Refrigeration unit of dispensing device

Abstract

The utility model discloses a refrigeration unit of a dispensing device, which comprises a refrigeration body and a refrigeration block, the refrigeration body is in contact connection with the refrigeration surface of the refrigeration block, the outer side of the refrigeration body is wrapped with a heat conduction shell, a heat insulation gap is formed between the inner wall of the heat conduction shell which is arranged at an interval with the refrigeration body and the refrigeration body, and the heat insulation gap is communicated with the heat conduction shell. The heat conduction shell is in contact connection with at least one heating component, the heating component is a heating rod embedded in the heat conduction shell or a heating block in contact with the outer side surface of the heat conduction shell, and the heat insulation gap is filled with a heat insulation material. While a good refrigeration effect is guaranteed, the temperature difference between the surfaces of the refrigeration block and the heat conduction shell and the surrounding environment is reduced, and the problem that condensate water is generated on the surface of the refrigeration block is solved fundamentally.

Description

Technical Field

[0001] This utility model relates to the field of dispensing technology, and in particular to a cooling unit for a dispensing device. Background Technology

[0002] Dispensing technology is widely used in product manufacturing. Dispensing equipment mainly consists of adhesive, dispensing devices, and dispensing valves. However, some adhesives tend to cure at room temperature, hindering dispensing. Therefore, refrigeration devices are needed to cool the adhesive coming out of the glue container. Existing refrigeration devices are prone to condensation on their outer surfaces due to low temperatures. This condensation dripping onto the product surface can damage or defect the product. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a cooling unit for a dispensing device. While ensuring a good cooling effect, the cooling unit of the dispensing device reduces the temperature difference between the surface of the cooling block and the heat-conducting shell and the surrounding environment, thus solving the problem of condensation on the surface of the cooling block from the root.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a cooling unit of a dispensing device, comprising: a cooling body and a cooling block, wherein the cooling body is in contact with the cooling surface of the cooling block, a heat-conducting shell is wrapped around the outside of the cooling body, and a heat-insulating gap is formed between the inner wall of the heat-conducting shell and the cooling body, and the heat-conducting shell is in contact with at least one heating component.

[0005] The following are further improvements to the above technical solution:

[0006] 1. In the above scheme, the heating element is a heating rod embedded in the heat-conducting shell or a heating block in contact with the outer surface of the heat-conducting shell.

[0007] 2. In the above scheme, the heating temperature of the heating element is close to room temperature.

[0008] 3. In the above scheme, the heat insulation gap is filled with heat insulation material.

[0009] 4. In the above scheme, the heat insulation material is heat insulation cotton or foamed heat insulation adhesive.

[0010] 5. In the above scheme, both the refrigeration body and the heat-conducting shell are metal bodies with high thermal conductivity.

[0011] 6. In the above scheme, the cooling body is a copper body, a brass body, or an aluminum body, and the heat-conducting shell is an aluminum shell or a copper shell.

[0012] 7. In the above scheme, the heat dissipation surface of the cooling block, which is composed of at least two stacked semiconductor cooling chips, is connected to a heat sink.

[0013] 8. In the above scheme, the heat-conducting shell is mounted on the heat sink.

[0014] 9. In the above scheme, the refrigeration body is provided with at least one receiving groove into which the glue supply tube and / or dispensing head are embedded, and the heat-conducting shell is provided with a clearance through hole through which the glue supply tube and / or dispensing head passes.

[0015] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0016] The refrigeration unit of the dispensing device of this utility model has a heat-conducting shell wrapped around the outside of the refrigeration body that is in contact with the cold surface of the refrigeration block. The inner wall of the heat-conducting shell, which is spaced apart from the refrigeration body, forms a heat-insulating gap with the refrigeration body. The heat-conducting shell is in contact with at least one heating component. While ensuring a good refrigeration effect, it reduces the temperature difference between the surface of the refrigeration block and the heat-conducting shell and their surrounding environment, thus solving the problem of condensation on the surface of the refrigeration block from the root. Attached Figure Description

[0017] Appendix Figure 1 This is a schematic diagram of the cooling unit of the dispensing device of this utility model;

[0018] Appendix Figure 2 for Figure 1 Cross-sectional schematic diagram of the middle structure;

[0019] Appendix Figure 3 This is a schematic diagram showing the refrigeration unit, hose, and dispensing head of this utility model in their assembled state.

[0020] Appendix Figure 4 for Figure 3 A cross-sectional schematic diagram of the structure.

[0021] In the above attached diagram: 100, hose; 200, dispensing head; 1, refrigeration body; 2, refrigeration block; 3, heat-conducting shell; 31, clearance hole; 4, heat insulation gap; 5, heating element; 6, receiving groove; 7, radiator. Detailed Implementation

[0022] The present patent can be further understood through the specific embodiments given below, but they are not intended to limit the present patent.

[0023] Example 1: A cooling unit for a dispensing device, used in conjunction with the dispensing device, for cooling the adhesive flowing through the dispensing tube and dispensing head of the dispensing device, overcoming the problem that the adhesive is prone to rapid curing at room temperature, comprising: a cooling body 1 and a cooling block 2, wherein the cooling body 1 is in contact with the cooling surface of the cooling block 2, a heat-conducting shell 3 is provided on the outer side of the cooling body 1, and a heat-insulating gap 4 is formed between the inner wall of the heat-conducting shell 3 and the cooling body 1, which is spaced apart from the cooling body 1, and the heat-conducting shell 3 is in contact with at least one heating element 5.

