Fingerprint module structure

Abstract

The utility model discloses a fingerprint module structure which comprises an FPC body, the FPC body is provided with a welding end, welding golden fingers are distributed on the welding end, the welding end is divided into a front welding surface and a back welding surface, and a gap is reserved between the outer end of each welding golden finger and the outer end of the welding end. According to the fingerprint module structure provided by the utility model, the golden finger on the conventional fingerprint module is retracted inwards, and the gap is formed between the golden finger and the outer end of the welding end, so that direct contact with the golden finger can be avoided when the edge of the fingerprint module is collided in the transfer process, the condition that the fingerprint module is easily damaged or broken is reduced, and meanwhile, the fingerprint module structure is convenient to use. Through the design of the PI covering film and the side face PI covering film, the gap at one side of the welding golden finger can be covered and protected, so that the strength of the gap is enhanced, the gap has good resistance and buffering effect when being subjected to external collision, and force is prevented from being further transmitted to the welding golden finger.

Description

Technical Field

[0001] This utility model relates to the field of fingerprint module technology, and in particular to a fingerprint module structure. Background Technology

[0002] The core component of a fingerprint lock is the fingerprint module, installed on devices such as fingerprint access control systems or hard drives. It's responsible for fingerprint acquisition and recognition. A fingerprint module mainly consists of a fingerprint acquisition module, a fingerprint recognition module, and extended function modules (such as a lock driver module). Fingerprint modules can be categorized by their fingerprint recognition method: optical fingerprint modules (recognizing fingerprints based on the refraction and reflection of light), capacitive fingerprint modules (acquiring fingerprints through changes in capacitance), and radio frequency fingerprint modules (scratch fingerprint modules) (using minute radio frequency signals to detect fingerprint patterns).

[0003] As per the instruction manual Figure 9 As shown, the fingerprint module structure is an FPC1-3 with a soldered gold finger. Because the soldered gold finger 1-1 is directly exposed on the outermost edge of the soldering end 1-2, it is easy for the soldered gold finger 1-1 to come into contact with external objects during operation and transportation due to collisions, which can cause damage or chipping. This may lead to failure when the subsequent module FPC1-3 is soldered to the motherboard. Therefore, a fingerprint module structure is proposed. Utility Model Content

[0004] Therefore, it is necessary to provide a fingerprint module structure that addresses the aforementioned technical issues by leaving a gap between the soldering gold fingers on the soldering end and the edge, thereby achieving avoidance and protection of the soldering gold fingers.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A fingerprint module structure includes an FPC body with soldering ends. Soldering gold fingers are distributed on the soldering ends, and the soldering ends are divided into a front soldering surface and a back soldering surface.

[0007] A gap is left between the outer end of the welding gold finger and the outer end of the welding end.

[0008] Furthermore, a front gap is left between the end of the welding gold finger located on the front welding surface and the edge of the welding end.

[0009] Furthermore, a back gap is left between the end of the welding gold finger located on the back welding surface and the edge of the welding end.

[0010] Furthermore, a protective structure is provided on the front gap.

[0011] Furthermore, the protective structure is a PI covering film.

[0012] Furthermore, the PI cover film, except for the three sides corresponding to the welding gold fingers, extends to the outside of the front gap and forms a side PI cover film;

[0013] The PI cover film on the side is wrapped around the outside of the welding end.

[0014] Furthermore, both sides of the outer end of the welding end have an outer arc chamfer.

[0015] Furthermore, the FPC body also includes a connecting section and a mounting section, and the welding end, connecting section and mounting section are connected end to end in sequence to form the FPC body.

[0016] Furthermore, the connection between the welding end and the connecting segment has an inner arc chamfer.

[0017] Furthermore, the front side of the mounting segment has a mounting area, and the mounting segment mounts a fingerprint packaging chip through the mounting area. A metal ring fixed to the mounting segment is sleeved on the surface of the fingerprint packaging chip.

