Copper-clad plate gluing device
By employing an inclined glue tank plate and overflow hole structure in the copper clad laminate gluing device, the problem of uneven glue deposition was solved, achieving uniform distribution of the glue layer and improving the quality of the board and production efficiency.
Patent Information
- Application Number
- CN202520034306.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-07
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-01-07
AI Technical Summary
In existing copper clad laminate gluing devices, the high viscosity and low fluidity of the adhesive cause filler clumping and deposition in some areas of the adhesive tank bottom plate, resulting in uneven distribution of the adhesive layer on the board and affecting quality.
The system employs an inclined glue tank bottom plate and an overflow section structure, combined with a circulation pump and a temporary storage tank. The inclined plate section allows the glue to flow rapidly, while the overflow hole controls the amount of glue, preventing sedimentation. Furthermore, the system improves the uniformity of the glue through recycling.
It improves the uniformity of the adhesive layer, enhances the quality of the boards, reduces adhesive waste, and increases production efficiency.
Smart Images
Figure CN223832739U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of copper clad laminate production equipment, specifically relating to a copper clad laminate gluing device. Background Technology
[0002] In the production of copper-clad laminates (CCLs), adhesive needs to be applied to the CCLs. This application is achieved through a release film coated with adhesive. During the adhesive application process, after the adhesive flows into the adhesive tank, a certain amount of adhesive needs to be accumulated. Operation is maintained by adjusting the amount of adhesive used (the amount carried away by the release film) and the amount of adhesive replenished from the adhesive tank. Because fillers constitute a large proportion of the adhesive, the overall viscosity of the prepared adhesive is high and its fluidity is low. Furthermore, the bottom plate of the adhesive tank in existing adhesive application devices is a horizontal structure, which leads to filler clumping and deposition in some areas of the bottom plate. This results in uneven filler distribution on the prepreg in certain locations, affecting the quality of the laminate. Utility Model Content
[0003] The purpose of this invention is to provide an adhesive bonding device for copper-clad laminates that can improve the problem of uneven adhesive layer distribution.
[0004] To achieve the above objectives, the present invention adopts the following technical solution:
[0005] A copper-clad laminate adhesive application device includes: an adhesive storage tank with an outlet pipe; a temporary storage tank connected to the adhesive storage tank via a connecting pipe, the connecting pipe being equipped with a circulation pump; a release film conveying roller for conveying release film, the release film conveying roller including a first conveying roller and a second conveying roller spaced vertically apart; an adhesive trough plate located between the first conveying roller and the second conveying roller, the adhesive trough plate being opposite to the release film that bypasses the first conveying roller and the second conveying roller; the adhesive trough plate includes a base plate, an adhesive blocking plate, and... The back plate is connected to the base plate. The base plate includes an upwardly inclined section and a horizontally arranged overflow section. The overflow section is provided with an overflow hole. The adhesive blocking plate is disposed on the overflow section, and the position of the adhesive blocking plate on the overflow section is adjustable. The temporary storage tank is located below the overflow hole. The first end of the inclined section is connected to the overflow section, and the height of the second end is higher than the height of the overflow section. The dispensing tube is located above the second end of the inclined section. The length of the projection of the inclined section on the horizontal plane is greater than the width of the release film.
[0006] In some embodiments, the inclination angle of the inclined plate segment is 5 to 30°.
[0007] In some embodiments, the back panel is inclined.
[0008] In some embodiments, the storage tank is equipped with a stirring device.
[0009] In some embodiments, the storage tank is a stainless steel tank.
[0010] In some embodiments, the temporary storage container is a metal container.
[0011] In some embodiments, the connecting pipe is a flexible metal hose.
[0012] As can be seen from the above technical solutions, in order to address the problem of uneven adhesive layer distribution on the board, the adhesive tank plate of this utility model adopts a sloping bottom plate. After the adhesive flows into the adhesive tank plate, it can flow quickly along the sloping section, reducing the phenomenon of local deposition and improving the bottom deposition. Furthermore, the overflow holes in the overflow section control the adhesive in the adhesive tank plate to prevent excessive adhesive. The adhesive tank plate structure of this utility model can improve the overall uniformity of the adhesive, improve the situation where uneven release film adhesive layer affects the quality of the board, and improve the quality of the board. Attached Figure Description
[0013] To more clearly illustrate the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0014] Figure 1 This is a schematic diagram of the adhesive application device on the copper-clad laminate according to an embodiment of the present invention;
[0015] Figure 2 The adhesive device on the copper-clad laminate in this embodiment of the utility model is along Figure 1 Structural diagram viewed from the direction of the middle arrow
[0016] Figure 3 For the embodiments of this utility model, the glue plate edge Figure 1 A structural diagram viewed from the direction of the middle arrow;
[0017] Figure 4 This is a top view of the adhesive plate in an embodiment of the present invention.
