Packaging test seat and packaging test machine

Abstract

The utility model discloses a packaging test seat and a packaging test machine, and relates to the technical field of semiconductor test equipment. The packaging test seat comprises a base, a clamp and a test circuit board, wherein the base comprises a packaging mounting groove, a fixing part surrounding the packaging mounting groove and a pin placing table between the fixing part and the packaging mounting groove; a supporting plate is arranged in the packaging mounting groove and is movably connected with the base, and the height of the supporting plate in the packaging mounting groove is adjustable; the clamp is fixed on the fixing part and comprises a pressing mechanism and a test pin; the test pin is arranged on one side, facing the base, of the pressing mechanism; one end of the test pin is placed on the pin placing table, and the other end is electrically connected with the test circuit board; the pressing mechanism is used for controlling the contact or separation of the test pin and the pin placing table; the test circuit board is fixed on one side of the base away from the clamp. According to the utility model, the height of the supporting plate in the packaging installation groove in the packaging test seat is adjustable, so that chips with different unpackaging modes can be tested.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing equipment technology, and in particular to a packaging test socket and a packaging test machine. Background Technology

[0002] In the large-scale research and development and production of semiconductor chips, packaging test sockets are often used for chip performance testing. The main function of a packaging test socket is to fix the chip in place and then provide and receive electrical signals from the chip via a circuit board to perform testing. During chip testing, the resin on the surface of the chip package is usually etched to expose the internal chip for testing.

[0003] When performing hotspot scanning tests on failed chips, it is often necessary to open the back of the chip to expose the silicon substrate inside for testing. However, the height of the base of the existing package test socket is usually insufficient to meet the testing requirements when the package is placed with the back facing up. Therefore, how to enable the package test socket to test chips with different opening methods has become an urgent technical problem to be solved. Utility Model Content

[0004] This invention provides a packaging test socket and a packaging test machine to test chips with different opening methods.

[0005] The first aspect of this utility model provides a packaging test fixture, which includes: a base, a fixture, and a test circuit board;

[0006] The base includes a packaging mounting slot, a fixing part that at least partially surrounds the packaging mounting slot, and a pin placement platform located between the fixing part and the packaging mounting slot; a support plate is provided in the packaging mounting slot, the support plate is movably connected to the base, and the height of the support plate in the packaging mounting slot is adjustable; the clamp is fixed to the fixing part.

[0007] The fixture includes a pressing mechanism and multiple test pins; the test pins are disposed on the side of the pressing mechanism facing the base; one end of the test pin is placed on the pin placement platform, and the other end of the test pin is electrically connected to the test circuit board; the pressing mechanism is used to control the test pin to contact or separate from the pin placement platform;

[0008] The test circuit board is fixed to the base on the side opposite to the fixture.

[0009] Optionally, the pressing mechanism includes a plurality of pin guide slots on the side facing the base;

[0010] A portion of the test pin moves within the pin guide slot;

[0011] When the pressing mechanism controls the separation of the test pin from the pin placement platform, the test pin contacts the bottom of the pin guide groove.

[0012] Optionally, the test pin is a curved structure that protrudes toward the pressing mechanism;

[0013] The apex of the curved structure of the test pin moves within the pin guide groove.

[0014] Optionally, the test pin includes a connecting portion and a pressing portion connected together;

[0015] One end of the connector is placed on the pin placement platform, and the other end of the connector is electrically connected to the test circuit board.

[0016] One end of the pressing part moves within the pin guide groove, and the other end of the pressing part is connected to the middle area of ​​the connecting part.

[0017] Optionally, the fixing part is provided with a plurality of first pin placement slots on the side facing the fixture; among the test pins, the portion extending towards the package mounting slot is located in the first pin placement slot.

[0018] Optionally, the fixing part is provided with a plurality of second pin placement slots on the side away from the packaging mounting groove; among the test pins, the portion extending toward the side of the test circuit board is located in the second pin placement slot.

