Inverter

Abstract

The utility model relates to the technical field of automobile parts, and provides an inverter, which comprises a power board and a control and drive board, the control and drive board is superposed on the power board, a conductive joint film layer is clamped between the control and drive board and the power board, and the control and drive board and the power board realize mechanical connection and signal connection through the conductive joint film layer. According to the utility model, the conductive joint film layer is clamped between the control and drive board and the power board, the conductive joint film layer has material joint performance and conductive performance, mechanical connection and signal connection between the control and drive board and the power board can be realized through the conductive joint film layer, and structures such as a frame board and a connector are not required to be arranged; and the component cost and the process cost are greatly saved. And through the conductive bonding film layer, the control and drive board and the power board are bonded to form a thick integral circuit board structure, so that the strength of the assembled integral circuit board structure is improved, and the stability is enhanced.

Description

Technical Field

[0001] This utility model relates to the field of automotive parts technology, and more specifically, to inverters. Background Technology

[0002] An inverter consists of two circuit boards: a power board and a control and drive board. The two circuit boards work together to convert DC power to AC power.

[0003] In inverter assembly, the traditional approach is to use a frame board to achieve mechanical connection between the power board and the control and drive board, and to use connectors and other interfaces to achieve signal connection between the power board and the control and drive board. This approach has high process and component costs.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this utility model, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0005] This invention provides an inverter that enables mechanical and signal connections between the power board and the control and drive board in a low-cost manner, and enhances the strength of the connected circuit board.

[0006] According to one aspect of the present invention, an inverter is provided, comprising a power board and a control and drive board, wherein: the control and drive board is stacked on the power board, a conductive bonding film layer is sandwiched between the control and drive board and the power board, and the control and drive board and the power board are mechanically connected and signal connected through the conductive bonding film layer.

[0007] In some embodiments, the conductive bonding film layer includes: a prepreg sandwiched between the power board and the control and drive board; and a conductive film embedded in the prepreg; wherein the conductive film connects the signal output area of ​​the power board and the control and drive board, and the prepreg connects the power board and other areas of the control and drive board except for the signal output area.

[0008] In some embodiments, the prepreg has a through hole corresponding to the signal lead-out area, and the conductive film is embedded in the through hole.

[0009] In some embodiments, the area of ​​the via is larger than the area of ​​the signal extraction region; the edge of the via extends 200 μm to 500 μm beyond the edge of the signal extraction region, and / or the edge of the conductive film overflows 200 μm to 500 μm beyond the edge of the via.

[0010] In some embodiments, the thickness of the prepreg and the conductive film is 60 μm to 200 μm.

[0011] In some embodiments, the conductive bonding film layer includes: conductive adhesive and a signal lead-out area connecting the power board and the control and drive board.

[0012] In some embodiments, the conductive adhesive has any of the following parameters: resistivity less than 0.05 Ω·cm; shear force greater than 5 N / mm. 2 Thermal conductivity greater than 9 W / (K·m).

[0013] In some embodiments, the conductive bonding film layer includes: a solder layer, and a signal lead-out area connecting the power board and the control and drive board.

[0014] In some embodiments, the surfaces of the power board and the control and drive board are respectively provided with solder pads connecting their respective signal areas, forming signal lead-out areas of the power board and the control and drive board; the other areas of the surfaces of the power board and the control and drive board, except for the solder pads, are insulated by a solder resist layer.

[0015] In some embodiments, the power board and / or the control and drive board are formed as chip-embedded circuit boards.

[0016] The beneficial effects of this utility model compared with the prior art include at least the following:

[0017] This invention sandwiches a conductive bonding film layer between the control and drive board and the power board. This conductive bonding film layer possesses both material bonding and conductivity properties, enabling mechanical and signal connections between the control and drive board and the power board without the need for frame boards, connectors, or other structures, significantly reducing component and manufacturing costs. Furthermore, the conductive bonding film layer also allows the control and drive board and the power board to be joined together to form a robust, integrated circuit board structure, increasing the overall strength and stability of the assembled circuit board.

