Shell for packaging integrated circuit

Abstract

The utility model discloses a shell for packaging an integrated circuit, which relates to the technical field of integrated circuits and comprises a shell, a circuit board body and a protective plate. The circuit board body is arranged in the shell; the protection plate is connected to one side of the shell through a hinge; a buckle is arranged on one side of the shell, locking blocks are arranged at the two ends of one side of the protection plate, and clamping assemblies for clamping and fixing the circuit board body are arranged on the two sides of the shell. According to the utility model, the buckle is pulled to be far away from the locking block, so that the protection plate can rotate and can be far away from the top of the shell, the circuit board body in the shell can be overhauled, the circuit board body can be clamped and fixed through the clamping assembly, and the clamping assembly can be pulled to clamp the circuit board body. Therefore, the effect of quickly disassembling the circuit board body is achieved, the maintenance time is shortened, damage to other components can be avoided, and the fault risk is reduced.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit technology, specifically to an integrated circuit packaging shell. Background Technology

[0002] Integrated circuits, or ICs for short, are also known as chips. They are the core components of modern electronic products. They are made by integrating a large number of electronic components, such as transistors, resistors, and capacitors, into a single semiconductor material in tiny dimensions and connecting them together through complex processes. An integrated circuit package refers to the structure or material used to wrap and protect the integrated circuit chip.

[0003] The patent document with announcement number CN215956805U describes a protective packaging shell for integrated circuits. The described solution uses a series of structures to mitigate external impacts during use by utilizing the elasticity of the spring seat, thus preventing damage to the integrated circuit board body during impact. The fan generates airflow to help dissipate heat inside the shell, thereby preventing damage to the integrated circuit board body when used in high-temperature environments.

[0004] While the aforementioned technologies can provide buffer protection for the integrated circuit board itself, they also present challenges in terms of maintenance. When a circuit board malfunctions, it is difficult to quickly locate and resolve the problem, requiring more time and specialized tools to open the package for inspection and repair. This maintenance difficulty leads to longer equipment downtime, impacting systems or businesses that rely on these devices. Furthermore, the technologies also prevent the rapid disassembly of the circuit board itself. During complex disassembly, other components or connections may be accidentally damaged, increasing the risk of further malfunctions. Moreover, more time and effort are required to disassemble the circuit board, extending repair time and affecting the normal operation of the equipment. Utility Model Content

[0005] The purpose of this invention is to provide a housing for integrated circuit packaging to solve the problem of inconvenient maintenance in the prior art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] An integrated circuit packaging housing, comprising:

[0008] case;

[0009] Circuit board body; the circuit board body is disposed inside the housing;

[0010] Protective plate; the protective plate is connected to one side of the housing via a hinge;

[0011] It also includes a fixing component for fixing the protective plate, the fixing component including two buckles, both of which are provided on one side of the housing, locking blocks are provided at both ends of one side of the protective plate, clamping components for clamping and fixing the circuit board body are provided on both sides of the housing, and heat dissipation components for dissipating heat from the circuit board body are provided inside the housing.

[0012] Based on the above technical solutions, this utility model also provides the following optional technical solutions:

[0013] In one alternative embodiment: the clamping assembly includes two support frames, both of which are fixedly connected to both sides of the housing. Limiting grooves are formed on both sides inside the housing. Limiting rods are slidably connected inside the limiting grooves and pass through the support frames. A U-shaped limiting frame is fixedly connected to the side of the limiting rod closest to the circuit board body. A spring is provided inside the limiting groove and is sleeved on the limiting rod. A limiting assembly for limiting the limiting rod is provided on the support frame.

[0014] In one alternative: the heat dissipation component includes a miniature water tank located inside the housing, a water pump located inside the miniature water tank, a cooling water pipe located at the output end of the water pump, and the other end of the cooling water pipe also located inside the miniature water tank.

[0015] In one alternative: the limiting component includes a transverse groove formed inside the support frame, and a limiting sleeve is rotatably connected to the outer surface of the limiting rod.

[0016] In one alternative: mounting plates are provided on all four sides of the housing.

[0017] In one alternative: the protective plate and the housing are magnetically attracted to each other.

[0018] In one alternative: the miniature water tank is equipped with a semiconductor cooling chip.

[0019] In one alternative: the two U-shaped limit brackets are compatible in shape and specifications, and both U-shaped limit brackets have protective pads in their grooves.

[0020] In one alternative: the transverse groove is adapted to the shape and specifications of the limiting sleeve.

[0021] In one alternative: a pull ring is provided on the end of the limiting rod away from the U-shaped limiting frame.