[0019] Optionally, the pressing mechanism includes a support structure and at least one elastic element;

[0020] One end of the elastic element is fixed to the side surface of the base facing the clamp, and the other end of the elastic element is fixed to the side surface of the support structure facing the base.

[0021] Optionally, the packaging mounting slot includes multiple slot groups; each slot group includes at least two slots;

[0022] The card slots of different card slot groups are located at different heights of the packaging mounting slot;

[0023] The slot is used to engage the support plate.

[0024] Optionally, the pressing mechanism includes a first pressing mechanism and a second pressing mechanism located on opposite sides of the encapsulation mounting groove;

[0025] The plurality of test pins are divided into a first test pin group and a second test pin group; the first test pin group and the second test pin group are located on opposite sides of the package mounting slot;

[0026] The first pressing mechanism is used to control the test pins in the first test pin group to contact or separate from the pin placement platform;

[0027] The second pressing mechanism is used to control the contact or separation of the test pin in the second test pin group from the pin placement platform.

[0028] The second aspect of this utility model provides a packaging test machine, a test probe, and a packaging test socket as described above.

[0029] The technical solution of this utility model involves setting a base, a fixture, and a test circuit board in a packaging test socket. The base includes a packaging mounting slot, a fixing part at least partially surrounding the packaging mounting slot, and a pin placement platform located between the fixing part and the packaging mounting slot. This allows the chip package under test (DUT) to be installed in the packaging mounting slot and its pins to be placed on the pin placement platform. Simultaneously, a support plate is provided within the packaging mounting slot. The support plate is movably connected to the base, and its height within the packaging mounting slot is adjustable. This allows for corresponding adjustments when the DUT is installed face-up or back-up in the packaging mounting slot, adapting to the testing height requirements of DUTs with different opening methods and ensuring that the pins of the DUT are precisely placed on the pin placement platform. The fixture is mounted on the fixing part, with the test pins of the fixture positioned on the side of the fixture's pressing mechanism facing the base, and one end of the test pin placed on the pin placement platform. One end of the pin is placed on the pin placement platform, and the other end is electrically connected to the test circuit board. The pressing mechanism controls the contact or separation of the test pin with the pin placement platform. When the test pin contacts the pin placement platform, it can contact the pin of the chip package under test placed on the pin placement platform, which can fix the pin of the chip package under test. The electrical connection between the test circuit board and the pin of the chip package under test allows the electrical signal in the test circuit board to be transmitted to the pin of the chip package under test through the test pin, and the electrical signal fed back by the pin of the chip package under test is received to test the chip package under test, thus ensuring the accuracy and reliability of the test.

[0030] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this utility model, nor is it intended to limit the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the structure of a packaging test socket provided in an embodiment of this utility model;

[0033] Figure 2 This is a top view of a packaging test socket provided in an embodiment of the present invention;

[0034] Figure 3 This is a schematic diagram of the structure of a chip package provided in an embodiment of the present invention;

[0035] Figure 4 This is a schematic diagram of another packaging test socket provided in an embodiment of the present invention;

[0036] Figure 5 This is a side view of a packaging test socket provided in an embodiment of the present invention;

[0037] Figure 6 This is a schematic diagram of another packaging test socket provided in an embodiment of the present invention;

[0038] Figure 7 This is a structural schematic diagram of a packaging and testing machine provided in an embodiment of this utility model. Detailed Implementation

[0039] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0040] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0041] Figure 1 This is a schematic diagram of the structure of a packaging test socket provided in an embodiment of the present invention. Figure 2 This is a top view of a packaging test socket provided in an embodiment of the present invention, combined with... Figure 1 and Figure 2 As shown, the packaging test socket includes a base 1, a fixture 2, and a test circuit board 3.

