Domain controller and vehicle

Abstract

The utility model discloses a domain controller, which comprises a shell, a first printed circuit board assembly and a second printed circuit board assembly, an electromagnetic shielding retaining wall is arranged in the shell, the first end of the electromagnetic shielding retaining wall abuts against the lower surface of the second printed circuit board in the installation state of the second printed circuit board assembly, and the second end of the electromagnetic shielding retaining wall abuts against the upper surface of the first printed circuit board. The first electromagnetic shielding element is arranged between the electromagnetic shielding retaining wall and the upper surface of the second printed circuit board in an extruded manner in the mounting state of the second printed circuit board assembly, and is arranged between the electromagnetic shielding retaining wall and the first end of the electromagnetic shielding bracket in an extruded manner in the removal state of the second printed circuit board assembly; the second electromagnetic shielding element is arranged between the second end of the electromagnetic shielding support and the upper surface of the first printed circuit board in a squeezed mode in the removed state of the second printed circuit board assembly. The third electromagnetic shielding element abuts against the lower surface of the first printed circuit board. The utility model further discloses a vehicle.

Description

Technical Field

[0001] This utility model relates to a domain controller, and more particularly to a domain controller compatible with single and dual printed circuit boards. Background Technology

[0002] Currently, based on different high and low configuration requirements, it is often necessary to set up two printed circuit boards (PCBs) in the domain controller for high-end configurations, while eliminating the sub-PCBs in the domain controller for low-end configurations. However, for domain controllers with two PCBs and those with one PCB, different electromagnetic compatibility (EMC) structures are often required to meet EMC requirements.

[0003] Currently, for the different configuration requirements of domain controllers with dual boards and single boards, the usual design solution is to design different mechanical housing structures to match the single board and dual board to meet EMC requirements. Therefore, more molds are needed to make parts with different structures to match the single board and dual board solutions respectively. This results in higher mold costs, more types of mechanical materials, and is also prone to management problems such as mixed materials. Utility Model Content

[0004] One of the objectives of this invention is to provide a domain controller compatible with both single and dual printed circuit boards, which, based on a shared structure, can meet EMC requirements under both single and dual printed circuit boards when selected.

[0005] To achieve the above objectives, this utility model proposes a domain controller, comprising a housing, a first printed circuit board assembly always disposed within the housing, and a second printed circuit board assembly switching between an installed state and a removed state. The second printed circuit board assembly is also disposed within the housing in the installed state. The first printed circuit board assembly includes a first printed circuit board and electronic devices disposed thereon, and the second printed circuit board assembly includes a second printed circuit board and electronic devices disposed thereon. The domain controller further includes:

[0006] An electromagnetic shielding barrier extending from the inner top surface of the outer casing;

[0007] An electromagnetic shielding bracket has a first end facing the top surface of the inner housing and a second end facing the bottom surface of the inner housing; in the mounted state of the second printed circuit board assembly, the first end abuts against the lower surface of the second printed circuit board, and the second end abuts against the upper surface of the first printed circuit board.

[0008] A first electromagnetic shielding element is pressed between the electromagnetic shielding barrier and the upper surface of the second printed circuit board in the mounted state of the second printed circuit board assembly, and is pressed between the electromagnetic shielding barrier and the first end of the electromagnetic shielding bracket in the removed state of the second printed circuit board assembly.

[0009] The second electromagnetic shielding element, which switches between an installed state and a removed state, is in an installed state when the second printed circuit board assembly is removed, and is disposed in a compressed manner between the second end of the electromagnetic shielding bracket and the upper surface of the first printed circuit board.

[0010] The third electromagnetic shielding element is disposed on the inner bottom surface of the housing and abuts against the lower surface of the first printed circuit board.

[0011] Furthermore, in the domain controller described in this utility model, a metal mesh is provided at the air outlet of the housing.

[0012] Furthermore, in the domain controller described in this utility model, the first electromagnetic shielding element includes conductive foam, conductive adhesive layer, or metal spring sheet.

[0013] Furthermore, in the domain controller described in this utility model, the second electromagnetic shielding element includes conductive foam.

[0014] Furthermore, in the domain controller described in this utility model, the third electromagnetic shielding element includes a metal spring.

[0015] Furthermore, in the domain controller described in this utility model, the inner top surface of the housing has at least one first heat dissipation protrusion, which is thermally connected to at least one electronic device on the upper surface of the first printed circuit board or the upper surface of the second printed circuit board.

