Package substrate and die package

Abstract

The utility model provides a packaging substrate and a crystal grain packaging body. The packaging substrate comprises an insulating substrate which is provided with a first surface and a second surface which are opposite to each other; the interconnection structure is arranged in the insulating substrate and is exposed out of the first surface of the insulating substrate; the part, exposed out of the first surface of the insulating substrate, of the interconnection structure is configured to be electrically connected with a crystal grain; wherein the first surface of the insulating substrate is provided with at least one exhaust groove; at least one exhaust groove extends to the edge of the insulating substrate, and the exhaust groove comprises at least one first groove section in the thickness direction of the insulating substrate; the first groove section is not perpendicular to the first surface of the insulating substrate. According to the packaging substrate, the risk that the packaging material overflows to the outer side of the crystal grain packaging body through the exhaust grooves is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technical field especially relates to a package substrate and grain package body. BACKGROUND

[0002] In the packaging process, the grain is attached or inverted on the packaging substrate, and then the grain is packaged to form a grain package body.

[0003] At present, the packaging substrate usually sets up the exhaust groove, so that the gas in the grain package body is exhausted through the exhaust groove in the packaging process, and the bubbles in the grain package body are avoided. However, the packaging material is easy to overflow to the outside of the grain package body through the exhaust groove, pollute the subsequent production, and the packaging material is left at the outlet of the exhaust groove, and the burrs of the packaging material may affect the subsequent process operation. SUMMARY

[0004] The packaging substrate and the grain package body of the application aim to solve the problem that the packaging material is easy to overflow to the outside of the grain package body through the exhaust groove, pollute the subsequent production, and the packaging material is left at the outlet of the exhaust groove, and the burrs of the packaging material may affect the subsequent process operation.

[0005] To solve the above technical problems, one technical scheme of the application is to provide a packaging substrate, which comprises:

[0006] An insulating substrate has a first surface and a second surface opposite to each other;

[0007] An interconnection structure is arranged in the insulating substrate and exposed on the first surface of the insulating substrate, and the part of the interconnection structure exposed on the first surface of the insulating substrate is configured to be electrically connected with the grain;

[0008] Among them, the first surface of the insulating substrate is provided with at least one exhaust groove; at least one of the exhaust grooves extends to the edge of the insulating substrate, and the exhaust groove includes at least one first groove segment along the thickness direction of the insulating substrate; the first groove segment is arranged non-perpendicularly relative to the first surface of the insulating substrate.

[0009] In an embodiment of the application, the exhaust groove includes one first groove segment along the thickness direction of the insulating substrate, and the cross section of the first groove segment along the thickness direction of the insulating substrate is a parallelogram.

[0010] In an embodiment of the application, the exhaust groove includes a plurality of first groove segments which are connected with each other along the thickness direction of the insulating substrate, and the extension directions of the two adjacent first groove segments intersect.

[0011] In an embodiment of the application, the plurality of first groove segments are distributed in S shape or Z shape.

[0012] In one embodiment of the present application, the inner surface of at least part of the first groove segments in the at least one first groove segment is concave-convex.

[0013] In one embodiment of the present application, the cross section of the exhaust groove along the thickness direction of the insulating substrate is a first cross section;

[0014] wherein the area of the first cross section gradually decreases along the extension direction of the exhaust groove towards the direction close to the edge of the insulating substrate; or

[0015] the area of the first cross section first increases and then decreases along the extension direction of the exhaust groove towards the direction close to the edge of the insulating substrate.

[0016] In one embodiment of the present application, along the extension direction of the exhaust groove, the distance between the bottom wall of the exhaust groove and the first surface of the insulating substrate gradually decreases.

[0017] In one embodiment of the present application, along the extension direction of the exhaust groove, the first groove segment includes at least one second groove segment; each second groove segment is arranged non-perpendicularly to the central axis of the insulating substrate along the second direction.

[0018] In one embodiment of the present application, along the extension direction of the exhaust groove, the exhaust groove includes one second groove segment, and the second groove segment is parallelogram-shaped along its extension direction.