[0042] The base 1 includes a packaging mounting groove 4, a fixing part 5 that at least partially surrounds the packaging mounting groove 4, and a pin placement stage 6 located between the fixing part 5 and the packaging mounting groove 4; a support plate 7 is provided in the packaging mounting groove 4, the support plate 7 is movably connected to the base 1, and the height of the support plate 7 in the packaging mounting groove 4 is adjustable; the clamp 2 is fixed on the fixing part 5.

[0043] Specifically, the base 1 is located at the bottom of the packaging test socket, providing stable support and fixation for the packaging test socket. The base 1 includes a packaging mounting groove 4, which can be understood as a groove-shaped structure for placing and fixing the chip package under test. Simultaneously, the base 1 also includes a fixing part 5 that at least partially surrounds the packaging mounting groove 4; that is, the fixing part 5 can be arranged around the perimeter of the packaging mounting groove 4 or partially around it. The height of the fixing part 5 is higher than the bottom of the packaging mounting groove 4. The fixing part 5 can be set according to the structure of the chip package under test, and this utility model does not specifically limit it in this regard. Furthermore, a pin placement platform 6 is provided between the fixing part 5 and the packaging mounting groove 4. The pin placement platform 6 is used to place the pins of the chip package under test, and its height is also higher than the bottom of the packaging mounting groove 4. A support plate 7 is provided inside the packaging mounting groove 4. The support plate 7 can be understood as a plate-shaped structure that provides support and fixation for the chip package under test installed in the packaging mounting groove 4. The support plate 7 is movably connected to the base 1, and the height of the support plate 7 within the packaging mounting groove 4 is adjustable.

[0044] Understandably, when the chip under test package is front-opening, it needs to be installed face-up in the package mounting slot 4 to test the front-opening chip under test package; when the chip under test package is back-opening, it needs to be installed back-up in the package mounting slot 4 to test the back-opening chip under test package.

[0045] It is also understandable that, such as Figure 3 As shown, when the pins of the chip under test package are rigidly bent, the pins of the chip under test package installed face up in the package mounting slot 4 and the pins of the chip under test package installed face down in the package mounting slot 4 have different orientations. Therefore, by making the height of the support plate 7 in the package mounting slot 4 adjustable, the chip under test package can be installed on the support plate 7 at different heights when the chip under test package is installed face up in the package mounting slot 4 or face down in the package mounting slot 4. This ensures that the pins of the chip under test package installed face up in the package mounting slot 4 and the pins of the chip under test package installed face down in the package mounting slot 4 can be placed precisely on the pin placement stage 6. The pins of the chip under test package can be fixed on the pin packaging stage 6 by the clamp 2 fixed to the fixing part 5, so as to realize the testing of chips with different opening methods.

[0046] Continue to refer to Figure 1 The fixture 2 includes a pressing mechanism 201 and multiple test pins 202; the test pins 202 are disposed on the side of the pressing mechanism 201 facing the base 1; one end of the test pin 202 is placed on the pin placement platform 6, and the other end of the test pin 202 is electrically connected to the test circuit board 3; the pressing mechanism 201 is used to control the test pin 202 to contact or separate from the pin placement platform 6; the test circuit board 3 is fixed to the side of the base 1 away from the fixture 2.

[0047] Specifically, the pressing mechanism 201 is a component of the fixture 2. When sufficient pressure is applied to the pressing mechanism 201, it can control the test pin 202 to contact or separate from the pin placement platform 6. The test pin 202 in the fixture 2 can have a gold finger structure, which can have good conductivity and hardness. One end of the test pin 202 is placed on the pin placement platform 6 so that it can contact the pin of the chip package under test placed on the pin placement platform 6. The other end of the test pin 202 is electrically connected to the test circuit board 3. In this way, the test pin can reliably connect with the pin of the chip package under test and fix the pin of the chip package under test. The test circuit board 3 can be specifically understood as a printed circuit board. The test circuit board 3 is used to realize signal transmission and data acquisition between the test pin 202 and the test equipment. The test circuit board 3 is fixed on the side of the base 1 away from the fixture 2. Through the wires and circuit design on the test circuit board 3, the electrical signals provided by the test equipment can be transmitted to the pins of the chip under test package through the test pin 202 to activate the internal circuits and functions of the chip under test, so as to realize the performance test of the chip under test, such as functional test, timing test, etc. The test circuit board 3 can also collect the test data generated from the chip under test and feed the test data back to the test equipment for analysis and evaluation.

