a semiconductor process apparatus in an example of Embodiment 1 of this utility model.

[0030] Figure 5 The diagram shown is a schematic diagram of the working environment system structure of a semiconductor process apparatus in an example of Embodiment 1 of this utility model.

[0031] Component designation explanation

[0032] 1. Robotic arm; 2. Laser emitter; 21. Laser beam; 22. First plane laser; 23. Prism group; 3. Laser receiver; 31. Laser to be tested; 32. Second plane laser; 33. Lens group; 4. Moving track; 5. Transition chamber; 6. Process chamber; 7. Equipment front-end module; 8. Vacuum transfer module; 9. Optical flatness detection structure. Detailed Implementation

[0033] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0034] In the detailed description of the embodiments of this utility model, for ease of explanation, the schematic diagrams illustrating the device structure may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0035] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the accompanying drawings for devices in use or operation.

[0036] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are formed in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0037] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0038] In semiconductor manufacturing processes, etching equipment can become contaminated during long-term operation. Incomplete back cleaning of some wafers or the presence of particles from previous processes can lead to surface contamination of the robot arm. This reduces the robot arm's ability to hold the wafer, causing it to shift or even slip during wafer handling. This severely impacts the stability and reliability of wafer transport. Furthermore, a contaminated robot arm can cross-contaminate clean wafers during handling. Contaminated wafers entering the reaction chamber can cause equipment downtime and wafer defects, ultimately reducing product yield. Current technologies, limited by the existing machine structure, only allow close-range visual inspection of the robotic arm's surface for contamination by opening the EFEM (Equipment Front-End Module) for automated wafer transfer and the VTM (Vacuum Transfer Module) for vacuum process control. This makes it impossible to effectively assess the robotic arm's true condition, as many tiny contaminant particles are difficult to detect in a timely manner, and it is also difficult to provide comprehensive and accurate feedback on the surface contamination of the robotic arm. Consequently, it is impossible to accurately determine whether the robotic arm needs cleaning, and the inspection efficiency is very low, thus reducing the uptime of the machine and lowering production efficiency.

[0039] Example 1:

[0040] This embodiment provides a semiconductor process apparatus, which includes: an optical flatness detection structure 9, a control unit, and an analysis and judgment unit;

[0041] The optical flatness detection structure 9 is used for optical detection to obtain surface morphology information of the robotic arm 1; the control unit is electrically connected to the optical flatness detection structure 9 and is used to control the working state of the optical flatness detection structure 9; the analysis and judgment unit is electrically connected to the optical flatness detection structure 9 and is used to receive and analyze the surface morphology information of the optical flatness detection structure 9 to determine whether the robotic arm 1 being tested needs cleaning; the analysis and judgment unit is electrically connected to the drive structure and cleaning structure of the robotic arm 1 being tested, so as to control the drive structure and cleaning structure of the robotic arm 1 based on the judgment result obtained by the analysis and judgment unit.

[0042] This invention uses an optical flatness detection structure 9 to detect the surface morphology of the robotic arm 1, accurately determining whether the robotic arm 1 needs cleaning. This avoids a decrease in the wafer adsorption capacity caused by surface contamination of the robotic arm 1, improving the stability and reliability of the robotic arm 1 in grasping wafers. Simultaneously, accurate judgment of the surface morphology of the robotic arm 1 through the optical flatness detection structure 9 also prevents cross-contamination of clean wafers by surface contamination of the robotic arm 1, reducing the risk of machine downtime and improving product yield. Furthermore, timely detection of the surface morphology of the robotic arm 1 reduces the frequency of machine alarms and shutdowns due to surface contamination, thereby improving overall production efficiency.

[0043] In one embodiment, the control unit controls the optical flatness detection structure 9 to perform timed detection of the flatness of the robotic arm 1 according to a preset cycle.

[0044] In one embodiment, the control unit controls the optical flatness detection structure 9 to detect the flatness of the robotic arm 1 in real time.

[0045] Specifically, those skilled in the art can adjust the control logic of the control unit according to their needs, all of which are within the protection scope of this utility model.

[0046] In one embodiment, the optical flatness detection structure 9 is one or more of the following: an optical interferometer, a coherent scanning detector, a Hartmann-Shack wavefront sensor, a charge-coupled device imager, or a planar laser detector.

