Wafer bearing device and probe station

Abstract

The utility model discloses a wafer bearing device and a probe station, and relates to the technical field of semiconductor processing. Wherein the bearing assembly comprises a main body, a carrying table and a containing groove, the carrying table comprises a bearing surface and a suction cup, the bearing surface is provided with a positioning hole and a plurality of dense holes, the suction cup is installed in the positioning hole, and the dense holes and the suction cup are both used for adsorbing wafers; the containing groove is formed in the outer side of the carrying table and extends in the circumferential direction of the carrying table, a frame is arranged on the edge of the wafer, and the containing groove is used for containing the frame; the carrying table is installed on the main body, the main body comprises a first gas path and a second gas path which are independent, the first gas path communicates with the dense hole, and the second gas path communicates with the suction cup; the negative pressure assembly comprises a first negative pressure pipe and a second negative pressure pipe, the first negative pressure pipe is communicated with the first air channel, and the second negative pressure pipe is communicated with the second air channel. Through the arrangement, the wafer can be flatly adsorbed on the bearing surface when the wafer is warped to different degrees, so that the accuracy of a test result is ensured.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a wafer carrier device and probe station. Background Technology

[0002] During the testing process, wafers are typically placed on specialized stages. With the continuous advancement of processing technology, wafers are becoming increasingly thinner. Ultra-thin wafers can warp to varying degrees during different processes. Traditional stages cannot effectively hold and fix warped wafers, causing them to easily shift or detach during testing, making it difficult to guarantee the accuracy of wafer test results.

[0003] In view of this, the present invention proposes a wafer carrier device and a probe station to solve or at least alleviate the above-mentioned technical problems. Utility Model Content

[0004] The main purpose of this invention is to provide a wafer carrier device and probe station, which aims to solve the technical problem of difficulty in ensuring the accuracy of test results when testing warped wafers.

[0005] To achieve the above objectives, this utility model proposes a wafer carrier device, comprising:

[0006] The carrier assembly includes a main body, a stage, and a receiving groove. The stage includes a bearing surface and a suction cup. The bearing surface is provided with a positioning hole and a plurality of dense holes. The suction cup is installed in the positioning hole. Both the dense holes and the suction cup are used to adsorb wafers.

[0007] The receiving groove is disposed on the outside of the stage and extends along the circumference of the stage. The edge of the wafer is provided with a frame, and the receiving groove is used to accommodate the frame.

[0008] The stage is mounted on the main body, which includes a first air passage and a second air passage that are independent of each other. The first air passage is connected to the dense hole, and the second air passage is connected to the suction cup.

[0009] A negative pressure assembly, comprising a first negative pressure pipe and a second negative pressure pipe, wherein the first negative pressure pipe is connected to the first air passage and the second negative pressure pipe is connected to the second air passage.

[0010] In one embodiment, the platform further includes a support plate and a bottom sealing plate. The support surface, the positioning hole, and the plurality of dense holes are all disposed on the support plate. An air passage groove is provided on the side of the support plate away from the support surface. The dense holes communicate with the air passage groove. The bottom sealing plate is installed on the side of the support plate away from the support surface. The bottom sealing plate is provided with an air passage hole, which communicates with the air passage groove and is also connected to the first air passage.

[0011] The bottom sealing plate is also provided with a fixing hole. The suction cup passes through the positioning hole and the fixing hole and communicates with the second air passage. A sealing ring is provided between the suction cup and the fixing hole to prevent the second air passage from communicating with the air passage groove.

[0012] In one embodiment, the main body includes a first negative pressure hole and a second negative pressure hole, the first negative pressure hole being connected to the first air passage, the second negative pressure hole being connected to the second air passage, the first negative pressure hole being connected to the air passage, and the second negative pressure hole being connected to the suction cup.

[0013] In one embodiment, there are multiple first negative pressure holes and multiple second negative pressure holes, and there is at least one first air passage and at least one second air passage. Each first air passage is connected to one or more first negative pressure holes, and each second air passage is connected to one or more second negative pressure holes.

[0014] In one embodiment, the main body includes multiple installation areas, and the platform includes multiple platforms. Each installation area corresponds to the installation of one platform. The multiple platforms are spaced apart, and the receiving groove is provided between adjacent platforms.