[0048] Understandably, when the chip under test (DUT) package is installed face up in the package mounting slot 4 and back up in the package mounting slot 4, the pin order of the DUT package will change. In this case, the wiring method between the test circuit board 3 and the test pin 202 can be adjusted, or the order of the electrical signals provided by the test circuit board 3 to each test pin can be adjusted to ensure that the test circuit board 3 and the pins of the DUT package are correctly connected, so as to achieve stable signal transmission and data acquisition and ensure the accuracy and reliability of chip testing.

[0049] In this embodiment, by setting a base, a fixture, and a test circuit board in the packaging test socket, and by setting a packaging mounting slot, a fixing part at least partially surrounding the packaging mounting slot, and a pin placement platform located between the fixing part and the packaging mounting slot in the base, the chip package under test can be installed in the packaging mounting slot, and the pins of the chip package under test can be placed on the pin placement platform. Simultaneously, by setting a support plate in the packaging mounting slot, the support plate is movably connected to the base, and the height of the support plate in the packaging mounting slot is adjustable, so that when the chip package under test is installed face up or back up in the packaging mounting slot, the height of the support plate can be adjusted accordingly, thereby adapting to the testing height requirements of chips under test with different opening methods, ensuring that the pins of the chip package under test can be precisely placed on the pin placement platform. By setting the fixture on the fixing part, with the test pins of the fixture positioned on the side of the fixture pressing mechanism facing the base, and one end of the test pin placed on the pin placement platform... One end of the pin is placed on the pin placement platform, and the other end is electrically connected to the test circuit board. The pressing mechanism controls the contact or separation of the test pin with the pin placement platform. When the test pin contacts the pin placement platform, it can contact the pin of the chip package under test placed on the pin placement platform, which can fix the pin of the chip package under test. The electrical connection between the test circuit board and the pin of the chip package under test allows the electrical signal in the test circuit board to be transmitted to the pin of the chip package under test through the test pin, and the electrical signal fed back by the pin of the chip package under test is received to test the chip package under test, thus ensuring the accuracy and reliability of the test.

[0050] Optional, Figure 4 This is a schematic diagram of another packaging test socket provided in an embodiment of the present invention. Figure 5 This is a side view structural diagram of a packaging test socket provided in an embodiment of this utility model, combined with... Figure 4 and Figure 5 As shown, the pressing mechanism 201 includes a plurality of pin guide grooves 203 on the side facing the base 1; a portion of the test pin 202 moves within the pin guide groove 203; when the pressing mechanism 201 controls the test pin 202 to separate from the pin placement platform 6, the test pin 202 contacts the bottom of the pin guide groove 203.

[0051] Specifically, the pin guide groove 203 can be understood as a structure used to guide and restrict the movement of the test pin 202. The pin guide groove 203 is located on the side of the pressing mechanism 201 facing the base 1, and part of the test pin 202 moves within the pin guide groove 203. When pressure is applied to the pressing mechanism 201, causing the pressing mechanism 201 to control the test pin 202 to separate from the pin placement platform 6, the test pin 202 contacts the bottom of the pin guide groove 203. This allows the test pin 202 to be subjected to the force applied by the pressing mechanism 201 through the pin guide groove 203, thereby controlling the end of the test pin 202 near the pin placement platform 6 to bounce up along a predetermined path, thus controlling the separation of the test pin 202 from the pin placement platform 6. At this time, the chip package under test can be installed into the package mounting slot 4, and the pins of the chip package under test can be placed on the pin placement platform 6. When no pressure is applied to the pressing mechanism 201, the test pin 202 is no longer subjected to external force. The end of the test pin 202 near the pin placement platform 6 will fall along a predetermined path and contact the pin placement platform 6. The test pin 202 can fix the pins of the chip package under test to the pin packaging platform 6, forming a stable connection, which is convenient for subsequent testing of the chip under test. In this way, by setting the pin guide groove, the pressing mechanism can accurately control and guide the test pin, ensuring that the test pin can contact or separate from the pin placement stage according to the set path.