[0019] In one embodiment of the present application, along the extension direction of the exhaust groove, the exhaust groove includes a plurality of second groove segments that are in communication with each other, and the extension directions of two adjacent second groove segments intersect.

[0020] In one embodiment of the present application, the plurality of second groove segments are S-shaped or zigzag-shaped.

[0021] To solve the above technical problems, another technical solution adopted by the present application is to provide a die package, which comprises: a packaging substrate, which is the packaging substrate mentioned above; at least one die, which is arranged on the first surface of the packaging substrate and is electrically connected to the interconnection structure of the packaging substrate; and a packaging layer, which encapsulates the die and part of the packaging substrate; wherein part of the packaging layer is embedded in the exhaust groove of the packaging substrate and is arranged in a spaced manner with the port of the exhaust groove close to the edge of the packaging substrate.

[0022] The beneficial effects of this application embodiment, which differ from the prior art, are as follows: The packaging substrate provided in this application embodiment has at least one venting groove on the first surface of the insulating substrate; at least one venting groove extends to the edge of the insulating substrate to communicate with the external environment; thereby, during the packaging process of the packaging substrate and the die, the gas between the packaging material and the packaging substrate and the die can be discharged to the external environment through the venting groove, reducing the risk of bubbles being generated in the final die package. In addition, by further making the venting groove include at least one first groove segment along the thickness direction of the insulating substrate; the first groove segment is not perpendicular to the first surface of the insulating substrate; in this way, during the packaging process, the travel of the packaging material in the venting groove can be increased, and the non-perpendicular sidewall of the first groove segment can be used to prevent the packaging material from overflowing from the venting groove, slowing down the flow speed of the packaging material in the venting groove, effectively reducing the risk of the packaging material overflowing to the outside of the die package through the venting groove, reducing the amount of packaging material overflow and the burrs of the packaging material at the outlet of the venting groove, thereby effectively reducing the risk of the packaging material contaminating subsequent production and the risk of the packaging material burrs affecting subsequent process operations. Meanwhile, the non-vertically positioned first slot section makes it difficult for external moisture and dust to enter the die package, thereby effectively reducing the risk of internal contamination of the die package and improving the quality of the die package. Attached Figure Description

[0023] Figure 1 This is a plan view of a packaging substrate provided in an embodiment of this application;

[0024] Figure 2 Provided for an embodiment of this application Figure 1 The image shows a vertical cross-sectional view of the packaging substrate along the first direction.

[0025] Figures 3 to 5 A vertical cross-sectional view of the ventilation duct along the second direction provided for different embodiments;

[0026] Figure 6 A schematic diagram illustrating the process by which encapsulation material, provided in an embodiment of this application, flows along a second direction to encapsulate an encapsulation substrate and a die;

[0027] Figure 7 for Figure 6 The diagram shows the process of the encapsulation material flowing along the first direction during the encapsulation process.

[0028] Figure 8 A schematic diagram of the structure after the encapsulation material completely encapsulates the encapsulation substrate and the die;

[0029] Figure 9 A vertical cross-sectional view of the ventilation duct along the second direction, provided for another embodiment;

[0030] Figures 10 to 12A top view of a vent groove on a packaging substrate provided for different embodiments of the present application;

[0031] Figure 13 A sectional view of a vent groove on a packaging substrate provided for an embodiment of the present application along a first direction;

[0032] Figure 14 A vertical sectional view of a vent groove provided for another embodiment of the present application along a second direction.

[0033] Legend of signs

[0034] 10 packaging substrate; 1 insulating substrate; Z1 first surface; Z2 second surface; 11 vent groove; 111 first groove segment; 112 second groove segment; 11a starting groove segment; 11b intermediate groove segment; 11c terminal groove segment; 2 interconnection structure;

[0035] 20 die; 30 packaging layer; 31 packaging material. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the scope of protection of the present application.

[0037] The terms “first”, “second”, “third” in the present application are only for descriptive purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with “first”, “second”, “third” can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of “plurality” is at least two, such as two, three, etc., unless otherwise specifically limited. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative position relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly. In addition, the terms “include” and “have” and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed, or can optionally include other steps or units inherent to the process, method, product or device.

