Wafer carrying manipulator and electroplating equipment

Abstract

The utility model relates to the technical field of packaging equipment, and discloses a wafer carrying manipulator and electroplating equipment. The electroplating equipment comprises a wafer carrying manipulator and a clamp, the wafer carrying manipulator comprises a support assembly, at least two adsorption arms and a driving assembly, the at least two adsorption arms are arranged at intervals in the circumferential direction of the support assembly, vacuum adsorption openings used for adsorbing wafers are formed in the adsorption arms, and the adsorption arms are in sliding fit with the support assembly; the driving assembly is installed on the support assembly and is in transmission fit with all the adsorption arms, and the driving assembly can drive all the adsorption arms to extend outwards relative to the support assembly in the radial direction or retract inwards relative to the support assembly. According to the wafer carrying manipulator provided by the utility model, on the basis of ensuring that the wafer carrying manipulator smoothly extends into the space between the base and the pressure plate, the stress areas on the two sides of the grabbed wafer are consistent, the wafer is prevented from being broken, the productivity is improved, and the manufacturing cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a wafer handling robot and electroplating equipment. Background Technology

[0002] Advanced packaging technology involves electroplating of wafers. Before electroplating, photoresist needs to be coated on one side of the wafer. Then, through processes such as exposure and development, the feature shape to be electroplated is etched on the photoresist. The feature shape will be filled after electroplating. However, during the electroplating process, only the side of the wafer with the feature shape can come into contact with the electroplating solution. Otherwise, the wafer will be corroded by the electroplating solution and thus damaged.

[0003] To prevent the electroplating solution from corroding the uncoated side of the wafer, a fixture is often used to hold the wafer during the electroplating process. For example... Figure 1 As shown, the fixture includes a base 100 and a pressure plate 200. The base 100 is annular and has a sealing ring on its upper side. The wafer 400 with the photoresist on it (i.e., the lower surface of the wafer 400) is positioned downwards, with its edge overlapping the sealing ring. The pressure plate 200 presses the wafer 400 onto the sealing ring from top to bottom. In actual production, the temperature of the electroplating solution in some electroplating processes can reach 55℃-60℃. When the photoresist is used in an electroplating solution above 45℃, it will soften and adhere to the sealing ring to a certain extent.

[0004] After electroplating, a robotic arm needs to be inserted between the base 100 and the pressure plate 200 to grip and pick up the upper surface of the wafer 400 for unloading. Because the space between the pressure plate 200 and the base 100 is relatively small due to the guide post 300, the robotic arm's suction cup is typically small and can only grip the middle area of ​​the upper surface of the wafer 400. However, when the photoresist at the edge of the lower surface of the wafer 400 adheres to the sealing ring, the edge of the lower surface of the wafer 400 is subjected to force, resulting in a mismatch between the force-bearing areas on the upper and lower surfaces of the wafer 400. This can lead to the sealing ring being pulled off the base 100, increasing maintenance costs, or even causing the wafer 400 to break, affecting production capacity and manufacturing costs. Utility Model Content

[0005] The purpose of this invention is to provide a wafer handling robot that, while ensuring smooth insertion between the base and the pressure plate, ensures that the force areas on both sides of the grasped wafer are consistent, avoids wafer fragmentation, improves production capacity, and reduces manufacturing costs.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] Wafer handling robots include:

[0008] Support assembly;

[0009] At least two adsorption arms are arranged at intervals along the circumference of the support assembly. Each adsorption arm is provided with a vacuum adsorption port for adsorbing wafers. The adsorption arm is slidably engaged with the support assembly.

[0010] A drive assembly is mounted on the support assembly and is in drive engagement with each of the adsorption arms. The drive assembly is capable of driving each of the adsorption arms to extend outward or retract inward relative to the support assembly in a radial direction.

[0011] As an optional embodiment, the adsorption arm includes:

[0012] An extension portion extends radially along the support assembly, and its inner end is slidably engaged with the support assembly;

[0013] An arc-shaped portion is connected to the outer end of the extension portion and extends circumferentially along the support assembly. At least two vacuum suction ports are provided on the arc-shaped portion.

[0014] As an optional solution, the extension is provided with the vacuum adsorption port.