[0018] A reinforcing steel sheet is fixed on the back of the mounting section at the position corresponding to the mounting area, and a protective film layer is also attached to the surface of the fingerprint packaging chip.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] The fingerprint module structure provided by this utility model shrinks the gold fingers on the conventional fingerprint module inward, so that there is a gap between them and the outer end of the welding end. In this way, when the edge of the fingerprint module is bumped during transportation, it can avoid direct contact with the welding gold fingers, thereby reducing the possibility of damage or chipping.

[0021] Meanwhile, the design of the PI cover film and the side PI cover film can cover and protect the gap on one side of the gold finger to strengthen the strength of the area, so that it has good resistance and buffering effect when subjected to external impact, and avoids further transmission of force to the gold finger.

[0022] By designing chamfered outer and inner arc surfaces, the resistance to damage at the edge welding end can be increased. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the fingerprint module structure provided by this utility model;

[0024] Figure 2 This is a schematic diagram of the gap structure of the fingerprint module structure provided by this utility model;

[0025] Figure 3 A schematic diagram of the PI cover film structure for the fingerprint module provided by this utility model;

[0026] Figure 4 A schematic diagram of the side PI cover film structure of the fingerprint module structure provided by this utility model;

[0027] Figure 5 A side view of the fingerprint module structure provided by this utility model;

[0028] Figure 6 A schematic diagram of the rear structure of the fingerprint module provided by this utility model;

[0029] Figure 7 A schematic diagram of the front welding surface structure of the fingerprint module structure provided by this utility model;

[0030] Figure 8 A schematic diagram of the back welding surface structure of the fingerprint module structure provided by this utility model;

[0031] Figure 9 A schematic diagram of the gold finger structure of the conventional fingerprint module provided by this utility model.

[0032] The markings in the diagram are explained as follows:

[0033] FPC body 1, welding end 11, welding gold finger 12, front welding surface 13, back welding surface 14, connecting section 15, mounting section 16;

[0034] Outer arc chamfer 110, inner arc chamfer 111; mounting area 160, fingerprint encapsulation chip 161, metal ring 162, reinforcing steel sheet 163, protective film layer 164;

[0035] Gap 2, front gap 21, back gap 22, PI cover film 23, side PI cover film 24. Detailed Implementation

[0036] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0037] As described in the background art, as per the appendix to the specification. Figure 9As shown, the fingerprint module structure is FPC1-3 with soldered gold fingers. Because the soldered gold fingers 1-1 are directly exposed on the outermost edge of the soldering end 1-2, they are easily damaged or chipped due to collisions during operation and transportation. This may lead to failure when the module FPC1-3 is soldered to the motherboard.

[0038] To solve this technical problem, this utility model provides a fingerprint module structure, which is applied to a fingerprint module.

[0039] For details, please refer to Figures 1-9 The fingerprint module structure specifically includes an FPC body 1, which has a welding end 11. Welded gold fingers 12 are distributed on the welding end 11, and the welding end 11 is divided into a front welding surface 13 and a back welding surface 14.

[0040] A gap 2 is left between the outer end of the welding gold finger 12 and the outer end of the welding end 11.

[0041] The fingerprint module structure provided by this utility model retracts the gold fingers on a conventional fingerprint module, creating a gap between them and the outer end of the welding end 11. This prevents direct contact between the gold fingers and the edges when the fingerprint module is bumped during transport, thereby reducing the risk of damage or chipping.

[0042] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0043] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0044] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0045] Example 1

[0046] Please refer to Figures 1-8 As shown, a fingerprint module structure includes an FPC body 1, on which a welding end 11 is provided, and welding gold fingers 12 are distributed on the welding end 11. The welding end 11 is divided into a front welding surface 13 and a back welding surface 14. In this embodiment, the front welding surface 13 and the back welding surface 14 are only used to distinguish the front and back of the welding end 11 and will not affect the structure of the welding end 11 and the welding gold fingers 12 themselves.