[0038] Reference to an "embodiment" herein means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive of one another. As will be apparent to those of ordinary skill in the art, embodiments described herein can be combined with other embodiments.

[0039] As background, during the packaging process, the packaging material is prone to overflow through the venting groove on the packaging substrate to the outside of the die package, contaminating subsequent production; and packaging material remains at the outlet of the venting groove, which can affect the subsequent process operation.

[0040] Based on this, the embodiments of the application provide a packaging substrate and a die package. The venting groove on the packaging substrate not only can exhaust the gas in the die package, reducing the risk of bubble generation in the die package; but also effectively reduces the risk of packaging material overflowing through the venting groove to the outside of the die package; reduces the probability of packaging material contaminating subsequent production and packaging material burrs affecting subsequent process operation.

[0041] The application will be described in detail below with reference to the accompanying drawings and embodiments.

[0042] Please refer to Figures 1 to 8 , Figure 1 The plan view of the packaging substrate provided by an embodiment of the application is shown in FIG. 1. Figure 2 The vertical cross-sectional view of the venting groove provided by an embodiment of the application is shown in FIG. 2. Figure 1 The vertical cross-sectional view of the packaging substrate along the first direction is shown in FIG. 3. Figures 3 to 5 The vertical cross-sectional view of the venting groove along the second direction provided by different embodiments is shown in FIG. 4. Figure 6 The process schematic diagram of the packaging material flowing along the second direction to package the packaging substrate and the die is shown in FIG. 5. Figure 7 The process schematic diagram of the packaging material flowing along the first direction during the packaging process is shown in FIG. 6. Figure 6 The structural schematic diagram of the packaging material completely packaging the packaging substrate and the die is shown in FIG. 7. Figure 8 The structural schematic diagram of the packaging material completely packaging the packaging substrate and the die is shown in FIG. 7.

[0043] The insulating substrate 1 has a first surface Z1 and a second surface Z2 opposite to each other. The interconnection structure 2 is arranged in the insulating substrate 1, and at least part of the interconnection structure 2 is exposed on the first surface Z1 and / or the second surface Z2 of the insulating substrate 1. The part of the interconnection structure 2 exposed on the first surface Z1 of the insulating substrate 1 is configured to be electrically connected with the die 20.

[0044] In some embodiments, as shown in Figure 1 The first surface Z1 of the insulating substrate 1 is provided with at least one vent groove 11; each vent groove 11 extends in the plane of the first surface Z1 of the insulating substrate 1, and at least one of all the vent grooves 11 on the insulating substrate 1 extends to the edge of the insulating substrate 1 along the first direction Y to communicate with the external environment; so that during the packaging of the packaging substrate 10 and the die 20, the gas between the packaging material 31 and the packaging substrate 10 and the die 20 can be discharged to the external environment through the vent groove 11, reducing the risk of air bubbles in the finally formed die package. The end of the vent groove 11 away from the edge of the insulating substrate 1 is defined as the first end; the end of the vent groove 11 close to the edge of the insulating substrate 1 is defined as the second end.

[0045] In one specific embodiment, all the vent grooves 11 extend to the edge of the insulating substrate 1 along the first direction Y.

[0046] In some embodiments, the first surface Z1 of the insulating substrate 1 can be provided with a plurality of vent grooves 11, and the plurality of vent grooves 11 are distributed on both sides of the insulating substrate 1 along the first direction Y of the insulating substrate 1. Wherein, the insulating substrate 1 can be rectangular, the first direction Y can be the width direction of the insulating substrate 1, the second direction X is perpendicular to the first direction Y, and the second direction X can be the length direction of the insulating substrate 1.

[0047] Wherein, the shapes of the cross sections of different vent grooves 11 along the thickness direction Z of the insulating substrate 1 can be the same. Or the shapes of the cross sections of different vent grooves 11 along the thickness direction Z of the insulating substrate 1 are different. Or the shapes of the cross sections of part of the vent grooves 11 along the thickness direction Z of the insulating substrate 1 are the same, and the shapes of the cross sections of part of the vent grooves 11 along the thickness direction Z of the insulating substrate 1 are different.