[0015] As an optional solution, the driving assembly includes a driving source and a transmission component. Each of the adsorption arms is driven by the transmission component. The driving source is connected to the support assembly and can drive the transmission component to rotate, thereby causing each of the adsorption arms to extend outward or retract inward. When the adsorption arm is in a fully retracted state, at least two of the arc-shaped portions form a closed state between their ends, or when the adsorption arm is in a dynamically extended outward or fully extended outward state, at least two of the arc-shaped portions are in an equally spaced separation state between their ends.

[0016] As an optional solution, the transmission component is provided with at least two arc-shaped drive grooves, and the at least two arc-shaped drive grooves are arranged at intervals along the circumference of the transmission component. The adsorption arm includes a protrusion, and each protrusion corresponds to a sliding engagement with one of the arc-shaped drive grooves.

[0017] As an alternative, the support assembly includes a base plate and a pressure plate, with a receiving cavity provided between the base plate and the pressure plate, and the transmission component disposed within the receiving cavity.

[0018] As an alternative, the support assembly includes a base plate and a pressure plate, the base plate being connected to the pressure plate and having at least two guide grooves on one side facing the pressure plate, the guide grooves extending radially along the support assembly, and each adsorption arm corresponding to one of the guide grooves in sliding engagement.

[0019] As an alternative, the adsorption arm is provided with a cooling structure configured to cool the adsorbed wafer.

[0020] As an alternative, the cooling structure includes a cooling element mounted on the adsorption arm, the cooling element being made of a thermoelectric material.

[0021] As an alternative, the cooling structure includes a cooling channel formed within the adsorption arm, wherein a cooling medium is circulated within the cooling channel.

[0022] Another objective of this invention is to provide an electroplating equipment that, by employing the aforementioned wafer handling robot, not only ensures production efficiency but also avoids wafer breakage during unloading, thereby increasing production capacity and reducing manufacturing costs.

[0023] To achieve this objective, the present invention adopts the following technical solution:

[0024] An electroplating apparatus includes at least a clamp and a wafer handling robot, the clamp being used to fix a wafer and move the wafer to an electroplating solution for electroplating, and the wafer handling robot being used to place the wafer into the clamp or remove the wafer from the clamp.

[0025] The beneficial effects of this utility model are:

[0026] This novel wafer handling robot features multiple adsorption arms that retract radially inwards, resulting in a small overall size that allows them to easily extend between the base and the pressure plate, avoiding interference with the guide posts of the clamp. When gripping the wafer, the adsorption arms extend radially outwards, enabling the vacuum adsorption port to adsorb the edge area of ​​the wafer. This ensures that the stress distribution on the upper and lower surfaces of the wafer corresponds, preventing the wafer from breaking due to uneven stress on the upper and lower surfaces. Consequently, this increases production capacity, reduces manufacturing costs, and also reduces the risk of accidentally pulling the sealing ring off the base, thereby lowering the maintenance costs of the clamp's components.

[0027] The electroplating equipment of this invention, by adopting the aforementioned wafer handling robot, not only ensures production efficiency but also avoids wafer breakage during unloading, thereby increasing production capacity and reducing manufacturing costs. Attached Figure Description

[0028] Figure 1 This is a structural diagram of a fixture provided by existing technology;

[0029] Figure 2 This is a schematic diagram of a wafer handling robot arm extending into a fixture to grasp a wafer, provided in a specific embodiment of this utility model.

[0030] Figure 3 This is a schematic diagram of a wafer handling robot gripping a wafer located on a base, provided in a specific embodiment of this utility model.

[0031] Figure 4 This is a schematic diagram of the structure of the wafer handling robot provided in a specific embodiment of the present invention;

[0032] Figure 5 This is a bottom view of the adsorption arm provided in a specific embodiment of this utility model;

[0033] Figure 6 This is a schematic diagram of the hidden support assembly of the wafer handling robot provided in a specific embodiment of this utility model;

[0034] Figure 7 yes Figure 6 Enlarged view of point A in the image;

[0035] Figure 8 This is a cross-sectional view of the first type of adsorption arm provided in a specific embodiment of this utility model;

[0036] Figure 9 This is a cross-sectional view of the second type of adsorption arm provided in a specific embodiment of this utility model.

[0037] In the picture:

[0038] 100. Base; 200. Pressure plate; 300. Guide post; 400. Wafer; 500. Wafer handling robot;

[0039] 10. Bracket assembly; 11. Base plate; 111. Guide groove; 12. Pressure plate;

[0040] 20. Adsorption arm; 21. Extension; 22. Arc-shaped part; 23. Protrusion; 201. Vacuum adsorption port;

[0041] 30. Drive assembly; 31. Drive source; 32. Transmission component; 321. Arc-shaped drive groove; 33. Connecting shaft;

[0042] 40. Connecting arm;

[0043] 51. Cooling component; 52. Cooling channel. Detailed Implementation

[0044] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not the entire structure.