[0015] In one embodiment, a fitting gap is provided between the stage and the body, and a sealing layer is filled in the fitting gap. The sealing layer is used to support at least a portion of the edge of the wafer.

[0016] In one embodiment, the plurality of the dense holes are distributed in a rectangular array;

[0017] Alternatively, multiple of the dense holes may be distributed in a circular array.

[0018] In one embodiment, the suction cup includes an opening for adsorbing the wafer, the opening protruding from the bearing surface.

[0019] In one embodiment, the bearing surface is coated with an antistatic coating.

[0020] This utility model also proposes a probe station, including a wafer carrier device as described in any of the above embodiments. The probe station further includes a moving mechanism, and the wafer carrier device is mounted on the moving mechanism. The negative pressure assembly further includes a negative pressure generator, and the negative pressure generator is connected to the first negative pressure tube and the second negative pressure tube respectively.

[0021] According to the technical solution provided by this utility model, the wafer carrier device includes a carrier component and a negative pressure component. The carrier component includes a main body, a stage, and a receiving groove. The stage includes a carrier surface and a suction cup. The carrier surface has positioning holes and multiple dense holes. The suction cup is installed in the positioning holes. Both the dense holes and the suction cup are used to adsorb the wafer. The receiving groove is located on the outside of the stage and extends circumferentially along the stage. The edge of the wafer has a frame, and the receiving groove is used to accommodate the frame. The stage is installed on the main body, which includes independent first and second air passages. The first air passage communicates with the dense holes, and the second air passage communicates with the suction cup. The negative pressure component includes a first negative pressure pipe and a second negative pressure pipe. The first negative pressure pipe communicates with the first air passage, and the second negative pressure pipe communicates with the second air passage. With this configuration, when the wafer experiences slight warping, the dense holes adsorb the wafer, allowing it to be placed stably on the carrier surface. When the wafer warps more severely, the suction cup works in conjunction with the dense holes to flatten and adsorb the wafer onto the carrier surface. Meanwhile, because the outer edge of the wafer is encapsulated with a frame, the frame can provide a certain degree of constraint to the wafer during the process of adsorbing the wafer with the aperture and the suction cup. Placing the frame in the receiving groove can create a negative pressure cavity between the wafer and the carrier surface. In conjunction with the aperture and the suction cup, the air in the negative pressure cavity is extracted, so that the wafer is firmly attached to the carrier surface, avoiding warping during wafer testing and thus ensuring the accuracy of the test results. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0023] Figure 1 A schematic diagram of an embodiment of the wafer carrier device provided by this utility model;

[0024] Figure 2 for Figure 1 A structural diagram from another perspective;

[0025] Figure 3 for Figure 1 An exploded structural diagram of the wafer carrier device provided in the document when a wafer edge is installed.

[0026] Figure 4 for Figure 3 A partial structural diagram;

[0027] Figure 5 for Figure 4 A structural diagram from another perspective;

[0028] Figure 6 for Figure 1 An exploded structural diagram of the main body and negative pressure components of the wafer carrier device provided in the diagram;

[0029] Figure 7 for Figure 1 A schematic diagram of the main structure of the wafer carrier device provided in the document;

[0030] Figure 8 for Figure 7 Schematic diagram of the cross-sectional structure of section AA in the middle;

[0031] Figure 9 for Figure 7 A schematic diagram of the cross-sectional structure of section BB.

[0032] Explanation of icon numbers:

[0033] 1000. Wafer carrier device;

[0034] 1. Supporting component; 11. Platform; 111. Supporting plate; 1111. Supporting surface; 1112. Dense hole; 1113. Air passage groove; 1114. Positioning hole; 112. Bottom sealing plate; 1121. Air passage; 1122. Fixing hole; 113. Suction cup; 12. Main body; 121. First air passage; 122. Second air passage; 123. First negative pressure hole; 124. Second negative pressure hole; 125. Mounting area; 13. Receiving groove; 14. Sealing layer;

[0035] 2. Negative pressure assembly; 21. First negative pressure pipe; 22. Second negative pressure pipe;

[0036] 2000, border.