[0048] In combination with Figures 3 to 5 , the vent groove 11 includes at least one first groove segment 111 along the thickness direction Z of the insulating substrate 1; at least one of all the first groove segments 111 of the vent groove 11 along the thickness direction Z of the insulating substrate 1 is arranged non-perpendicularly to the first surface Z1 of the insulating substrate 1. Wherein, the first groove segment 111 arranged non-perpendicularly to the first surface Z1 of the insulating substrate 1 specifically means that the inner wall surface of the side wall of the first groove segment 111 is arranged non-perpendicularly to the first surface Z1 of the insulating substrate 1. Wherein, when the inner wall surface of the side wall of the first groove segment 111 is a plane, the first groove segment 111 arranged non-perpendicularly to the first surface Z1 of the insulating substrate 1 means that the inner wall surface of the side wall of the first groove segment 111 is arranged inclinedly to the first surface Z1 of the insulating substrate 1. When the inner wall surface of the side wall of the first groove segment 111 is a curved surface, the first groove segment 111 arranged non-perpendicularly to the first surface Z1 of the insulating substrate 1 means that the tangent plane of the inner wall surface of the side wall of the first groove segment 111 is arranged inclinedly to the first surface Z1 of the insulating substrate 1.

[0049] In one embodiment, all the first groove segments 111 of each vent groove 11 are arranged non-perpendicularly to the first surface Z1 of the insulating substrate 1.

[0050] The first groove segments 111 arranged non-perpendicularly to the first surface Z1 of the insulating substrate 1 can increase the travel distance of the packaging material 31 in the vent groove 11, and in combination with the fact that Figures 6 to 8 The sidewalls of the first groove segments 111 arranged non-perpendicularly to the first surface Z1 of the insulating substrate 1 can hinder the packaging material 31 from overflowing out of the vent groove 11, slow down the flow speed of the packaging material 31 in the vent groove 11, effectively reduce the risk of the packaging material 31 overflowing out of the vent groove 11 to the outside of the die package, reduce the amount of overflow of the packaging material 31 and the burrs of the packaging material 31 at the outlet of the vent groove 11, and thus effectively reduce the risk of the packaging material 31 contaminating the subsequent production and the burrs of the packaging material 31 affecting the subsequent production process.

[0051] In combination with the fact that Figures 3 to 5 The included angle a1 between the first groove segment 111 and the first surface Z1 of the insulating substrate 1 can be 30°-70°. For example, the included angle a1 can be 30°, or 45°, or 50°, or 60°, etc. When the inner wall surface of the sidewall of the first groove segment 111 is arc-shaped, the included angle a1 between the first groove segment 111 and the first surface Z1 of the insulating substrate 1 specifically refers to the included angle between the tangent plane of the inner wall surface of the sidewall of the first groove segment 111 and the first surface Z1 of the insulating substrate 1.

[0052] In one embodiment, as shown in Figure 3 The vent groove 11 includes a first groove segment 111 along the thickness direction Z of the insulating substrate 1, and the cross section of the first groove segment 111 along the thickness direction Z of the insulating substrate 1 is a parallelogram. Of course, the inner wall surface of the sidewall of the first groove segment 111 can also be curved, such as an arc surface.

[0053] In another embodiment, as shown in Figure 4 or Figure 5 The vent groove 11 includes a plurality of first groove segments 111 that are in communication with each other along the thickness direction Z of the insulating substrate 1, the extension directions of adjacent two first groove segments 111 intersect, and the included angle between the adjacent two first groove segments 111 is a first preset angle b1; the first preset angle b1 can be greater than 0° and less than or equal to 90°. For example, the first preset angle b1 can be 20°, or 30°, or 45°, or 50°, 60°, or 90°, etc.

