Shielding type electroplating bath for electroplating

Abstract

The utility model relates to the field of electroplating baths, in particular to a shielding type electroplating bath for electroplating, which comprises a bath body, a shielding frame and a shielding mechanism, a shielding frame used for containing a shielding mechanism is arranged at the upper end of the tank body, the shielding mechanism used for shielding electroplated workpieces is arranged in the shielding frame, and a first shielding track, a second shielding track, a third shielding track and a fourth shielding track are arranged on the two walls of the inner side of the shielding frame correspondingly. The first shielding track, the second shielding track, the third shielding track and the fourth shielding track are sequentially arranged along the two walls of the inner side of the shielding frame in a step shape. According to the utility model, the tank body, the shielding frame and the shielding mechanism are combined, so that when local electroplating is carried out, a worker can adjust the corresponding position of the shielding mechanism through the first shielding track, the second shielding track, the third shielding track and the fourth shielding track according to the local electroplating position of a workpiece so as to support the workpiece.

Description

Technical Field

[0001] This utility model relates to the field of electroplating tanks, and more particularly to a shielded electroplating tank for electroplating. Background Technology

[0002] Electroplating is a technique that deposits a layer of metal onto the surface of other materials through electrolysis. This technique is not only used in industrial production, but also has a wide range of applications in decoration, corrosion protection, improving wear resistance and improving conductivity. Local electroplating refers to electroplating specific parts of a workpiece.

[0003] Currently, when performing partial electroplating on metal workpieces, the entire workpiece is usually immersed in the electroplating solution, and the excess plating layer is polished off after electroplating is completed. Alternatively, insulating materials are used to cover the parts of the metal workpiece that need to be shielded. However, both of these methods increase the number of electroplating steps, thereby reducing the efficiency of electroplating.

[0004] Therefore, to address the problem of increased electroplating processes leading to reduced electroplating efficiency, a shielding electroplating tank can be designed. By incorporating a multi-level adjustable stepped structure within the electroplating tank, the non-electroplated parts of the workpiece are lifted above the surface of the electroplating solution, preventing them from contacting and reacting with the solution, thus providing a shielding effect and facilitating the solution of the aforementioned problem. Utility Model Content

[0005] To overcome the current problem that when performing partial electroplating on metal workpieces, the entire workpiece is usually immersed in the electroplating solution, and the excess plating layer is polished off after electroplating, or insulating materials are used to wrap the parts of the metal workpiece that need to be covered. However, both of these methods increase the number of electroplating steps and reduce the efficiency of workpiece electroplating.

[0006] The technical solution of this utility model is as follows: a shielded electroplating tank for electroplating, comprising a tank body, a shielding frame and a shielding mechanism; the upper end of the tank body is provided with a shielding frame for accommodating the shielding mechanism, and the inside of the shielding frame is provided with a shielding mechanism for shielding the electroplated workpiece; the inner two walls of the shielding frame are provided with a first shielding track, a second shielding track, a third shielding track and a fourth shielding track, and the first shielding track, the second shielding track, the third shielding track and the fourth shielding track are arranged in a stepped manner along the inner two walls of the shielding frame.

[0007] Preferably, this application combines a tank, a shielding frame, and a shielding mechanism, so that during local electroplating, the operator can adjust the shielding mechanism to the corresponding position via the first, second, third, and fourth shielding tracks according to the location of the local electroplating on the workpiece, thereby supporting the workpiece, or by putting a rubber ring on the electroplating boundary of the workpiece, so that the workpiece can be positioned and lifted by the rubber ring after the shielding mechanism moves, so that the non-electroplated parts do not come into contact with the electroplating solution.

[0008] Preferably, the shielding mechanism includes a first shielding plate, a second shielding plate, a third shielding plate, and a fourth shielding plate. Each of the first, second, third, and fourth shielding plates is provided in two sets. The two sets of first shielding plates are symmetrically arranged between the two sets of first shielding tracks, the two sets of second shielding plates are symmetrically arranged between the two sets of second shielding tracks, the two sets of third shielding plates are symmetrically arranged between the two sets of third shielding tracks, and the two sets of fourth shielding plates are symmetrically arranged between the two sets of fourth shielding tracks.