[0037] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0038] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0039] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0040] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0041] In the chip manufacturing process, precise testing of wafers is a crucial step in ensuring product quality and performance. As a core piece of equipment in wafer testing, the probe station not only performs electrical performance testing on integrated circuit devices on the wafer but also allows for detailed observation of their microstructure. During wafer testing, the wafer needs to be placed flat and securely on the probe station's support mechanism to ensure it does not move during the testing process.

[0042] However, based on the applicant's long-term observation and research, it has been found that as wafers become increasingly ultra-thin, warping and deformation during testing are becoming more frequent. Due to the reduced stiffness of ultra-thin wafers, they are more susceptible to deformation caused by external factors such as temperature and pressure. Traditional support mechanisms often struggle to effectively secure warped ultra-thin wafers to the support structure, making it difficult to ensure wafer stability during testing and consequently affecting the accuracy and reliability of probe station test results.

[0043] In view of this, the present invention proposes a wafer carrier device to solve the above-mentioned technical problems.

[0044] Please see Figures 1 to 3In one embodiment of this utility model, the wafer carrier device 1000 includes a carrier component 1 and a negative pressure component 2. The carrier component 1 includes a main body 12, a stage 11, and a receiving groove 13. The stage 11 includes a carrier surface 1111 and a suction cup 113. The carrier surface 1111 is provided with a positioning hole 1114 and a plurality of dense holes 1112. The suction cup 113 is installed in the positioning hole 1114. Both the dense holes 1112 and the suction cup 113 are used to adsorb wafers. The receiving groove 13 is disposed on the outer side of the stage 11 and along the stage 11. The wafer is circumferentially extended and has a frame 2000 at its edge. A receiving groove 13 is used to receive the frame 2000. The stage 11 is mounted on the main body 12. The main body 12 includes a first air passage 121 and a second air passage 122 that are independent of each other. The first air passage 121 is connected to the dense hole 1112 and the second air passage 122 is connected to the suction cup 113. The negative pressure assembly 2 includes a first negative pressure tube 21 and a second negative pressure tube 22. The first negative pressure tube 21 is connected to the first air passage 121 and the second negative pressure tube 22 is connected to the second air passage 122.

[0045] Specifically, the aperture 1112 and the suction cup 113 employ independent gas passages. The aperture 1112 is connected only to the first gas passage 121, and the suction cup 113 is connected only to the second gas passage 122. The aperture 1112 and the suction cup 113 generate suction through the negative pressure component 2. When the wafer is placed on the support surface 1111, the aperture 1112 and the suction cup 113 can extract the air between the wafer and the support surface 1111, thereby allowing the wafer to adhere to the support surface 1111. It should be noted that the suction cup 113 is made of one of the following materials: rubber, silicone, or soft PVC. In other embodiments, the suction cup 113 can be made of other materials with a certain degree of flexibility. Because the suction cup 113 has a certain degree of flexibility, when the wafer is adsorbed by the suction cup 113, the suction cup 113 can deform to a certain extent according to the degree of wafer warpage while adsorbing the wafer, thereby reducing the degree of wafer deformation and preventing wafer breakage.

[0046] The technical solution provided in this embodiment uses independently configured apertures 1112 and suction cups 113 to adsorb the wafer, and places the wafer's edge 2000 in the receiving grooves 13 around the stage 11. With this configuration, when the wafer is slightly warped, the apertures 1112 are used to adsorb the wafer, making it stably placed on the support surface 1111. When the wafer warping is more severe, the suction cups 113 work in conjunction with the apertures 1112 to flatten and adsorb the wafer onto the support surface 1111. Meanwhile, since the outer edge of the wafer is encapsulated with a frame 2000, the frame 2000 can provide a certain degree of constraint on the wafer during the process of adsorbing the wafer with the aperture 1112 and the suction cup 113. Placing the frame 2000 in the receiving groove 13 can form a negative pressure cavity between the wafer and the bearing surface 1111. With the help of the aperture 1112 and the suction cup 113, the air in the negative pressure cavity is extracted, so that the wafer is firmly attached to the bearing surface 1111, avoiding warping during the wafer testing process, thereby ensuring the accuracy of the test results.

