Easily-radiating steel plate type cushioning base for integrated circuit production

Abstract

The utility model relates to the technical field of integrated circuit production equipment, in particular to an easy-heat-dissipation steel plate type cushioning base for integrated circuit production, which comprises a bearing platform, a supporting frame is arranged at the bottom of the bearing platform, and the bearing platform comprises a bearing heat dissipation layer, a cushioning layer and a supporting layer which are arranged from top to bottom. A plurality of cavities are horizontally formed in the middle of the bearing heat dissipation layer in a penetrating mode and are sequentially connected end to end, the two cavities on the outermost side are connected with a water outlet pipe and a water return pipe of a water cooling circulation system respectively, the cushioning layer comprises a square outer frame, a plurality of containing frames are arranged in the outer frame, and the containing frames are filled with cushioning blocks; the upper end and the lower end of the cushioning block make contact with the heat dissipation layer and the supporting layer correspondingly. According to the utility model, a heat dissipation mode of combining the water cooling circulation system and the heat dissipation fin plate is adopted, so that the heat dissipation efficiency is greatly improved, heat generated by equipment can be dissipated in time, the equipment is ensured to operate at a proper temperature, and the service life of the equipment is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit manufacturing equipment technology, specifically to a shock-absorbing base for integrated circuit manufacturing using a heat-dissipating steel plate. Background Technology

[0002] In the field of integrated circuit manufacturing equipment, the heat generated during equipment operation and external vibrations can severely impact the production accuracy and equipment stability of integrated circuits. As integrated circuit manufacturing processes continue to evolve towards higher precision and higher performance, the requirements for heat dissipation and vibration damping of production equipment are becoming increasingly stringent.

[0003] Chinese patent CN201921299420, "A Steel Plate-Type Vibration-Proof Base for an Integrated Circuit Cleanroom," includes a support plate with several evenly distributed control devices connected to its lower end. Each control device includes a positioning post, support posts, a triangular base, a protective shell, a positioning ring, a deformable shape, and a pressure-resistant seat. The positioning post is cylindrical with a columnar groove in the center of its bottom surface at one end. Three support posts are evenly arranged in the groove of the positioning post, and a triangular base is fixedly connected to the lower end of each support post. While this patent achieves some degree of buffering against vibration and impact through its unique control device design, reducing damage to the equipment, it suffers from significant deficiencies in heat dissipation. During integrated circuit manufacturing, equipment continuously generates a large amount of heat. If this heat cannot be dissipated in time, the internal temperature of the equipment will become excessively high, affecting the performance of electronic components and consequently reducing production efficiency and product quality. However, the patent's technical solution does not mention any heat dissipation-related structures or technologies, failing to meet the heat dissipation requirements of integrated circuit manufacturing equipment.

[0004] Therefore, it is necessary to develop a device that can both efficiently dissipate heat and provide stable shock absorption under various vibration conditions. Utility Model Content

[0005] To solve the above problems, the present invention adopts the following technical solution.

[0006] A shock-absorbing base for integrated circuit production using a heat-dissipating steel plate includes a support platform with a support frame at the bottom. The support platform includes a heat-dissipating layer, a shock-absorbing layer, and a support layer arranged from top to bottom. Several cavities are horizontally arranged through the middle of the heat-dissipating layer, and the cavities are connected end to end in sequence. The two outermost cavities are respectively connected to the outlet and return water pipes of a water-cooling circulation system. The shock-absorbing layer includes a square outer frame, and several receiving frames are arranged inside the outer frame. Shock-absorbing blocks are filled in the receiving frames, and the upper and lower ends of the shock-absorbing blocks are in contact with the heat-dissipating layer and the support layer, respectively.

[0007] Preferably, the receiving frame has a hexagonal structure.

[0008] Preferably, the edges of the heat dissipation layer, the shock absorption layer, and the support layer are provided with several mounting holes.

[0009] Preferably, the bottom surface of the heat dissipation layer and the shock-absorbing layer are provided with a number of positioning pins, and the upper surface of the shock-absorbing layer and the upper surface of the support layer are provided with positioning holes corresponding to the positioning pins.

[0010] Preferably, the bottom surface of the support layer is provided with a plurality of heat dissipation fins.

[0011] Preferably, the heat dissipation layer and heat dissipation fins are made of aluminum, and the outer frame, housing frame and support layer are made of stainless steel.

[0012] Preferably, the damping block includes an outer block and an inner block. The outer block is a hexagonal structure filled in the receiving frame. A conical hole is provided in the middle of the outer block. The inner block is a conical block inserted into the conical hole. The upper surface of the inner block is slightly higher than the upper surface of the outer block. The Shore A hardness of the inner block is greater than that of the outer block.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] This invention employs a heat dissipation method that combines a water-cooled circulation system with heat dissipation fins, which greatly improves heat dissipation efficiency. It can dissipate the heat generated by the equipment in a timely manner, ensuring that the equipment operates at a suitable temperature, extending the service life of the equipment, and improving production efficiency and product quality.