[0016] Furthermore, in the domain controller described in this utility model, a first heat dissipation protrusion is provided between the first heat dissipation protrusion and the corresponding electronic device.

[0017] Furthermore, in the domain controller described in this utility model, the inner bottom surface of the housing has at least one second heat dissipation protrusion, which is thermally connected to at least one electronic device on the lower surface of the first printed circuit board.

[0018] Furthermore, in the domain controller described in this utility model, a second heat-conducting element is provided between the second heat dissipation boss and the corresponding electronic device.

[0019] Furthermore, in the domain controller described in this utility model, the housing includes an upper cover and a lower cover connected to the upper cover, and a fourth electromagnetic shielding element is provided between the upper cover and the lower cover.

[0020] Furthermore, in the domain controller described in this utility model, the side end of the electromagnetic shielding bracket is arranged to overlap with the side wall portion of the outer casing.

[0021] Another object of this invention is to provide a vehicle having a domain controller as described above.

[0022] The domain controller described in this invention can meet EMC requirements under various conditions based on a shared structure, with the option of selecting compatible single or dual printed circuit boards, thereby achieving the effect of reducing product costs. Attached Figure Description

[0023] Figure 1 The external structure of the second printed circuit board assembly of the domain controller described in this invention in the mounted state is shown from one perspective.

[0024] Figure 2 This invention provides another perspective on the external structure of the second printed circuit board assembly of the domain controller described herein in one embodiment, in its mounted state.

[0025] Figure 3 The external structure of the second printed circuit board assembly of the domain controller described in this invention in the removed state is shown from one perspective.

[0026] Figure 4 This invention provides another perspective on the external structure of the second printed circuit board assembly of the domain controller described herein in a removed state under one embodiment.

[0027] Figure 5 This diagram shows a split structure of the second printed circuit board assembly of the domain controller according to one embodiment of the present invention in the installed state.

[0028] Figure 6 This diagram shows a split structure of the second printed circuit board assembly of the domain controller according to one embodiment of the present invention in the removed state.

[0029] Figure 7 The internal structure of the housing of the domain controller described in this invention is shown in one embodiment.

[0030] Figure 8 The structure of the electromagnetic shielding bracket of the domain controller described in this utility model is shown in one embodiment.

[0031] Figure 9 This invention illustrates a third electromagnetic shielding element of the domain controller described in one embodiment.

[0032] Figure 10The external structure of the second printed circuit board assembly of the domain controller described in this invention in the mounted state is shown from a top-down perspective.

[0033] Figure 11 for Figure 10 Sectional view at point AA.

[0034] Figure 12 for Figure 11 A magnified view of a section at point B.

[0035] Figure 13 This invention illustrates a second printed circuit board of the domain controller according to one embodiment.

[0036] Figure 14 The external structure of the second printed circuit board assembly of the domain controller described in this invention in the removed state is shown from a top-down perspective.

[0037] Figure 15 for Figure 14 Sectional view at point CC.

[0038] Figure 16 The overlapping portion of the electromagnetic shielding support and the inner sidewall of the housing is shown.

[0039] Figure 17 This image shows a rear view of the domain controller described in one embodiment of the present invention.

[0040] Figure 18 for Figure 17 Sectional view at point DD.

[0041] Figure 19 for Figure 18 A magnified view of a section at point E in the middle. Detailed Implementation

[0042] The domain controller and vehicle described in this utility model will be further explained and described below with reference to the accompanying drawings and specific embodiments. However, such explanation and description do not constitute an undue limitation on the technical solution of this utility model.

[0043] Currently, based on different high and low configuration requirements, it is often necessary to set up two printed circuit boards (PCBs) in the domain controller for high-end configurations, while eliminating the sub-PCBs in the domain controller for low-end configurations. However, for domain controllers with two PCBs and those with one PCB, different electromagnetic compatibility (EMC) structures are often required to meet EMC requirements.

[0044] Currently, for the different configuration requirements of domain controllers with dual boards and single boards, the usual design solution is to design different mechanical housing structures to match the single board and dual board to meet EMC requirements. Therefore, more molds are needed to make parts with different structures to match the single board and dual board solutions respectively. This results in higher mold costs, more types of mechanical materials, and is also prone to management problems such as mixed materials.

[0045] To address the aforementioned issues, this invention proposes, in one embodiment, a domain controller compatible with both single and dual printed circuit boards.