[0054] In some embodiments, as shown in Figure 4 The plurality of first groove segments 111 of the vent groove 11 can be distributed in an S shape. Alternatively, as shown in Figure 5As shown, the plurality of first groove segments 111 of the exhaust groove 11 can be distributed in a Z shape. Of course, in other embodiments, the plurality of first groove segments 111 of the exhaust groove 11 can also be a heterogeneous structure in combination of S shape and Z shape.

[0055] Of course, in other specific embodiments, referring to Figure 9 , Figure 9 The vertical sectional view of the exhaust groove provided by another embodiment along the second direction; the first preset angle β1 can also be greater than 90°. For example, the first preset angle β1 can be 120°, or 130°, or 145°, or 150°, etc. The plurality of first groove segments 111 can be distributed in a stepped shape.

[0056] In the embodiment, when the exhaust groove 11 includes a plurality of first groove segments 111 along the thickness direction Y of the insulating substrate 1, the shape and size of different first groove segments 111 along the extension direction of the exhaust groove 11 are the same, which is taken as an example in the embodiment. Of course, the shapes of different first groove segments 111 along the extension direction of the exhaust groove 11 can also be different; or the shapes and sizes of part of the first groove segments 111 along the extension direction of the exhaust groove 11 are the same, and the shapes and sizes of part of the first groove segments 111 along the extension direction of the exhaust groove 11 are different.

[0057] In some embodiments, referring to Figures 10 to 12 The top view of the exhaust groove 11 on the packaging substrate 10 provided by different embodiments of the present application; the first groove segment 111 includes at least one second groove segment 112 along the extension direction of the exhaust groove 11; at least one second groove segment 112 of all the second groove segments 112 of the first groove segment 111 along the extension direction of the exhaust groove 11 is arranged non-perpendicularly to the central axis O of the insulating substrate 1. Wherein, the central axis O of the insulating substrate 1 is the center line of the insulating substrate 1 along the first direction Y, which is parallel to the second direction X. Wherein, the non-perpendicular arrangement of the second groove segment 112 relative to the central axis O of the insulating substrate 1 specifically refers to the inner wall surface of the side wall of the second groove segment 112 is arranged non-perpendicularly to the central axis O of the insulating substrate 1. Wherein, when the inner wall surface of the side wall of the second groove segment 112 is a plane, the non-perpendicular arrangement of the second groove segment 112 relative to the central axis O of the insulating substrate 1 refers to the inner wall surface of the side wall of the second groove segment 112 is arranged obliquely to the central axis O of the insulating substrate 1. When the inner wall surface of the side wall of the second groove segment 112 is a curved surface, the non-perpendicular arrangement of the second groove segment 112 relative to the central axis O of the insulating substrate 1 refers to the tangent plane of the inner wall surface of the side wall of the second groove segment 112 is arranged obliquely to the central axis O of the insulating substrate 1.

[0058] In one specific embodiment, all the second groove segments 112 of each first groove segment 111 are arranged non-perpendicularly to the central axis O of the insulating substrate 1.

[0059] In this way, the inner surface of the sidewall of the second groove segment 112 can hinder the encapsulation material 31 from overflowing through the first groove segment 111, thereby reducing the amount of overflow of the encapsulation material 31 and the burrs of the encapsulation material 31 at the outlet of the exhaust groove 11, and effectively reducing the risk of the encapsulation material 31 polluting the subsequent production and the burrs of the encapsulation material 31 affecting the subsequent production process.

[0060] In some embodiments, the angle a2 between the second groove segment 112 and the central axis O of the insulating substrate 1 can be 30°-70°. For example, the angle a2 can be 30°, or 45°, or 50°, or 60°, etc. Similarly, if the inner wall surface of the sidewall of the second groove segment 112 is arc-shaped, the angle a2 between the second groove segment 112 and the central axis O of the insulating substrate 1 specifically refers to the angle between the tangent of the inner wall surface of the sidewall of the second groove segment 112 and the central axis O of the insulating substrate 1.