[0015] This utility model's vibration damping block adopts a combination structure of outer and inner blocks, which can deform to different degrees according to the intensity and frequency of vibration, effectively buffering vibration, providing a stable operating environment for equipment, improving the processing accuracy of equipment, and reducing the defect rate. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a cross-sectional view of the heat dissipation layer.

[0018] Figure 3 This is a top view of the shock-absorbing layer;

[0019] Figure 4 This is a schematic diagram of the shock absorber structure;

[0020] Figure 5 This is an exploded view of the platform structure.

[0021] In the picture:

[0022] 1. Support frame; 2. Load-bearing heat dissipation layer; 21. Cavity; 3. Shock-absorbing layer; 31. Outer frame; 32. Receiving frame; 33. Shock-absorbing block; 331. Outer block; 332. Inner block; 333. Conical hole; 4. Support layer; 41. Heat dissipation fin plate; 5. Water outlet pipe; 6. Water return pipe; 7. Mounting hole; 8. Positioning pin; 9. Positioning hole. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0024] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Example

[0026] like Figure 1-5 As shown, this utility model provides a shock-absorbing base for integrated circuit production using a heat-dissipating steel plate, including a load-bearing platform and a support frame 1. The load-bearing platform includes a load-bearing heat dissipation layer 2, a shock-absorbing layer 3, and a support layer 4 arranged sequentially from top to bottom. The layers cooperate with each other to achieve the functions of load-bearing, heat dissipation, and shock absorption for integrated circuit production equipment.

[0027] In this embodiment, a plurality of cylindrical cavities 21 are horizontally arranged through the middle of the heat dissipation layer 2. The ends of these cylindrical cavities 21 are fitted with sealing plugs and connected end-to-end by water pipes to form a continuous coolant flow channel. The water pipes of the two outermost cavities 21 are connected to the outlet pipe 5 and return pipe 6 of the water-cooling circulation system, respectively. When the water-cooling circulation system is working, coolant flows from the outlet pipe 5 into the cavities 21, absorbing heat from the heat dissipation layer 2 during its flow, and then flows back to the water-cooling circulation system through the return pipe 6 for cooling. This cycle repeats, achieving efficient heat dissipation.

[0028] In this embodiment, the damping layer 3 includes a square outer frame 31, and a plurality of receiving frames 32 are arranged inside the outer frame 31. Preferably, the receiving frames 32 are hexagonal structures arranged in a honeycomb pattern. This structure allows for close arrangement, improving space utilization and enhancing structural stability. Damping blocks 33 are filled inside the receiving frames 32, with their upper and lower ends contacting the heat dissipation layer 2 and the support layer 4, respectively. The damping block 33 includes an outer block 331 and an inner block 332. The outer block 331, being a hexagonal structure, is filled inside the receiving frame 32 and has a conical hole 333 in its center. The inner block 332 is a conical block inserted into the conical hole 333. The upper surface of the inner block 332 is slightly higher than the upper surface of the outer block 331, and the Shore A hardness of the inner block 332 is greater than that of the outer block 331. In this embodiment, the inner block is made of silicone with a hardness of 60 Shore A, and the outer block is made of EPDM rubber with a hardness of 50 Shore A. This design allows the damping block 33 to deform to different degrees according to the intensity and frequency of the vibration, effectively buffering the vibration.

[0029] In this embodiment, a plurality of heat dissipation fins 41 are provided on the bottom surface of the support layer 4. The heat dissipation fins 41 can increase the heat dissipation area and further improve the heat dissipation efficiency. The heat dissipation layer 2 and the heat dissipation fins 41 are made of aluminum. The good thermal conductivity of aluminum helps to conduct and dissipate heat quickly. The outer frame 31, the housing frame 32 and the support layer 4 are made of stainless steel, which ensures the strength and stability of the structure.

[0030] In this embodiment, several mounting holes 7 are provided through the edges of the heat dissipation layer 2, the shock absorption layer 3, and the support layer 4, respectively. These holes allow the layers to be fixed together using bolts or other connectors, facilitating installation and disassembly. Several positioning pins 8 are provided on the bottom surface of the heat dissipation layer 2 and the shock absorption layer 3, while positioning holes 9 are provided on the upper surface of the shock absorption layer 3 and the upper surface of the support layer 4, corresponding to the positioning pins 8. The cooperation between the positioning pins 8 and the positioning holes 9 ensures the installation accuracy between the layers, allowing the shock absorption and heat dissipation functions to be better utilized.

[0031] In this embodiment, the upper surface of the heat dissipation layer 2 and the lower bottom surface of the support layer 4 are provided with several threaded holes, which are used to install equipment and support frame 1, respectively.