[0018] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit the present invention. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments conforming to the present invention and, together with the description, serve to explain the principles of the present invention. It is obvious that the drawings described below are merely some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0020] Figure 1 This diagram shows a structural schematic of an inverter according to an embodiment of the present invention;

[0021] Figure 2 This diagram shows a structural schematic of another inverter in an embodiment of the present invention;

[0022] Figure 3 This diagram shows a structural schematic of a conductive bonding film layer in an embodiment of the present invention.

[0023] Figure 4 This diagram shows a schematic representation of the signal extraction area in an embodiment of the present invention.

[0024] Figure 5 A schematic diagram of the structure of the prepreg in an embodiment of this utility model is shown. Detailed Implementation

[0025] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to those described herein. Rather, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0026] The accompanying drawings are merely illustrative of the present invention and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore, repeated descriptions of them will be omitted.

[0027] The terms "upper," "lower," etc., indicating orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, in the description of this utility model, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0028] It should be noted that, unless otherwise specified, the embodiments of this utility model and the features in different embodiments can be combined with each other.

[0029] Figure 1 and Figure 2 The diagram illustrates the structures of two inverters in embodiments of this utility model. Figure 1 and Figure 2 The diagram shows a cross-sectional view of the inverter's half-bridge module. Combined with... Figure 1 and Figure 2As shown, the inverter provided in this embodiment of the present invention includes:

[0030] The power board 100 and the control and drive board 200 are provided, wherein the control and drive board 200 is stacked on the power board 100, and a conductive bonding film layer 300 is sandwiched between the control and drive board 200 and the power board 100. The control and drive board 200 and the power board 100 are mechanically connected and signal connected through the conductive bonding film layer 300.

[0031] The Power Board 100 is responsible for energy conversion and transmission, and contains power switching devices. The Control and Driver Board 200 integrates control and drive functions, and is responsible for controlling the switching action of the power switching devices on the Power Board 100 to ensure stable operation of the inverter.

[0032] This invention sandwiches a conductive bonding film layer 300 between the control and drive board 200 and the power board 100. The conductive bonding film layer 300 possesses both material joining and conductivity properties. Through this conductive bonding film layer 300, mechanical and signal connections between the control and drive board 200 and the power board 100 can be achieved, eliminating the need for frame boards, connectors, and other structures, thus significantly reducing component and manufacturing costs. The material joining property refers to the conductive bonding film layer 300's ability to form a durable interface bond between the power board 100 and the control and drive board 200, achieving the mechanical connection between them. The signal connection refers to the transmission of control signals, feedback signals, drive signals, power signals, and other signals required for efficient inverter control and stable operation between the control and drive board 200 and the power board 100, achieved through the conductive bonding film layer 300.

[0033] This invention, through the conductive bonding film layer 300, also connects the control and drive board 200 and the power board 100 to form a thick overall circuit board structure, thereby improving the strength and stability of the assembled overall circuit board structure.

[0034] Figure 3 The structure of a conductive bonding film is illustrated, combining... Figure 1 and Figure 3 As shown, in some embodiments, the conductive bonding film layer 300 includes: a prepreg 310 sandwiched between the power board 100 and the control and drive board 200; and a conductive film 320 embedded in the prepreg 310; wherein the conductive film 320 connects the power board 100 and the signal output area A of the control and drive board 200, and the prepreg 310 connects the power board 100 and other areas of the control and drive board 200 other than the signal output area A.

[0035] Prepreg 310 refers to a fibrous material (such as glass fiber or carbon fiber) pre-impregnated with resin. Prepreg 310 is in a semi-cured state at room temperature, facilitating storage and processing. During heating and pressurization, prepreg 310 gradually cures, bonding the power board 100 to the control and drive board 200. After complete curing, prepreg 310 possesses high strength and rigidity, enabling it to be used for structural support, allowing the control and drive board 200 and power board 100 to bond and form a structurally stable integrated circuit board. Furthermore, prepreg 310 has insulating properties, ensuring good electrical insulation between the control and drive board 200 and power board 100, except for the signal lead-out area A.