[0047] Further, please refer to Figures 4 to 5 In one embodiment of this utility model, the platform 11 further includes a support plate 111 and a bottom sealing plate 112. The support surface 1111, the positioning hole 1114, and a plurality of dense holes 1112 are all provided on the support plate 111. An air passage groove 1113 is provided on the side of the support plate 111 away from the support surface 1111. The dense holes 1112 communicate with the air passage groove 1113. The bottom sealing plate 112 is installed on the side of the support plate 111 away from the support surface 1111. The bottom sealing plate 112 is provided with an air passage hole 1121, which communicates with the air passage groove 1113 and is also connected to the first air passage 121. The bottom sealing plate 112 is also provided with a fixing hole 1122. The suction cup 113 passes through the positioning hole 1114 and the fixing hole 1122 and communicates with the second air passage 122. A sealing ring is provided between the suction cup 113 and the fixing hole 1122 to prevent the second air passage 122 from communicating with the air passage groove 1113. The gas passage 1113 allows gas to pass through. Gas passing through the dense hole 1112 gathers in the gas passage 1113 and finally enters the first passage through the gas passage hole 1121. The suction cup 113 directly passes through the positioning hole 1114 and the hole to communicate with the second gas passage 122. That is, the entire suction cup 113 passes through the support plate 111 and the bottom sealing plate 112 to communicate with the second gas passage 122. This arrangement effectively prevents gas leakage between different gas passages, enhances the sealing performance of the wafer carrier device 1000, and eliminates the need for the suction cup 113 to communicate with a separate structure similar to the gas passage 1113. Instead, it communicates directly with the second gas passage 122, reducing the overall structural complexity of the stage 11 and helping to reduce its volume. At the same time, the design of the gas passage 1113 on the support plate 111 and the gas passage hole 1121 on the bottom sealing plate 112 facilitates uniform airflow distribution, thereby improving the uniformity and reliability of wafer adsorption.

[0048] Furthermore, please refer to Figures 6 to 9 In one embodiment of this utility model, the main body 12 includes a first negative pressure hole 123 and a second negative pressure hole 124. The first negative pressure hole 123 is connected to the first air passage 121, and the second negative pressure hole 124 is connected to the second air passage 122. The first negative pressure hole 123 is connected to the air outlet 1121, and the second negative pressure hole 124 is connected to the suction cup 113. By connecting the first negative pressure hole 123 to the first air passage 121 and the second negative pressure hole 124 to the second air passage 122, precise control of the negative pressure in different parts of the carrier component 1 can be achieved. This arrangement helps to adjust the adsorption force according to the characteristics and testing requirements of wafers of different sizes or thicknesses, ensuring the stability of the wafer during the testing process.

[0049] Furthermore, in one embodiment of this utility model, there are multiple first negative pressure holes 123 and second negative pressure holes 124, and at least one first air passage 121 and second air passage 122. Each first air passage 121 is connected to one or more first negative pressure holes 123, and each second air passage 122 is connected to one or more second negative pressure holes 124. Please refer to the following for details. Figures 7 to 9 Depending on the wafer product, the required adsorption force during testing varies, and the dimensions of the main body 12 and the stage 11 also differ. Therefore, the design of the gas path in the main body 12 needs to comprehensively consider the model of the wafer product that the stage 11 is compatible with. In this embodiment, two first gas paths 121 are provided, one connected to one first negative pressure hole 123, and the other connected to both first negative pressure holes 123 simultaneously. Similarly, two second gas paths 122 are provided, one connected to one second negative pressure hole 124, and the other connected to both second negative pressure holes 124. Correspondingly, one first gas path 121 corresponds to one first negative pressure tube 21, and one second gas path 122 corresponds to one second negative pressure tube 22. Furthermore, the first gas paths 121 and second gas paths 122 are arranged alternately and intermittently to improve the space utilization rate within the main body 12.