[0032] The working principle of the above technical solution is as follows:

[0033] When the integrated circuit manufacturing equipment is placed on the heat dissipation layer 2, the heat generated by the equipment is transferred to the heat dissipation layer 2. Coolant in the water-cooling circulation system flows into the cavity 21 through the outlet pipe 5. During its flow within the cavity 21, the coolant absorbs heat from the heat dissipation layer 2 and then flows back to the water-cooling circulation system through the return pipe 6 for further cooling. Simultaneously, the heat dissipation fins 41 on the bottom surface of the support layer 4 come into contact with the air, dissipating heat into the surrounding environment. Through the combined action of water cooling and the heat dissipation fins 41, efficient heat dissipation is achieved.

[0034] When the equipment vibrates during operation or is disturbed by external vibrations, the vibration is transmitted to the damping layer 3. For smaller vibrations, the outer block 331 deforms first, providing initial cushioning. When the vibration intensity increases, the inner block 332 also deforms. Due to the greater hardness of the inner block 332, the cushioning effect is further enhanced. Through the coordinated deformation of the outer block 331 and the inner block 332, the impact of vibration on the equipment is effectively reduced.

[0035] Compared with existing technologies,

[0036] This utility model adopts a heat dissipation method that combines a water-cooled circulation system with a heat dissipation fin plate 41, which greatly improves the heat dissipation efficiency, can dissipate the heat generated by the equipment in a timely manner, ensure that the equipment operates at a suitable temperature, extend the service life of the equipment, and improve production efficiency and product quality.

[0037] In this invention, the damping block 33 adopts a combined structure of outer block 331 and inner block 332, which can deform to different degrees according to the intensity and frequency of vibration, effectively buffering vibration, providing a stable operating environment for the equipment, improving the processing accuracy of the equipment, and reducing the defect rate.

[0038] In this invention, the layers of the support platform are connected and positioned via mounting holes 7, positioning pins 8, and positioning holes 9, making installation convenient and highly accurate. Furthermore, the appropriate selection of different materials ensures both structural strength and stability, while also utilizing the material properties to achieve excellent heat dissipation and shock absorption.

[0039] The above are merely preferred embodiments of this utility model; however, the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and its improved concept, should be included within the scope of protection of this utility model.

Claims

1. A shock-absorbing base for integrated circuit manufacturing using a heat-dissipating steel plate, characterized in that, The system includes a support platform with a support frame (1) at the bottom. The support platform includes a heat dissipation layer (2), a shock-absorbing layer (3), and a support layer (4) arranged from top to bottom. The heat dissipation layer (2) has several cavities (21) arranged horizontally through the middle. The cavities (21) are connected end to end in sequence. The two outermost cavities (21) are connected to the water outlet pipe (5) and the water return pipe (6) of the water cooling circulation system, respectively. The shock-absorbing layer (3) includes a square outer frame (31). Several receiving frames (32) are arranged inside the outer frame (31). Shock-absorbing blocks (33) are filled in the receiving frames (32). The upper and lower ends of the shock-absorbing blocks (33) are in contact with the heat dissipation layer (2) and the support layer (4), respectively.

2. The shock-absorbing base for integrated circuit manufacturing using a heat-dissipating steel plate as described in claim 1, characterized in that, The receiving frame (32) has a hexagonal structure.

3. The shock-absorbing base for integrated circuit manufacturing using a heat-dissipating steel plate as described in claim 1, characterized in that, Several mounting holes (7) are provided at the edges of the heat dissipation layer (2), shock absorption layer (3), and support layer (4).

4. The shock-absorbing base for integrated circuit manufacturing using a heat-dissipating steel plate as described in claim 1, characterized in that, The bottom surface of the heat dissipation layer (2) and the shock absorption layer (3) are provided with a number of positioning pins (8), and the upper surface of the shock absorption layer (3) and the upper surface of the support layer (4) are provided with positioning holes (9) corresponding to the positioning pins (8).

5. The shock-absorbing base for integrated circuit manufacturing using a heat-dissipating steel plate as described in claim 1, characterized in that, The bottom surface of the support layer (4) is provided with several heat dissipation fins (41).

6. The shock-absorbing base for integrated circuit manufacturing using a heat-dissipating steel plate as described in claim 5, characterized in that, The heat dissipation layer (2) and heat dissipation fin plate (41) are made of aluminum, while the outer frame (31), the receiving frame (32) and the support layer (4) are made of stainless steel.

7. The shock-absorbing base for integrated circuit manufacturing using a heat-dissipating steel plate as described in claim 5, characterized in that, The damping block (33) includes an outer block (331) and an inner block (332). The outer block (331) is a hexagonal structure filled in the receiving frame (32). A conical hole (333) is provided in the middle of the outer block (331). The inner block (332) is a conical block and is inserted into the conical hole (333). The upper surface of the inner block (332) is slightly higher than the upper surface of the outer block (331). The Shore A hardness of the inner block (332) is greater than that of the outer block (331).

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