[0036] The conductive film 320 has high conductivity, enabling high-performance signal connection between the signal output area A of the control and drive board 200 and the signal output area A of the power board 100. The conductive film 320 can be a metal thin film, such as a copper film, or other suitable conductive thin films such as conductive oxide films.

[0037] Figure 4 The structure of the signal extraction area is shown. Figure 5 The structure of the prepreg is illustrated; combined with Figure 1 , Figures 3 to 5 As shown, in some embodiments, the prepreg 310 is provided with a through hole 311 corresponding to the signal output area A, and the conductive film 320 is embedded in the through hole 311. The through hole 311 facilitates the precise determination of the position of the conductive film 320, so as to realize the signal connection between the control and drive board 200 and the signal output area A of the power board 100 through the conductive film 320.

[0038] in, Figure 4 The circuit board shown can be either a power board 100 or a control and drive board 200, and the signal output area A is located in the same position in both. It should be noted that... Figure 1 , Figure 2 , Figure 4 The location of signal output area A shown is merely illustrative; its location can be adjusted as needed based on the inverter's design requirements. Furthermore, process holes B can be provided on the power board 100 and control and drive board 200 to relieve stress.

[0039] Continue to combine Figure 1 , Figures 3 to 5As shown, in some embodiments, the area of ​​the via 311 is larger than the area of ​​the signal lead-out region A; the edge of the via 311 may extend 200 μm to 500 μm beyond the edge of the signal lead-out region A, and / or the edge of the conductive film 320 may extend 200 μm to 500 μm beyond the edge of the via 311. This ensures effective signal connection between the control and drive board 200 and the signal lead-out region A of the power board 100, while maintaining a reasonable spacing between adjacent vias 311 / conductive films 320 to avoid insulation failure.

[0040] In one specific example, the edge of the via 311 extends 200 μm beyond the edge of the signal lead-out region A, and the edge of the conductive film 320 overflows 200 μm beyond the edge of the via 311, but is not limited thereto.

[0041] In some embodiments, the thickness of the prepreg 310 and the conductive film 320 is 60 μm to 200 μm. This enables the conductive bonding film layer 300 to possess effective adhesive and conductive properties, achieving mechanical and signal connections between the control and drive board 200 and the power board 100.

[0042] Reference Figure 2 As shown, in some embodiments, the conductive bonding film layer 300 includes: conductive adhesive 330, and signal lead-out area A connecting the power board 100 and the control and drive board 200.

[0043] Conductive adhesive 330 is a conductive adhesive whose main components include: a base resin, such as epoxy resin or silicone rubber, which provides adhesion and mechanical properties; conductive fillers, such as silver powder or copper powder, which provide conductivity; and optionally, additives such as diluents, curing agents, and toughening agents to improve the processing performance of conductive adhesive 330. Connecting the power board 100 to the signal lead-out area A of the control and drive board 200 via conductive adhesive 330 also achieves both mechanical and signal connections between the power board 100 and the control and drive board 200.

[0044] In some embodiments, to ensure that the conductive adhesive 330 has good adhesion and conductivity, the composition of the conductive adhesive 330 can be improved so that the conductive adhesive 330 has any of the following process parameters: resistivity less than 0.05 Ω·cm; shear force greater than 5 N / mm. 2 The thermal conductivity is greater than 9 W / (K·m). Thus, the conductive adhesive 330 possesses effective adhesive and conductive properties, enabling mechanical and signal connections between the control and drive board 200 and the power board 100.

[0045] Among these factors, resistivity determines the conductivity of conductive adhesive 330. Shear force, the force that causes conductive adhesive 330 to undergo shear deformation, determines its mechanical properties. Thermal conductivity determines the heat dissipation capability of conductive adhesive 330, enabling heat dissipation for the power board 100 and the control and drive board 200, especially the signal output area A, thereby improving the reliability of the inverter.