[0061] In one embodiment, as shown in FIG. 1A, the first groove segment 111 includes a second groove segment 112 along the extension direction of the exhaust groove 11, and the second groove segment 112 is parallelogram-shaped along the extension direction thereof; that is, the top view of the second groove segment 112 is parallelogram-shaped. Of course, the two sidewalls of the second groove segment 112 along the extension direction thereof can also be curved, such as arc-shaped. Figure 10

[0062] In another embodiment, as shown in FIG. 1B or 1C, the first groove segment 111 includes a plurality of second groove segments 112 that are connected to each other along the extension direction of the exhaust groove 11, the extension directions of adjacent two second groove segments 112 intersect, and the angle between the adjacent two second groove segments 112 is a second preset angle b2; the second preset angle b2 is greater than 0° and less than or equal to 90°. For example, the second preset angle b2 can be 20°, or 30°, or 45°, or 50°, or 60°, etc. Figure 11 Figure 12 In some specific embodiments, as shown in FIG. 1B, the plurality of second groove segments 112 of the first groove segment 111 can be distributed in an S shape. Alternatively, as shown in FIG. 1C, the plurality of second groove segments 112 of the first groove segment 111 can be distributed in a Z shape. Of course, in other embodiments, the plurality of second groove segments 112 of the first groove segment 111 can also be a combination of S shape and Z shape.

[0063] In some specific embodiments, as shown in FIG. 1B, the plurality of second groove segments 112 of the first groove segment 111 can be distributed in an S shape. Alternatively, as shown in FIG. 1C, the plurality of second groove segments 112 of the first groove segment 111 can be distributed in a Z shape. Of course, in other embodiments, the plurality of second groove segments 112 of the first groove segment 111 can also be a combination of S shape and Z shape. Figure 11 Figure 12 Similarly, when the first groove segment 111 includes a plurality of second groove segments 112, the shapes and sizes of different second groove segments 112 are the same, and the embodiments of the present application are all taken as examples. Of course, the shapes and sizes of different second groove segments 112 can also be different; or the shapes and sizes of part of the second groove segments 112 are the same, and the shapes and sizes of part of the second groove segments 112 are different.

[0064] In a specific embodiment, the shapes and sizes of the plurality of second groove segments 112 of the first groove segment 111 are the same.

[0065] In a specific embodiment, the shapes and sizes of the plurality of second groove segments 112 of the first groove segment 111 are the same.​​​Figure 12 The first groove section 111 is S-shaped along its extending direction, for example. The first groove section 111 can include a starting groove section 11a, at least one intermediate groove section 11b, and an ending groove section 11c along its extending direction, wherein the starting groove section 11a is close to the central region of the packaging substrate 10, and the ending groove section 11c is directly connected to the external environment; the at least one intermediate groove section 11b is connected to each other and located between the starting groove section 11a and the ending groove section 11c. The starting groove section 11a, the at least one intermediate groove section 11b, and the ending groove section 11c are S-shaped. In this way, during the packaging process, the packaging material 31 will first encounter the slope M of the starting groove section 11a, which will hinder the overflow of the packaging material 31, thereby reducing the overflow amount of the packaging material 31. The packaging material 31 overflowing into the starting groove section 11a will encounter the slope N of the intermediate groove section 11b during further overflow, which will again hinder the overflow of the packaging material 31, thereby further reducing the overflow amount of the packaging material 31. According to this principle, after being buffered by the other intermediate groove sections 11b and the ending groove section 11c, the amount of the packaging material 31 overflowing to the external environment is small, thereby effectively slowing down the flow speed of the packaging material 31 in the exhaust groove 11 and reducing the risk of the packaging material 31 overflowing through the exhaust groove 11 to the outside of the die packaging body.

[0066] Of course, in other specific embodiments, similar Figure 9 The second preset angle β2 can also be greater than 90°. For example, the second preset angle β2 can be 120°, or 130°, or 145°, or 150°, and the like. The plurality of second groove sections 112 can be ladder-shaped.

[0067] In some embodiments, the cross section of the exhaust groove 11 along the thickness direction Z of the insulating substrate 1 is a first cross section; since the size of the first cross section directly affects the overflow amount of the packaging material 31 through the exhaust groove 11 per unit time; the smaller the area of the first cross section, the less the overflow amount of the packaging material 31 per unit time of the corresponding exhaust groove 11. Therefore, the area of the first cross section can gradually decrease along the extending direction of the exhaust groove 11 towards the direction close to the edge of the insulating substrate 1; in this way, the overflow of the packaging material 31 can be hindered to a certain extent, and the overflow amount of the packaging material 31 can be reduced.