[0046] Figure 1 The external structure of the second printed circuit board assembly of the domain controller described in this invention in the mounted state is shown from one perspective.

[0047] Figure 2 This invention provides another perspective on the external structure of the second printed circuit board assembly of the domain controller described herein in one embodiment, in its mounted state.

[0048] like Figure 1 and Figure 2 As shown, under the requirement of high configuration and greater computing power, the domain controller has a first printed circuit board assembly 200 that is always disposed inside the housing 100, and a second printed circuit board assembly 300 that is also disposed inside the housing 100 in the installed state.

[0049] Figure 3 The external structure of the second printed circuit board assembly of the domain controller described in this invention in the removed state is shown from one perspective.

[0050] Figure 4 This invention provides another perspective on the external structure of the second printed circuit board assembly of the domain controller described herein in a removed state under one embodiment.

[0051] like Figure 3 and Figure 4 As shown, under relatively low configuration requirements, the second printed circuit board assembly can be removed from the housing to leave the second printed circuit board in a removed state, so that the housing 100 only contains the first printed circuit board assembly.

[0052] from Figure 1 , Figure 2 The displayed domain controller has dual printed circuit boards installed. Figure 3 , Figure 4The comparison shown between the domain controllers with a single printed circuit board installed reveals that the thickness of the housing 100 of the second printed circuit board assembly 300 in the installed state is greater than that of the housing 100 of the second printed circuit board assembly 300 in the removed state.

[0053] Figure 5 This diagram shows a split structure of the second printed circuit board assembly of the domain controller according to one embodiment of the present invention in the installed state.

[0054] Figure 6 This diagram shows a split structure of the second printed circuit board assembly of the domain controller according to one embodiment of the present invention in the removed state.

[0055] like Figure 5 and Figure 6 As shown, in some more specific embodiments, for ease of installation, the housing 100 includes an upper cover 101 and a lower cover 102 connected to the upper cover. In some more specific embodiments, the lower cover 102 can be connected to the upper cover 101 via a connector 103, such as a connecting screw, to form a hollow housing 100. In some more specific embodiments, the upper cover can be a die-cast aluminum alloy part, and similarly, the lower cover can also be a die-cast aluminum alloy part.

[0056] In some more specific implementations, such as Figure 5 As shown, the second printed circuit board assembly can be mounted inside the housing using connecting screws 81. The first and second printed circuit board assemblies are connected together via connector 82. Furthermore, as... Figure 5 As shown, in some more specific embodiments, an antenna cover 9 made of plastic or rubber can also be provided on the Bluetooth antenna area of ​​the first printed circuit board to protect the first printed circuit board.

[0057] like Figure 5 As shown, the first printed circuit board assembly 200 includes a first printed circuit board 201 and electronic devices 202 disposed thereon. The second printed circuit board assembly 300 includes a second printed circuit board 301 and electronic devices 302 disposed thereon, wherein the first printed circuit board assembly 200 is always disposed within a housing, while the second printed circuit board assembly 300 has, as shown in the diagram... Figure 5 The installation state shown and as Figure 6 The removal state is shown.

[0058] In some more specific implementations, the first printed circuit board can be configured as a motherboard, and the second printed circuit board can be configured as a daughterboard.

[0059] In this invention, the electronic devices on the first and second printed circuit boards can be systems on a chip (SOC), or other electronic components that generate heat and consume power, such as resistors, capacitors, inductors, diodes, and transistors.

[0060] Figure 7 The internal structure of the housing of the domain controller described in this invention is shown in one embodiment.

[0061] In the domain controller described in this utility model, the structure for implementing EMC includes at least the following: Figure 7 The electromagnetic shielding barrier 404 and the first electromagnetic shielding element 401 extend from the inner top surface 104 of the outer casing (e.g., the inner surface of the top cover 101).

[0062] In addition, such as Figure 5 and Figure 6 As shown, the structure for implementing EMC in the domain controller described in this utility model also includes an electromagnetic shielding bracket 500. In some more specific embodiments, the electromagnetic shielding bracket 500 can be a die-cast aluminum part.

[0063] like Figure 5 and Figure 8 As shown, the electromagnetic shielding bracket 500 has a first end 501 facing the inner top surface of the housing (e.g., the inner surface of the upper cover) and a second end 502 facing the inner bottom surface of the housing (e.g., the inner surface of the lower cover 102). In some more specific embodiments, the electromagnetic shielding bracket 500 may also have a connection hole 503 for fixing it to the housing, for example, a connecting bolt 504 can be used to connect it to the housing through the connection hole.