[0047] In this embodiment, the back welding surface 14 on the welding end 11 needs to be in contact with the motherboard surface and bonded by soldering. Therefore, this part is called the back welding surface 14, and the opposite is called the front welding surface 13.

[0048] like Figure 2 As shown, there is a gap 2 between the outer end of the welding gold finger 12 and the outer end of the welding end 11. In this embodiment, the gap 2 is that the outer end of the welding gold finger 12 is not flush with the outer end of the welding end 11 as in a conventional gold finger, but is recessed to form the gap 2. The actual size of the gap 2 can be comprehensively considered based on the size of different fingerprint modules and the overall size of the FPC body 1.

[0049] In this embodiment, the gap 2 dimension is 1.5MM±0.5mm;

[0050] like Figure 7 As shown, a front gap 21 is left between the end of the welding gold finger 12 located on the front welding surface 13 and the edge of the welding end 11.

[0051] like Figure 8 As shown, a back gap 22 is left between the end of the welding gold finger 12 located on the back welding surface 14 and the edge of the welding end 11;

[0052] The distance and size of the front gap 21 and the back gap 22 are the same. Since the same welding gold finger is used, when the edge of the welding end 11 is bumped during actual transportation, it will not directly contact the end of the welding gold finger 12. Therefore, it can avoid damage or chipping caused by direct contact, which is conducive to better protection of the fingerprint module.

[0053] Example 2

[0054] In the above embodiment one, a gap is formed by the inward direction of the welding gold finger 12, so that it cannot directly contact the welding gold finger 12 to achieve the protection function during the collision. However, since the gap is relatively weak, the impact force may still be transmitted to the welding gold finger during the collision, affecting the protection of the welding gold finger 12. Therefore, the protection structure is designed in this embodiment, as follows.

[0055] The fingerprint module structure provided in Embodiment 1 is further optimized, specifically, as follows: Figure 4 As shown, a protective structure is provided on the front gap 21;

[0056] The protective structure in this embodiment is a PI covering film 23. PI is an abbreviation for polyimide, an organic polymer material with characteristics such as high temperature resistance, good flexibility, wear resistance, and good insulation. Therefore, when it is placed on the front gap 21, it can protect the gap area. At the same time, it provides a certain degree of resistance and buffering effect when there is an impact with the outside, preventing further force from being transmitted to the welding gold finger 12, thus better protecting the welding gold finger 12.

[0057] As a further optimization of this embodiment: such as Figure 4 As shown, the PI cover film 23 extends to the outside of the front gap 21 on the other three sides except for the corresponding welding gold finger 12, and forms a side PI cover film 24. Through the design of the side PI cover film, a local area on the outside of the welding end 11 can also be covered to form better protection, so the protection effect when the edge is bumped will be better.

[0058] The side PI covering film 24 is wrapped around the outside of the welding end 11;

[0059] In this embodiment, the PI cover film 23 is only set on the front gap 21, while the back gap 22 on the back welding surface 14 is not designed with the PI cover film 23. Therefore, with this design, when the welding end 11 contacts and adheres to the external motherboard through the back welding surface 14, it can better achieve the position correspondence with the pad position on the motherboard. Therefore, no protective structure design is performed.

[0060] In different application scenarios or welding conditions, the back gap 22 on the back welding surface 14 can also be protected in some cases. This embodiment does not limit it to a single type.

[0061] Example 3

[0062] The fingerprint module structure provided in Embodiment 1 or 2 is further optimized, such as... Figure 3 and Figure 7 As shown, both sides of the outer end of the welding end 11 have an outer arc chamfer 110. The design of the outer arc chamfer 110 can disperse the stress at the edges on both sides of the outer end of the welding end 11. By dispersing the stress, the problem of excessive stress concentration and more likely edge chipping damage can be avoided when impacted from the side.

[0063] The FPC body 1 also includes a connecting section 15 and a mounting section 16. The welding end 11, the connecting section 15 and the mounting section 16 are connected end to end in sequence to form the FPC body 1.