[0046] Combination Figures 1 to 5 As shown, in some embodiments, the signal output area A of the power board 100 and the control and drive board 200 is formed by solder pads disposed on the surfaces of the power board 100 and the control and drive board 200. The solder pads of the power board 100 and the control and drive board 200 are respectively connected to their respective signal areas C. Other areas of the surfaces of the power board 100 and the control and drive board 200, except for the solder pads, are insulated by a solder mask. The signal areas C of the power board 100 and the control and drive board 200 are connected to their respective electronic components to achieve signal transmission. The solder pads are, for example, soldering plates whose surfaces are treated with ENIG (electrochemical nickel immersion gold) to protect the solder pads from oxidation while providing good contact performance.

[0047] In the above embodiments, the power board 100 and / or the control and drive board 200 can be formed as a chip-embedded PCB, which improves the integration, performance and reliability of the power board 100 / control and drive board 200 by embedding electronic components inside the PCB.

[0048] The conductive bonding film layer 300 of this invention is not limited to the combination of the prepreg 310 and the conductive film 320 or the conductive adhesive 330 described in the above embodiments, but can be any film layer with material bonding and conductivity properties, such as a welding layer. Specifically, in some embodiments, a welding layer can be provided as the conductive bonding film layer 300 between the power board 100 and the signal output area A of the control and drive board 200 to achieve mechanical connection and signal connection between the control and drive board 200 and the power board 100.

[0049] Combination Figures 1 to 5 As shown, the assembly process of the inverter provided by this utility model includes: setting a conductive bonding film layer 300 on a power board 100; stacking a control and drive board 200 on the power board 100, such that the conductive bonding film layer 300 is sandwiched between the power board 100 and the control and drive board 200; and pressing the power board 100 and the control and drive board 200 together, so as to realize the mechanical connection and signal connection between the power board 100 and the control and drive board 200 through the conductive bonding film layer 300.

[0050] This invention sandwiches a conductive bonding film layer 300, which possesses both material bonding and conductivity properties, between the control and drive board 200 and the power board 100. This achieves both mechanical and signal connections between the two boards, eliminating the need for frame boards, connectors, and other structures, thus significantly reducing component and manufacturing costs. The conductive bonding film layer 300 also allows the control and drive board 200 and the power board 100 to be joined together to form a robust, integrated circuit board structure, thereby increasing the strength and stability of the assembled circuit board.

[0051] In some embodiments, combined with Figure 1 , Figures 3 to 5 As shown, a conductive bonding film layer 300 is formed on the power board 100, including: forming through holes 311 in the prepreg 310 according to the positions of the signal lead-out areas A of the power board 100 and the control and drive board 200, forming a conductive bonding film layer 300 as shown. Figure 5 The structure of the prepreg 310 with through-hole 311 is shown. The signal output areas A of the power board 100 and the control and drive board 200 are distributed as follows: Figure 4 As shown. A prepreg 310 with through holes 311 is laid on the power board 100. A conductive film 320 is embedded in the through holes 311. The conductive film 320 can be placed using a pick-and-place machine or other suitable methods. The structure of the formed conductive bonding film layer 300 is as follows. Figure 3 As shown. A control and drive board 200 is stacked on the power board 100, so that the conductive film 320 connects the power board 100 and the signal output area A of the control and drive board 200, and the prepreg 310 connects the power board 100 and other areas of the control and drive board 200 except for the signal output area A.

[0052] Further, the pressing of the power plate 100 and the control and drive plate 200 includes: pressing them together at a temperature of 150°C to 180°C using a pressing force of 10 MPa to 20 MPa. Specifically, before laying the prepreg 310 with through holes 311 on the power plate 100, the power plate 100 can be placed on the lower platen; after stacking the control and drive plate 200 on the power plate 100, an upper platen can be stacked on the control and drive plate 200; then, it can be fed into a laminating machine for heating and pressurization, and the power plate 100 and the control and drive plate 200 are pressed together by the pressing force between the upper and lower plates.