[0047] Preferably, the optical flatness detection structure 9 is a planar laser detector, such as... Figures 1-3 As shown, where Figure 1 This is a structural diagram illustrating the working principle of the planar laser detector when inspecting the surface of the robotic arm 1. Figure 2 This is a structural diagram illustrating the working principle of the optical emission path when the planar laser detector inspects the surface of the robotic arm 1. Figure 3 The diagram illustrates the working principle of the optical path receiving device when the planar laser detector inspects the surface of the robotic arm 1. The planar laser detector includes a laser emitter 2, a prism group 23, a lens group 33, and a laser receiver 3.

[0048] The laser emitter 2 is used to emit a laser beam 21; the prism group 23 is located at the emission port of the laser emitter 2 and is used to convert the laser beam 21 into a first planar laser 22; the lens group 33 is used to convert the second planar laser 32 reflected from the surface of the detected robotic arm 1 by the first planar laser 22 into a laser to be detected 31 aligned with the receiving port of the laser receiver 3; the laser receiver 3 is used to receive the laser to be detected 31 and obtain the surface morphology information of the detected robotic arm 1 based on the laser to be detected 31.

[0049] This invention uses a planar laser detector as the optical flatness detection structure 9, which can achieve high precision and wide-range flatness detection with a smaller structure. While ensuring the surface detection accuracy of the robotic arm 1, it also facilitates the lightweighting of the semiconductor process device.

[0050] In one embodiment, such as Figure 4 As shown, the semiconductor process apparatus further includes a moving track 4 and a first moving structure (not shown in the figure); the moving track 4 is fixed at a preset position in the chamber where the robotic arm 1 to be inspected is located, and the planar laser detector is slidably connected to the moving track 4; the first moving structure is used to drive the planar laser detector to slide on the moving track 4 so that the laser emitter 2 can scan the preset surface to be inspected of the robotic arm 1 to be inspected with a first planar laser 22.

[0051] This invention features a planar laser detector that can slide on a moving track 4, thereby controlling the planar laser detector to detect all surfaces of the robotic arm 1 that need to be inspected. This enables comprehensive and effective contamination detection of the robotic arm 1, further improving the accuracy and effectiveness of semiconductor process equipment in judging surface contamination of the robotic arm 1.

[0052] In one embodiment, such as Figure 1 As shown, the angle θ between the laser beam 21 and the surface of the robotic arm 1 being tested is 75°-80°.

[0053] By setting the angle between the laser beam 21 and the surface of the robotic arm 1, this invention can achieve comprehensive and effective detection of the relatively narrow robotic arm 1 commonly used in the prior art without blind spots, thereby further optimizing the surface contamination detection efficiency of the robotic arm 1.

[0054] In one embodiment, such as Figure 5 As shown, the semiconductor process apparatus is located within the transition chamber 5 (Load Lock) of the semiconductor process.

[0055] This invention places the semiconductor process apparatus inside the transition chamber 5, thereby enabling timely detection of the surface of the robotic arm 1 during the waiting period before it starts working. This ensures that the robotic arm 1 undergoes surface contamination detection before operation, which helps to further reduce the risk of surface contamination of the robotic arm 1 entering the process chamber 6.

[0056] In one embodiment, such as Figure 5As shown, the semiconductor process apparatus is located in the transition chamber 5 of the device front-end module 7 (EFEM) and / or the vacuum transfer module 8 (VTM), and is used to detect the surface morphology of the robotic arm 1 in the device front-end module 7 and / or the vacuum transfer module 8.

[0057] Specifically, this utility model is mainly used to solve the problem of surface contamination detection of robotic arm 1 in semiconductor process equipment. The robotic arm 1 is mainly used in the modules of EFEM and VTM, but this solution can also be applied to robotic arms 1 of other semiconductor equipment that need to perform surface contamination detection, all of which are within the protection scope of this utility model.

[0058] In one embodiment, the semiconductor process apparatus further includes an alarm unit electrically connected to the analysis and judgment unit, which is used to issue an alarm prompt when the analysis and judgment unit obtains a judgment result that the robotic arm 1 needs to be cleaned.

[0059] Example 2:

[0060] This embodiment provides a semiconductor process apparatus, which has other features that are basically the same as those in Embodiment 1, except that:

[0061] In this embodiment, the semiconductor process apparatus further includes a second moving structure, which is used to adjust the angle of the laser beam emitted by the laser emitter of the planar laser detector and the position of the prism group and the lens group, so that the laser emitter scans the preset surface to be detected of the robotic arm with the first planar laser, and the laser receiver can always receive the laser to be detected.