[0064] The domain controller described in this utility model further includes a second electromagnetic shielding element 402 that switches between an installed state and a removed state, wherein when the second printed circuit board assembly 300 is in such a state as Figure 5 When the second electromagnetic shielding element 402 is in the installed state as shown, it is in the removed state; when the second printed circuit board assembly 300 is in the installed state as shown, it is in the removed state. Figure 6 When the device is in the removed state, the second electromagnetic shielding element 402 is in the installed state.

[0065] Figure 9 This invention illustrates a third electromagnetic shielding element of the domain controller described in one embodiment.

[0066] like Figure 9 As shown, the structure for implementing EMC in the domain controller described in this utility model also includes a third electromagnetic shielding element 403, which is disposed on the inner bottom surface 105 of the housing (e.g., the inner surface of the lower cover 102).

[0067] Following this setup method, such as Figure 10 , Figure 11 and Figure 12 As shown, in the mounted state of the second printed circuit board assembly, the first electromagnetic shielding element 401 is pressed between the electromagnetic shielding barrier 404 and the upper surface 3011 of the second printed circuit board, thereby achieving contact with the upper surface of the second printed circuit board, especially as shown in the figure. Figure 13 The interference fit of the grounding area 3013 shown achieves EMC sealing of the upper surface (or front side) of the second printed circuit board. Simultaneously, the first end 501 of the electromagnetic shielding bracket 500 directly abuts against the lower surface 3012 (or back side) of the second printed circuit board, particularly the grounding area 3013, achieving EMC sealing of the back side of the second printed circuit board 301. Similarly, the second end 502 of the electromagnetic shielding bracket 500 directly abuts against the upper surface 2011 (or front side) of the first printed circuit board, particularly the grounding area 2013, achieving EMC sealing of the front side of the first printed circuit board 201. Furthermore, the third electromagnetic shielding element 403 directly abuts against the lower surface (or back side) 2012 of the first printed circuit board, achieving EMC sealing of the back side of the first printed circuit board. Thus, EMC sealing is achieved on both the front and back sides of the first printed circuit board 201 and the second printed circuit board 301.

[0068] With the second printed circuit board assembly removed, the electromagnetic shielding bracket 500 will still be mounted on the housing, but it will then be recessed towards the top cover by the thickness of the second printed circuit board assembly. For example... Figure 14 and Figure 15 As shown, in this state, the first electromagnetic shielding element 401 is pressed between the electromagnetic shielding barrier 404 and the first end 501 of the electromagnetic shielding bracket, achieving an EMC seal between the inner top surface of the housing and the electromagnetic shielding bracket. Simultaneously, the second electromagnetic shielding element 402 is pressed between the second end 502 of the electromagnetic shielding bracket and the upper surface of the first printed circuit board 201, thereby achieving an EMC seal on the upper surface (or front side) of the first printed circuit board. Meanwhile, the third electromagnetic shielding element 403 directly abuts against the lower surface (or back side) 2012 of the first printed circuit board, achieving an EMC seal on the back side of the first printed circuit board.

[0069] When the second printed circuit board assembly is removed, the electromagnetic shielding bracket 500 will sink downwards towards the top cover by the thickness of the second printed circuit board assembly, which will cause a gap between the electromagnetic shielding bracket 500 and the first printed circuit board 201. This invention fills this gap by setting the second electromagnetic shielding element 402, thereby achieving EMC sealing of the first printed circuit board.

[0070] In some more specific embodiments, the first electromagnetic shielding element 401 may include conductive foam. In other more specific embodiments, the first electromagnetic shielding element 401 may include a conductive adhesive layer. In still other more specific embodiments, the first electromagnetic shielding element 401 may include a metal spring.

[0071] In some more specific embodiments, the conductive adhesive layer can be a compressible solid conductive adhesive, which can be directly fixed to the electromagnetic shielding wall by dispensing and curing.

[0072] In some more specific embodiments, the second electromagnetic shielding element 402 may include conductive foam. In other more specific embodiments, the second electromagnetic shielding element 402 may include a conductive adhesive layer. In still more specific embodiments, the second electromagnetic shielding element 402 may include a metal spring. However, considering that the gap between the electromagnetic shielding bracket 500 and the first printed circuit board 201 is relatively large after the electromagnetic shielding bracket 500 sinks towards the top cover, and that the conductive adhesive layer and the metal spring are relatively difficult to remove, preferably, the second electromagnetic shielding element 402 includes conductive foam, for example... Figure 6 shown.