[0022] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0023] 1. This utility model achieves the effect of rotating the protective plate by pulling the buckle away from the locking block, allowing it to be moved away from the top of the housing, thus enabling the circuit board body inside the housing to be inspected and repaired. It is flexible in use and simple in operation.

[0024] 2. This utility model achieves the effect of clamping and fixing the circuit board body by setting the clamping component. It can also pull the clamping component away from the circuit board body, thereby achieving the effect of quickly disassembling the circuit board body, thus reducing maintenance time, avoiding damage to other components, and reducing the risk of failure. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of this utility model.

[0026] Figure 2 This is a cross-sectional view of the structure of this utility model.

[0027] Figure 3 This is a schematic diagram of the structure of utility model A.

[0028] Figure 4 This is a schematic diagram of the protective plate structure of this utility model.

[0029] The components are as follows: 100, housing; 200, circuit board body; 300, protective plate; 401, buckle; 402, locking block; 501, support frame; 502, limiting groove; 503, limiting rod; 504, U-shaped limiting frame; 505, spring; 601, miniature water tank; 602, cooling water pipe; 701, horizontal groove; 702, limiting sleeve; 800, pull ring. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0031] In one embodiment, such as Figures 1-4As shown, an integrated circuit packaging housing includes: a housing 100, a circuit board body 200, a protective plate 300, and a fixing assembly; the circuit board body 200 is disposed inside the housing 100; the protective plate 300 is connected to one side of the housing 100 by a hinge; the fixing assembly includes two buckles 401, both of which are disposed on one side of the housing 100; locking blocks 402 are provided at both ends of one side of the protective plate 300; clamping assemblies for clamping and fixing the circuit board body 200 are provided on both sides of the housing 100; and a heat dissipation assembly for dissipating heat from the circuit board body 200 is provided inside the housing 100. By rotating the protective plate 300, the locking blocks 402 are moved closer to the housing 100 and the buckles 401; and then the buckles 401 are pulled closer to the locking blocks 402, thereby fixing the protective plate 300.

[0032] In one embodiment, such as Figure 1 , Figure 2 and Figure 3 As shown, the clamping assembly includes two support frames 501, both of which are fixedly connected to both sides of the housing 100. Limiting grooves 502 are formed on both sides of the housing 100. Limiting rods 503 are slidably connected inside the limiting grooves 502, and the limiting rods 503 pass through the support frames 501. A U-shaped limiting frame 504 is fixedly connected to the side of the limiting rod 503 closest to the circuit board body 200. A spring 505 is provided inside the limiting grooves 502. The spring 505 is sleeved on the limiting rod 503. The support frame 501 is provided with a limiting component to limit the limiting rod 503. By pulling the limiting rod 503, it causes the U-shaped limiting frame 504 to move away from the circuit board body 200, thereby completing the quick disassembly of the circuit board body 200. Then, the pulling force on the limiting rod 503 is released, and then under the action of the spring 505, the limiting rod 503 and the U-shaped limiting frame 504 are driven back to their original positions, thereby clamping the circuit board body 200.

[0033] In one embodiment, such as Figure 1 and Figure 2 As shown, the heat dissipation component includes a miniature water tank 601, which is located inside the housing 100. A water pump is installed inside the miniature water tank 601, and a cooling water pipe 602 is provided at the output end of the water pump. The other end of the cooling water pipe 602 is also located inside the miniature water tank 601. By starting the water pump, water inside the miniature water tank 601 is drawn into the cooling water pipe 602, thereby cooling the circuit board body 200.

[0034] In one embodiment, such as Figure 3As shown, the limiting component includes a transverse groove 701, which is formed inside the support frame 501. A limiting sleeve 702 is rotatably connected to the outer surface of the limiting rod 503. The limiting sleeve 702 passes through the transverse groove 701, and then the limiting sleeve 702 is rotated so that it intersects with the transverse groove 701, thereby limiting the limiting rod 503.

[0035] In one embodiment, such as Figure 1 and Figure 2 As shown, mounting plates are provided around the perimeter of the housing 100 to facilitate installation.

[0036] In one embodiment, such as Figure 1 and Figure 2 As shown, the protective plate 300 and the housing 100 are magnetically attracted to each other, so that the protective plate 300 can be fixed when opened.

[0037] In one embodiment, such as Figure 1 As shown, the miniature water tank 601 is equipped with a semiconductor cooling chip, which enables it to cool the water inside the miniature water tank 601.

[0038] In one embodiment, such as Figure 1 and Figure 2 As shown, the two U-shaped limiting brackets 504 are compatible in shape and size, and the grooves of the two U-shaped limiting brackets 504 are provided with protective pads, which facilitates the clamping of the circuit board body 200 and also protects the circuit board body 200.

