High-performance network switch system based on domestic Feiteng processor

By using a high-performance network switch system based on the Phytium E2000Q processor, combined with optimized packet processing flow and heat dissipation module design, the problems of insufficient throughput, high latency and high heat release of traditional switches are solved, achieving efficient data processing and heat dissipation, and reducing hardware costs.

CN223843791UActive Publication Date: 2026-01-27深圳市中微信息技术有限公司
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Patent Information

Application Number
CN202520457019.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-14
Publication Date
2026-01-27
Estimated Expiration
2035-03-14

AI Technical Summary

Technical Problem

Traditional network switches suffer from insufficient throughput, high latency, and high heat generation when handling large-scale data traffic, which affects hardware performance and cost.

Method used

The system employs a high-performance network switch based on the domestic Phytium E2000Q processor, combined with optimized packet processing flow, multi-core architecture, and heat dissipation module design, including heat sinks and heat dissipation holes, and optimized power management to improve performance and reduce temperature.

Benefits of technology

It increases the throughput of network switches and reduces latency, while also reducing hardware power consumption and production costs, and improving communication real-time performance and market competitiveness.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of switches, and discloses a high-performance network switch system based on a domestic Feiteng processor, and the system comprises an SOC module which comprises a CPU and a memory controller; the network interface module comprises a plurality of interfaces, and the plurality of interfaces are connected with the CPU and are used for receiving and transmitting data packets; the data storage module is used for storing network data and configuration information and comprises a memory, an EMMC, a solid-state drive and a USB interface, information interaction between the data storage module and the CPU is achieved through the memory, an operating system is stored through the EMMC, and logs and working states of the system are stored through the solid-state drive; the power management module is used for supplying power to the SOC module and the data storage module; the heat dissipation module comprises an upper cover and a lower cover, the SOC module, the network interface module, the data storage module and the power management module are covered by the upper cover and the lower cover, heat dissipation fins are distributed on the upper cover, and heat dissipation holes are formed in the two sides of the upper cover. According to the utility model, the problems of low performance and high heat release of the switch can be solved.
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Description

Technical Field

[0001] This utility model relates to the field of switch technology, and in particular to a high-performance network switch system based on the domestic Phytium processor. Background Technology

[0002] With the development of network technology, the performance requirements for network switches are becoming increasingly stringent. Traditional network switches often suffer from insufficient throughput and high latency when handling large-scale data traffic. Furthermore, processing large-scale data traffic increases the power consumption of the switch's hardware, which is often accompanied by high heat dissipation, further impacting hardware performance. Utility Model Content

[0003] In view of the above technical problems, this utility model provides a high-performance network switch system based on the domestic Phytium processor to solve the problems of low performance and high heat release of the switch.

[0004] Other features and advantages of this invention will become apparent from the following detailed description, or may be learned in part by practice of this invention.

[0005] The purpose of this utility model is to provide a high-performance network switch system based on the domestic Phytium processor, the system comprising:

[0006] SOC module, the SOC module including CPU;

[0007] A network interface module, comprising multiple interfaces connected to the CPU for sending and receiving data packets;

[0008] The data storage module is used to store network data and configuration information. It includes memory, eMMC, solid-state drive and USB interface. The data storage module interacts with the CPU through the memory, stores the operating system through the eMMC, and stores the system logs and working status through the solid-state drive.

[0009] A power management module is provided to supply power to the SOC module and the data storage module.

[0010] The heat dissipation module includes an upper cover and a lower cover, which enclose the SOC module, the network interface module, the data storage module and the power management module. The upper cover has heat dissipation fins distributed on it and heat dissipation holes on both sides.

[0011] Furthermore, a hard drive cover is also provided on the upper cover, and the hard drive cover is fixed to the upper cover by screws.

[0012] Furthermore, the upper cover is mounted on the lower cover by screws.

[0013] Furthermore, the system also includes a puller protruding from the top cover.

[0014] Furthermore, the CPU is a Phytium E2000Q processor. The network interface design based on the Phytium E2000Q processor optimizes the data packet processing flow, reduces network latency, and boasts high throughput, capable of handling large volumes of concurrent data streams, making it suitable for high-load network environments. This improves the real-time performance of network communication; simultaneously, CPUs typically offer cost advantages, reducing switch production costs and enhancing product market competitiveness.

[0015] The technical solution of this utility model has the following beneficial effects:

[0016] Based on performance hardware and the heat dissipation design of the top and bottom covers, the performance of the switch is improved, the throughput is increased and the latency is reduced; based on the heat dissipation design of the top cover, the heat dissipation effect of the switch is improved and the operating temperature of the heat sink is effectively reduced. Attached Figure Description

[0017] Figure 1 This is a block diagram of the switch system according to an embodiment of this specification;

[0018] Figure 2 This is a structural block diagram of the SOC module in an embodiment of this specification;

[0019] Figure 3 This is a structural block diagram showing the connection between the network interface module and the CPU in an embodiment of this specification.

[0020] Figure 4 This is a structural block diagram showing the connection between the data storage module and the CPU in an embodiment of this specification;

[0021] Figure 5 This is a structural block diagram showing the connection between the power management module and the CPU in an embodiment of this specification.

[0022] Figure 6 This is a schematic diagram of the heat dissipation module in an embodiment of this specification;

[0023] Figure 7 This is a schematic diagram of the heat dissipation module in an embodiment of this specification. Detailed Implementation

[0024] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this disclosure more comprehensive and complete, and to fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a full understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced with one or more of these specific details omitted, or other components, devices, steps, etc., can be employed. In other instances, well-known technical solutions are not shown or described in detail to avoid obscuring various aspects of this disclosure.