[0073] In some more specific embodiments, the third electromagnetic shielding element 403 may include conductive foam. In other more specific embodiments, the third electromagnetic shielding element 403 may include a conductive adhesive layer. In still other more specific embodiments, the third electromagnetic shielding element 403 may include a metal spring. However, for ease of manufacturing, it is preferable that the third electromagnetic shielding element 403 may include a metal spring.

[0074] In addition, such as Figure 7 As shown, the housing 100 of the domain controller described in this utility model has an air outlet at the location of the fan 6. To further improve EMC performance, a metal mesh 106 can be provided at the air outlet. This metal mesh 106 can be fixed to the housing by riveting or other means, satisfying EMC sealing performance while dissipating heat and exhausting air.

[0075] Furthermore, to improve EMC sealing performance, a fourth electromagnetic shielding element may be provided between the upper cover 101 and the lower cover 102. In some more specific embodiments, the fourth electromagnetic shielding element may be configured to include, for example... Figure 7 The conductive adhesive 405 shown and / or as shown Figure 5 and Figure 6 The conductive foam shown is 406.

[0076] Figure 16 The overlapping portion of the electromagnetic shielding support and the inner sidewall of the housing is shown.

[0077] Figure 17 This image shows a rear view of the domain controller described in one embodiment of the present invention.

[0078] Figure 18 for Figure 17 Sectional view at point DD.

[0079] Figure 19 for Figure 18 A magnified view of a section at point E in the middle.

[0080] like Figure 16 , Figure 17 , Figure 18 and Figure 19 As shown, in order to further improve the EMC sealing effect, in some embodiments, the electromagnetic shielding bracket 500 and the sidewall of the inner shell that constitutes the printed circuit board accommodating cavity have overlapping portions e and f.

[0081] In some more specific embodiments, the side ends 505 and 504 of the electromagnetic shielding bracket 500 are respectively arranged to overlap with the side walls 107 and 108 of the printed circuit board accommodating cavity inside the housing, thereby achieving a better EMC sealing effect.

[0082] like Figure 7 As shown, in some more specific embodiments, the inner top surface 104 of the housing may also have at least one first heat dissipation protrusion 1041, which is thermally connected to at least one electronic device on the upper surface of the first printed circuit board or the upper surface of the second printed circuit board.

[0083] Similarly, in some more specific implementations, such as Figure 5 and Figure 6 As shown, the inner bottom surface 105 of the housing may also have at least one second heat dissipation protrusion 1051, which is thermally connected to at least one electronic device on the lower surface of the first printed circuit board.

[0084] This configuration allows for the simultaneous cooling of various electronic components on both the first and second printed circuit boards, improving cooling efficiency and ensuring uniform cooling.

[0085] In some more specific implementations, such as Figure 5 and Figure 6 As shown, a first thermally conductive element 71 may be provided between the first heat dissipation protrusion and the corresponding electronic device; and / or a second thermally conductive element 72 may be provided between the second heat dissipation protrusion and the corresponding electronic device. The first and second thermally conductive elements can reduce thermal resistance, thereby further improving the heat conduction effect.

[0086] In some more specific embodiments, the first and second thermally conductive elements may include thermally conductive silicone grease layers. Those skilled in the art can select the thermal conductivity of the thermally conductive grease according to actual needs; generally, the higher the thermal conductivity of the thermally conductive grease, the more beneficial it is for heat dissipation. Of course, in other more specific embodiments, the first and second thermally conductive elements may also include thermally conductive putty, thermally conductive gel, thermally conductive double-sided adhesive, thermally conductive graphite sheets, or similar thermally conductive elements.

[0087] In this invention, the domain controller can be a vehicle domain controller, which is used for vehicle status control and status monitoring, including but not limited to an in-vehicle mobile data center, a hardware monitor (HMI) that implements human-machine interface controller functions, an in-vehicle entertainment (IVI) controller, a body control module (BCM), and a vehicle control unit (VCU).

[0088] The domain controller described in this invention can be used in vehicles, for example, in the automated driving of intelligent vehicles. Intelligent vehicles may include electric vehicles or gasoline-powered vehicles that support unmanned driving, driver assistance systems (ADAS), intelligent driving, connected driving, intelligent network driving, and car sharing.