[0052] Optional, continue to refer to Figure 4 The test pin 202 is a curved structure that protrudes toward the pressing mechanism 201; wherein, the apex 2021 of the curved structure of the test pin 202 moves within the pin guide groove 203.

[0053] Specifically, the test pin 202 has a curved structure protruding towards the pressing mechanism 201. The apex 2021 of the curved structure moves within the pin guide groove 203. When pressure is applied to the pressing mechanism 201 to separate the test pin 202 from the pin placement platform 6, the apex 2021 of the curved structure is subjected to pressure within the pin guide groove 203, causing the test pin 202 to spring up along a predetermined path, separating it from the pin placement platform 6. When no pressure is applied to the pressing mechanism 201, the apex 2021 of the curved structure of the test pin 202 can move above the pin guide groove 203, so that the test pin 202 is no longer subjected to external pressure and falls along a predetermined path, contacting the pin placement platform 6. Thus, by allowing the apex of the curved structure of the test pin to move within the pin guide groove, the pressing mechanism can accurately control and guide the test pin, ensuring that the test pin can contact or separate from the pin placement platform.

[0054] Optional, Figure 6This is a schematic diagram of another packaging test socket provided in an embodiment of the present invention, as shown below. Figure 6 As shown, the test pin 202 includes a connecting part 2022 and a pressing part 2023 connected together; one end of the connecting part 2022 is placed on the pin placement platform 6, and the other end of the connecting part 2022 is electrically connected to the test circuit board 3; one end of the pressing part 2023 moves in the pin guide groove 203, and the other end of the pressing part 2023 is connected to the middle area of ​​the connecting part 2022.

[0055] Specifically, one end of the connection portion 2022 of the test pin 202 is placed on the pin placement stage 6, and the other end of the connection portion 2022 is electrically connected to the test circuit board 3, so that the test circuit board 3 and the pin of the chip package under test can be electrically connected through the connection portion 2022. At the same time, one end of the pressing portion 2023 moves within the pin guide groove 203, and the other end of the pressing portion 2023 is connected to the middle area of ​​the connection portion 2022, so that the connection portion 2022 can be subjected to the pressure applied by the pressing mechanism 201 through the pressing portion 2023, thereby enabling the connection portion 2022 to bounce up or fall along a predetermined path, thereby realizing the contact or separation of the test pin 202 and the pin placement stage 6.

[0056] Optional, continue to refer to Figure 5 The fixing part 5 is provided with a plurality of first pin placement slots 601 on the side facing the clamp 2; the part of the test pin 202 that extends toward the package mounting slot 4 is located in the first pin placement slot 601.

[0057] Specifically, the fixing part 5 has multiple first pin placement slots 601 on the side facing the fixture 2. The first pin placement slots 601 are used to place test pins 202. It can be understood that the number and position of the first pin slots 601 usually correspond to the number and arrangement of the test pins 202 to ensure that each test pin can be placed in the corresponding first pin slot. At the same time, the portion of the test pin 202 extending towards the package mounting slot 4 is located in the first pin placement slot 601, so as to restrict the movement space of the test pin 202 by the first pin placement slot 601, thereby ensuring that the test pin 202 can accurately contact the pins of the chip under test package, and can transmit the electrical signals provided by the test equipment to the pins of the chip under test package through the test pins 202, so as to activate the internal circuits and functions of the chip under test, realize the performance test of the chip under test, and improve the accuracy and reliability of the test.