[0025] like Figure 1 As shown, a high-performance network switch system based on the domestic Phytium processor is provided. The system includes: SOC module 1, network interface module 2, data storage module 3, power management module 4, and heat dissipation module 5.

[0026] like Figure 2 As shown, SOC module 1 includes a CPU. Specifically, SOC module 1 uses a Phytium E2000Q processor, which features a multi-core architecture, providing powerful computing capabilities and efficient network processing performance. The SOC module integrates the processor, memory controller, and other key components. With the Phytium E2000Q processor, it provides the necessary computing power to handle network traffic, execute network protocols, and fulfill service requests. The network interface design based on the Phytium E2000Q processor optimizes packet processing, reduces network latency, and offers high throughput, enabling it to handle large volumes of concurrent data streams, making it suitable for high-load network environments. This improves the real-time performance of network communication; simultaneously, CPUs typically offer cost advantages, reducing switch production costs and enhancing product market competitiveness.

[0027] like Figure 3 As shown, network interface module 2 includes multiple interfaces 21, which are connected to the CPU for sending and receiving data packets. Specifically, network interface module 2 is the part of the switch that connects to the external network. It includes multiple ports to allow simultaneous connection of multiple network devices, such as computers and servers. It supports standard Ethernet network interfaces and is responsible for receiving and sending data packets to the SOC module for information processing.

[0028] like Figure 4As shown, the data storage module 3 is used to store network data and configuration information. It includes a cache 31 and a non-volatile memory 32, as well as a memory 33, an eMMC 34, a solid-state drive 35, and a USB interface 36. The data storage module 3 interacts with the CPU through the memory 33, stores the operating system through the eMMC 34, and stores the system logs and operating status through the solid-state drive 35. The USB interface 36 is for convenient maintenance and upgrades and can be configured to support hot-swapping, that is, it can obtain motherboard data without turning off the device.

[0029] like Figure 5 As shown, the power management module 4 is used to power the SOC module 1 and the data storage module 3. It includes a power supply circuit 41, an overvoltage and overcurrent protection circuit 42, a fuse, and a voltage regulator 43. The power management module 4 is specifically responsible for providing a stable power supply to the switch and taking measures to protect the switch when the power supply is unstable or there is a power outage. Specifically, it includes power monitoring, OCP & OVP functions, and other protection circuits. It dynamically adjusts the power supply of each component according to the workload of the SOC module and the network interface module to achieve the best energy efficiency ratio.

[0030] like Figure 6-7 As shown, the heat dissipation module 5 includes an upper cover 51 and a lower cover 52, which enclose the SOC module 1, network interface module 2, data storage module 3, and power management module 4. The upper cover 51 has heat dissipation fins 511 and ventilation holes on both sides. The heat dissipation module 5 is used to maintain the stability and performance of the switch under high load operation. Specifically, it dissipates heat from the inside of the device. Specifically, the upper cover 51 of the heat dissipation module 5 also has a hard drive cover 53, which is fixed to the upper cover 51 with screws. The upper cover 51 is mounted on the lower cover 52 with screws. The upper cover 51 also includes a pull-out device 54 protruding from its exterior.

[0031] Beneficial effects:

[0032] Based on the performance hardware and the heat dissipation design of the upper cover 51 and lower cover 52, the performance of the switch is improved, the throughput is increased and the latency is reduced; based on the heat dissipation design of the upper cover, the heat dissipation effect of the switch is improved and the operating temperature of the heat sink is effectively reduced.

[0033] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model. In addition, those skilled in the art can understand that although some embodiments described herein include certain features included in other embodiments but not other features, combinations of features of different embodiments mean that they are within the scope of this utility model and form different embodiments. For example, in the above claims, any one of the claimed embodiments can be used in any combination. The information disclosed in this background section is only intended to deepen the understanding of the overall background technology of this utility model, and should not be regarded as an admission or in any form implying that the information constitutes prior art known to those skilled in the art.

Claims

1. A high-performance network switch system based on a domestically produced Phytium processor, characterized in that, The system includes: SOC module, the SOC module including CPU; A network interface module, comprising multiple interfaces connected to the CPU for sending and receiving data packets; The data storage module is used to store network data and configuration information. It includes memory, eMMC, solid-state drive and USB interface. The data storage module interacts with the CPU through the memory, stores the operating system through the eMMC, and stores the system logs and working status through the solid-state drive. A power management module is provided to supply power to the SOC module and the data storage module. The heat dissipation module includes an upper cover and a lower cover, which enclose the SOC module, the network interface module, the data storage module and the power management module. The upper cover has heat dissipation fins distributed on it and heat dissipation holes on both sides.

2. The high-performance network switch system based on the domestic Phytium processor according to claim 1, characterized in that, The upper cover is also provided with a hard drive cover, which is fixed to the upper cover by screws.

3. The high-performance network switch system based on the domestic Phytium processor according to claim 1, characterized in that, The upper cover is mounted on the lower cover by screws.

4. The high-performance network switch system based on the domestic Phytium processor according to claim 1, characterized in that, The system also includes a puller that protrudes from the top cover.

5. The high-performance network switch system based on the domestic Phytium processor according to claim 1, characterized in that, The CPU is a Phytium E2000Q processor.