[0050] In one embodiment of this utility model, please refer to Figure 3 and Figure 6, the main body 12 includes multiple mounting areas 125, the carrier stage 11 includes multiple ones, and each mounting area 125 is correspondingly mounted with a carrier stage 11. The multiple carrier stages 11 are arranged at intervals, and a receiving groove 13 is provided between adjacent carrier stages 11. In this embodiment, the projection of the carrier stage 11 onto the main body 12 is rectangular, and the number of carrier stages 11 is four. Correspondingly, there are four mounting areas 125 in the main body 12. The structure of each mounting area 125 is the same. Each mounting area 125 is correspondingly provided with two first air paths 121 and two second air paths 122. After the carrier stage 11 is mounted on the mounting area 125, adjacent carrier stages 11 are symmetrically distributed along their center lines. A receiving groove 13 is provided on the outer circumferences of all four carrier stages 11 for placing the frame 2000 of the wafer. Overall, the receiving grooves 13 around the four carrier stages 11 are in a "field" shape to ensure that when a small-sized wafer is placed on only one carrier stage 11, its frame 2000 can still be placed in the receiving groove 13. Through this setting, each time the wafer is tested, four small-sized wafers can be placed and tested simultaneously, thereby improving the test efficiency. Or a larger-sized wafer can be placed for testing, enabling the wafer carrier device 1000 to be compatible with wafers of different sizes for testing. In other embodiments, the shapes of the carrier stage 11 and the mounting position can be set to be circular or other polygonal shapes according to needs or design requirements to adapt to wafers of other shapes.

[0051] Meanwhile, in an embodiment of the present utility model, there is a fitting gap between the carrier stage 11 and the main body 12, and a sealing layer 14 is filled in the fitting gap. The sealing layer 14 is used to carry at least part of the frame 2000 of the wafer. Please refer to Figure 1 and Figure 2 , after all four carrier stages 11 are mounted on the mounting positions, a circle of sealing layer 14 is filled between the outer edge of the rectangular structure formed by the four carrier stages 11 and the main body 12. The function of the sealing layer 14 is to prevent air leakage between the carrier stage 11 and the main body 12. If there is also air leakage between adjacent carrier stages 11, a sealing layer 14 can be filled between adjacent carrier stages 11. The material of the sealing layer 14 includes one of materials such as sealing foam, sealant, and sealing silica gel. After the wafer is placed on the bearing surface 1111, part of the frame 2000 of the wafer close to the first negative pressure tube 21 and the second negative pressure tube 22 is placed on the top surface of the sealing layer 14. Through this setting, air leakage between the carrier stage 11 and the main body 12 is avoided, thereby ensuring the precise control of the main body 12 over the airtight holes 1112 and the suction cups 113.

[0052] In an embodiment of the present utility model, the multiple airtight holes 1112 are distributed in a rectangular array; or, the multiple airtight holes 1112 are distributed in a circular array. Through this setting, the airtight holes 1112 can be evenly distributed on the bearing surface 1111, thereby further ensuring that the adsorption force of the multiple airtight holes 1112 on the wafer is more uniform and avoiding wafer breakage caused by excessive local suction force.

[0053] In one embodiment of this utility model, the suction cup 113 includes an opening for adsorbing a wafer, the opening protruding from the bearing surface 1111. Please refer to [link / reference]. Figure 2 The opening of the suction cup 113, i.e. the part of the suction cup 113 used to adsorb the wafer, protrudes two to three millimeters from the bearing surface 1111. This setting allows the suction cup 113 to get closer to the bottom surface of the wafer when the wafer warps, making it easier for the suction cup 113 to adsorb the warped wafer. At the same time, since the suction cup 113 itself has a certain degree of flexibility, after the warped part of the wafer is adsorbed, a negative pressure cavity is formed between the wafer and the bearing surface 1111. Due to the pressure difference between the inside and outside of the wafer, the wafer gradually moves closer to the bearing surface 1111, thereby deforming the suction cup 113. Finally, the entire wafer is flatly adsorbed onto the bearing surface 1111.

[0054] In one embodiment of this invention, the bearing surface 1111 is coated with an antistatic coating. This design effectively prevents static electricity from accumulating on the surface of the wafer product, reduces the risk of electrostatic discharge (ESD) damage to the wafer product, and prevents the accuracy of wafer test results from being affected by static electricity accumulation.