[0024] The heating element 5 is a heating rod embedded in the heat-conducting housing 3; the heating temperature of the heating element 5 is close to room temperature.

[0025] The aforementioned heat insulation gap 4 is filled with heat insulation material; the aforementioned heat insulation material is heat insulation cotton.

[0026] The aforementioned cooling body 1 is made of copper, and the aforementioned heat-conducting shell 3 is made of aluminum. Aluminum has good thermal conductivity. By actively heating the heat-conducting shell, its surface temperature is not much different from the room temperature. When air comes into contact with the surface of the heat-conducting shell, water molecules will not condense due to excessive temperature difference. In principle, the formation of condensate is avoided, which is more stable and durable than adding a water absorption device.

[0027] The aforementioned refrigeration body 1 has at least one receiving groove 6 into which a glue supply tube 100 is embedded, which is convenient for wrapping the glue tube that needs to be refrigerated so as to refrigerate the glue liquid therein and ensure its fluidity. The aforementioned heat-conducting shell 3 has a clearance through hole 31 through which the glue supply tube 100 passes.

[0028] Example 2: A cooling unit of a dispensing device includes: a cooling body 1 and a cooling block 2. The cooling body 1 is in contact with the cooling surface of the cooling block 2. A heat-conducting shell 3 is wrapped around the outside of the cooling body 1. A heat-insulating gap 4 is formed between the inner wall of the heat-conducting shell 3 and the cooling body 1, which is spaced apart from the cooling body 1. The heat-conducting shell 3 is in contact with at least one heating element 5.

[0029] The aforementioned heating element 5 is a heating block that contacts the outer surface of the heat-conducting shell.

[0030] The aforementioned heat insulation gap 4 is filled with heat insulation material; the aforementioned heat insulation material is foamed heat insulation adhesive.

[0031] Both the refrigeration body 1 and the heat-conducting shell 3 are metal bodies with high thermal conductivity; the refrigeration body 1 is a brass body and the heat-conducting shell 3 is a copper shell.

[0032] The heat dissipation surface of the aforementioned cooling block 2, which is composed of at least two stacked semiconductor cooling chips, is connected to a heat sink 7; the aforementioned heat-conducting housing 3 is installed on the heat sink 7. Both the cooling chips and the heat sink are purchased externally and fall within the scope of existing technology, so they will not be described in detail here.

[0033] The aforementioned refrigeration body 1 has at least one receiving groove 6 into which a dispensing head 200 is embedded, and the aforementioned heat-conducting housing 3 has a clearance through hole 31 through which the dispensing head 200 passes.

[0034] When using the above-mentioned dispensing device in a refrigeration unit, while ensuring a good refrigeration effect, it reduces the temperature difference between the surface of the refrigeration block and the heat-conducting shell and their surrounding environment, thus fundamentally solving the problem of condensation on the surface of the refrigeration block.

[0035] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A cooling unit for a dispensing apparatus, comprising: The refrigeration body (1) and the refrigeration block (2) are connected in contact with each other on the refrigeration surface of the refrigeration body (1). The refrigeration body (1) is wrapped with a heat-conducting shell (3) on the outside. The inner wall of the heat-conducting shell (3) is spaced apart from the refrigeration body (1) and a heat-insulating gap (4) is formed between the heat-conducting shell (3) and the refrigeration body (1). The heat-conducting shell (3) is connected in contact with at least one heating element (5).

2. The cooling unit of the dispensing device according to claim 1, characterized in that: The heating element (5) is a heating rod embedded in the heat-conducting shell (3) or a heating block that contacts the outer surface of the heat-conducting shell (3).

3. The cooling unit of the dispensing device according to claim 1, characterized in that: The heating element (5) has a heating temperature close to room temperature.

4. The cooling unit of the dispensing device according to claim 1, characterized in that: The insulation gap (4) is filled with insulation material.

5. The cooling unit of the dispensing device according to claim 4, characterized in that: The heat insulation material is heat insulation cotton or foamed heat insulation adhesive.

6. The cooling unit of the dispensing device according to claim 1, characterized in that: Both the refrigeration body (1) and the heat-conducting shell (3) are metal bodies with high thermal conductivity.

7. The cooling unit of the dispensing device according to claim 6, characterized in that: The cooling body (1) is a copper body, a brass body or an aluminum body, and the heat-conducting shell (3) is an aluminum shell or a copper shell.

8. The cooling unit of the dispensing device according to claim 1, characterized in that: The heat dissipation surface of the cooling block (2), which is composed of at least two stacked semiconductor cooling chips, is connected to a heat sink (7).

9. The cooling unit of the dispensing device according to claim 8, characterized in that: The heat-conducting housing (3) is mounted on the radiator (7).

10. The cooling unit of the dispensing device according to claim 1, characterized in that: The refrigeration body (1) has a receiving groove (6) in which at least one glue supply tube (100) and / or glue dispensing head (200) are embedded, and the heat-conducting housing (3) has a clearance through hole (31) through which the glue supply tube (100) and / or glue dispensing head (200) pass.

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