[0058] Optional, continue to refer to Figure 4 and Figure 5 The fixing part 5 is provided with a plurality of second pin placement slots 501 on the side away from the packaging mounting slot 4; the part of the test pin 202 that extends toward the test circuit board 3 is located in the second pin placement slot 501.

[0059] Specifically, the fixing part 5 has multiple second pin placement slots 501 on its side away from the package mounting groove 4. The portion of the test pin 202 extending towards the test circuit board 3 is located within the second pin placement slot 501. The second pin placement slots 501 are used to fix the test pin 202 within the fixing part 5. It is understood that the number of second pin placement slots 501 usually corresponds to the number of test pins 202. Fixing the test pin 202 within the fixing part 5 via the second pin placement slots 501 ensures that the test pin 202 can be fixedly connected to the test circuit board 3, preventing the test pin 202 from moving or loosening during testing. This provides a stable electrical connection for chip testing, thereby improving the accuracy and reliability of the test. Furthermore, fixing the test pin 202 within the fixing part 5 via the second pin placement slots 501 also ensures that when pressure is applied to the pressing mechanism 201, while keeping the bottom of the test pin 202 fixed, the portion of the test pin 202 extending towards the package mounting groove 4 can spring up along a predetermined path, allowing the test pin 202 to separate from the first pin placement slot 601. By setting up a second pin placement slot, a stable electrical connection between the test pin and the test circuit board is ensured. At the same time, the pressing mechanism can effectively control the test pin to contact or detach from the first pin placement slot, ensuring successful testing of the chip package and improving the accuracy and reliability of the test.

[0060] Optional, continue to refer to Figure 5 The pressing mechanism 201 includes a support structure 2011 and at least one elastic element 2012; one end of the elastic element 2012 is fixed to the side surface of the base 1 facing the clamp 2, and the other end of the elastic element 2012 is fixed to the side surface of the support structure 2011 facing the base 1.

[0061] Specifically, the support structure 2011 can be understood as a support and connecting element made of a material with a certain degree of hardness, such as metal or plastic. The support structure 2011 is used to provide stable support and positioning to ensure the stability and accuracy of the pressing mechanism 201. The elastic element 2012 can be understood as an element with elastic properties, such as a spring. The elastic element 2012 is used to provide elastic force to the pressing mechanism 201.

[0062] Specifically, the elastic element 2012 is disposed between the base 1 and the support structure 2011. When pressure is applied to the support structure 2011, the elastic element 2012 will contract under the pressure of the support structure 2011, allowing the test pin 202 to spring up along a predetermined path under the pressure applied by the pressing mechanism 201. At this time, the test pin 202 separates from the pin placement platform 6. When no pressure is applied to the support structure 2011, the elastic element 2012 will release its elastic force, causing the support structure 2011 to return to its pre-press position under the action of the rebound force. This rebound process causes the test pin 202 to fall down along a predetermined path and re-contact the pin placement platform 6. It is understood that the number of elastic elements 2012 in the pressing mechanism 201 can be set according to actual needs, and this utility model does not make a specific limitation in this regard. By setting the support structure and elastic element in the pressing structure, it is ensured that the pressing mechanism can effectively control the contact or disengagement of the test pin from the pin placement platform, ensuring the successful testing of the chip package and improving the accuracy and reliability of the test.

[0063] Optional, continue to refer to Figure 4 The encapsulation mounting slot 4 includes multiple slot groups; each slot group includes at least two slots; the slots of different slot groups are located at different heights of the encapsulation mounting slot; the slots are used to engage the support plate 7.

[0064] Specifically, the encapsulation mounting slot 4 includes multiple slot groups, each slot group including at least two slots. The number of slot groups and slots in each slot group can be set according to actual needs, and this utility model does not limit this. For ease of description, unless otherwise specified, this utility model takes an example where the encapsulation mounting slot 4 includes two slot groups, and each slot group includes two slots, to illustrate the technical solution of the embodiment of this utility model. Continue to refer to Figure 1 The encapsulation and mounting slot 4 includes a first slot group 401 and a second slot group 402. Both the first slot group 401 and the second slot group 402 include two slots. The first slot group 401 and the second slot group 402 are located at different heights of the encapsulation and mounting slot 4. The slots are used to engage the support plate 7.