[0068] In one specific embodiment, referring to Figure 13 , Figure 13The sectional view of the exhaust groove 11 along the first direction Y is provided in an embodiment of the present application. Along the extending direction of the exhaust groove 11, the distance S1 between the bottom wall of the exhaust groove 11 and the first surface Z1 of the insulating substrate 1 gradually decreases. In this way, the position of the second end of the exhaust groove 11 along the thickness direction of the insulating substrate 1 is higher than that of the first end of the exhaust groove 11, so that the two ends of the exhaust groove 11 along the extending direction thereof form a certain height difference, so as to further block the risk of the encapsulation material 31 overflowing out of the exhaust groove 11 by using the height difference.

[0069] In this specific embodiment, the groove width corresponding to each position of the exhaust groove 11 along the extending direction thereof can be the same.

[0070] Of course, in other embodiments, the area of the first section can also first increase and then decrease along the extending direction of the exhaust groove 11 towards the direction close to the edge of the insulating substrate 1, so as to further hinder the encapsulation material 31 from overflowing out by the smaller area of the end of the exhaust groove 11.

[0071] In an embodiment, referring to Figure 14 , Figure 14 The vertical sectional view of the exhaust groove along the second direction is provided in another embodiment of the present application. The inner surface of at least part of the first groove segments 111 is in a concave-convex shape, such as a zigzag shape; in this way, the area of the inner surface of the first groove segment 111 can be increased, so as to increase the blocking area of each first groove segment 111 to the encapsulation material 31, so as to reduce the amount of the encapsulation material 31 overflowing out.

[0072] The packaging substrate 10 provided by the embodiments of the present application is characterized in that: the first surface Z1 of the insulating substrate 1 is provided with at least one exhaust groove 11; each exhaust groove 11 extends to the edge of the insulating substrate 1 to communicate with the external environment; thus, during the packaging process of the packaging substrate 10 and the die 20, the gas between the packaging material 31 and the packaging substrate 10 and the die 20 can be discharged to the external environment through the exhaust groove 11, thereby reducing the risk of generating air bubbles in the finally formed die package. In addition, the exhaust groove 11 further includes at least one first groove segment 111 along the thickness direction Z of the insulating substrate 1; each first groove segment 111 is arranged non-perpendicularly to the first surface Z1 of the insulating substrate 1; compared with the scheme in which the first groove segment 111 is perpendicular to the first surface Z1 of the insulating substrate 1, the above scheme of the present application can increase the travel distance of the packaging material 31 in the exhaust groove 11 during the packaging process, and the non-perpendicular side wall of the first groove segment 111 can hinder the overflow of the packaging material 31 from the exhaust groove 11, slow down the flow speed of the packaging material 31 in the exhaust groove 11, effectively reduce the risk of overflow of the packaging material 31 through the exhaust groove 11 to the outside of the die package, reduce the overflow amount of the packaging material 31 and the burrs of the packaging material 31 at the outlet of the exhaust groove 11, and further effectively reduce the risk of pollution of the packaging material 31 to the subsequent production and the risk of affecting the post-process operation caused by the burrs of the packaging material 31. At the same time, the non-perpendicular arrangement of the first groove segment 111 makes it difficult for external water vapor, dust and the like to enter the inside of the die package, thereby effectively reducing the risk of internal pollution of the die package and improving the quality of the die package.

[0073] In one embodiment, referring to Figure 8 ; a die package is provided, which includes a packaging substrate 10, a die 20 and a packaging layer 30. The packaging substrate 10 can be any of the packaging substrates 10 provided by the above embodiments. The die 20 is arranged on the first surface Z1 of the packaging substrate 10 and electrically connected to the interconnection structure 2 of the packaging substrate 10. The packaging layer 30 encapsulates the die 20 and part of the packaging substrate 10. Part of the packaging layer 30 is embedded in the exhaust groove 11 of the packaging substrate 10 and arranged at a distance from the port of the exhaust groove 11 close to the edge of the packaging substrate 10. The material of the packaging layer 30 includes silicon dioxide or epoxy resin.