[0062] This invention, by setting a second moving structure, can achieve overall detection of surface contamination on a robotic arm by directly rotating the angle of the laser beam emitted by the planar laser detector and the position of the laser receiving structure. Compared with the method of using a moving track and a first moving structure in Embodiment 1, it occupies less space in the transition chamber where the robotic arm is located, which can improve the flexibility of the robotic arm. However, when the robotic arm is too long, the change in the laser beam angle will increase the laser beam incident time and incident distance, which may affect the laser receiving effect. Those skilled in the art can choose the setting according to their needs.

[0063] Example 3:

[0064] This embodiment provides a semiconductor process apparatus, which has other features that are basically the same as those in Embodiment 1, except that:

[0065] In this embodiment, the semiconductor process apparatus further includes a self-learning unit, which includes a topography input terminal, a wafer gripping input terminal, an error reporting input terminal, an analysis and learning module, and a feedback output terminal. The topography input terminal is electrically connected to the optical flatness detection structure and is used to receive the surface topography information of the optical flatness detection structure. The wafer gripping input terminal is electrically connected to the analysis and judgment unit and is used to receive the drive control signal of the analysis and judgment unit to the drive structure of the robotic arm. The error reporting input terminal is electrically connected to the wafer quality detection structure corresponding to the wafer operated by the robotic arm and is used to receive the error signal when the wafer quality detection structure judges that the wafer quality is abnormal. The feedback output terminal is connected to the analysis and judgment unit. The analysis and judgment unit is electrically connected and used to provide feedback correction on the judgment result of the analysis and judgment unit. The analysis and learning module is electrically connected to the topography input terminal, the wafer gripping input terminal, the error reporting input terminal, and the feedback output terminal to analyze the surface topography information of the optical flatness detection structure, the drive control signal of the robotic arm drive structure, and the error signal of wafer quality anomaly. It determines whether the drive control signal corresponding to the surface topography information of the optical flatness detection structure will generate an error signal, and outputs a correction signal to the feedback output terminal to correct the judgment result of the analysis and judgment unit. The analysis and judgment unit controls the drive structure and cleaning structure of the robotic arm through the correction signal.

[0066] This invention, through the setting of a self-learning unit, can accumulate a large amount of actual robotic arm surface morphology data and corresponding abnormal error reports as feedback correction signals for the analysis and judgment unit, thereby improving the accuracy of robotic arm surface cleaning alarms. While ensuring that the robotic arm surface cleaning meets process requirements, it avoids the waste of resources caused by frequent ineffective cleaning of the robotic arm, and helps to improve the efficiency of robotic arm cleaning while ensuring that surface contamination of the robotic arm is detected in a timely manner.

[0067] In summary, the semiconductor process apparatus of this invention can accurately determine whether the robotic arm needs cleaning by setting up an optical flatness detection structure to detect the surface morphology of the robotic arm. This avoids a decrease in the robotic arm's ability to adsorb wafers due to surface contamination, thus improving the stability and reliability of the robotic arm's wafer gripping. Simultaneously, accurate judgment of the robotic arm's surface morphology through the optical flatness detection structure can also prevent cross-contamination of clean wafers by surface contamination, reducing the risk of machine downtime and improving product yield. Furthermore, timely detection of the robotic arm's surface morphology can reduce the frequency of machine alarms and shutdowns due to surface contamination, thereby improving overall production efficiency. Finally, the self-learning unit can accumulate a large amount of actual robotic arm surface morphology data and corresponding abnormal error reports, thereby improving the accuracy of robotic arm surface cleaning alarms. This ensures that the robotic arm's surface cleaning meets process requirements while avoiding resource waste caused by frequent and ineffective cleaning.

[0068] Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0069] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A semiconductor process apparatus, characterized in that, The semiconductor process apparatus includes: an optical flatness detection structure, a control unit, and an analysis and judgment unit; The optical flatness detection structure is used for optical detection to obtain surface morphology information of the robotic arm; the control unit is electrically connected to the optical flatness detection structure and is used to control the working state of the optical flatness detection structure; the analysis and judgment unit is electrically connected to the optical flatness detection structure and is used to receive and analyze the surface morphology information of the optical flatness detection structure to determine whether the detected robotic arm needs cleaning; the analysis and judgment unit is electrically connected to the drive structure and cleaning structure of the detected robotic arm to control the drive structure and cleaning structure of the robotic arm based on the judgment result obtained by the analysis and judgment unit.