[0065] Understandably, this is in conjunction with references. Figure 3 and Figure 4As shown, since the pins of the chip under test package are rigidly bent, the pins face different when the chip under test package is installed face up in the package mounting slot 4 and when it is installed back up in the package mounting slot 4. Therefore, by setting the first slot group 401 and the second slot group 402 at different heights in the package mounting slot 4, the height of the support plate 7 in the package mounting slot 4 is adjustable. This allows the chip under test package to be installed on the support plate 7 at different heights when it is installed face up or back up in the package mounting slot 4. This ensures that the pins of the chip under test package are placed precisely on the pin placement stage 6 when it is installed face up or back up in the package mounting slot 4, and the pins of the chip under test package can be fixed on the pin packaging stage 6 by the test pin 202, so as to realize the testing of chips with different opening methods.

[0066] Optional, continue to refer to Figure 4 The pressing mechanism 201 includes a first pressing mechanism 1201 and a second pressing mechanism 2201 located on opposite sides of the package mounting groove 4; multiple test pins 202 are divided into a first test pin group 1202 and a second test pin group 2202; the first test pin group 1202 and the second test pin group 2202 are located on opposite sides of the package mounting groove 4; the first pressing mechanism 1201 is used to control the test pins 202 in the first test pin group 1202 to contact or separate from the pin placement stage 6; the second pressing mechanism 2201 is used to control the test pins 202 in the second test pin group 2202 to contact or separate from the pin placement stage 6.

[0067] For details, please refer to [link / reference]. Figure 3The chip package under test has two oppositely arranged first pins 01 and second pins 02. Therefore, by setting the first pressing mechanism 1201 and the second pressing mechanism 2201 on opposite sides of the package mounting groove 4 in the pressing mechanism 201, the first pressing mechanism 1201 and the second pressing mechanism 2201 can respectively control the contact or separation of the test pins in different test pin groups with the pin placement stage. By dividing the multiple test pins 202 into the first test pin group 1202 and the second test pin group 2202, which are located on opposite sides of the package mounting groove 4, the first pressing mechanism 1201 can control the contact or separation of the test pins in different test pin groups with the pin placement stage. The test pin 202 in the first test pin group 1202 is brought into contact with the pin placement stage 6, thereby allowing the first pin 01 of the chip package under test to be fixed in the first pin placement slot in the pin placement stage 6 via the test pin 202 in the first test pin group 1202. At the same time, the second pressing mechanism 2201 can control the test pin 202 in the second test pin group 2202 to be brought into contact with the pin placement stage 6, thereby allowing the second pin 02 of the chip package under test to be fixed in the first pin placement slot in the pin placement stage 6 via the test pin 202 in the second test pin group 2202. This ensures the successful testing of the chip package and improves the accuracy and reliability of the test.

[0068] Based on the same inventive concept, this utility model embodiment also provides a packaging and testing machine, such as... Figure 7 As shown, the packaging test machine includes a test probe 01 and a packaging test socket 02 as described in the above embodiment.

[0069] Specifically, the test probe 01 can be understood as a detector used to test the chip package under test (DUT) installed in the package test socket 02. For example, it can be a hotspot scanning test detector. It is understood that when the DUT package is installed face up in the package test socket 02, the test probe 01 can test the front-opened chip package; when the DUT package is installed back up in the package test socket 02, the test probe 01 can test the back-opened chip package. Therefore, the package test machine can test chips with different opening methods to determine potential defects or faults in the chip.