[0009] Preferably, the two sets of first, second, third, and fourth shielding plates each have a mating slot at one end.

[0010] Preferably, two sets of sliders are symmetrically provided on both sides of the two sets of first, second, third and fourth shielding plates.

[0011] Preferably, the first, second, third, and fourth shielding tracks are all provided with corresponding slider grooves.

[0012] Preferably, the interior of the tank is provided with a plating solution tank for containing the electroplating solution, the upper inner side of the plating solution tank is provided with a mating inner groove that connects to the shielding frame, and the lower end of the shielding frame is provided with a mating outer groove corresponding to the mating inner groove.

[0013] Preferably, an anode notch is provided at the center of the upper part of both ends of the shielding frame, and a shielding positioning notch is provided at the center of the upper part of both sides of the shielding frame.

[0014] The beneficial effects of this utility model are as follows: Compared with the current partial electroplating methods on the market, which increase the number of electroplating processes and reduce the efficiency of workpiece electroplating, this application combines a tank, a shielding frame, and a shielding mechanism. This allows the workpiece's electroplating boundary line to be fitted with a commonly available rubber ring during partial electroplating. Then, based on the depth of the electroplating area, two sets of first shielding plates or other shielding plates are selected. The two sets of first shielding plates slide opposite each other along the groove of the first shielding track via sliders. When the distance between the two sets of first shielding plates is reduced to a suitable position, the worker removes the electroplated portion of the workpiece. The shielding plate extends into the plating bath, while the rubber ring covering the workpiece is mounted on two sets of first shielding plates to prevent the shielded parts of the workpiece from falling into the plating solution. When performing localized plating on relatively regular workpieces with different plating depths, the operator can slide the first, second, third, and fourth shielding plates along the slide groove using sliders and connect them through the docking slots to form a stepped plating platform. This allows the plating solution at the same level to perform plating on the workpiece at different depths, thereby improving the efficiency of localized plating and avoiding the need for additional processes that would reduce the plating efficiency. Attached Figure Description

[0015] Figure 1 The diagram shown is a schematic representation of the overall structure of the electroplating tank of this utility model.

[0016] Figure 2 The diagram shown is a schematic representation of the electroplating tank structure of this utility model.

[0017] Figure 3 The diagram shown is a schematic representation of the shielding frame structure of the electroplating tank of this utility model.

[0018] Figure 4 The diagram shown is a schematic representation of the shielding mechanism of the electroplating tank of this utility model.

[0019] Explanation of reference numerals in the attached drawings: 1. Tank body; 2. Shielding frame; 3. Shielding mechanism; 4. First shielding track; 5. Second shielding track; 6. Third shielding track; 7. Fourth shielding track; 8. Inner groove for docking; 9. Plating solution tank; 10. Anode notch; 11. Outer groove for docking; 12. Shielding positioning notch; 13. Sliding groove; 301. First shielding plate; 302. Second shielding plate; 303. Third shielding plate; 304. Fourth shielding plate; 305. Sliding block; 306. Dock slot. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] Please see Figures 1-4This utility model provides an embodiment: a shielded electroplating tank for electroplating, including a tank body 1, a shielding frame 2, and a shielding mechanism 3; the upper end of the tank body 1 is provided with a shielding frame 2 for accommodating the shielding mechanism 3, and the inside of the shielding frame 2 is provided with a shielding mechanism 3 for shielding the electroplated workpiece. The inner two walls of the shielding frame 2 are provided with a first shielding track 4, a second shielding track 5, a third shielding track 6, and a fourth shielding track 7, which are arranged in a stepped manner along the inner two walls of the shielding frame 2.