[0074] The die package provided by the embodiments effectively reduces the risk of overflow of the packaging layer 30 through the exhaust groove 11 to the outside of the die package, reduces the overflow amount of the packaging layer 30 and the burrs of the packaging layer 30 at the outlet of the exhaust groove 11, and further effectively reduces the risk of pollution of the packaging layer 30 to the subsequent production and the risk of affecting the post-process operation caused by the burrs of the packaging layer 30. At the same time, it effectively reduces the risk of pollution of the die package caused by the entry of external water vapor, dust and the like into the inside of the die package through the exhaust groove 11, and improves the quality of the die package.

[0075] The above merely provides the implementation of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation based on the content of the present application specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A packaging substrate, characterized in that, include: An insulating substrate having a first surface and a second surface facing away from each other; An interconnect structure is disposed within the insulating substrate and exposed on a first surface of the insulating substrate; and the portion of the interconnect structure exposed on the first surface of the insulating substrate is configured to be electrically connected to a die. Wherein, at least one venting groove is formed on the first surface of the insulating substrate; at least one venting groove extends to the edge of the insulating substrate, and the venting groove includes at least one first groove segment along the thickness direction of the insulating substrate; the first groove segment is not perpendicular to the first surface of the insulating substrate.

2. The packaging substrate according to claim 1, characterized in that, The venting groove includes a first groove segment along the thickness direction of the insulating substrate, and the cross-section of the first groove segment along the thickness direction of the insulating substrate is a parallelogram.

3. The packaging substrate according to claim 1, characterized in that, The exhaust groove includes a plurality of interconnected first groove segments along the thickness direction of the insulating substrate, and the extension directions of two adjacent first groove segments intersect.

4. The packaging substrate according to claim 3, characterized in that, The multiple first groove segments are distributed in an S-shape or a Z-shape.

5. The packaging substrate according to any one of claims 1-4, characterized in that, At least a portion of the inner surface of the at least one first groove segment is irregular.

6. The packaging substrate according to any one of claims 1-4, characterized in that, The cross section of the exhaust groove along the thickness direction of the insulating substrate is the first cross section; Wherein, the area of ​​the first cross-section gradually decreases along the extension direction of the venting groove towards the edge of the insulating substrate; or The area of ​​the first cross section increases first and then decreases along the extension direction of the exhaust groove toward the edge of the insulating substrate.

7. The packaging substrate according to claim 6, characterized in that, Along the extending direction of the exhaust groove, the distance between the bottom wall of the exhaust groove and the first surface of the insulating substrate gradually decreases.

8. The packaging substrate according to any one of claims 1-4, characterized in that, Along the extension direction of the exhaust groove, the first groove segment includes at least one second groove segment; the second groove segment is not perpendicular to the central axis of the insulating substrate along the second direction.

9. The packaging substrate according to claim 8, characterized in that, Along the extending direction of the exhaust channel, the exhaust channel includes a second channel segment, which is parallelogram-shaped along its extending direction.

10. The packaging substrate according to claim 8, characterized in that, Along the extension direction of the exhaust channel, the exhaust channel includes a plurality of interconnected second channel segments, and the extension directions of two adjacent second channel segments intersect.

11. The packaging substrate according to claim 10, characterized in that, The multiple second slots are distributed in an S-shape or Z-shape.

12. A die-packaged material, characterized in that, include: The packaging substrate is the packaging substrate as described in any one of claims 1-11; At least one die is disposed on the first surface of the packaging substrate and is electrically connected to the interconnect structure of the packaging substrate; An encapsulation layer encapsulates a portion of the die and a portion of the encapsulation substrate therein; wherein a portion of the encapsulation layer is embedded within an venting groove of the encapsulation substrate and is spaced apart from the port of the venting groove near the edge of the encapsulation substrate.

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