[0018] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. Detailed Implementation
[0019] The present invention will now be described in detail with reference to the accompanying drawings. In the detailed description of the embodiments of the present invention, for ease of explanation, the drawings illustrating the device structure will be partially enlarged without adhering to the general scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. It should be noted that the drawings are in a simplified form and use non-precise scales, solely for the purpose of conveniently and clearly illustrating the embodiments of the present invention. Additionally, in the description of this application, terms such as "first" and "second" are used only to distinguish descriptions and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Terms such as "positive," "negative," "bottom," "upper," "lower," "front," "rear," "left," and "right" indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.
[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can also refer to the internal connection of two components; and they can refer to a wireless connection or a wired connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0021] like Figure 1 and Figure 2 As shown, the coating device for copper-clad laminate in this embodiment includes a storage tank 1, a glue tank plate 2, a temporary storage tank 3, a circulating pump 4, and a release film conveying roller 5. The storage tank 1 stores the adhesive to be coated onto the release film. A stirring device is installed inside the storage tank 1. After the adhesive raw material is added to the storage tank 1 according to the specified ratio, it is stirred by the stirring device. The stirred adhesive is then stored in the storage tank 1. In some embodiments, the storage tank 1 may be a tank made of stainless steel. The temporary storage tank 3 collects the adhesive overflowing from the glue tank plate 2. In some embodiments, the temporary storage tank 3 may be a tank made of metal.
[0022] The temporary storage tank 3 and the glue storage tank 1 are connected by a connecting pipe 6. A circulation pump 4 is installed on the connecting pipe 6. The circulation pump 4 can transport the glue in the temporary storage tank 3 to the glue storage tank 1 to realize the reuse of the overflow glue. In some embodiments, the connecting pipe 6 can be a metal hose.
[0023] The outlet of the glue storage tank 1 is equipped with a glue dispensing pipe 1-1, and a valve is installed at the outlet of the glue dispensing pipe 1-1 to control the speed at which the glue is delivered. The glue in the storage tank 1 is transported to the glue tank plate 2 through the glue dispensing pipe 1-1. The temporary storage tank 3 is located below the glue tank plate 2, so as to collect the glue overflowing from the glue tank plate 2.
[0024] The release film conveying roller 5 and the adhesive tank plate 2 are arranged opposite to each other. The release film conveying roller 5 includes a first conveying roller 5-1 and a second conveying roller 5-2 arranged vertically at intervals. The release film 100 passes around the first conveying roller 5-1 and the second conveying roller 5-2 in sequence and moves under the drive of the two conveying rollers. The first conveying roller 5-1 and the second conveying roller 5-2 are located on the upper and lower sides of the adhesive tank plate 2, respectively. When the conveying roller drives the release film 100 to move, the release film 100 moves from the first conveying roller 5-1 to the second conveying roller 5-2 and passes through the adhesive tank plate 2, so that the adhesive tank plate 2 applies the adhesive to the surface of the release film 100.
[0025] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the glue tank plate 2 in this embodiment includes a base plate 2-1, a back plate 2-2, and a glue-blocking plate 2-3. The base plate 2-1 has a folded plate structure, consisting of an inclined plate segment 2-1a and a horizontally positioned glue overflow segment 2-1b. One end (first end) of the inclined plate segment 2-1a is integrally connected to the glue overflow segment 2-1b, while the other end (second end) is raised upwards, exceeding the height of the glue overflow segment 2-1b. A glue overflow hole a is machined into the glue overflow segment 2-1b. The glue outlet pipe 1-1 is located above the inclined plate segment 2-1a and near its second end. After the glue flows out from the outlet pipe 1-1, it flows onto the inclined plate segment 2-1a. Because the inclined plate segment 2-1a is inclined, and its second end is higher than the first end connected to the glue overflow segment 2-1b, the glue naturally flows from the inclined plate segment 2-1a to the glue overflow segment 2-1b under gravity. In this embodiment, the inclined plate segment 2-1a is tilted upwards at 15 degrees, meaning the angle between the plane (horizontal plane) containing the inclined plate segment 2-1a and the adhesive overflow segment 2-1b is 15°. In other embodiments, the tilt angle of the inclined plate segment 2-1a can be adjusted as needed, with an adjustment range between 5 and 30°. The length of the projection of the inclined plate segment 2-1a onto the plane (horizontal plane) containing the adhesive overflow segment 2-1b must be greater than the width w of the release film to achieve full coverage of the release film during adhesive application.
[0026] The back plate 2-2 is connected to the base plate 2-1, located behind the base plate 2-1, and opposite the release film 100, so that when the release film 100 is applied to the base plate 2-1, an adhesive groove can be formed. The back plate 2-2 can also be an inclined plate.