[0045] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0046] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0047] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0048] This embodiment provides a wafer handling robot and an electroplating device. The electroplating device includes a fixture and a wafer handling robot. The fixture is used to fix the wafer and move the wafer to the electroplating solution for electroplating. The wafer handling robot is used to put the wafer into the fixture or take the wafer out of the fixture.

[0049] like Figure 1 and Figure 2 As shown, the fixture includes a base 100 and a pressure plate 200. The base 100 is annular and has a sealing ring on its upper side. The edge of the lower surface of the wafer 400 (i.e., the surface with photoresist) overlaps the sealing ring. A guide post 300 is provided on the base 100, and the pressure plate 200 slides in engagement with the base 100. The pressure plate 200 can move away from the base 100 along the guide post 300, so that the wafer handling robot 500 can extend between the base 100 and the pressure plate 200 to place the wafer 400 on or remove the wafer 400 from the sealing ring. The pressure plate 200 can also move closer to the base 100 along the guide post 300 to press the wafer 400 onto the sealing ring.

[0050] In actual production, the temperature of the electroplating solution in some electroplating processes can reach 55℃-60℃. When photoresist is used in electroplating solutions above 45℃, it softens and adheres to the sealing ring to a certain extent. To avoid the guide post 300, the existing wafer handling robot 500 typically has a small suction cup, which can only adhere to the middle area of ​​the upper surface of the wafer 400. However, when the photoresist at the edge of the lower surface of the wafer 400 adheres to the sealing ring, the lower surface edge of the wafer 400 is subjected to force. This results in a mismatch between the force-bearing areas on the upper and lower surfaces of the wafer 400. This can lead to the sealing ring being pulled off the base 100, increasing maintenance costs, or even causing the wafer 400 to fragment, affecting production capacity and manufacturing costs.

[0051] like Figures 2-5 As shown, the wafer handling robot 500 includes a support assembly 10, at least two suction arms 20, a drive assembly 30, and a connecting arm 40. The connecting arm 40 is connected to the support assembly 10 and is used to connect to an external drive structure so that the external drive structure can drive the entire wafer handling robot 500 to a designated position. The at least two suction arms 20 are arranged at intervals along the circumference of the support assembly 10. The suction arms 20 are provided with vacuum suction ports 201 for suctioning wafers 400. The vacuum suction ports 201 are connected to an external negative pressure supply device for suctioning wafers 400. The suction arms 20 are slidably engaged with the support assembly 10. The drive assembly 30 is mounted on the support assembly 10 and is driven to each suction arm 20. The drive assembly 30 can drive each suction arm 20 to extend radially outward relative to the support assembly 10 or retract radially relative to the support assembly 10.

[0052] In this embodiment, the wafer handling robot 500 has a small overall size when its multiple adsorption arms 20 retract radially inward, allowing them to smoothly extend between the base 100 and the pressure plate 200 without interfering with the guide posts 300 of the fixture. When gripping the wafer 400, the adsorption arms 20 extend radially outward, enabling the vacuum adsorption port 201 to adsorb the edge area of ​​the wafer 400. This ensures that the force-bearing areas on the upper and lower surfaces of the wafer 400 correspond, preventing the wafer 400 from breaking due to uneven force on the upper and lower surfaces. This improves production capacity, reduces manufacturing costs, and also reduces the risk of detaching the sealing ring from the base 100, thereby reducing the maintenance costs of the fixture components.

[0053] In this embodiment, the support assembly 10 is circular, resulting in a more compact overall structure of the wafer handling robot 500 when each adsorption arm 20 is in the recovery state. Optionally, in this embodiment, the wafer handling robot 500 is provided with eight adsorption arms 20. In other embodiments, the specific number of adsorption arms 20 can be flexibly set, such as five, six, or other different quantities. Optionally, each adsorption arm 20 is evenly arranged along the circumference of the support assembly 10, thereby ensuring the uniformity of force on the wafer 400 and further reducing the risk of wafer 400 fragmentation.