[0064] The connection between the welding end 11 and the connecting segment 15 has an inner arc chamfer 111. The inner arc chamfer 111 here has the same function as the outer arc chamfer 110 mentioned above, which is to disperse stress and thus better protect the FPC as a whole. At the same time, since the inner arc chamfer 111 is designed at the connection between the welding end 11 and the connecting segment 15, the inner arc chamfer 111 can reduce the likelihood of tearing at the connection by dispersing stress when the welding end 11 and the connecting segment 15 are twisted.

[0065] Example 4

[0066] The fingerprint module structure provided in Embodiment 3 is further optimized, such as... Figure 5 The mounting section 16 shown has a mounting area 160 on its front side. The mounting section 16 mounts a fingerprint encapsulation chip 161 through the mounting area 160. A metal ring 162 fixed to the mounting section 16 is sleeved on the surface of the fingerprint encapsulation chip 161.

[0067] A reinforcing steel sheet 163 is fixed on the back of the mounting section 16 at the position corresponding to the mounting area 160, and a protective film layer 164 is also attached to the surface of the fingerprint encapsulation chip 161.

[0068] The fingerprint module structure provided by this utility model is used as follows: When the gold finger 12 is designed, a gap 2 is formed between it and the outer end of the welding end 11 before fixing. In this way, when the edge of the fingerprint module is bumped during transportation, it can avoid direct contact with the gold finger 12, reducing the possibility of damage or chipping. Then, the outer arc chamfer 110 is designed on both sides of the outer end of the welding end 11, and the inner arc chamfer 111 is designed at the connection between the welding end 11 and the connecting section 15. Finally, a PI covering film 23 and a side PI covering film 24 are designed at the gap 2 on the front side to cover and protect the gap 2 on one side of the gold finger 12, thereby strengthening the strength of that area.

[0069] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0070] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A fingerprint module structure, characterized in that, The FPC body (1) includes a welding end (11) on which welding gold fingers (12) are distributed, and the welding end (11) is divided into a front welding surface (13) and a back welding surface (14). A gap (2) is left between the outer end of the welding gold finger (12) and the outer end of the welding end (11).

2. The fingerprint module structure according to claim 1, characterized in that, A front gap (21) is left between the end of the welding gold finger (12) located on the front welding surface (13) and the edge of the welding end (11).

3. The fingerprint module structure according to claim 1, characterized in that, A back gap (22) is left between the end of the welding gold finger (12) located on the back welding surface (14) and the edge of the welding end (11).

4. The fingerprint module structure according to claim 2, characterized in that, A protective structure is provided on the front gap (21).

5. The fingerprint module structure according to claim 4, characterized in that, The protective structure is a PI covering film (23).

6. The fingerprint module structure according to claim 5, characterized in that, The PI cover film (23) extends to the outside of the front gap (21) on the other three sides, except for the corresponding welding gold finger (12), and forms a side PI cover film (24). The side PI cover film (24) is wrapped around the outside of the welding end (11).

7. The fingerprint module structure according to claim 1, characterized in that, Both sides of the outer end of the welding end (11) have an outer arc chamfer (110).

8. The fingerprint module structure according to claim 1, characterized in that, The FPC body (1) also includes a connecting section (15) and a mounting section (16). The welding end (11), the connecting section (15) and the mounting section (16) are connected end to end in sequence to form the FPC body (1).

9. The fingerprint module structure according to claim 8, characterized in that, The connection between the welding end (11) and the connecting section (15) has an inner arc chamfer (111).

10. The fingerprint module structure according to claim 8, characterized in that, The mounting section (16) has a mounting area (160) on its front side. The mounting section (16) mounts a fingerprint encapsulation chip (161) through the mounting area (160). A metal ring (162) fixed to the mounting section (16) is sleeved on the surface of the fingerprint encapsulation chip (161). A reinforcing steel sheet (163) is fixed on the back of the mounting section (16) at the position corresponding to the mounting area (160), and a protective film layer (164) is also attached to the surface of the fingerprint encapsulation chip (161).

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