[0022] Please see Figures 1-2 In this embodiment, the interior of the tank 1 is provided with a plating solution tank 9 for containing electroplating solution. The upper inner side of the plating solution tank 9 is provided with a mating inner groove 8 connected to the shielding frame 2. The lower end of the shielding frame 2 is provided with a mating outer groove 11 corresponding to the mating inner groove 8. The upper center of both ends of the shielding frame 2 is provided with an anode notch 10. The upper center of both sides of the shielding frame 2 is provided with a shielding positioning notch 12. By combining the mating inner groove 8 and the mating outer groove 11, during installation, the operator can engage the mating outer groove 11 with the mating inner groove 8 to install the shielding frame 2 above the tank 1. Then, sufficient electroplating solution is injected into the plating solution tank 9. Through the two sets of anode notches 10, the operator can place the two anodes into the plating solution tank 9 through the two sets of anode notches 10 during electroplating, thereby ensuring that the current can be evenly distributed during electroplating. The shielding positioning notch 12 is used to position the opposing splicing of the shielding mechanism 3.

[0023] Please see Figures 2-3 In this embodiment, two sets of sliders 305 are symmetrically arranged on both sides of the two sets of first shielding plates 301, second shielding plates 302, third shielding plates 303 and fourth shielding plates 304. The first shielding track 4, second shielding track 5, third shielding track 6 and fourth shielding track 7 are all provided with corresponding grooves 13 for the sliders 305. By combining the sliders 305 and the grooves 13, when performing local electroplating, the worker can put the electroplating boundary line of the workpiece on the commonly available rubber ring. Then, according to the depth of the electroplating part of the workpiece, two sets of first shielding plates 301 or other shielding plates are selected, so that the two sets of first shielding plates 301 slide in opposite directions along the grooves 13 of the first shielding track 4 through the sliders 305. When the distance between the two sets of first shielding plates 301 is reduced to a suitable position, the worker extends the electroplating part of the workpiece into the plating bath 9, and the rubber ring on the workpiece is placed on the two sets of first shielding plates 301 to prevent the shielded part of the workpiece from falling into the electroplating solution.

[0024] Please see Figures 3-4In this embodiment, the shielding mechanism 3 includes a first shielding plate 301, a second shielding plate 302, a third shielding plate 303, and a fourth shielding plate 304. Each of the first shielding plate 301, second shielding plate 302, third shielding plate 303, and fourth shielding plate 304 has two sets. The two sets of first shielding plates 301 are symmetrically arranged between the two sets of first shielding tracks 4; the two sets of second shielding plates 302 are symmetrically arranged between the two sets of second shielding tracks 5; the two sets of third shielding plates 303 are symmetrically arranged between the two sets of third shielding tracks 6; and the two sets of fourth shielding plates 304 are symmetrically arranged between the two sets of fourth shielding tracks 7. Each of the shielding plates 302, 303, and 304 has a docking slot 306 at one of its adjacent ends. By combining the first shielding plate 301, 302, 303, and 304, when performing local electroplating on relatively regular workpieces with different electroplating depths, the operator can slide the first shielding plate 301, 302, 303, and 304 along the slide groove 13 via the slider 305 and dock them through the docking slot 306 to form a stepped electroplating platform. This allows the electroplating solution at the same level to electroplat the workpiece to different depths.

[0025] During operation, the workers engage the outer groove 11 and the inner groove 8 together, install the shielding frame 2 above the tank body 1, then inject sufficient electroplating solution into the plating tank 9, and place the two anodes into the plating tank 9 through the two sets of anode notches 10, thereby ensuring that the current can be evenly distributed during electroplating, and positioning the opposing splicing of the shielding mechanism 3 through the shielding positioning notch 12.

[0026] When performing local electroplating, the electroplating boundary line of the workpiece can be fitted with a commercially available rubber ring. Then, according to the depth of the electroplating part of the workpiece, two sets of first shielding plates 301 or other shielding plates are selected. The two sets of first shielding plates 301 slide in opposite directions along the slide groove 13 of the first shielding track 4 via the slider 305. When the distance between the two sets of first shielding plates 301 is reduced to a suitable position, the worker extends the electroplating part of the workpiece into the plating bath 9. The rubber ring on the workpiece is placed on the two sets of first shielding plates 301 to prevent the shielded part of the workpiece from falling into the electroplating solution.