[0089] Therefore, in another embodiment, this invention also provides a vehicle having the domain controller described above. Since this invention does not improve other components of the vehicle, these components will not be described in detail here.

[0090] It should be noted that the prior art within the scope of protection of this utility model is not limited to the embodiments given in this utility model document. All prior art that does not contradict the solution of this utility model, including but not limited to prior patent documents, prior publications, prior public uses, etc., can be included in the scope of protection of this utility model.

[0091] Furthermore, the combination of the technical features in this case is not limited to the combination methods described in the claims of this case or the combination methods described in the specific embodiments. All technical features described in this case can be freely combined or combined in any way, unless they contradict each other.

[0092] It should also be noted that the embodiments listed above are merely specific embodiments of this utility model. Obviously, this utility model is not limited to the above embodiments, and any similar changes or modifications made thereto that can be directly derived or easily conceived by those skilled in the art from the content disclosed in this utility model should fall within the protection scope of this utility model.

Claims

1. A domain controller comprising a housing (100), a first printed circuit board assembly (200) permanently disposed within the housing, and a second printed circuit board assembly (300) switchable between an installed state and a removed state, the second printed circuit board assembly also being disposed within the housing in the installed state, the first printed circuit board assembly comprising a first printed circuit board (201) and electronic devices disposed thereon, the second printed circuit board assembly (300) comprising a second printed circuit board (301) and electronic devices disposed thereon; characterized in that, The domain control also includes: An electromagnetic shielding barrier (404) extends from the inner top surface (104) of the outer casing; An electromagnetic shielding bracket (500) has a first end (501) facing the inner top surface of the housing and a second end (502) facing the inner bottom surface of the housing; in the mounted state of the second printed circuit board assembly, the first end abuts against the lower surface of the second printed circuit board and the second end abuts against the upper surface of the first printed circuit board. A first electromagnetic shielding element (401) is pressed between the electromagnetic shielding barrier and the upper surface of the second printed circuit board in the mounted state of the second printed circuit board assembly, and is pressed between the electromagnetic shielding barrier and the first end of the electromagnetic shielding bracket in the removed state of the second printed circuit board assembly. The second electromagnetic shielding element (402) switches between an installed state and a removed state. In the removed state of the second printed circuit board assembly, it is in an installed state and is pressed between the second end of the electromagnetic shielding bracket and the upper surface of the first printed circuit board. The third electromagnetic shielding element (403) is disposed on the inner bottom surface of the housing and abuts against the lower surface of the first printed circuit board.

2. The domain controller as described in claim 1, characterized in that, The air outlet of the outer casing is provided with a metal mesh (106).

3. The domain controller as described in claim 1, characterized in that, The first electromagnetic shielding element includes conductive foam, conductive adhesive layer, or metal spring sheet.

4. The domain controller as described in claim 1, characterized in that, The second electromagnetic shielding element includes conductive foam.

5. The domain controller as described in claim 1, characterized in that, The third electromagnetic shielding element includes a metal spring.

6. The domain controller as claimed in claim 1, characterized in that, The inner top surface of the housing has at least one first heat dissipation boss (1041), which is thermally connected to at least one electronic device on the upper surface of the first printed circuit board or the upper surface of the second printed circuit board.

7. The domain controller as claimed in claim 6, characterized in that, A first heat dissipation protrusion and the corresponding electronic device are provided with a first heat-conducting element (71).

8. The domain controller as claimed in claim 1, characterized in that, The inner bottom surface of the housing has at least one second heat dissipation protrusion (1051), which is thermally connected to at least one electronic device on the lower surface of the first printed circuit board.

9. The domain controller as claimed in claim 8, characterized in that, A second heat dissipation protrusion and the corresponding electronic device are provided with a second heat-conducting element (72).

10. The domain controller as claimed in claim 1, characterized in that, The outer casing includes an upper cover (101) and a lower cover (102) connected to the upper cover, and a fourth electromagnetic shielding element is provided between the upper cover and the lower cover.

11. The domain controller as claimed in claim 1, characterized in that, The side ends (504, 505) of the electromagnetic shielding bracket overlap with the side wall portion of the printed circuit board accommodating cavity inside the housing.

12. A vehicle, characterized in that, It has a domain controller as described in any one of claims 1-11.

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