[0053] After pressing, the prepreg 310 can firmly bond the power board 100 and the control and drive board 200, and realize the structural support between the power board 100 and the control and drive board 200; the conductive film 320 can realize high-performance signal connection between the signal output area A of the power board 100 and the signal output area A of the control and drive board 200.

[0054] In some embodiments, refer to Figure 2 As shown, a conductive bonding film layer 300 is provided on the power board 100, including: applying conductive adhesive 330 to the signal output area A of the power board 100; and stacking a control and drive board 200 on the power board 100 so that the conductive adhesive 330 connects the power board 100 and the signal output area A of the control and drive board 200.

[0055] The conductive adhesive 330 can be applied using a dispensing machine. The process of connecting the power board 100 and the signal lead-out area A of the control and drive board 200 using the conductive adhesive 330 is simple. It is only necessary to ensure a good mechanical connection and signal connection between the power board 100 and the control and drive board 200 by setting the process parameters of the conductive adhesive 330.

[0056] Further, the lamination of the power board 100 and the control and drive board 200 includes: curing conductive adhesive 330 at room temperature and laminating them with a pressure of 10 MPa to 20 MPa. Specifically, before applying conductive adhesive 330 to the signal output area A of the power board 100, the power board 100 can be placed on the lower platen; after stacking the control and drive board 200 on the power board 100, an upper platen can be stacked on the control and drive board 200; then, it can be fed into a laminating machine for pressurization, and the power board 100 and the control and drive board 200 are laminated by the pressure between the upper and lower platens.

[0057] After pressing, the conductive adhesive 330 can firmly bond the power board 100 and the signal lead-out area A of the control and drive board 200, realizing the mechanical connection and signal connection between the power board 100 and the control and drive board 200.

[0058] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the protection scope of the present invention.

Claims

1. An inverter, comprising a power board and a control and drive board, characterized in that: The control and drive board is stacked on the power board, and a conductive bonding film layer is sandwiched between the control and drive board and the power board. The control and drive board and the power board are mechanically connected and signal connected through the conductive bonding film layer.

2. The inverter as described in claim 1, characterized in that, The conductive bonding film layer includes: A prepreg is sandwiched between the power board and the control and drive board; A conductive film is embedded in the prepreg; The conductive film connects the signal output area of ​​the power board and the control and drive board, and the prepreg connects the power board and other areas of the control and drive board except for the signal output area.

3. The inverter as described in claim 2, characterized in that, The prepreg has through holes corresponding to the signal lead-out area, and the conductive film is embedded in the through holes.

4. The inverter as described in claim 3, characterized in that, The area of ​​the through hole is larger than the area of ​​the signal extraction region; The edge of the via extends 200 μm to 500 μm beyond the edge of the signal extraction area, and / or the edge of the conductive film overflows 200 μm to 500 μm beyond the edge of the via.

5. The inverter as described in claim 2, characterized in that, The thickness of the prepreg and the conductive film is 60 μm to 200 μm.

6. The inverter as described in claim 1, characterized in that, The conductive bonding film layer includes: Conductive adhesive is used to connect the power board to the signal output area of ​​the control and drive board.

7. The inverter as described in claim 6, characterized in that, The conductive adhesive has any of the following parameters: Resistivity less than 0.05 Ω·cm; Shear force greater than 5 N / mm 2 ; The thermal conductivity is greater than 9 W / (K·m).

8. The inverter as described in claim 1, characterized in that, The conductive bonding film layer includes: The solder layer connects the power board to the signal output area of ​​the control and drive board.

9. The inverter as described in any one of claims 2, 6, and 8, characterized in that, The power board and the control and drive board are respectively provided with solder pads that connect to their respective signal areas, forming signal output areas of the power board and the control and drive board; The surfaces of the power board and the control and drive board, except for the solder pads, are insulated by a solder resist layer.

10. The inverter as claimed in claim 1, characterized in that, The power board and / or the control and drive board are formed as a chip-embedded circuit board.

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