[0027] When performing localized electroplating on relatively regular workpieces with different electroplating depths, the operator can slide the first shielding plate 301, the second shielding plate 302, the third shielding plate 303 and the fourth shielding plate 304 along the slide groove 13 via the slider 305, and make them connect through the docking slot 306 to form a stepped electroplating platform, so that the electroplating solution at the same level can electroplat the workpiece to different depths.

[0028] Through the above steps, this application combines the tank 1, the shielding frame 2, and the shielding mechanism 3, so that during local electroplating, the electroplating boundary line of the workpiece can be fitted with a commercially available rubber ring. Then, according to the depth of the electroplating area of ​​the workpiece, two sets of first shielding plates 301 or other shielding plates are selected, and the two sets of first shielding plates 301 slide in opposite directions along the slide groove 13 of the first shielding track 4 via sliders 305. When the distance between the two sets of first shielding plates 301 is reduced to a suitable position, the worker extends the electroplating area of ​​the workpiece into the plating bath 9, while the rubber ring on the workpiece is placed on the two sets of first shielding plates 301. A shielding plate 301 prevents the shielded part of the workpiece from falling into the electroplating solution. When performing local electroplating on relatively regular workpieces with different electroplating depths, the operator can slide the first shielding plate 301, the second shielding plate 302, the third shielding plate 303 and the fourth shielding plate 304 along the slide groove 13 via the slider 305 and connect them through the docking slot 306 to form a stepped electroplating platform. This allows the electroplating solution at the same level to perform electroplating on the workpiece at different depths, thereby improving the efficiency of local electroplating of the workpiece and avoiding the need for additional processes that reduce the efficiency of workpiece electroplating.

Claims

1. A shielded electroplating tank for electroplating, comprising a tank body (1); characterized in that: It also includes a shielding frame (2) and a shielding mechanism (3); the upper end of the tank (1) is provided with a shielding frame (2) for placing the shielding mechanism (3), and the inside of the shielding frame (2) is provided with a shielding mechanism (3) for shielding the electroplated workpiece. The inner two walls of the shielding frame (2) are provided with a first shielding track (4), a second shielding track (5), a third shielding track (6) and a fourth shielding track (7). The first shielding track (4), the second shielding track (5), the third shielding track (6) and the fourth shielding track (7) are arranged in a stepped manner along the inner two walls of the shielding frame (2); the shielding mechanism (3) includes a first shielding plate (301 The first shielding plate (301), the second shielding plate (302), the third shielding plate (303) and the fourth shielding plate (304) are provided in two sets. The two sets of first shielding plates (301) are symmetrically arranged between the two sets of first shielding tracks (4), the two sets of second shielding plates (302) are symmetrically arranged between the two sets of second shielding tracks (5), the two sets of third shielding plates (303) are symmetrically arranged between the two sets of third shielding tracks (6), and the two sets of fourth shielding plates (304) are symmetrically arranged between the two sets of fourth shielding tracks (7).

2. The shielded electroplating tank for electroplating according to claim 1, characterized in that: The two sets of first shielding plates (301), second shielding plate (302), third shielding plate (303) and fourth shielding plate (304) all have a docking slot (306) at their adjacent ends.

3. A shielded electroplating tank for electroplating according to claim 1, characterized in that: Two sets of sliders (305) are symmetrically provided on both sides of the two sets of first shielding plates (301), second shielding plates (302), third shielding plates (303) and fourth shielding plates (304).

4. A shielded electroplating tank for electroplating according to claim 3, characterized in that: The first shielding track (4), the second shielding track (5), the third shielding track (6) and the fourth shielding track (7) are all provided with grooves (13) for corresponding sliders (305).

5. A shielded electroplating tank for electroplating according to claim 1, characterized in that: The interior of the tank (1) is provided with a plating solution tank (9) for containing electroplating solution. The upper inner side of the plating solution tank (9) is provided with a docking inner groove (8) connected to the shielding frame (2). The lower end of the shielding frame (2) is provided with a docking outer groove (11) corresponding to the docking inner groove (8).

6. A shielded electroplating tank for electroplating according to claim 1, characterized in that: An anode notch (10) is provided at the center of the upper part of both ends of the shielding frame (2), and a shielding positioning notch (12) is provided at the center of the upper part of both sides of the shielding frame (2).

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