[0055] This utility model also proposes a probe station, which includes a wafer carrier 1000. The specific structure of the wafer carrier 1000 is as described in the above embodiments. Since this probe station adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The probe station also includes a moving mechanism, on which the wafer carrier 1000 is mounted. The negative pressure assembly 2 also includes a negative pressure generator, which is connected to the first negative pressure tube 21 and the second negative pressure tube 22. The wafer carrier 1000 can move synchronously with the moving mechanism, facilitating the placement and pickup of the wafer. The negative pressure generator is used to extract air from the negative pressure cavity formed between the wafer and the carrier surface 1111. The negative pressure generator has two independent air paths, one connected to the first negative pressure tube 21 and the other connected to the second negative pressure tube 22, to precisely control the gas flow rate of the first air path 121 and the second air path 122.

[0056] It should be noted that the connection relationship described in any of the above embodiments is an airtight connection. This connection method can prevent gas from leaking from the component connection and ensure that gas will not escape from the gaps or interfaces of the connection.

[0057] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A wafer carrier device, characterized in that, include: The carrier assembly includes a main body, a stage, and a receiving groove. The stage includes a bearing surface and a suction cup. The bearing surface is provided with a positioning hole and a plurality of dense holes. The suction cup is installed in the positioning hole. Both the dense holes and the suction cup are used to adsorb wafers. The receiving groove is disposed on the outside of the stage and extends along the circumference of the stage. The edge of the wafer is provided with a frame, and the receiving groove is used to accommodate the frame. The stage is mounted on the main body, which includes a first air passage and a second air passage that are independent of each other. The first air passage is connected to the dense hole, and the second air passage is connected to the suction cup. A negative pressure assembly, comprising a first negative pressure pipe and a second negative pressure pipe, wherein the first negative pressure pipe is connected to the first air passage and the second negative pressure pipe is connected to the second air passage.

2. The wafer carrier device as described in claim 1, characterized in that, The platform further includes a support plate and a bottom sealing plate. The support surface, the positioning hole, and the plurality of dense holes are all provided on the support plate. An air passage groove is provided on the side of the support plate away from the support surface. The dense holes communicate with the air passage groove. The bottom sealing plate is installed on the side of the support plate away from the support surface. The bottom sealing plate is provided with an air passage hole, which communicates with the air passage groove and is also connected to the first air passage. The bottom sealing plate is also provided with a fixing hole. The suction cup passes through the positioning hole and the fixing hole and communicates with the second air passage. A sealing ring is provided between the suction cup and the fixing hole to prevent the second air passage from communicating with the air passage groove.

3. The wafer carrier device as described in claim 2, characterized in that, The main body includes a first negative pressure hole and a second negative pressure hole. The first negative pressure hole is connected to the first air passage, the second negative pressure hole is connected to the second air passage, the first negative pressure hole is connected to the air passage, and the second negative pressure hole is connected to the suction cup.

4. The wafer carrier device as described in claim 3, characterized in that, There are multiple first negative pressure holes and multiple second negative pressure holes, and there is at least one first air passage and at least one second air passage. Each first air passage is connected to one or more first negative pressure holes, and each second air passage is connected to one or more second negative pressure holes.

5. The wafer carrier device as described in claim 1, characterized in that, The main body includes multiple installation areas, and the platform includes multiple platforms. Each installation area corresponds to the installation of one platform. The multiple platforms are spaced apart, and the receiving groove is provided between adjacent platforms.

6. The wafer carrier device as described in claim 5, characterized in that, A fitting gap is provided between the stage and the main body, and a sealing layer is filled in the fitting gap. The sealing layer is used to support at least a portion of the edge of the wafer.

7. The wafer carrier device as described in claim 1, characterized in that, The multiple dense holes are distributed in a rectangular array; Alternatively, multiple of the dense holes may be distributed in a circular array.

8. The wafer carrier device as described in claim 1, characterized in that, The suction cup includes an opening for adsorbing the wafer, the opening protruding from the bearing surface.

9. The wafer carrier device as claimed in claim 1, characterized in that, The bearing surface is coated with an antistatic coating.

10. A probe station, characterized in that, The wafer carrier device includes any one of claims 1 to 9, the probe station further includes a moving mechanism, the wafer carrier device is mounted on the moving mechanism, and the negative pressure assembly further includes a negative pressure generator, the negative pressure generator being connected to the first negative pressure tube and the second negative pressure tube respectively.

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