[0054] like Figure 4 and Figure 5 As shown, the adsorption arm 20 includes an extension 21 and an arc-shaped portion 22. The extension 21 extends radially along the support assembly 10, and its inner end slides in engagement with the support assembly 10. The arc-shaped portion 22 is connected to the outer end of the extension 21 and extends circumferentially along the support assembly 10. A vacuum adsorption port 201 is provided on the arc-shaped portion 22. The arc-shaped portion 22 is designed to match the radial outer end of the adsorption arm 20 with the edge shape of the wafer 400. The vacuum adsorption port 201 on the arc-shaped portion 22 makes the force area exerted by the adsorption arm 20 on the edge of the wafer 400 more consistent with the force area exerted by the sealing ring on the edge of the wafer 400, thereby further reducing the risk of the wafer 400 breaking due to uneven force on the upper and lower surfaces.

[0055] like Figure 4 and Figure 5 As shown, the arc-shaped portion 22 is arc-shaped. Specifically, when the adsorption arm 20 is in a fully recovered state, the ends of at least two arc-shaped portions 22 form a closed relationship with each other; when the adsorption arm 20 is in a dynamically extended or fully extended state, the ends of at least two arc-shaped portions 22 are equally spaced and substantially on the same circumference, and this circumference is substantially the same size as the sealing ring. Optionally, as... Figure 5 As shown, the arc-shaped portion 22 is provided with three vacuum adsorption ports 201. In other embodiments, the arc-shaped portion 22 may also be provided with two, four or more vacuum adsorption ports 201. In some embodiments, the arc-shaped portion 22 may also be provided with one adsorption port 201 with the same arc shape as the arc-shaped portion 22. No specific limitation is made here. Optionally, the vacuum adsorption ports 201 on the arc-shaped portion 22 are evenly arranged along the extension direction of the arc-shaped portion 22.

[0056] like Figure 5As shown, a vacuum adsorption port 201 is provided on the extension 21. When the wafer 400 is removed from the sealing ring, the vacuum adsorption port 201 on the extension 21 and the vacuum adsorption port 201 on the arc-shaped portion 22 work together to more evenly and firmly adsorb the wafer 400, preventing the wafer 400 from accidentally falling. In some embodiments, the negative pressure in the vacuum adsorption port 201 on the extension 21 and the vacuum adsorption port 201 on the arc-shaped portion 22 is supplied simultaneously. In some embodiments, the negative pressure in the vacuum adsorption port 201 on the extension 21 and the negative pressure in the vacuum adsorption port 201 on the arc-shaped portion 22 can also be supplied separately. No specific limitation is made here.

[0057] like Figure 4 As shown, the support assembly 10 includes a base plate 11 and a pressure plate 12. The base plate 11 and the pressure plate 12 are interlocked. At least two guide grooves 111 are provided on the side of the base plate 11 facing the pressure plate 12. The guide grooves 111 extend radially along the support assembly 10, and each adsorption arm 20 slides into one guide groove 111. Through the cooperation of the base plate 11 and the pressure plate 12, and the provision of the guide grooves 111 on the base plate 11, each adsorption arm 20 slides into the support assembly 10, facilitating the installation of the adsorption arms 20. Optionally, the base plate 11 and the pressure plate 12 can be connected by snap-fit, fasteners, or other means. In this embodiment, the pressure plate 12 is located on the upper side of the base plate 11, and the connecting arm 40 is connected to the pressure plate 12.

[0058] like Figure 4 and Figure 6 As shown, the drive assembly 30 includes a drive source 31 and a transmission component 32. Each adsorption arm 20 is driven by the transmission component 32. The drive source 31 is connected to the support assembly 10 and can drive the transmission component 32 to rotate, thereby causing each adsorption arm 20 to extend outward or retract inward. In this embodiment, each adsorption arm 20 is connected to the transmission component 32, and the extension and retraction of multiple adsorption arms 20 can be achieved by driving the transmission component 32 to rotate through the drive source 31. This not only reduces the number of parts but also makes the structure compact, resulting in a smaller overall size for the wafer handling robot 500, allowing it to easily extend between the base 100 and the pressure plate 200. Figure 6 As shown, this represents the size of the wafer handling robot in its fully extended state. When the robot is fully retracted, its size can be different ratios such as 1 / 2, 1 / 3, 1 / 4, or 2 / 3 of the extended state, which can be set according to actual conditions. Here, "size" refers to the area occupied by the robot's projection on the horizontal plane in different states.