[0027] The adhesive blocking plate 2-3 is movably mounted on the adhesive overflow section 2-1b of the base plate 2-1. The position of the adhesive blocking plate 2-3 on the adhesive overflow section 2-1b is adjustable. Its function is to block the adhesive liquid so that the adhesive liquid can reach the preset height.
[0028] The working process of the coating device on the copper clad laminate in this embodiment is described below.
[0029] First, add the prepared adhesive raw materials to storage tank 1, stir well, and set aside for use;
[0030] Release film 100 is passed around first conveyor roller 5-1 and second conveyor roller 5-2 in sequence. When the drive roller rotates, release film 100 is conveyed from first conveyor roller 5-1 to second conveyor roller 5-2.
[0031] Adjust the position between the release film 100 and the adhesive tank plate 2 so that the release film 100 is close to the inclined plate section 2-1b of the base plate 2-1, and the base plate 2-1 slightly intrudes into the conveying path of the release film 100. The base plate 2-1 is perpendicular to the release film 100. When the release film 100 is tightened, the film surface of the release film 100 is tightly attached to the inclined plate section 2-1b to prevent the adhesive from seeping out and dripping from the gap between the inclined plate section 2-1b and the release film 100; an adhesive storage space is formed between the release film 100 and the adhesive tank plate 2.
[0032] At the beginning of glue application, the glue-blocking plate 2-3 is placed in front of the glue overflow hole a (on the side closer to the inclined plate section). Due to the obstruction of the glue-blocking plate 2-3, the glue cannot flow to the glue overflow hole a and outward. Instead, it is stored in the glue storage space formed between the release film 100 and the glue tank plate 2. When the glue storage reaches the preset liquid level, the glue-blocking plate 2-3 is moved backward to gradually open the glue overflow hole a. The glue can flow to the glue overflow section 2-1b and flow out from the overflow hole a. The glue flowing out from the overflow hole a flows into the temporary storage tank 3. By adjusting the opening of the valve at the outlet of the glue pipe 1-1 and the position of the glue-blocking plate 2-3, the inflow and outflow of the glue can be adjusted to maintain sufficient glue storage on the glue tank plate 2 to achieve glue coating of the release film.
[0033] The adhesive liquid flowing into the temporary storage tank 3 can be sent back to the storage tank 1 by the action of the circulation pump 4, and reused after stirring, thereby improving the utilization rate and reducing waste.
[0034] This invention sets the bottom plate of the glue tank plate as an inclined plate and has a horizontal overflow section. The inclined plate section allows for a large flow of glue to maintain the flow of the glue liquid, thereby preventing glue sedimentation and filler clumping. At the same time, the overflow hole of the overflow section controls the glue liquid in the glue tank plate to prevent excessive glue, thus maintaining the overall uniformity of the glue liquid and avoiding uneven release film adhesive layer from affecting the quality of the board, thereby improving the overall quality of the board.
[0035] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. An adhesive bonding device for copper-clad laminates, characterized in that, include: A glue storage tank, wherein the outlet of the glue storage tank is provided with a glue outlet pipe; A temporary storage tank is connected to the storage tank via a connecting pipeline, and a circulation pump is installed on the connecting pipeline. A release film conveying roller for conveying release film, the release film conveying roller including a first conveying roller and a second conveying roller arranged at an upper and lower interval; A glue tank plate is located between the first conveyor roller and the second conveyor roller, and the glue tank plate is opposite to the release film that passes around the first conveyor roller and the second conveyor roller; the glue tank plate includes a bottom plate, a glue-blocking plate and a back plate connected to the bottom plate, the bottom plate includes an upwardly inclined plate section and a horizontally arranged glue overflow section, the glue overflow section is provided with a glue overflow hole, the glue-blocking plate is disposed on the glue overflow section, and the position of the glue-blocking plate on the glue overflow section is adjustable, and the temporary storage tank is located below the glue overflow hole; The first end of the inclined plate segment is connected to the overflow section, the height of the second end is higher than the height of the overflow section, the glue outlet tube is located above the second end of the inclined plate segment, and the length of the projection of the inclined plate segment on the horizontal plane is greater than the width of the release film.
2. The adhesive application device for copper-clad laminates as described in claim 1, characterized in that: The inclination angle of the inclined plate segment is 5 to 30°.
3. The adhesive application device for copper-clad laminates as described in claim 1, characterized in that: The back plate is set at an angle.
4. The adhesive application device for copper-clad laminates as described in claim 1, characterized in that: The storage tank is equipped with a stirring device.
5. The adhesive application device for copper-clad laminates as described in claim 1, characterized in that: The storage tank is made of stainless steel.
6. The adhesive application device for copper-clad laminates as described in claim 1, characterized in that: The temporary storage container is a metal container.
7. The adhesive application device for copper-clad laminates as described in claim 1, characterized in that: The connecting pipe is a flexible metal hose.