2. The semiconductor process apparatus according to claim 1, characterized in that: The optical flatness detection structure is any combination of one or more of the following: optical interferometer, coherent scanning detector, Hartmann-Shack wavefront sensor, charge-coupled device imager, or planar laser detector.

3. The semiconductor process apparatus according to claim 2, characterized in that: The optical flatness detection structure is a planar laser detector, which includes a laser emitter, a prism group, a lens group, and a laser receiver. The laser emitter is used to emit a laser beam; the prism group is located at the emission port of the laser emitter and is used to convert the laser beam into a first planar laser; the lens group is used to convert the second planar laser reflected from the surface of the robot arm after the first planar laser is detected into a laser to be detected aligned with the receiving port of the laser receiver; the laser receiver is used to receive the laser to be detected and obtain the surface morphology information of the robot arm being detected based on the laser to be detected.

4. The semiconductor process apparatus according to claim 3, characterized in that: The semiconductor process apparatus further includes a moving track and a first moving structure; the moving track is fixed at a preset position in the chamber where the robotic arm to be inspected is located, and the planar laser detector is slidably connected to the moving track; the first moving structure is used to drive the planar laser detector to slide on the moving track so that the laser emitter can scan the preset surface to be inspected of the robotic arm with a first planar laser.

5. The semiconductor process apparatus according to claim 4, characterized in that: The angle between the laser beam and the surface of the robotic arm being inspected is 75°-80°.

6. The semiconductor process apparatus according to claim 3, characterized in that: The semiconductor process apparatus further includes a second moving structure, which is used to adjust the angle of the laser beam emitted by the laser emitter of the planar laser detector and the position of the prism group and the lens group, so that the laser emitter scans the preset surface to be detected of the robotic arm with a first planar laser, and that the laser receiver can always receive the laser to be detected.

7. The semiconductor process apparatus according to claim 1, characterized in that: The semiconductor process apparatus is located within the transition chamber of the semiconductor process.

8. The semiconductor process apparatus according to claim 7, characterized in that: The semiconductor process apparatus is located in the transition chamber of the equipment front-end module and / or the vacuum transfer module, and is used to detect the surface morphology of the robotic arm in the equipment front-end module and / or the vacuum transfer module.

9. The semiconductor process apparatus according to claim 1, characterized in that: The semiconductor process apparatus further includes an alarm unit, which is electrically connected to the analysis and judgment unit and is used to issue an alarm prompt when the analysis and judgment unit obtains a judgment result that the robotic arm needs to be cleaned.

10. The semiconductor process apparatus according to claim 1, characterized in that: The semiconductor process apparatus further includes a self-learning unit, which comprises a topography input terminal, a wafer gripping input terminal, an error reporting input terminal, an analysis and learning module, and a feedback output terminal. The topography input terminal is electrically connected to the optical flatness detection structure and is used to receive the surface topography information of the optical flatness detection structure. The wafer gripping input terminal is electrically connected to the analysis and judgment unit and is used to receive the drive control signal from the analysis and judgment unit to the drive structure of the robotic arm. The error reporting input terminal is electrically connected to the wafer quality detection structure corresponding to the wafer operated by the robotic arm and is used to receive the error signal when the wafer quality detection structure determines that the wafer quality is abnormal. The feedback output terminal is electrically connected to the analysis and judgment unit and is used to provide feedback correction on the judgment result of the analysis and judgment unit. The analysis and learning module is electrically connected to the morphology input terminal, the wafer gripping input terminal, the error reporting input terminal, and the feedback output terminal to analyze the surface morphology information of the optical flatness detection structure, the drive control signal of the robotic arm drive structure, and the error signal of wafer quality anomaly. It determines whether the drive control signal corresponding to the surface morphology information of the optical flatness detection structure will generate an error signal, and outputs a correction signal to the feedback output terminal to provide feedback correction on the judgment result of the analysis and judgment unit. The analysis and judgment unit controls the drive structure and cleaning structure of the robotic arm through the correction signal.

Images