[0059] like Figure 6 and Figure 7As shown, the transmission component 32 is provided with at least two arc-shaped drive grooves 321, which are arranged at intervals along the circumference of the transmission component 32. The number of arc-shaped drive grooves 321 is the same as the number of adsorption arms 20. Each adsorption arm 20 includes a protrusion 23, specifically, the protrusion 23 is disposed on the surface of the extension 21 and is integrally formed with the extension 21. Each protrusion 23 corresponds to a sliding engagement with one arc-shaped drive groove 321. When the drive source 31 drives the transmission component 32 to rotate, the sidewall of the arc-shaped drive groove 321 guides the protrusion 23 to slide within the arc-shaped drive groove 321. Under the limitation of the guide groove 111, the protrusion 23 drives the entire adsorption arm 20 to move radially, thereby realizing that one transmission component 32 drives multiple adsorption arms 20 to extend or retract synchronously. The structure is simple and the drive is convenient. In a preferred embodiment, such as... Figure 7 As shown, the transmission member 32 is circular, and each arc-shaped drive groove 321 extends in an arc shape from the outside of the transmission member 32 towards the center. When the protrusion 23 slides in the arc-shaped drive groove 321, if the protrusion 23 moves to the outermost part of the arc-shaped drive groove 321, the adsorption arm 20 is in a fully extended state. If the protrusion 23 moves to the innermost part of the arc-shaped drive groove 321, the adsorption arm 20 is in a fully retracted state.

[0060] Furthermore, the arc-shaped drive groove 321 also limits the radial movement of the entire adsorption arm 20 through the protrusion 23, preventing the adsorption arm 20 from falling out between the base plate 11 and the pressure plate 12. In this embodiment, the protrusion 23 is provided on the extension 21.

[0061] In this embodiment, as Figure 4 and Figure 6 As shown, the drive source 31 is located on the upper side of the pressure plate 12. The transmission component 32 is constructed as a plate, with a receiving cavity provided between the base plate 11 and the pressure plate 12, and the transmission component 32 is disposed within the receiving cavity. This arrangement not only guides the rotation of the transmission component 32 but also protects it, preventing external structures from affecting its transmission. Figure 6 As shown, the drive assembly 30 also includes a connecting shaft 33, which is connected to the transmission component 32. The connecting shaft 33 passes through the pressure plate 12 and is connected to the drive source 31 so that the drive source 31 can drive the connecting shaft 33 to rotate. Optionally, the drive source 31 can be a motor, a rotary cylinder, etc., which is not specifically limited here.

[0062] In this embodiment, the adsorption arm 20 is equipped with a cooling structure configured to cool the adsorbed wafer 400. After the wafer 400 is fixed in the electroplating solution for electroplating, the fixture removes the wafer 400 from the electroplating solution. At this time, the temperature of the wafer 400 is usually high. At this high temperature, the photoresist on the surface of the wafer 400 adheres, causing the wafer to stick to the sealing ring through the adhered photoresist. If the wafer 400 is removed from the fixture at this time, it is prone to breakage and other problems. The wafer 400 can only be removed from the fixture after the temperature of the wafer has dropped to the point where the photoresist has re-cured. During this process, if we wait for the wafer 400 to cool down automatically, it can take several minutes, tens of minutes, or even longer, depending on the time it takes to lower the wafer 400 from the temperature that caused the photoresist to stick to the photoresist curing temperature. This long cooling waiting time seriously reduces the efficiency of electroplating and subsequent processes.

[0063] Therefore, this embodiment provides a specific solution: before the wafer handling robot 500 drives the wafer 400 to move, the wafer 400 is cooled by a cooling structure. This allows the softened photoresist on the wafer 400 to re-solidify, thereby reducing its adhesion to the sealing ring. Then, the wafer handling robot 500 picks up the wafer 400 and drives its movement, solving the problem of wafer 400 fragments and sealing ring detachment caused by photoresist adhesion to the sealing ring. Furthermore, it eliminates the need to wait for the wafer 400 to cool down automatically, thus ensuring the efficiency of electroplating.

[0064] In some embodiments, such as Figure 8 As shown, the cooling structure includes a cooling element 51 mounted on the adsorption arm 20, and the cooling element 51 is made of a thermoelectric material. When the cooling element 51 is energized, its temperature drops, thus cooling the wafer 400. Optionally, the cooling element 51 is mounted on the arc-shaped portion 22, thereby allowing for faster and more uniform cooling of the photoresist on the wafer 400 that is in contact with the sealing ring. Optionally, the cooling element 51 can be embedded inside the adsorption arm 20 or attached to the surface of the adsorption arm 20; no specific limitation is made here.