[0070] The above-described packaging and testing machine can be used with the packaging and testing socket provided in any embodiment of this utility model for testing, and has the corresponding structure and beneficial effects of the packaging and testing socket. Technical details not described in detail in this embodiment can be found in the packaging and testing socket provided in any embodiment of this utility model.

[0071] Since the packaging and testing machine described above can be used to perform tests using the packaging and testing socket provided in any embodiment of this utility model, those skilled in the art can understand the specific implementation methods and various variations of the packaging and testing machine based on the packaging and testing socket described in the embodiments of this utility model. Therefore, how the packaging and testing machine performs tests using the packaging and testing socket provided in any embodiment of this utility model will not be described in detail here. Any packaging and testing machine implemented by those skilled in the art using the packaging and testing socket provided in any embodiment of this utility model falls within the scope of protection of this application.

[0072] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A packaging test socket, characterized in that, include: Base, fixture, and test circuit board; The base includes a packaging mounting slot, a fixing part that at least partially surrounds the packaging mounting slot, and a pin placement platform located between the fixing part and the packaging mounting slot; a support plate is provided in the packaging mounting slot, the support plate is movably connected to the base, and the height of the support plate in the packaging mounting slot is adjustable; the clamp is fixed to the fixing part. The fixture includes a pressing mechanism and multiple test pins; the test pins are disposed on the side of the pressing mechanism facing the base; one end of the test pin is placed on the pin placement platform, and the other end of the test pin is electrically connected to the test circuit board; the pressing mechanism is used to control the test pin to contact or separate from the pin placement platform; The test circuit board is fixed to the base on the side opposite to the fixture.

2. The packaging test socket according to claim 1, characterized in that, The pressing mechanism includes multiple pin guide slots on the side facing the base; A portion of the test pin moves within the pin guide slot; When the pressing mechanism controls the separation of the test pin from the pin placement platform, the test pin contacts the bottom of the pin guide groove.

3. The packaging test socket according to claim 2, characterized in that, The test pin is a curved structure that protrudes towards the pressing mechanism; The apex of the curved structure of the test pin moves within the pin guide groove.

4. The packaging test socket according to claim 2, characterized in that, The test pin includes a connecting part and a pressing part that are connected together; One end of the connector is placed on the pin placement platform, and the other end of the connector is electrically connected to the test circuit board. One end of the pressing part moves within the pin guide groove, and the other end of the pressing part is connected to the middle area of ​​the connecting part.

5. The packaging test socket according to claim 1, characterized in that, The fixing part is provided with a plurality of first pin placement slots on the side facing the clamp; among the test pins, the portion extending towards the package mounting slot is located in the first pin placement slot.

6. The packaging test socket according to claim 1, characterized in that, The fixing part has a plurality of second pin placement slots on the side away from the packaging mounting groove; among the test pins, the portion extending toward the side of the test circuit board is located in the second pin placement slot.

7. The packaging test socket according to claim 1, characterized in that, The pressing mechanism includes a support structure and at least one elastic element; One end of the elastic element is fixed to the side surface of the base facing the clamp, and the other end of the elastic element is fixed to the side surface of the support structure facing the base.

8. The packaging test socket according to claim 1, characterized in that, The encapsulation mounting slot includes multiple slot groups; each slot group includes at least two slots. The card slots of different card slot groups are located at different heights of the packaging mounting slot; The slot is used to engage the support plate.

9. The packaging test socket according to claim 1, characterized in that, The pressing mechanism includes a first pressing mechanism and a second pressing mechanism located on opposite sides of the encapsulation mounting groove; The plurality of test pins are divided into a first test pin group and a second test pin group; the first test pin group and the second test pin group are located on opposite sides of the package mounting slot; The first pressing mechanism is used to control the test pins in the first test pin group to contact or separate from the pin placement platform; The second pressing mechanism is used to control the contact or separation of the test pin in the second test pin group from the pin placement platform.

10. A packaging and testing machine, characterized in that, include: Test probes, and the packaged test socket as described in any one of claims 1-9.

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