[0039] In one embodiment, such as Figure 3 As shown, the shape and specifications of the transverse groove 701 are adapted to the limiting sleeve 702, so that the limiting sleeve 702 can pass through the transverse groove 701.

[0040] In one embodiment, such as Figure 1 , Figure 2 and Figure 3 As shown, a pull ring 800 is provided on the end of the limiting rod 503 away from the U-shaped limiting frame 504, which facilitates the pulling of the limiting rod 503.

[0041] The above embodiment discloses an integrated circuit packaging housing. When the circuit board body 200 inside the housing 100 needs maintenance, the latch 401 can be pulled away from the locking block 402, thereby moving the protective plate 300 away from the housing 100, allowing maintenance of the circuit board body 200. If the circuit board body 200 needs replacement, the limiting rod 503 can be pulled away from the circuit board body 200, causing the U-shaped limiting bracket 504 to move away from the circuit board body 200. After the limiting rod 503 drives the limiting sleeve 702 through the transverse groove 701, the limiting sleeve 702 can be rotated to intersect with the transverse groove 701. This limits the position of the limiting rod 503, thereby enabling the quick disassembly of the circuit board body 200. After the circuit board body 200 is replaced, the limiting sleeve 702 is rotated again to align with the transverse groove 701. Then, the tension on the limiting rod 503 is released. Subsequently, under the action of the spring 505, the limiting rod 503 and the U-shaped limiting frame 504 are driven back to their original positions, thereby clamping the circuit board body 200. Then, by rotating the protective plate 300, the locking block 402 is brought closer to the housing 100 and the buckle 401. Then, the buckle 401 is pulled to bring it closer to the locking block 402, thereby fixing the protective plate 300.

[0042] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A housing for integrated circuit packaging, comprising: Casing (100); Circuit board body (200); the circuit board body (200) is disposed inside the housing (100); Protective plate (300); the protective plate (300) is connected to one side of the housing (100) by a hinge; The invention is characterized by further including a fixing component for fixing the protective plate (300), the fixing component including two buckles (401), both buckles (401) being provided on one side of the housing (100), locking blocks (402) being provided at both ends of one side of the protective plate (300), clamping components for clamping and fixing the circuit board body (200) being provided on both sides of the housing (100), and a heat dissipation component for dissipating heat from the circuit board body (200) being provided inside the housing (100).

2. The housing for integrated circuit packaging according to claim 1, characterized in that, The clamping assembly includes two support frames (501), both of which are fixedly connected to both sides of the housing (100). Limiting grooves (502) are provided on both sides inside the housing (100). A limiting rod (503) is slidably connected inside the limiting groove (502), and the limiting rod (503) passes through the support frame (501). A U-shaped limiting frame (504) is fixedly connected to the side of the limiting rod (503) near the circuit board body (200). A spring (505) is provided inside the limiting groove (502), and the spring (505) is sleeved on the limiting rod (503). A limiting assembly for limiting the limiting rod (503) is provided on the support frame (501).

3. The housing for integrated circuit packaging according to claim 1, characterized in that, The heat dissipation component includes a miniature water tank (601), which is located inside the housing (100). The miniature water tank (601) is equipped with a water pump, and the output end of the water pump is equipped with a cooling water pipe (602). The other end of the cooling water pipe (602) is also located inside the miniature water tank (601).

4. The housing for integrated circuit packaging according to claim 2, characterized in that, The limiting component includes a transverse groove (701) which is formed inside the support frame (501), and a limiting sleeve (702) is rotatably connected to the outer surface of the limiting rod (503).

5. The housing for integrated circuit packaging according to claim 1, characterized in that, Mounting plates are provided on all four sides of the housing (100).

6. The housing for integrated circuit packaging according to claim 1, characterized in that, The protective plate (300) and the shell (100) are magnetically attracted to each other.

7. The housing for integrated circuit packaging according to claim 3, characterized in that, The miniature water tank (601) is equipped with a semiconductor cooling chip inside.

8. A housing for integrated circuit packaging according to claim 2, characterized in that, The two U-shaped limit brackets (504) are compatible in shape and size, and the grooves of the two U-shaped limit brackets (504) are provided with protective pads.

9. A housing for integrated circuit packaging according to claim 4, characterized in that, The transverse groove (701) is compatible with the shape and specifications of the limiting sleeve (702).

10. A housing for integrated circuit packaging according to claim 2, characterized in that, A pull ring (800) is provided on the end of the limiting rod (503) away from the U-shaped limiting frame (504).

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