[0065] In some embodiments, such as Figure 9 As shown, the cooling structure includes a cooling channel 52 formed within the adsorption arm 20. The cooling channel 52 is used to connect to an external device supplying cooling medium. When the device supplying cooling medium introduces cooling medium into the cooling channel 52, the wafer handling robot 500 can cool the wafer 400. Optionally, the cooling channel 52 passes through the arc-shaped portion 22, thereby enabling faster and more uniform cooling of the photoresist in contact with the sealing ring on the wafer 400. Optionally, the cooling medium can be liquid nitrogen, water, etc.

[0066] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. For those skilled in the art, based on the concept of this utility model, there will be changes in the specific implementation methods and application scope. The content of this specification should not be construed as a limitation of this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A wafer handling robot, characterized in that, include: Support assembly (10); At least two adsorption arms (20) are arranged at intervals along the circumference of the support assembly (10). The adsorption arms (20) are provided with vacuum adsorption ports (201) for adsorbing wafers. The adsorption arms (20) are slidably engaged with the support assembly (10). A drive assembly (30) is mounted on the support assembly (10) and is in drive engagement with each of the adsorption arms (20). The drive assembly (30) is capable of driving each of the adsorption arms (20) to extend outward relative to the support assembly (10) radially or to retract inward relative to the support assembly (10).

2. The wafer handling robot as described in claim 1, characterized in that, The adsorption arm (20) includes: An extension (21) extends radially along the support assembly (10) and its inner end slides into the support assembly (10); The arc-shaped portion (22) is connected to the outer end of the extension portion (21) and extends circumferentially along the support assembly (10). The arc-shaped portion (22) is provided with the vacuum adsorption port (201).

3. The wafer handling robot as described in claim 2, characterized in that, The extension (21) is provided with the vacuum adsorption port (201).

4. The wafer handling robot as described in claim 2, characterized in that, The driving assembly (30) includes a driving source (31) and a transmission component (32). Each of the adsorption arms (20) is driven by the transmission component (32). The driving source (31) is connected to the support assembly (10) and can drive the transmission component (32) to rotate, so as to drive each of the adsorption arms (20) to extend outward or retract inward, so that when the adsorption arm (20) is in a fully retracted state, at least two of the arc-shaped portions (22) form a closed state between their ends, or when the adsorption arm (20) is in a state of dynamic outward extension or fully outward extension, at least two of the arc-shaped portions (22) are in a state of equal spacing separation between their ends.

5. The wafer handling robot as described in claim 4, characterized in that, The transmission component (32) is provided with at least two arc-shaped drive grooves (321), and the at least two arc-shaped drive grooves (321) are arranged at intervals along the circumference of the transmission component (32). The adsorption arm (20) includes a protrusion (23), and each protrusion (23) is slidably engaged with one of the arc-shaped drive grooves (321).

6. The wafer handling robot as described in claim 4, characterized in that, The bracket assembly (10) includes a base plate (11) and a pressure plate (12), and a receiving cavity is provided between the base plate (11) and the pressure plate (12), and the transmission member (32) is disposed in the receiving cavity.

7. The wafer handling robot as described in claim 1, characterized in that, The support assembly (10) includes a base plate (11) and a pressure plate (12). The base plate (11) is connected to the pressure plate (12), and at least two guide grooves (111) are provided on one side facing the pressure plate (12). The guide grooves (111) extend radially along the support assembly (10), and each adsorption arm (20) is slidably engaged with one of the guide grooves (111).

8. The wafer handling robot as described in any one of claims 1-7, characterized in that, The adsorption arm (20) is provided with a cooling structure, which is configured to cool the adsorbed wafer.

9. The wafer handling robot as described in claim 8, characterized in that, The cooling structure includes a cooling element (51) mounted on the adsorption arm (20), the cooling element (51) being made of a thermoelectric material; or The cooling structure includes a cooling channel (52) formed within the adsorption arm (20), and the cooling channel (52) is configured to allow the passage of a cooling medium.

10. An electroplating device, characterized in that, The electroplating equipment includes at least a clamp and a wafer handling robot as described in any one of claims 1-9, wherein the clamp is used to fix the wafer and move the wafer to the electroplating solution for electroplating, and the wafer handling robot is used to place the wafer into the clamp or remove the wafer from the clamp.

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